A B C D E F G H 1 Order Code: AR xx- x x No. of contact 06 ~ 64 2 X.XX X.X X. TOL ±0.10 ±0.30 ±0.50 3 4 Date Name Lucas Lucas A. Plate PCB LAYOUT Add "HGL"-Version,corrected P/N code 28.01.2014 4 23.07.2012 16.08.2012 2 Drawn Add sheet 2 0 Id. 3 Modification 1 Versions -TT - Standard /7-TT - Only for 24+28 poles* (Dim C: 7.62) Plating HZL - Sleeve tin / clip gold flash HZL/01 - Sleeve tin / clip 10u" gold HZL/07 - Sleeve tin / clip 30u" gold HGL - Sleeve gold flash / clip gold flash Scale DIM TOL ±1° Angle X.° Free RoHS compliant TOLERANCE 2 Unit:mm 1 5 NOTES 6 7 Sheet 1/2 rev02 Material: Pin (outer sleeve) : Brass,machined, CuZn38Pb2 Clip(contact 4 finger) : Phosphor Bronze Insulator body(black) : Glass filled thermoplastic polyester UL94V-0 Electrical Current rating : 3 Amps/contact max. Contact resistance : ≦4mΩ /contact Insulation resistance : ≧10000MΩ at 500VAC Rated voltage : 100 VRMS /150VDC Mechanical Operating temperature : Gold plated:-55 °C to +125 °C (Continuous) -67 °F to +105 °F Tin plated:-40 °C to +105 °C Average insertion force with steel pin of: ∅0.43mm/0.017" < 250g Average withdrawal force with steel pin of ∅ 0.43mm/0.017" >50g Mechanical life : min.200 Applications and features: 1.The open frame is most common type. 2.The open body design gives better access (for cleaning and inspections) to air -cooling. 3.Side and end stackable. 4.High retention design prevents IC walkout during heavy vibration. 5.Closed bottom sleeve for 100% anti-wicking of silder. 6.Twist free construction. Environmental data Solderability (IEC 60068-2-20. Ta) :235 °C, 2s Resistance to soldering heat (IEC 60068-2-20. Tb) : -Through hole mount components :260 °C, 10s 17.78 20.32 22.86 25.40 7 AR xx-x x 10.16 10.16 10.16 10.16 10.16 10.16 10.16 12.70 Dim D 10.16 17.78 10.16 Dim C 7.62 7.62 7.62 7.62 7.62 7.62 7.62 10.16 7.62 15.24 7.62 Dim A 22.86 25.40 27.94 27.94 33.02 7.62 10.16 12.70 27.94 30.48 30.48 35.56 6 Replace ASS 4852 CO Drawing-No. ASSMANN WSW-No. Customer-No. Dim B 5.08 7.62 10.16 15.24 17.78 20.32 Contact 06 08 10 14 16 18 20 22 24* 24 28* 17.78 17.78 Name 15.24 15.24 Date Lucas 33.02 38.10 23.07.2012 Winnie 35.56 40.64 Drawn 16.08.2012 28 32 Approved 5 A B C D E F G H A B C D E F G H 1 RoHS compliant Unit:mm 1 2 2 Scale 3 PCB LAYOUT Free 4 ±0.50 TOLERANCE X. Date Name Lucas Lucas X.X 4 23.07.2012 16.08.2012 ±0.30 ±0.10 2 Add "HGL"-Version,corrected P/N code 28.01.2014 A. Plate Drawn Add sheet 2 X.XX 1 0 Id. Modification TOL TOL DIM Angle 3 5 NOTES Contact 45.72 50.80 53.34 60.96 63.50 66.04 63.50 66.04 81.28 Dim A Lucas 6 6 Dim D 17.78 17.78 17.78 17.78 17.78 17.78 25.40 25.40 25.40 Replace 7 7 AR xx-x x ASS 4852 CO Drawing-No. ASSMANN WSW-No. Customer-No. Dim B Dim C 15.24 15.24 15.24 15.24 15.24 15.24 22.86 22.86 22.86 43.18 48.26 50.80 58.42 60.96 63.50 60.96 63.50 78.74 Material: Pin (outer sleeve) : Brass,machined, CuZn38Pb2 Clip(contact 4 finger) : Phosphor Bronze Insulator body(black) : Glass filled thermoplastic polyester UL94V-0 Electrical Current rating : 3 Amps/contact max. Contact resistance : ≦ 4mΩ /contact Insulation resistance : ≧ 10000MΩ at 500VAC Rated voltage : 100 VRMS /150VDC Mechanical Operating temperature : Gold plated:-55 °C to +125 °C (Continuous) -67 °F to +105 °F Tin plated:-40 °C to +105 °C Average insertion force with steel pin of: ∅0.43mm/0.017" < 250g Average withdrawal force with steel pin of ∅ 0.43mm/0.017" >50g Mechanical life : min.200 Applications and features: 1.The open frame is most common type. 2.The open body design gives better access (for cleaning and inspections) to air -cooling. 3.Side and end stackable. 4.High retention design prevents IC walkout during heavy vibration. 5.Closed bottom sleeve for 100% anti-wicking of silder. 6.Twist free construction. Environmental data Solderability (IEC 60068-2-20. Ta) :235 °C, 2s Resistance to soldering heat (IEC 60068-2-20. Tb) : -Through hole mount components :260 °C, 10s 36 40 42 48 50 52 50 52 64 23.07.2012 Winnie Name Drawn 16.08.2012 Date Approved 5 rev02 Sheet 2/2 A B C D E F G H