Model BD2425N100ATI

Model BD2425N100ATI
Rev A
Impedance Matched Ultra Low profile 0404
Balun for TI CC2530 chipset
(Anaren Application Note Ann-2004)
Description
The BD2425N100ATI is a low cost, low profile sub-miniature unbalanced to
balanced transformer specifically designed for differential inputs and output
locations Texas Instruments CC2530 SoC Solution in an easy to use surface
mount package. The BD2425N100ATI is ideal for high volume
manufacturing and delivers higher performance than traditional ceramic
baluns. This transformation enables single ended signals to be applied to
differential ports on the CC2530. The output ports have equal amplitude (3dB) with 180 degree phase differential. The BD2425N100ATI is available
on tape and reel for pick and place high volume manufacturing.
Detailed Electrical Specifications: Specifications subject to change without notice.
Features:
ROOM (25°°C)
• 2400 – 2500 MHz
Parameter
Min.
Typ.
Max
• Matched to TI CC2530 SoC
Frequency
2300
2600
• 0.57mm Height Profile
Unbalanced Port Impedance*
50
• Low Insertion Loss
• Surface Mountable
Balanced Port Impedance*
Matched
• Tape & Reel
Return Loss*
17.3
23.6
• Non-conductive Top Surface
Insertion Loss**
0.68
0.84
• RoHS Compliant
Power
Handling
1.0
• Zigbee, RF4CE
Unit
MHz
Ω
Ω
dB
dB
Watts
• Halogen Free
Operating Temperature
-55
+85
ºC
*Specification based on performance of unit properly installed on microstrip printed circuit boards with 50 Ω nominal impedance.
** Insertion Loss stated at room temperature (Insertion Loss is approximately 0.1dB higher at +85°C
Outline Drawing
Top View (Near-side)
Side View
Bottom View (Far-side)
.24
.57±.05
1.04±.10
3x .27
1
2
.24
3x .27
.30
.30
1.04±.10
.50
3x .25
3
4
3x .25
Pin Designation
GND / DC Feed
1
+ RF GND
Dimensions are in Millimeters
Mechanical Outline
.50
2 Unbalanced Port
3 Balanced Port
4 Balanced Port
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Model BD2425N100ATI
Rev A
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines must be
used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR may not meet
published specifications.
All of the Xinger components are constructed from organic PTFE based composites which possess excellent
electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green standards and
ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.
An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the
transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as varying
pick and place equipment tolerances.
Circuit Pattern
Plated thru
hole to
ground
Footprint Pad (s)
Solder Resist
0402
Capacitor
.33
3x .29
3x .29
.50 .22
.22
Transmission Line
3x
.50
0402
Inductor
Dimensions are in Millimeters
Mounting Footprint
Visit us at
www.Anaren.com
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 432-8909
(800) 411-6596
+44 2392-232392
+86 512-62749282
Model BD2425N100ATI
Rev A
Packaging and Ordering Information
Parts are available in reel and are packaged per EIA 481-2. Parts are oriented in tape and reel as shown below. Minimum order
quantities are 4000 per reel. See Model Numbers below for further ordering information.
2.00
4.00
Ø1.50
.18
1.75
3.50
8.00
1.21
1.21
4.00
.70
Visit us at
www.Anaren.com
USA/Canada:
Toll Free:
Europe:
Asia:
(315) 432-8909
(800) 411-6596
+44 2392-232392
+86 512-62749282