RL2550W(1W)

DOCUMENT : SM560000NH
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SPECIFICATION FOR APPROVAL
1W, 2010, Low Resistance Chip Resistor (Lead / Halogen Free)
1. Scope
This specification applies to 2.5mm x 5.0mm size 1W, fixed metal film chip resistors rectangular type
for use in electronic equipment.
2. Type Designation
RL2550
(1)
Where
W - □□□□
(3)
(2)
(1) Series No.
□
(4)
(2) W = W Type
(3) Resistance value :
For example - R005 = 5mΩ
R050 = 50mΩ
(4) Resistance tolerance
F = ± 1%
G = ± 2%
J = ± 5%
3. Outline Construction and Marking
3-1 Outline Construction
(5)
L
(4)
(3)
(1)
(2)
(3)
(4)
(5)
Substrate
Resistor
Terminals
Protection coat
Marking
R005
W
Alumina 96%
Cu alloy
Sn (on Cu )
Heat resistive epoxy resin
Epoxy resin
Dimensions (mm)
(2)
Code Letter
RL2550
t
(Bottom View)
a
a
L
5.0 ± 0.20
W
a
t
2.5 ± 0.20
1.00 ± 0.15
(1)
Figure 1. Construction and Dimensions
0.80 ± 0.15
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SPECIFICATION FOR APPROVAL
3-2 Marking
Resistance value is marked on the top surface.
Ex.) 5mΩ → R005
50mΩ → R050
4. Ratings
4-1 Specification
Power Rating*
1W
Resistance Value
5 ~ 50mΩ
(≤10mΩ) ±100ppm/℃
(>10mΩ) ± 50ppm/℃
Temperature Coefficient of Resistance
Resistance Tolerance
±1% , ± 2% , ±5%
Insulation Resistance
Over 100MΩ
( P*R)1/2
Maximum Working Voltage (V)
Note * :
Power rating is based on continuous full load operation at rated ambient temperature of 70℃.
For resistors operated at ambient temperature in excess of 70℃, the maximum load shall be
RATED LOAD(%)
derated in accordance with the following curve.
100
0
70
-55
125
AMBIENT TEMPERATURE(℃)
Figure 2.:Power Temperature Derating Curve
4-2 Rated Voltage
The rated voltage shall be determined by the following expression.
V = P× R
Where V:Rated voltage (V)
R:Nominal resistance value (Ω)
P:Rated dissipation (W)
4-3 Operation and Storage Temperature Range
-55℃ to
+125℃
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SPECIFICATION FOR APPROVAL
5. Schematic Diagram. Measurement Point
Schtemtic Diagram
Measurement Point
V
R050
I
V
I
V
Current terminal
I
Voltage terminal
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SPECIFICATION FOR APPROVAL
6. Characteristics
Test Item
Condition of Test
Requirements
Short Time Overload
2.5 * rated voltage for 5 seconds
Refer to JIS C 5201-1 4.13
∆R : ± (0.5%+0.0005Ω)
Without significant damage by
flashover ( spark, arching ), burning
or breakdown etc.
Insulation Resistance
The resistor shall be cramped in the
metal block and tested , as shown below.
Test voltage : 100 ± 15VDC for 1 minute
Refer to JIS C 5201-1 4.6 Mounting
condition G.
Between Electrode and Protection
Film 100MΩ or over
Between Electrode and Substrate
1,000MΩ or over
Voltage Proof
The voltage : 100VAC (rms.) for 1 minute ∆R : ± (0.5%+0.0005Ω)
Refer to JIS C 5201-1 4.7
Without damage by flashover, fire
or breakdown, as shown below.
Thermal Shock
-55 ~125℃ 5 cycles, 15 min at each
extreme condition
Refer to JIS C 5201-1 4.19
∆R : ± (1.0%+0.0005Ω)
Without distinct damage in
appearance
Low Temperature Storage
Kept at -55℃, 1,000 hours
Refer to JIS C 5201-1 4.23.4
∆R : ± (1.0%+0.0005Ω)
Without distinct damage in
appearance
High Temperature Exposure
Kept at 125℃ for 1,000 hours
Refer to JIS C 5201-1 4.23.2
∆R : ± (1.0%+0.0005Ω)
Without distinct damage in
appearance
Solderability
Temperature of Solder : 245 ± 5℃
Immersion Duration : 3 ± 0.5 second
Refer to JIS C 5201-1 4.17
Uniform coating of solder cover
minimum of 95% surface being
immersed
Resistance to Soldering Heat
Dipped into solder at 270 ± 5℃
for 10 ± 1 seconds
Refer to JIS C 5201-1 4.18
∆R : ± (0.5%+0.0005Ω)
Without distinct deformation in
appearance
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SPECIFICATION FOR APPROVAL
Test Item
Condition of Test
Requirements
Load Life
Rated voltage for 1.5 hours followed by a
pause 0.5 hour at 70 ± 2℃.
Cycle repeated 1000 hours
Refer to JIS C 5201-1 4.25
∆R : ± (1.0%+0.0005Ω)
Without distinct damage in
appearance
Damp Heat with Load
40 ± 2℃ with relative humidity 90% to
95%. D.C. rated voltage for 1.5 hours
ON and 30 minutes OFF. Cycle
repeated 1,000 hours
Refer to JIS C 5201-1 4.24
∆R : ± (0.5%+0.0005Ω)
Without distinct damage in
appearance
Mechanical Shock
100 G’s for 6milliseconds. 5 pulses
Refer to JIS C 5201-1 4.21
∆R : ± (0.5%+0.0005Ω)
Without mechanical damage such
as break
Bending Test
Glass-Epoxy board thickness : 1.6mm
Bending width : 2mm
Between the fulcrums : 90mm
Refer to JIS C 5201-1 4.33
∆R : ±(0.5%+0.0005Ω)
Without mechanical damage such
as break
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SPECIFICATION FOR APPROVAL
7. Recommended Solder Pad Dimensions
L
2550
W
L
D
3.05
6.12
1.56
D
W
Unit : mm
Cu Trace
Sensing Trace
Note : We recommend there is no circuit design
between pads to avoid circuit short
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SPECIFICATION FOR APPROVAL
8. Packaging
8-1 Dimensions
8-1-1 Tape packaging dimensions
1.55 ± 0.05
0.23±0.10
4.0 ± 0.10
1.75 ± 0.10
2.0 ± 0.05
5.50 ± 0.05
5.35 ± 0.10
12.0 ± 0.30
1.05±0.10
4.0 ± 0.10
2.80 ± 0.10
1.50±0.1
Pulling direction
Unit : mm
8-1-2 Reel dimensions
13.0±0.5
4.0
0 +0
- 0 .5
2.0±0.5
178.0±2.0
60.2±0.5
13.2±1.5
16.0±0.2
Unit : mm
DOCUMENT : SM560000NH
SPECIFICATION FOR APPROVAL
8-2 Peel Strength of Top Cover Tape
The peel speed shall be about 300mm/minute
The peel force of top cover tape shall between 0.1 to 0.7N
Top Cover Tape
165 ~ 180°
0.1 ~ 0.7N
Carrier tape
8-3 Number of Taping
2,000 pieces / reel
8-4 Label marking
The following items shall be marked on the reel.
(1) Type designation
(2) Quantity
(3) Manufacturing date code
(4) Manufacturer’s name
(5) The country of origin
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