Design Assistance Customised Pack Sizes / Qtys Assembly Assistance Support for all industry recognised supply formats: Die handling consultancy Hi-Rel die qualification Hot & Cold die probing Electrical test & trimming o Waffle Pack o Gel Pak o Tape & Reel Onsite storage, stockholding & scheduling 100% Visual Inspection o MIL-STD 883 Condition A o MIL-STD 883 Condition A On-site failure analysis Bespoke 24 Hour monitored storage systems for secure long term product support On-site failure analysis Contact [email protected] For price, delivery and to place orders HMC913 www.analog.com www.micross.com Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK HMC913 v04.0913 SDLVAs - CHIP SUCCESSIVE DETECTION LOG VIDEO AMPLIFER (SDLVA), 0.6 - 20 GHz Typical Applications Features The HMC913 is ideal for: High Logging Range: 59 dB (-54 to +5 dBm) @ 18 GHz • EW, ELINT & IFM Receivers Output Frequency Flatness: ±1.5 dB • DF Radar Systems Log Linearity: ±1 dB • ECM Systems • Broadband Test & Measurement • Power Measurement & Control Circuits • Military & Space Applications Functional Diagram Fast Rise/Fall Times: 5/10 ns Single Positive Supply: +3.3V ESD Sensitivity (HBM): Class 1A General Description The HMC913 is a Successive Detection Log Video Amplifier (SDLVA) which operates from 0.6 to 20 GHz. The HMC913 provides a logging range of 59 dB. This device offers typical fast rise/fall times of 5/10 ns and a superior delay time of only 14 ns. The HMC913 log video output slope is typically 14 mV/dB. Maximum recovery times are less than 30 ns. Ideal for high speed channelized receiver applications, the HMC913 operates from a single +3.3 V supply, and consumes only 80 mA. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes. Electrical Specifications, TA = +25 °C, Vcc1 = Vcc2 = 3.3V [1] Parameter Conditions Typ. Units 0.6 - 20 GHz ±1.5 dB Pin = -50 to +3 dBm ±1 dB Pin = -25 dBm ±1.5 dB Minimum Logging Range to ±3 dB error @ 18 GHz -54 @ 18 GHz dBm Maximum Logging Range to ±3 dB error @ 18 GHz +5 @ 18 GHz dBm 5.5 dB Log Video Minimum Output Voltage 1 V Log Video Maximum Output Voltage 1.8 V Input Frequency Range [1][2] Frequency Flatness Log Linearity Log Linearity over Temperature (-55 °C to +85 °C) Pin = -25 dBm Input Return Loss Log Video Output Rise Time 10% to 90% 5 ns Log Video Output Fall Time 90% to 10% 10 ns Log Video Recovery Time 25 ns Log Video Output Slope 14 mV/dB 5 µV/dB°C Log Video Output Slope Variation over Temperature @ 10 GHz Log Video Propagation Delay Supply Current (Icc1 + Icc2) @ Pin = -30 dBm 14 ns 80 mA [1] Electrical specs and performance plots are given for single-ended operation [2] Video output load should be 1K Ohm or higher. 1 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC913 v04.0913 SUCCESSIVE DETECTION LOG VIDEO AMPLIFER (SDLVA), 0.6 - 20 GHz VIDEO OUT & Error vs. Input Power, Fin = 500 MHz [1] 5 2 GHz 6 GHz 10 GHz 14 GHz 18 GHz 20 GHz 3 2 ERR +25C ERR +85C ERR -55C 1 0 -1 -2 2 1 1.5 0 -1 1 -3 Ideal Video Out +25C Video Out +85C Video Out -55C -4 -5 -70 -60 -50 -40 -30 -20 -10 0 10 -70 20 -60 -50 VIDEO OUT & Error vs. Input Power, Fin = 1 GHz [1] 3 Ideal Video Out +25C Video Out +85C Video Out -55C VIDEO OUT (V) -1 1 -10 0 10 1 1.5 0 -1 1 -2 -70 -60 -50 3 0 10 ERR +25C ERR +85C ERR -55C 20 -1 1 Ideal Video Out +25C Video Out +85C Video Out -55C 0 10 1 1.5 0 -1 1 Ideal Video Out +25C Video Out +85C Video Out -55C -2 -3 0.5 2 20 INPUT POWER (dBm) -2 -3 0.5 -70 ERROR (dB) 0 VIDEO OUT (V) 1 1.5 -10 -10 3 2 -20 -20 2 ERROR (dB) VIDEO OUT (V) ERR +25C ERR +85C ERR -55C -30 -30 VIDEO OUT & Error vs. Input Power, Fin = 10 GHz [1] 2 -40 -40 INPUT POWER (dBm) VIDEO OUT & Error vs. Input Power, Fin = 6 GHz [1] -50 -2 -3 0.5 20 INPUT POWER (dBm) -60 20 2 Ideal Video Out +25C Video Out +85C Video Out -55C -3 0.5 -70 10 ERROR (dB) 0 -20 0 ERR +25C ERR +85C ERR -55C 1 -30 -10 3 2 1.5 -40 -20 2 ERROR (dB) VIDEO OUT (V) ERR +25C ERR +85C ERR -55C -50 -30 VIDEO OUT & Error vs. Input Power, Fin = 2 GHz [1] 2 -60 -40 INPUT POWER (dBm) INPUT POWER (dBm) -70 -2 -3 0.5 -6 ERROR (dB) VIDEO OUT (V) 4 ERROR (dB) 3 2 6 SDLVAs - CHIP Error Flatness vs. Input Power Over Frequency [1][2] -60 -50 -40 -30 -20 -10 0 10 20 INPUT POWER (dBm) [1] Electrical specs and performance plots are given for single-ended operation [2] An average ideal line is used to calculate error curves. For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] 2 HMC913 v04.0913 SUCCESSIVE DETECTION LOG VIDEO AMPLIFER (SDLVA), 0.6 - 20 GHz VIDEO OUT vs. Error vs. Input Power, Fin = 18 GHz [1] VIDEO OUT & Error vs. Input Power, Fin = 14 GHz [1] 0 -1 1 Ideal Video Out +25C Video Out +85C Video Out -55C VIDEO OUT (V) 1 1.5 -70 -60 -50 -40 -30 -20 -10 0 10 1 1.5 0 -1 1 Ideal Video Out +25C Video Out +85C Video Out -55C -2 0.5 -3 0.5 2 -70 20 -60 -50 -40 -30 -20 -10 0 10 -2 -3 20 INPUT POWER (dBm) INPUT POWER (dBm) VIDEO OUT & Error vs. Input Power, Fin = 20 GHz [1] 3 2 2 1 1.5 0 -1 1 Ideal Video Out +25C Video Out +85C Video Out -55C ERROR (dB) VIDEO OUT (V) ERR +25C ERR +85C ERR -55C -2 -3 0.5 -70 -60 -50 -40 -30 -20 -10 0 10 20 INPUT POWER (dBm) VIDEO OUT vs. Frequency Over Input Power & Bias Voltage [1] VIDEO OUT vs. Frequency Over Input Power & Temperature [1] 1.8 1.8 +25C +85C -55C 1.7 VIDEO OUT (V) 1.5 1.4 -25 dBm 1.3 1.2 1.5 -25 dBm 1.4 1.3 1.2 -40 dBm -40 dBm 1.1 1.1 1 -10 dBm 1.6 VIDEO OUT (V) -10 dBm 1.6 3.15V 3.30V 3.45V 1.7 0 2 4 6 8 10 12 14 16 18 20 22 FREQUENCY (GHz) 1 0 2 4 6 8 10 12 14 16 18 20 22 FREQUENCY (GHz) [1] Electrical specs and performance plots are given for single-ended operation 3 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] ERROR (dB) VIDEO OUT (V) ERR +25C ERR +85C ERR -55C 2 ERROR (dB) SDLVAs - CHIP ERR +25C ERR +85C ERR -55C 3 2 3 2 HMC913 v04.0913 SUCCESSIVE DETECTION LOG VIDEO AMPLIFER (SDLVA), 0.6 - 20 GHz 1.8 1.8 1.6 1.6 1.4 2 GHz 10 GHz 18 GHz 1.2 1 0.8 1.4 1.2 2 GHz 10 GHz 18 GHz 1 0 20 40 60 80 0.8 100 0 20 40 TIME (ns) 60 80 100 TIME (ns) SDLVAs - CHIP Fall Time for Various Frequencies @ 0 dBm [1] VIDEO OUT (V) VIDEO OUT (V) Rise Time for Various Frequencies @ 0 dBm [1] Input Return Loss vs. Frequency [1] RETURN LOSS (dB) 0 -5 -10 -15 -20 0 5 10 15 20 25 30 FREQUENCY (GHz) [1] Electrical specs and performance plots are given for single-ended operation For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] 4 HMC913 v04.0913 SUCCESSIVE DETECTION LOG VIDEO AMPLIFER (SDLVA), 0.6 - 20 GHz SDLVAs - CHIP Absolute Maximum Ratings Vcc +3.6V ENBL +3.6V RF Input Power +15 dBm Channel Temperature 125 °C Continuous Pdiss (T=85°C) Derate 12.63 mW/°C above 85°C 0.51 W Thermal Resistance Rth (Junction to die bottom) 33.94 °C/W Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C ESD Sensitivity (HBM) Class 1A Die Packaging Information [1] Standard Alternate WP-3 (Waffle Pack) [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. NOTES: 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] 2. DIE THICKNESS IS 0.011 (0.279) 3. TYPICAL BOND PAD IS 0.0024 SQUARE 4. BOND PAD METALLIZATION: ALUMINUM 5. NO BACKSIDE METAL 6. