RL32649C(2W)

DOCUMENT : SM990000NH
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SPECIFICATION FOR APPROVAL
2W, 2512, L Type Low Resistance Chip Resistor (Lead free / Halogen Free)
1. Scope
This specification applies to 3.2mm x 6.4mm size 2W, fixed metal foil current sensing resistors used
in electronic equipment.
2. Type Designation
RL32649C
– □□□□ – □
(1)
(2)
(3)
Where
(1) Series No.
(2) Resistance value :
For example :
Four digits of number
R001 = 1mΩ
R002 = 2mΩ
(3) Tolerance :
Refer to paragraph 4
3. Dimensions and schematic
L
W
t
a
Code
Letter
Dimensions (mm)
L
6.35 ± 0.25
W
3.20 ± 0.20
a
a
3264
(1mΩ)
(2mΩ)
t
Figure 1. Construction and Dimensions
2.30 ± 0.15
1.45 ± 0.15
0.70 ± 0.15
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4. Specification
Characteristics
Feature
Power Rating*
2W
Resistance Value
1~2 mΩ
Temperature Coefficient of Resistance
± 75ppm/℃
Operation Temperature Range
-55℃ ~ +170℃
Resistance Tolerance
± 1%(F) , ± 2%(G) , ± 5%(J)
Insulation Resistance
Over 100MΩ
( P*R)1/2
Maximum Working Voltage (V)
RATED LOAD(%)
Note * :
Power rating is based on continuous full load operation at rated ambient temperature of 70℃. For
resistors operated at ambient temperature in excess of 70℃, the maximum load shall be derated in
accordance with the following curve.
100
0
-55
70
170
AMBIENT TEMPERATURE(℃)
Figure 2.:Power Temperature Derating Curve
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5. Reliability Performance
Test Item
Short Time Overload
Condition of Test
2.5 x Rated power for 5 seconds
Refer to JIS C 5201-1 4.13
Thermal Shock
Requirements
ΔR:± (0.5% + 0.0005Ω)
-55 ~150℃ 1,000 cycles, 15 min at each extreme
condition
ΔR:± (0.5% + 0.0005Ω)
Refer to JIS C 5201-1 4.19
Low Temperature Storage
Kept at -55℃, 1,000 hours
Refer to JIS C 5201-1 4.23.4
Resistance to Soldering Heat
ΔR:± (0.5% + 0.0005Ω)
Dipped into solder at 270 ± 5℃ for
20 ± 1 seconds
ΔR:± (0.5% + 0.0005Ω)
Refer to JIS C 5201-1 4.18
Load Life
Rated voltage for 1.5hours followed by a pause
0.5hour at 70 ± 3℃
Cycle repeated 1,000 hours
ΔR:± (1.0% + 0.0005Ω)
Refer to JIS C 5201-1 4.25
Damp Heat with Load
40 ± 2℃ with relative humidity 90% to 95%.
D.C. rated voltage for 1.5 hours ON 30
minutes OFF.
ΔR:± (1.0% + 0.0005Ω)
Cycle repeated 1,000 hours
Refer to JIS C 5201-1 4.24
High Temperature Exposure
Kept at 170℃ for 1,000 hours
Refer to JIS C 5201-1 4.23.2
Solderability
Mechanical Shock
Temperature of Solder : 245 ± 5℃
Uniform coating of solder
Immersion Duration : 3 ± 0.5 second
cover minimum of 95%
Refer to JIS C 5201-1 4.17
surface being immersed
100 G’s for 6milliseconds. 5 pulses
ΔR:± (0.5% + 0.0005Ω)
Refer to JIS C 5201-1 4.21
Substrate Bending
ΔR:± (1.0% + 0.0005Ω)
Glass-Epoxy board thickness : 1.6mm
Bending width : 2mm
Between the fulcrums : 90mm
Refer to JIS C 5201-1 4.33
ΔR:± (0.5% + 0.0005Ω)
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6. Recommended Solder Pad Dimensions
L
D
3264
W
L
D
4.00
8.00
3.35
W
Cu Trace
Sensing Trace
Note : We recommend there is no circuit design between pads to avoid circuit short
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7. Packaging
7-1 Dimensions
7-1-1 Tape packaging dimensions
0.3 max.
1.5+0.1
-0.0
4.0 ± 0.1
2.0 ± 0.05
Feed forward hole
1.5 ± 0.1
1.75 ± 0.10
5.50 ± 0.05
B
12.0 ± 0.3
1.5 max.
A
Cavity
4.0 ± 0.1
Pulling direction
A = 3.40 ± 0.20
B = 6.70 ± 0.20
Unit : mm
7-1-2 Reel dimensions
13.0±0.5
4.0
0
+0
-0 .5
2.0±0.5
178.0±2.0
60.2±0.5
13.2±1.5
16.0±0.2
Unit : mm
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SPECIFICATION FOR APPROVAL
7-2 Peel Strength of Top Cover Tape
The peel speed shall be about 300mm/min.
The peel force of top cover tape shall between 0.1 to 0.7N
Top Cover Tape
165 ~ 180°
0.1 ~ 0.7N
Carrier tape
7-3 Number of Taping
2,000 pieces / reel
7-4 Label marking
The following items shall be marked on the reel.
(1) Type designation
(2) Quantity
(3) Manufacturing date code
(4) Manufacturer’s name
(5) The country of origin