BYD1100

Certificate TH97/10561QM
BYD1100
HYPER FAST SOFTRECOVERY RECTIFIER
PRV : 100 Volts
Io : 2.7 Amperes
MELF (Plastic)
Cathode Mark
FEATURES :
*
*
*
*
*
*
Certificate TW00/17276EM
φ 0.102 (2.6)
Glass passivated
High maximum operating temperature
Low leakage current
Excellent stability
Smallest surface mount rectifier outline
Pb / RoHS Free
0.094 (2.4)
0.022(0.55)
0.205(5.2)
0.189(4.8)
MECHANICAL DATA :
* Case : Molded plastic
* Terminals : Plated Terminals, solderable per
MIL-STD-750 Method 2026
* Polarity : Color band denotes cathode end
* Mounting position : Any
* Weight : 0.116 gram
Dimensions in inches and ( millimeters )
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25 °C ambient temperature unless otherwise specifie d.
RATING
Maximum Repetitive Peak Reverse Voltage
Maximum Continuous Reverse Voltage
Min. Reverse Avalanche Breakdown Voltage @ IR = 0.1 mA
Maximum Average Forward Current
SYMBOL
VALUE
UNIT
VRRM
100
V
VR
100
V
V(BR)R-min
120
V
2.7
IF(AV)
(1)
0.85(2)
A
Maximum Non-Repetitive Peak Forward Surge Current (Note 3)
IFSM
15
A
Maximum Repetitive Peak Forward Current at Ttp = 105 °C
IFRM
16
A
Maximum Forward Voltage at I F = 1.0 A, T J = 25 °C
VF
0.96
V
Maximum Reverse Current at VR = VRRMmax
TJ = 25 °C
IR
5.0
μA
TJ = 165 °C
IR(H)
150
μA
Trr
10
ns
Thermal Resistance from Junction to Tie-Point
Rth j-tp
30
K/W
Thermal Resistance from Junction to Ambient (Note 5)
Rth j-a
150
K/W
Junction Temperature Range
TJ
- 65 to + 175
°C
Storage Temperature Range
TSTG
- 65 to + 175
°C
Maximum Reverse Recovery Time (Note 4)
Notes :
(1) Ttp = 55 °C; averaged over any 20 ms period; see Fig. 1and 3.
(2) Tamb = 60 °C; printed-circuit board mounting ;averaged over any 20 ms period; see Fig. 2 and 3.
(3) t=10ms half sine wave; Tj = Tjmax prior to surge; VR = VRRMmax.
(4) Reverse Recovery Test Conditions : I F = 0.5 A, IR = 1.0 A, Irr = 0.25 A.
(5) Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥ 40 μm.
Page 1 of 2
Rev. 01 : November 11, 2006
Certificate TH97/10561QM
Certificate TW00/17276EM
RATING AND CHARACTERISTIC CURVES ( BYD1100 )
CURRENT AS A FUNCTION OF AMBIENT TEMPERATURE
4
3
2
1
0
0
40
80
120
160
200
AVERAGE FORWARD CURRENT, I F(AV)
(A)
FIG.2 - MAXIMUM PERMISSIBLE AVERAGE FORWARD
CURRENT AS A FUNCTION OF TIE-POINT TEMPERATURE
AVERAGE FORWARD CURRENT, I F(AV)
(A)
FIG.1 - MAXIMUM PERMISSIBLE AVERAGE FORWARD
1.6
1.2
0.8
0.4
0
0
TIE-POINT TEMPERATURE, Ttp ( °C)
80
120
160
200
AMBIENT TEMPERATURE, Tamp ( °C)
FIG.3 - MAXIMUM STEADY STATE POWER DISSIPATION
FIG.4 - FORWARD CURRENT AS FUNCTION
AS A FUNCTION OF AVERAGE FORWARD CURRENT
2.0
OF FORWARD VOLTAGE
20
a =3
2.5
2
1.57
1.42
FORWARD CURRENT, I F (A)
POWER DISSIPATION, P D (W)
40
1.6
1.2
0.8
0.4
a = IF(RMS)/IF(AV) ; VR = V RRMmax; δ = 0.5
16
12
8
4
TJ = 25 °C
0
0
0
0.4
0.8
1.2
1.6
2.0
AVERAGE FORWARD CURRENT, I F(AV) (A)
0
1
2
3
4
FORWARD VOLTAGE, V F (V)
FIG.5 - REVERSE CURRENT AS FUNCTION OF
JUNCTION TEMPERATURE; MAXIMUM VALUES
REVERSE CURRENT, IR (μA)
1000
100
10
VR =V RRMmax
1
0
100
200
JUNCTION TEMPERATURE, T J ( °C)
Page 2 of 2
Rev. 01 : November 11, 2006