IDT74FST163209 ADVANCE INFORMATION 9-BIT BUS EXCHANGE SWITCH Integrated Device Technology, Inc. or source capability. Thus they generate little or no noise of their own while providing a low resistance path for an external driver. These devices connect input and output ports through an n-channel FET. When the gate-to-source junction of this FET is adequately forward-biased the device conducts and the resistance between input and output ports is small. Without adequate bias on the gate-to-source junction of the FET, the FET is turned off, therefore with no VCC applied, the device has hot insertion capability. The low on-resistance and simplicity of the connection between input and output ports reduces the delay in this path to close to zero. The FST163209 provides four 9-bit TTL- compatible ports that support 2 way bus exchange. The S0-2 pins control the bus exchange and switch enable functions. FEATURES: • Bus switches provide zero delay paths • Extended commercial range of –40°C to +85°C • Low switch on-resistance: FST163xxx – 4Ω • TTL-compatible input and output levels • ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) • Available in SSOP, TSSOP and TVSOP DESCRIPTION: The FST163209 belongs to IDT's family of Bus switches. Bus switch devices perform the function of connecting or isolating two ports without providing any inherent current sink FUNCTIONAL BLOCK DIAGRAM 1 of 9 Channels 1A1 1B 1 1A2 1B 2 Flow Control S0 S1 3510 drw 01 S2 PIN DESCRIPTION Pin Names A1, A2 B1, B2 S0-2 I/O I/O I Description Buses A1, A2, B1, B2 Control Pins for Mux and Switch Enable Functions 3510 tbl 01 The IDT logo is a registered trademark of Integrated Device Technology, Inc. COMMERCIAL TEMPERATURE RANGE SEPTEMBER 1996 1996 Integrated Device Technology, Inc. DSC-3510/1 1 IDT74FST163209 9-BIT BUS EXCHANGE SWITCH COMMERCIAL TEMPERATURE RANGE ABSOLUTE MAXIMUM RATINGS(1) PIN CONFIGURATION Symbol Description VTERM(2) Terminal Voltage with Respect to GND TSTG Storage Temperature S0 1 48 S1 1 A1 2 47 S2 1 A2 3 46 1B1 GND 4 45 1B2 2 A1 5 44 2B1 2 A2 6 43 2B2 VCC 7 42 GND 3 A1 8 41 3B1 3 A2 9 40 3B2 GND 10 39 GND CAPACITANCE(1) 4 A1 11 38 4B1 Symbol 4 A2 12 37 4B2 SO48-1 SO48-2 SO48-3 36 5B1 14 35 5B2 GND 15 34 GND 6 A1 16 33 6B1 6 A2 17 32 6B2 7 A1 18 31 7B1 7 A2 19 30 7B2 GND 20 29 GND 8 A1 21 28 8B1 8 A2 22 27 8B2 9 A1 23 26 9B1 9 A2 24 25 9B2 5 A1 13 5 A2 I OUT Maximum Continuous Channel Current Max. –0.5 to +7.0 Unit V –65 to +150 °C 128 mA 3510 tbl 02 NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating condiitions for extended periods may affect reliability. 2. VCC, Control and Switch terminals. Conditions(2) Typ. Unit Parameter CIN Control Input Capacitance CI/O Switch Input/Output Capacitance 4 pF Switch Off pF 3510 tbl 03 NOTES: 1. Capacitance is characterized but not tested 2. TA = 25°C, f = 1MHz, VIN = 0V, VOUT = 0V FUNCTION TABLE S2 L S1 L S0 L A1 Z A2 Z Function Disconnect L L H B1 Z A1 to B1 L H L B2 Z A1 to B2 L H H Z B1 A2 to B1 H L L Z B2 A2 to B2 H L H Z Z Disconnect H H L B1 B2 A1 to B1, A2 to B2 H H H B2 B1 A1 to B2, A2 to B1 3510 tbl 04 SSOP/ TSSOP/TVSOP TOP VIEW 3510 drw 02 2 IDT74FST163209 9-BIT BUS EXCHANGE SWITCH COMMERCIAL TEMPERATURE RANGE DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE Following Conditions Apply Unless Otherwise Specified: Commercial: TA = –40°C to +85°C, VCC = 5.0V ±10% Symbol VIH Parameter Input HIGH Voltage Test Conditions(1) Guaranteed Logic HIGH for Control Inputs Min. 2.0 Typ.