ONSEMI 517BR-01

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN4 1.0x1.0, 0.65P
CASE 517BR−01
ISSUE O
1
SCALE 4:1
PIN ONE
REFERENCE
2X
0.05 C
4X
A
B
D
ÏÏ
ÏÏ
typ
DETAIL A
0.05 C
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L3
c 0.18
L2
E
3X
TOP VIEW
0.43
4X
(A3)
0.05 C
A
3X
0.05 C
NOTE 4
A1
SIDE VIEW
e
DETAIL A
e/2
1
3X
2
DATE 27 OCT 2010
C
SEATING
PLANE
DETAIL B
0.10
0.23
DIM
A
A1
A3
b
D
D2
E
e
L
L2
L3
GENERIC
MARKING DIAGRAM*
L
1
D2
4
3
4X
b
0.05
XX
MM
XX = Specific Device Code
MM = Date Code
D2
45 5
MILLIMETERS
MIN
MAX
−−−
0.60
0.00
0.05
0.10 REF
0.20
0.30
1.00 BSC
0.43
0.53
1.00 BSC
0.65 BSC
0.20
0.30
0.27
0.37
0.02
0.12
M
C A B
NOTE 3
BOTTOM VIEW
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
MOUNTING FOOTPRINT*
0.65
PITCH
DETAIL B
2X
0.52
PACKAGE
OUTLINE
1.30
0.53
4X
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON53254E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
UDFN4, 1.0X1.0, 0.65P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON53254E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY B. LOFTS.
DATE
27 OCT 2010
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2010
October, 2010 − Rev. 01O
Case Outline Number:
517BR