BeRex Reflow Soldering Guide Application Note RF MMIC Innovator www.berex.com Classification: Reflow Soldering Document Number: Reflow61110 Revision code: 0.1 Reflow Soldering Guide for Surface Mount Devices Name Writer Date Signature BY KIM JH Bae OK Dr. Yoo OK Checked Approval Rev B61110 MMIC Innovator http: //www.berex.com BeRex Reflow Soldering Guide Application Note Contents RF MMIC INNOVATOR WWW.BEREX.COM .................1 1. REFLOW SOLDERING GUIDE FOR SURFACE MOUNT DEVICES.................................3 2. FIGURE 1. TEMPERATURE PROFILE FOR INFRARED OR CONVECTION REFLOW .......................................................................................................................................4 3. TABLE 1. REFLOW PROFILE ..................................................................................................4 Rev B61110 MMIC Innovator 2 http: //www.berex.com BeRex 1. Reflow Soldering Guide Application Note Reflow Soldering Guide for Surface Mount Devices This technical note provides general guidelines for a solder reflow process for BeRex surface mount products. The data used in this document is based on IPC/JEDEC standards. The reflow process consists of applying a Pb-free solder paste to a circuit board, placing devices onto the paste, and then conveying the board through an oven with successive heating elements of varying temperatures. In the oven, each board typically goes through the following stages: - Gradual preheating Flux activation Reflow Controlled cooling process The maximum temperature, the rate of heating, the time a device spends at each temperature, controlled heating, and controlled cooling are critical parameters for effective soldering. Figure 1 and Table 1 show a sample temperature profile compliant to JEDEC standards. Different board designs use different number and types of devices, solder paste, reflow ovens, and circuit boards. No single temperature profile works for all possible combinations. One can use this example as a generic target to set up its own reflow process. Reflow process should adhere to the JEDEC profile limits as well as specifications and recommendations from solder paste manufacturer to avoid damaging the device and create a reliable solder joint. Rev B61110 MMIC Innovator 3 http: //www.berex.com BeRex Reflow Soldering Guide Application Note Figure 1. Temperature Profile for Infrared or Convection Reflow 2. Temperature (C) tp TP Ramp-Up TL Ramp-Down tL T SMAX T SMIN ts Preheat 25C Flux Activation Reflow Cool Down Time to Peak Time (Seconds) Figure 1. Temperature Profile for Infrared or Convection Reflow Table 1. Reflow Profile 3. Parameter Description Pb-Free Package Ramp-Up Average Ramp-Up Rate (TSMAX to Tp) 3 ºC/second max. TSMIN Preheat Peak Min. Temperature 150 ºC TSMAX Preheat Peak Max. Temperature 200 ºC Tp Max. Reflow Temperature 260 (+0/-5) ºC Ts Time between TSMIN and TSMAX 60-180 seconds TL Solder Melting Point 218 ºC tL Time Maintained above TL 60-150 seconds tp Time within 5C of Peak Temperature 20-40 seconds Ramp-Down Ramp-down Rate 6 ºC/second max. Time to Peak Time from 25 ºC to Peak Temperature 8 minutes max. Rev B61110 MMIC Innovator 4 http: //www.berex.com