(2) — Max. — Unit V VIL Input LOW Voltage Guaranteed Logic LOW for Control Inputs — — 0.8 V II H Input HIGH Current VCC = Max. VI = VCC — — ±1 µA II L Input LOW Voltage VI = GND — — ±1 IOZH High Impedance Output Current VO = VCC — — ±1 IOZL (3-State Output pins) VO = GND — — ±1 IOS Short Circuit Current VCC = Max., VO = GND(3) — 300 — mA VIK Clamp Diode Voltage VCC = Min., IIN = –18mA — –0.7 –1.2 V RON Switch On Resistance(4) VCC = Min. VIN = 0.0V — 4 7 Ω — 4 7 Ω — 6 15 Ω µA VCC = Max. µA ION = 64mA VCC = Min. VIN = 0.0V ION = 30mA VCC = Min. VIN = 2.4V ION = 15mA IOFF Input/Output Power Off Leakage VCC = 0V, VIN or VO ≤ 4.5V — — ±1 ICC Quiescent Power Supply Current VCC = Max., VIN = GND or VCC — 0.1 3 NOTES: 1. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type. 2. Typical values are at VCC = 5.0V, +25°C ambient. 3. Not more than one output should be tested at one time. Duration of the test should not exceed one second. 4. Measured by voltage drop between ports at indicated current through the switch. 3 µA 3510 tbl 05 IDT74FST163209 9-BIT BUS EXCHANGE SWITCH COMMERCIAL TEMPERATURE RANGE POWER SUPPLY CHARACTERISTICS Symbol ∆ICC ICCD IC Parameter Quiescent Power Supply Current TTL Inputs HIGH Dynamic Power Supply Current(4) Total Power Supply Current (6) Test Conditions(1) VCC = Max. VIN = 3.4V(3) VCC = Max. Outputs Open Enable Pin Toggling 50% Duty Cycle VCC = Max. Outputs Open 3 Select Pins Toggling (9 Switches Toggling) fi = 10MHz 50% Duty Cycle Min. — Typ.(2) 0.5 Max. 1.5 Unit mA VIN = VCC VIN = GND — 30 40 µA/ MHz/ Switch VIN = VCC VIN = GND — 2.7 3.6 mA VIN = 3.4 VIN = GND — 3.5 5.9 NOTES: 1. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type. 2. Typical values are at VCC = 5.0V, +25°C ambient. 3. Per TTL driven input (VIN = 3.4V). All other inputs at VCC or GND. 4. This parameter is not directly testable, but is derived for use in Total Power Supply Calculations. 5. Values for these conditions are examples of the ICC formula. These limits are guaranteed but not tested. 6. IC = IQUIESCENT + IINPUTS + IDYNAMIC IC = ICC + ∆ICC DHNT + ICCD (fiN) ICC = Quiescent Current ∆ICC = Power Supply Current for a TTL High Input (VIN = 3.4V) DH = Duty Cycle for TTL Inputs High NT = Number of TTL Inputs at DH ICCD = Dynamic Current Caused by an Input Transition Pair (HLH or LHL) fi = Input Frequency N = Number of Switches Toggling at fi All currents are in milliamps and all frequencies are in megahertz. 3510 tbl 06 SWITCHING CHARACTERISTICS OVER OPERATING RANGE Following Conditions Apply Unless Otherwise Specified: Commercial: TA = –40°C to +85°C, VCC = 5.0V ±10% Symbol tPLH tPHL tBX tPZH tPZL tPHZ tPLZ |QCI| Description Data Propagation Delay A to B, B to A(3,4) Switch Multiplex Delay S to A, B Switch Turn on Delay S to A, B Switch Turn off Delay S to A, B Charge Injection, Typical(5,7) |QDCI| Charge Injection, Typical(6,7) Condition(1) CL = 50pF RL = 500Ω Min.