ROHM BU16025MUV_11

HDMI Switch ICs
1 for input 1 output buffer
(Sync with OE)
No.11063EAT06
BU16025MUV
●Description
BU16025MUV is HDMI Buffer IC for Source, Sink, and repeater equipment. Each TMDS input has internal 50ohm resistor.
These resistors can be turned off by OE pin control. And BU16025MUV has selectable equalizer circuit and DDC active
buffer to isolate capacitor between input and output.
●Features
1) Support 480i/p, 720p, and 1080i/p 12bit deep color and 2.70Gbps data rate
2) 5V Tolerance to all DDC and HPD_SINK Inputs
3) Integrated active DDC buffer
4) Integrated DDC data line delay mode to get hold margin
5) Integrated Switchable 50ΩReceiver Termination
6) Integrated Low TMDS output swing mode for High speed signal
7) High Impedance Outputs When Disabled
8) TMDS Inputs and output HBM ESD Protection Exceeds 8kV
9) Support AC coupling input (TMDS input common mode voltage is 3.3V)
10) Selectable Receiver Equalization
2
11) Integrated I C Identification Data for HDMI/DVI distinction (Display port translator mode)
12) 48-Pin VQFN Package
13) ROHS Compatible
●Applications
Digital TV, DVD player, set-top box, AV receiver, Digital projector, Desktop/Note book PC
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© 2011 ROHM Co., Ltd. All rights reserved.
1/16
2011.01 - Rev.A
Technical Note
BU16025MUV
●Absolute maximum ratings
Parameter
Ratings
Unit
Input Voltage
-0.3~+4.5
V
DDC, HPD_SINK input voltage
-0.3~+5.5
V
Differential pin input voltage
+2.5~+4.0
V
PRE, I2C_ONB, SELREF, OEB, EQ, DDC_TI,
DDCEN, HDMID_EN, HPDINV input voltage
-0.3~+4.0
V
2123(*1)
mW
-55~+125
℃
Power Dissipation rating
Storage temperature
*1 ROHM standard substrate When it’s used by than Ta=25℃, it’s reduced by 21.2mW/℃
●Operating conditions
Parameter
Symbol
Ratings
Min.
Typ.
Max.
Unit
Supply Voltage
VCC
3.0
3.3
3.6
V
Operating free-air temperature
TA
0
-
70
℃
Input differential voltage range
VID
150
-
1560
mVp-p
Input common voltage range
VIC
1.5
-
VCC+0.01
V
Current control resistor
REXT
1.18
1.2
1.22
kΩ
TMDS output voltage range
AVCC
3
3.3
3.6
V
RT
45
50
55
Ω
-
-
-
2.70
Gbps
TMDS DIFFERENTIAL PINS (A/B)
Termination Resistor
Signal rate
CONTROL PINS (PRE, I2C_ONB, OEB, SELREF, EQ, DDC_TI, DDCEN, HDMIID_EN, HPDINV)
H level input voltage
VIH
0.7×Vcc
-
VCC
V
L level input voltage
VIL
-0.3
-
0.3×Vcc
V
dR(I2C)
-
-
100
kHz
H level input voltage
VIH
2.1
-
5.5
V
L level input voltage
VIL
-0.3
-
0.35
V
H level input voltage
VIH
2.1
-
5.5
V
L level input voltage
VIL
-0.3
-
1.5
V
H level input voltage
VIH
2.1
-
5.5
V
L level input voltage
VIL
-0.3
-
0.8
V
DDC I/O PINS (SCLx, SCLy, SDAx, SDAy)
I2C data rate
SDAx, SCLx
SDAy , SCLy
STATUS PINS (HPD_SINK)
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© 2011 ROHM Co., Ltd. All rights reserved.
2/16
2011.01 - Rev.A
Technical Note
BU16025MUV
●Electrical characteristics(Unless Otherwise noted Ta=25℃, Vcc=3.3V)
Limits
Parameter
Symbol
Min.
Typ.
Max.
