Comchip Soldering Information SMD Diode Specialist Min reflow profile requirements for solderability testing Parameter Reference Specification Average temperature gradient in preheating 2.5 OC/S tsoak 2-3 minutes Time above 217 OC t1 Max 30 sec Peak temperature in reflow T2 230 OC(-0/+5 OC) Time at peak temperature t2 10s Soak time Max -6 OC/s Temperature gradient in cooling Temperature T2 T1 tsoak t2 Time t1 Figure 1. Reflow profile for solderability testing. REV:U Page 9 QW-1109 Comchip Technology CO., LTD. Comchip Soldering Information SMD Diode Specialist Max reflow profile requirements for solderability testing Parameter Reference Specification Average temperature gradient in preheating 2.5 OC/s tsoak 2-3 minutes Time above 217 OC t1 Max 60 sec Time above 230 OC t2 Max 50 sec Time above 250 OC t3 Max 10 sec Soak time Peak temperature in reflow Tpeak 260 OC(-5/+0 OC) Max -6 OC/s Temperature gradient in cooling Note: 1. Can withstand maximum of 3 cycles of profile above. Temperature Tpeak T3 T2 T1 tsoak t3 t2 t1 Time Figure 2. Reflow profile for soldering heat resistance testing. REV:U Page 10 QW-1109 Comchip Technology CO., LTD.