(2) — Typ. — Max. 0.25 Unit ns 1.5 — 6.5 ns 1.5 — 6.5 ns 1.5 — 7 ns — 1.5 — pC — 0.5 — 3510 tbl 07 NOTES: 1. See test circuit and waveforms. 2. Minimum limits guaranteed but not tested. 3. This parameter is guaranteed by design but not tested. 4. The bus switch contributes no propagation delay other than the RC delay of the on resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 2.5ns for 50pF load. Since this time is constant and much smaller than the rise/fall times of typical driving signals, it adds very little propagation delay to the system. Propagation delay on the bus switch when used in a system is determined by the driving circuit on the driving side of the switch and its interaction with the load on the driven side. 5. Measured at switch turn off, load = 50 pF in parallel with 10 MΩ scope probe, VIN = 0.0 volts. 6. Measured at switch turn off through bus multiplexer, (e.g.- A1 to B1 = >A1 to B2), load = 50 pF in parallel with 10 MΩ scope probe, VIN at A = 0.0 volts. Charge injection is reduced because the injection from the turn off of the A to C switch is compensated by the turn on of the B to C switch. 7. Characterized parameter. Not 100% tested. 4 IDT74FST163209 9-BIT BUS EXCHANGE SWITCH COMMERCIAL TEMPERATURE RANGE TEST CIRCUITS AND WAVEFORMS TEST CIRCUITS FOR ALL OUTPUTS V CC SWITCH POSITION 500Ω Pulse Generator Switch Open Drain Disable Low Closed Enable Low V OUT VIN Test 7.0V Open All Other Tests D.U.T. 50pF RT 3510 lnk 08 DEFINITIONS: CL= Load capacitance: includes jig and probe capacitance. RT = Termination resistance: should be equal to ZOUT of the Pulse Generator. 500Ω CL 3510 lnk 03 PULSE WIDTH SET-UP, HOLD AND RELEASE TIMES DATA INPUT TIMING INPUT ASYNCHRONOUS CONTROL PRESET CLEAR ETC. SYNCHRONOUS CONTROL PRESET CLEAR CLOCK ENABLE ETC. tH tSU tREM tSU 3V 1.5V 0V 3V 1.5V 0V LOW-HIGH-LOW PULSE 1.5V tW 3V 1.5V 0V HIGH-LOW-HIGH PULSE 1.5V 3V 1.5V 0V tH 3510 lnk 05 3510 lnk 04 PROPAGATION DELAY ENABLE AND DISABLE TIMES ENABLE SAME PHASE INPUT TRANSITION tPLH tPHL OUTPUT tPLH OPPOSITE PHASE INPUT TRANSITION tPHL 3V 1.5V 0V VOH 1.5V VOL DISABLE 3V CONTROL INPUT tPLZ tPZL OUTPUT NORMALLY LOW 3V 1.5V 0V SWITCH CLOSED 3510 lnk 06 SWITCH OPEN 3.5V 3.5V 1.5V tPZH OUTPUT NORMALLY HIGH 1.5V 0V 0.3V VOL tPHZ 0.3V VOH 1.5V 0V 0V 3510 lnk 07 NOTES: 1. Diagram shown for input Control Enable-LOW and input Control DisableHIGH 2. Pulse Generator for All Pulses: Rate ≤ 1.0MHz; tF ≤ 2.5ns; tR ≤ 2.5ns 5 IDT74FST163209 9-BIT BUS EXCHANGE SWITCH COMMERCIAL TEMPERATURE RANGE ORDERING INFORMATION IDT XX FST 16 XX Temp. Range Device Type X Package PV PA PF Shrink Small Outline Package (SO48-1) Thin Shrink Small Outline Package (SO48-2) Thin Very Small Outline Package (SO48-3) 163209 9-Bit Bus Exchange Switch 74 –40°C to +85°C 3510 drw 08 Integrated Device Technology, Inc. reserves the right to make changes to the specifications in this data sheet in order to improve design or performance and to supply the best possible product. Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA 95054-3090 Telephone: (408) 727-6116 6 FAX 408-492-8674