AME8831

REL-1009 -A-A
Reliability Report
for
AME8831 Series Product
Approved by
Prepared by
Amy Shen
Quality & Reliability Dept.
Manager
Eric Chen
Quality & Reliability Dept.
Engineer
Conclusion:
The AME8831 series product has successfully met AME’s reliability standard that is required on all
AME, Inc products.
Furthermore, QRA Dept. of AME, Inc monitors the reliability continuously to make sure that all
AME8831 series product will still meet AME’s reliability standard in the future.
Table of Contents:
Ⅰ、General Description
Ⅱ、Product Information
Ⅲ、Failures In Time Calculation
Ⅳ、Product Reliability Test Result
Ⅴ、Package Reliability Test Result
Ⅵ、IR-reflow Test Result
Ⅰ、General Description:
The AME8831 family of positive, linear regulators feature low quiescent current (17µA typ.) with low
dropout voltage, making them ideal for battery applications. The space-saving SOT-25 packages are
attractive for “Pocket” and “Hand Held”applications.
These rugged devices have both Thermal Shutdown, and Current Limitation to prevent device failure
under the “Worst” operating conditions. In application requires a low noise regulated supply. The
AME8831 family uses the SR pin to program the output voltage’s slew rate to control the in-rush current.
This is specifically used in the USB application where large load capacitance is present at start-up.
The AME8831 also features a logic-enabled sleep mode to shutdown the regulator, reducing
quiescent current to 1µA typical at TA= 25oC.
The AME8831 is stable with an output capacitance of 4.7µF or larger.
Ⅱ、Product Information:
Product Grade Operating Ambient
or Opition
Temperature Range
A: 1.IN
E:-40℃ to 85℃
(SOT-25) 2.GND
3.ENB
4.SR
5.OUT
Package
Number
Output
Type
of Pins
Voltage
V: 5
180: V=1.8V
Y:Lead free & Low profile
250: V=2.5V
Z: Lead Free
E: SOT-2X
285: V=2.85V
300: V=3.0V
B:
(SOT-25)
1.IN
2.GND
3.EN
4.SR
5.OUT
330: V=3.3V
Special Feature
Ⅲ、Failures In Time Calculation:
Use HTOL test information mentioned in sectionⅣ, FIT (Failures In Time) can be calculated as below:
FIT = ( x 2 (ν ,
CL )
× 10 9 ) /( 2 × S × H × AF ) = ( 4 .61 × 10 9 ) /( 2 × 77 × 1000 × 280 .59 )
=106.69 (pieces per 109 hours) @ 40℃ with 90% Confidence Level.
Where AF is acceleration factor setting activation energy to 1.0eV as zero failure.
Ⅳ、Product Reliability Test Result:
Test Item
HTOL
Test Condition
Precondition
NOTE 1
Sample Size / Failures
Result
77 pcs / 0 pcs
Pass
3 pcs per pin pair / 0 pcs
Pass
3 pcs per pin pair / 0 pcs
Pass
TSTRESS=125℃
Duration=1000hrs
Biased, Read at
168/504/1000 hours
ESD
Human Body Model
Pin-to-Pin test
Level 2, 2kV minimum
Machine Model
Pin-to-Pin test
Level 2, 200V minimum
Latch-up
Level 3, 100mA minimum
3 pcs per pin pair / 0 pcs
Pass
NOTE 1: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 245℃ (leaded) or 260℃ (lead-free).
Ⅴ、Package Reliability Test Result:
Test Item
Test Condition
Sample Size / Failures
Result
MSL
85/85 168 hours
22 pcs / 0 pcs
Level 1
45 pcs / 0 pcs
Pass
45 pcs / 0 pcs
Pass
45 pcs / 0 pcs
Pass
45 pcs / 0 pcs
Pass
5 pcs / 0 pcs
Pass
IR-reflow 3 cycles
Peak Temp.= 260℃ (lead-free)
IPC/JEDEC J-STD-020C
HTS
Precondition NOTE 2
Temp.=150℃
Duration=1000 hours
Unbiased, Read at
168/504/1000 hours
THT
Precondition NOTE 2
Temp.=85℃, R.H.=85%
Duration=1000 hours
Unbiased, Read at
168/504/1000 hours
PCT
Precondition NOTE 2
Temp.=121℃, R.H.=100%
15PSIG, Unbiased
Duration=168 hours
Read at 168 hours
TCT
Precondition NOTE 2
-65℃ ~ 150℃
1000 cycles
Unbiased, Read at
500/1000 cycles
Solderability
Temp.=245℃ (leaded)
Temp.=260℃ (lead-free)
Duration=5sec
NOTE 2: 85/85 168 hours + IR-reflow 3 cycles with Peak Temp.= 245℃ (leaded) or 260℃ (lead-free).
Ⅵ、IR-reflow Test Result:
Test Item
Test Condition
Sample Size / Failures
Result
IR-reflow
See IR reflow Profile
22 pcs / 0 pcs
Pass
Perform 3 cycles test
IR reflow Profile:
Profile Feature
Average Ramp-Up Rate
(Tsmax to Tp)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (tsmin to tsmax)
Time maintained above
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5℃ of actual Peak
Temperature (tp)
Ramp-Down Rate
Time 25℃ to Peak Temperature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3℃/second max.
3℃/second max.
100℃
150℃
60~120 seconds
150℃
200℃
60~180 seconds
183℃
60~150 seconds
245℃
217℃
60~150 seconds
260℃
10~30 seconds
20~40 seconds
6℃/second max.
6 minutes max.
6℃/second max.
8 minutes max.