TH09/2479 TH97/2478 www.eicsemi.com BZG03-C10 ~ BZG03-C200 IATF 0113686 SGS TH07/1033 VOLTAGE REGULATOR DIODES SMA FEATURES : 2.3 2.1 5.65 5.35 * Excellent stability * Low leakage current 4.6 4.2 * Complete Voltage Range 10 to 200 Volts * High maximum operating temperature 1.5 1.1 0.2 * Pb / RoHS Free 2.5 2.1 2.9 2.5 MECHANICAL DATA : 0.27 0.13 * Case : SMA Molded plastic * Epoxy : UL94V-O rate flame retardant * Polarity : Color band denotes cathode end * Mounting position : Any * Weight : 0.060 gram (Approximately) 2.1 1.7 Dimensions in millimeters MAXIMUM RATINGS Rating at 25 °C ambient temperature unless otherwise specified Parameter Symbol Power dissipation Ptot Power dissipation Ptot PZSM Non-repetitive peak reverse Condition Ttp = 100 °C, see Fig. 1 Ta = 50 °C, see Fig. 1; device Min. Max. Unit - 3 W - 1.25 W - 600 W - 1.2 V mounted on an Al2O3 PCB (Fig. 4) tp = 100 µs; square pulse; Tj = 25°C prior to surge; see Fig. 2 IF = 0.5 A; Tj = 25 °C; see Fig. 3 Forward voltage VF Junction Temperature Range Tj -65 +175 °C Storage Temperature Range Tstg -65 +175 °C THERMAL CHARACTERISTICS Parameter Symbol Rth j-tp Value Unit 25 K/W 100 K/W , D P Thermal resistance from junction to tie-point Condition Thermal resistance from junction to ambient Rth j-a (Note 1) Note 1. Device mounted on an Al2O3 printed-circuit board, 0.7 mm thick; thickness of Cu-layer ≥35 µm, see Fig.4. Page 1 of 3 Rev. 09 : February 25, 2013 TH09/2479 TH97/2478 www.eicsemi.com IATF 0113686 SGS TH07/1033 ELECTRICAL CHARACTERISTICS Rating at Tj = 25 °C unless otherwise specified Type No. Working Voltage Differental VZ @ IZ Marking Code Temperature Test Maximum Reverse Resistance Coefficient Current Leakage Current rdiff(Ω) at IZ SZ (%/K) at IZ IZ IR @ V R Min. Nom. Max. Typ. Max. Min. Max. (mA) (mA) (V) BZG03-C10 C10 9.4 10 10.6 2 4 0.05 0.09 50 7.0 7.5 BZG03-C11 C11 10.4 11 11.6 4 7 0.05 0.10 50 4.0 8.2 BZG03-C12 C12 11.4 12 12.7 4 7 0.05 0.10 50 3.0 9.1 BZG03-C13 C13 12.4 13 14.1 5 10 0.05 0.10 50 2.0 10 BZG03-C15 C15 13.8 15 15.6 5 10 0.05 0.10 50 1.0 11 BZG03-C16 C16 15.3 16 17.1 6 15 0.05 0.11 25 1.0 12 BZG03-C18 C18 16.8 18 19.1 6 15 0.06 0.11 25 1.0 13 BZG03-C20 C20 18.8 20 21.2 6 15 0.06 0.11 25 1.0 15 BZG03-C22 C22 20.8 22 23.3 6 15 0.06 0.11 25 1.0 16 BZG03-C24 C24 22.8 24 25.6 7 15 0.06 0.11 25 1.0 18 BZG03-C27 C27 25.1 27 28.9 7 15 0.06 0.11 25 1.0 20 BZG03-C30 C30 28 30 32 8 15 0.06 0.11 25 1.0 22 BZG03-C33 C33 31 33 35 8 15 0.06 0.11 25 1.0 24 BZG03-C36 C36 34 36 38 21 40 0.06 0.11 10 1.0 27 BZG03-C39 C39 37 39 41 21 40 0.06 0.11 10 1.0 30 BZG03-C43 C43 40 43 46 24 45 0.07 0.12 10 1.0 33 BZG03-C47 C47 44 47 50 24 45 0.07 0.12 10 1.0 36 BZG03-C51 C51 48 51 54 25 60 0.07 0.12 10 1.0 39 BZG03-C56 C56 52 56 60 25 60 0.07 0.12 10 1.0 43 BZG03-C62 C62 58 62 66 25 80 0.08 0.13 10 1.0 47 BZG03-C68 C68 64 68 72 25 80 0.08 0.13 10 1.0 51 BZG03-C75 C75 70 75 79 30 100 0.08 0.13 10 1.0 56 BZG03-C82 C82 77 82 87 30 100 0.08 0.13 10 1.0 62 BZG03-C91 C91 85 91 96 60 200 0.09 0.13 5 1.0 68 BZG03-C100 C100 94 100 106 60 200 0.09 0.13 5 1.0 75 BZG03-C110 C110 104 110 116 80 250 0.09 0.13 5 1.0 82 BZG03-C120 C120 114 120 127 80 250 0.09 0.13 5 1.0 91 BZG03-C130 C130 124 130 141 110 300 0.09 0.13 5 1.0 100 BZG03-C150 C150 138 150 156 130 300 0.09 0.13 5 1.0 110 BZG03-C160 C160 153 160 171 150 350 0.09 0.13 5 1.0 120 BZG03-C180 C180 168 180 191 180 400 0.09 0.13 5 1.0 130 BZG03-C200 C200 188 200 212 200 500 0.09 0.13 5 1.0 150 Page 2 of 3 Rev. 09 : February 25, 2013 TH09/2479 TH97/2478 www.eicsemi.com IATF 0113686 SGS TH07/1033 RATING AND CHARACTERISTIC CURVES ( BZG03-C10 ~ BZG03-C200 ) FIG.1 - Maximum total power dissipation as a function of temperature. Ptot (W) FIG.2 - Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse). 4 PZSM (W) 104 3 103 2 102 1 10 10-2 0 100 0 T, (°C) 175 Solid line: tie-point temperature. Dotted line: ambient temperature; device mounted on an Al2O3 PCB as shown in Fig.5. 1 10-1 tp (ms) 10 Tj= 25 °C prior to surge. FIG. 3 - Forward current as a function of forward voltage; typical values. FIG.4 - Printed-circuit board for surface mounting. 50 3 IF (A) 4.5 2 50 □ 2.5 1 1.25 0 0 1 VF (V) 2 Dimensions in mm. Tj= 25 °C. Page 3 of 3 Rev. 09 : February 25, 2013