MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN6 2x2, 0.65P CASE 517AB ISSUE C DATE 10 APR 2013 SCALE 4:1 D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25MM FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. TIE BARS MAY BE VISIBLE IN THIS VIEW AND ARE CONNECTED TO THE THERMAL PAD. A B NOTE 5 PIN ONE REFERENCE 0.10 C 0.10 C ÍÍ ÍÍ ÍÍ E END VIEW TOP VIEW A3 DETAIL B 0.10 C A 6X 0.08 C A1 NOTE 4 D2 1 SEATING PLANE C SIDE VIEW DETAIL A L 3 ÉÉ ÇÇ EXPOSED Cu A1 DETAIL B 4 6X e DETAIL A BOTTOM VIEW ALTERNATE TERMINAL CONSTRUCTIONS b 0.10 M C A B 0.05 M C GENERIC MARKING DIAGRAM* XXMG G L L1 6 ÉÉ ÇÇ ÇÇ ALTERNATE CONSTRUCTIONS L E2 A3 MOLD CMPD MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.25 0.35 2.00 BSC 1.50 1.70 2.00 BSC 0.80 1.00 0.65 BSC 0.25 0.35 --0.15 DIM A A1 A3 b D D2 E E2 e L L1 XX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. RECOMMENDED SOLDERING FOOTPRINT* PACKAGE OUTLINE 1.70 6X 0.47 2.30 0.95 1 0.65 PITCH 6X 0.40 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: 98AON22162D Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed STATUS: ON SEMICONDUCTOR STANDARD versions are uncontrolled except when stamped “ CONTROLLED COPY” in red. NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 Case Outline Number: http://onsemi.com October, DESCRIPTION: 2002 − Rev. 0 PAGE 1 OFXXX 2 UDFN6 2X2, 0.65P 1 DOCUMENT NUMBER: 98AON22162D PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION. REQ. BY C. GOYON. 01 MAR 2006 A ADDED SOLDERING FOOTPRINT. REQ. BY C. GOYON. 13 MAR 2007 B REMOVED PREVIOUS NOTE 3. REQ. BY W. CLEMENS. 22 MAY 2007 C REDREW TO JEDEC STANDARDS. ADDED END VIEW AND DETAILS A AND B. REQ. BY S. RAO. 10 APR 2013 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2013 April, 2013 − Rev. C Case Outline Number: 517AB