Type FCN Material Content Declaration 1206 and 1210 Stacked Metallized Film (PEN) Chips for Reflow Soldering Material Content for RoHS Compliant Parts Typical Construction Material Element Group Active Part Termination CAS Mass Materials if Applicable (Wt. %) ppm Metals Al (metal spray) 7429-90-5 .7 7000 Polymers PEN 25853-85-4 36.5 365000 Metals Cu/Zn (metal spray) 46.9 469000 Metals CuNi/Ag 11.3 113000 Polymersl Phenol Resin 1.0 10000 Metal Sn/Ag/Cu (Plating) 3.6 36000 9003-35-4 Sum Total (%) 37.2 62.8 100.0 Case Sizes, Weight and Outline Drawing Case Size LxW Weight (mm) (mg) 1206 15.1 - 20.1 1210 32.2 - 45.1 061506 To the best of our knowledge, the information provided on the enclosed is correct as of the date indicated on the document. Since some of the information is provided by the acceptance of data from sources outside of Cornell Dubilier Electronics, we can not guarantee that all is complete and accurate. CDE Cornell Dubilier • 1605 E. Rodney French Blvd. • New Bedford, MA 02744 • Phone: (508)996-8561 • Fax: (508)996-3830 • www.cde.com