Certificate TH97/10561QM BYD1100 HYPER FAST SOFTRECOVERY RECTIFIER PRV : 100 Volts Io : 2.7 Amperes MELF (Plastic) Cathode Mark FEATURES : * * * * * * Certificate TW00/17276EM φ 0.102 (2.6) Glass passivated High maximum operating temperature Low leakage current Excellent stability Smallest surface mount rectifier outline Pb / RoHS Free 0.094 (2.4) 0.022(0.55) 0.205(5.2) 0.189(4.8) MECHANICAL DATA : * Case : Molded plastic * Terminals : Plated Terminals, solderable per MIL-STD-750 Method 2026 * Polarity : Color band denotes cathode end * Mounting position : Any * Weight : 0.116 gram Dimensions in inches and ( millimeters ) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Rating at 25 °C ambient temperature unless otherwise specifie d. RATING Maximum Repetitive Peak Reverse Voltage Maximum Continuous Reverse Voltage Min. Reverse Avalanche Breakdown Voltage @ IR = 0.1 mA Maximum Average Forward Current SYMBOL VALUE UNIT VRRM 100 V VR 100 V V(BR)R-min 120 V 2.7 IF(AV) (1) 0.85(2) A Maximum Non-Repetitive Peak Forward Surge Current (Note 3) IFSM 15 A Maximum Repetitive Peak Forward Current at Ttp = 105 °C IFRM 16 A Maximum Forward Voltage at I F = 1.0 A, T J = 25 °C VF 0.96 V Maximum Reverse Current at VR = VRRMmax TJ = 25 °C IR 5.0 μA TJ = 165 °C IR(H) 150 μA Trr 10 ns Thermal Resistance from Junction to Tie-Point Rth j-tp 30 K/W Thermal Resistance from Junction to Ambient (Note 5) Rth j-a 150 K/W Junction Temperature Range TJ - 65 to + 175 °C Storage Temperature Range TSTG - 65 to + 175 °C Maximum Reverse Recovery Time (Note 4) Notes : (1) Ttp = 55 °C; averaged over any 20 ms period; see Fig. 1and 3. (2) Tamb = 60 °C; printed-circuit board mounting ;averaged over any 20 ms period; see Fig. 2 and 3. (3) t=10ms half sine wave; Tj = Tjmax prior to surge; VR = VRRMmax. (4) Reverse Recovery Test Conditions : I F = 0.5 A, IR = 1.0 A, Irr = 0.25 A. (5) Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥ 40 μm. Page 1 of 2 Rev. 01 : November 11, 2006 Certificate TH97/10561QM Certificate TW00/17276EM RATING AND CHARACTERISTIC CURVES ( BYD1100 ) CURRENT AS A FUNCTION OF AMBIENT TEMPERATURE 4 3 2 1 0 0 40 80 120 160 200 AVERAGE FORWARD CURRENT, I F(AV) (A) FIG.2 - MAXIMUM PERMISSIBLE AVERAGE FORWARD CURRENT AS A FUNCTION OF TIE-POINT TEMPERATURE AVERAGE FORWARD CURRENT, I F(AV) (A) FIG.1 - MAXIMUM PERMISSIBLE AVERAGE FORWARD 1.6 1.2 0.8 0.4 0 0 TIE-POINT TEMPERATURE, Ttp ( °C) 80 120 160 200 AMBIENT TEMPERATURE, Tamp ( °C) FIG.3 - MAXIMUM STEADY STATE POWER DISSIPATION FIG.4 - FORWARD CURRENT AS FUNCTION AS A FUNCTION OF AVERAGE FORWARD CURRENT 2.0 OF FORWARD VOLTAGE 20 a =3 2.5 2 1.57 1.42 FORWARD CURRENT, I F (A) POWER DISSIPATION, P D (W) 40 1.6 1.2 0.8 0.4 a = IF(RMS)/IF(AV) ; VR = V RRMmax; δ = 0.5 16 12 8 4 TJ = 25 °C 0 0 0 0.4 0.8 1.2 1.6 2.0 AVERAGE FORWARD CURRENT, I F(AV) (A) 0 1 2 3 4 FORWARD VOLTAGE, V F (V) FIG.5 - REVERSE CURRENT AS FUNCTION OF JUNCTION TEMPERATURE; MAXIMUM VALUES REVERSE CURRENT, IR (μA) 1000 100 10 VR =V RRMmax 1 0 100 200 JUNCTION TEMPERATURE, T J ( °C) Page 2 of 2 Rev. 01 : November 11, 2006