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS 7. OVERALL DIE SIZE IS ±.002 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Outline Drawing 5 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC913 v04.0913 SUCCESSIVE DETECTION LOG VIDEO AMPLIFER (SDLVA), 0.6 - 20 GHz Pad Descriptions Function 1-5 VCC1 Description Interface Schematic Bias Supply. Connect Supply Voltage to these pins with appropriate filtering. To ensure proper start-up supply rise time should be faster than 100usec SDLVAs - CHIP Pad Number Bias Supply. Connect supply voltage to these pins with appropriate filtering. 6 VCC2 7 EN Enable pin connected to VCC1 or VCC2 for normal operation. Total supply current reduced to less than 3mA when EN is set to 0V. 8, 11 - 18, 21, 22 Die Bottom GND These pins and the die bottom must be connected to a high quality RF/DC ground. 9, 10 VIDEO OUT, VIDEO FB Video out and feedback. These pins should be shorted to each other (see application circuit). Video out load should be at least 1K Ohm or higher. To ensure proper start-up supply rise time should be faster than 100usec For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] 6 HMC913 v04.0913 SUCCESSIVE DETECTION LOG VIDEO AMPLIFER (SDLVA), 0.6 - 20 GHz SDLVAs - CHIP Pad Descriptions (Continued) Pad Number Function Description 19, 20 RFINN, RFINP RF Input pins Connect RF to RFINP and AC couple RFINN to ground via 50 Ohm for single ended operation. Interface Schematic Application Circuit Note: Video output load should be 1K Ohm or higher. 7 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] HMC913 v04.0913 SUCCESSIVE DETECTION LOG VIDEO AMPLIFER (SDLVA), 0.6 - 20 GHz SDLVAs - CHIP Assembly Diagram List of Materials for Assembly Diagram Item Description C1, C2 33 pF Capacitor, 0402 Pkg. C3 - C6 100 pF SLC Capacitor, SA1212BX101M16VHXF C7 - C8 10 nF SLC Capacitor, MVB3030X103ZGH5N R1 50 Ohm Resistor, 0402 Pkg. U1 HMC913 Die ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected] 8 HMC913 v04.0913 SUCCESSIVE DETECTION LOG VIDEO AMPLIFER (SDLVA), 0.6 - 20 GHz SDLVAs - CHIP Mounting & Bonding Techniques for MMICs The die should be attached directly to the ground plane with epoxy (see HMC general Handling, Mounting , Bonding Note). 50 Ohm Microstrip transmission lines on 0.254mm (10 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). Microstrip substrates should be placed as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 0.279mm (0.011”) Thick MMIC Wire Bond 0.076mm (0.003”) Handling Precautions RF Ground Plane Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. 0.254mm (0.010”) Thick Alumina Thin Film Substrate Figure 1. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. General Handling: The chip may be handled by a vacuum collet or with a sharp pair of tweezers. Mounting Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. 9 For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Application Support: Phone: 978-250-3343 or [email protected]