AME8570

REL-1221 -A-A
Reliability Report
for
AME8570 Series Product
Approved by
Prepared by
Amy Shen
Quality & Reliability Dept.
Manager
Eric Chen
Quality & Reliability Dept.
Engineer
Conclusion:
The AME8570 series product has successfully met AME’s reliability standard that is required on all
AME, Inc products.
Furthermore, QRA Dept. of AME, Inc monitors the reliability continuously to make sure that all
AME8570 series product will still meet AME’s reliability standard in the future.
Table of Contents:
Ⅰ、General Description
Ⅱ、Product Information
Ⅲ、Failures In Time Calculation
Ⅳ、Product Reliability Test Result
Ⅴ、Package Reliability Test Result
Ⅵ、IR-reflow Test Result
Ⅰ、General Description:
The AME8570 family allows the user to customize the CPU reset function without any external
components.The user has serveral choice of reset voltage thresholds, reset time intervals, and output
driver configurations, all of which are preset at the factory.
These circuits monitor the power supply voltage of µP based systems. When the power supply
voltage drops below the voltage threshold a reset is asserted immediately ( within an interval TD1 ). The
reset remains asserted after the supply voltage rises above the voltage threshold for a time interval, TD2.
The reset output may be either active high ( RESET ) or active low ( RESETB ). The reset output may be
configured as either push/pull or open drain. The state of the reset output is guaranteed
to be correct only when supply voltage is greater than 1V.
The AME8570 also provide a reset manually by pulling the MRB input to ground.
Space saving SC-70 package and micropower quiescent current ( < 3.0µA ) make this family a
natural for portable battery powered equipment.
Ⅱ、Product Information:
Operating
Pin
Ambient
Package
Configuration
Temperature
Type
Range
A: SOT-23
TSOT-23
SC-70-3
1. GND
2. Reset/
ResetB
3. IN
B: SOT-23
TSOT-23
1. Reset/
ResetB
2. GND
3. IN
C: SOT-23
TSOT-23
1. Reset/
ResetB
2. IN
3. GND
A: SC-70-4
1. GND
2. Reset/
ResetB
3. MRB
4. IN
E:-40℃ to 85℃ E: SOT-2X
I: SC-70
Numb
er of
Reset Time
VIN Threshold
Special
(TD2NOM)
Voltage (VTH)
Feature
16: VTH=1.60V
20: VTH=2.00V
21: VTH=2.10V
23: VTH=2.32V
26: VTH=2.63V
27: VTH=2.70V
28: VTH=2.80V
29: VTH=2.93V
31: VTH=3.08V
40: VTH=4.00V
44: VTH=4.38V
46: VTH=4.63V
Y: Lead free &
Output Options
Pins
T: 3
A: RESETB/PP
A: 1.5ms
U: 5
B: RESETB/OD
E: 150ms
C: RESET/PP
F: 210ms
(RESET=Active High)
(RESETB=Active Low)
(PP=Push-pull out)
(OD=Open-Drain output)
Low profile
Z: Lead free
Ⅲ、Failures In Time Calculation:
Use HTOL test information mentioned in sectionⅣ, FIT (Failures In Time) can be calculated as below:
FIT = ( x 2 (ν ,
CL )
× 10 9 ) /( 2 × S × H × AF ) = ( 4 .61 × 10 9 ) /( 2 × 77 × 1000 × 280 .59 )
=106.69 (pieces per 109 hours) @ 40℃ with 90% Confidence Level.
Where AF is acceleration factor setting activation energy to 1.0eV as zero failure.
Ⅳ、Product Reliability Test Result:
Test Item
HTOL
Test Condition
Precondition
NOTE 1
Sample Size / Failures
Result
77 pcs / 0 pcs
Pass
3 pcs per pin pair / 0 pcs
Pass
3 pcs per pin pair / 0 pcs
Pass
3 pcs per pin pair / 0 pcs
Pass
TSTRESS=125℃
Duration=1000hrs
Biased, Read at
168/504/1000 hours
ESD
Human Body Model
Pin-to-Pin test
Level 2, 2kV minimum
ESD
Machine Model
Pin-to-Pin test
Level 2, 200V minimum
Latch-up
Level 3, 100mA minimum
NOTE 1: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 245℃ (leaded) or 260℃ (lead-free).
Ⅴ、Package Reliability Test Result:
Test Item
Test Condition
Sample Size / Failures
Result
MSL
85/85 168 hours
22 pcs / 0 pcs
Level 1
45 pcs / 0 pcs
Pass
45 pcs / 0 pcs
Pass
45 pcs / 0 pcs
Pass
45 pcs / 0 pcs
Pass
45 pcs / 0 pcs
Pass
5 pcs / 0 pcs
Pass
IR-reflow 3 cycles
Peak Temp.= 260℃ (lead-free)
IPC/JEDEC J-STD-020C
HTS
Precondition NOTE 2
Temp.=150℃
Duration=1000 hours
Unbiased, Read at
168/504/1000 hours
THT
Precondition NOTE 2
Temp.=85℃, R.H.=85%
Duration=1000 hours
Unbiased, Read at
168/504/1000 hours
PCT
Precondition NOTE 2
Temp.=121℃, R.H.=100%
15PSIG, Unbiased
Duration=168 hours
Read at 168 hours
TCT
Precondition NOTE 2
-65℃ ~ 150℃
1000 cycles
Unbiased, Read at
500/1000 cycles
TST
PreconditionNOTE 2
-55℃~ 125℃
200 cycles Unbiased,
Dwell time:5min
Read at 200 cycles
Solderability
Temp.=245℃ (leaded)
Temp.=260℃ (lead-free)
Duration=5sec
NOTE 2: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 245℃ (leaded) or 260℃ (lead-free).
Ⅵ、IR-reflow Test Result:
Test Item
Test Condition
Sample Size / Failures
Result
IR-reflow
See IR reflow Profile
22 pcs / 0 pcs
Pass
Perform 3 cycles test
IR reflow Profile:
Profile Feature
Average Ramp-Up Rate
(Tsmax to Tp)
-
Preheat
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
Time maintained above
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5℃ of actual Peak
Temperature (tp)
Ramp-Down Rate
Time 25℃ to Peak Temperature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3℃/second max.
3℃/second max.
100℃
150℃
60~120 seconds
150℃
200℃
60~180 seconds
183℃
60~150 seconds
217℃
60~150 seconds
245℃
260℃
10~30 seconds
20~40 seconds
6℃/second max.
6 minutes max.
6℃/second max.
8 minutes max.