Stand by Current
(DDC_EN= “L”)
Stand by Current2
(DDC_EN= “H”)
Circuit Current
Conditions
Ist
-
-
10
µA
OEB = “Vcc”, VIL= “0V”,VIH=”Vcc”
Ist2
-
1.8
3.0
mA
OEB = “Vcc”, VIL= “0V”,VIH=”Vcc”
mA
VIH = Vcc,VIL = Vcc-0.4V,
REXT=1.2kΩ, RT = 50Ω,
AVcc = 3.3V,PRE=0V
Am/Bm =2.25 Gbps HDMI data pattern,
m = 2,3,4, A1/B1 = 225 MHz clock
381
mW
VIH = Vcc,VIL = Vcc-0.4V
REXT=1.2kΩ, RT = 50Ω,
AVcc = 3.3V, PRE=0V
Am/Bm = 2.25Gbps HDMI data pattern,
m = 2,3,4, A1/B1 = 225 MHz clock
Icc
Power Consumptions
Unit
-
PD
68+32*(1) 84+32*(1)
-
-
TMDS DIFFERENTIAL PINS (A/B; Y/Z)
H level output voltage
VOH
AVcc-10
-
AVcc+10
mV
L level output voltage
VOL
AVcc-600
-
AVcc-400
mV
VSWING
400
-
600
mV
VSWING 2
600
-
920
mVp-p
TMDS internal Resistor
RINT
45
50
55
Ω
VIN = 2.9V
Output leak current
Voff
-10
0
10
µA
AVcc = 3.3V, Vcc=0V
Input leak current
IIH1
-10
-
10
µA
VI = 5.5V
Input leak current
IIH2
-10
-
10
µA
VI = Vcc
H level output current
IOHT
-10
-
10
µA
VO = 5.5V
L level output current
IlL
-10
-
10
µA
VIL = GND
L level output voltage
VOLT
V
RL = 4.7kΩ
Swing voltage
Swing voltage2
(Low TMDS output swing mode)
AVcc = 3.3V,
RT = 50Ω,PRE = 0V
PRE = Vcc,
Am/Bm =225 Mbps HDMI data pattern,
m = 2,3,4, A1/B1 = 225 MHz clock
DDC Input and output
SDAx, SCLx
L level input voltage below
output voltage
VOLT-VIL
0.43
-
0.57
0.52
-
0.87
-
100
-
-
400
-
SELREF = “L”
SELREF = “H”
SELREF = “L”
mV
SELREF = “H”
SDAy , SCLy
Input leak current
IIH1
-10
-
10
µA
VI = 5.5V
Input leak current
IIH2
-10
-
10
µA
VI = Vcc
H level output current
IOH
-10
-
10
µA
VO = 5.5V
L level output current
IOL
-10
-
10
µA
VIL = GND
L level output voltage
VOL
-
-
0.2
V
IOUT = 4mA
H level output voltage
VOH
2.4
-
Vcc
V
IOH = - 8mA
L level output voltage
VOL
0
-
0.4
V
IOL = 8mA
STATUS PINS (HPD)
CONTROL PINS
(PRE, OEB, DDCEN, HPDINV)
H level input current
IIH
-10
-
10
µA
VIH = Vcc
L level input current
IIL
-10
-
10
µA
VIL = GND
CONTROL PINS
(SELREF, EQ, DDC_TI)
H level input current
IIH
50
-
150
µA
VIH = Vcc
L level input current
IIL
-10
-
10
µA
VIL = GND
CONTROL PINS (I2C_ONB, HDMIID_EN)
H level input current
IIH
-10
-
10
µA
VIH = Vcc
L level input current
IIL
-150
-
50
µA
VIL = GND
(*1) 32mA is the current through TMDS internal resistor
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© 2011 ROHM Co., Ltd. All rights reserved.
3/16
2011.01 - Rev.A
Technical Note
BU16025MUV
●AC Characteristic (Unless Otherwise noted Ta=25℃, Vcc=3.3V)
Parameter
Symbol
Limits
Min.
Typ.
Max.
Unit
Conditions
TMDS Output Differential pin (Y/Z)
Differential output rise time
(20%-80%)
tR_tmds
-
110
-
ps
Differential output rise time
(20%-80%)
tF_tmds
-
110
-
ps
tsk(D)
-
35
-
ps
Propagetion delay (L to H)
SCLx to SCLy
tPLH1
-
30
-
ns
Propagetion delay (H to L)
SCLx to SCLy
tPHL1
-
10
-
ns
Propagetion delay (L to H)
SCLy to SCLx
tPLH2
-
40
-
ns
Propagetion delay (H to L)
SCLy to SCLx
tPHL2
-
20
-
ns
Propagetion delay (L to H)
SDAx to SDAy
tPLH3
-
570
-
ns
Propagetion delay (H to L)
SDAx to SDAy
tPHL3
-
570
-
ns
Propagetion delay (L to H)
SDAy to SDAx
tPLH4
-
370
-
ns
Propagetion delay (H to L)
SDAyto SDAx
tPHL4
-
370
-
ns
Propagetion delay (L to H)
SDAx/SCLx to SDAy/SCLy
tPLH5
-
30
-
ns
Propagetion delay (H to L)
SDAx/SCLx to SDAy/SCLy
tPHL5
-
10
-
ns
Propagetion delay (L to H)
SDAy/SCLy to SDAx/SCLx
tPLH6
-
40
-
ns
Propagetion delay (H to L)
SDAy/SCLy to SDAx/SCLx
tPHL6
-
20
-
ns
SDAx/SCLx output rise time
tR1
-
80
-
ns
SDAx/SCLx output rise time
tF1
-
5
-
ns
SDAy/SCLy output rise time
tR2
-
95
-
ns
SDAy/SCLy output rise time
tF2
-
5
-
ns
Propagation delay time (L to H)
tPLH(HPD)
-
100
-
ns
CL=10pF
Propagation delay time (H to L)
tPHL(HPD)
-
100
-
ns
CL=10pF
Differential intra pair skew (Fig9)
AVCC = 3.3V,
RT = 50Ω, PRE =”H”
DDC I/O Pin (SCLx, SCLy, SDAx, SDAy)
RL = 4.7KΩ
CL = 10pF
DDC_TI = “H”
RL = 4.7KΩ
CL = 10pF
DDC_TI = “H”
RL = 4.7KΩ
CL = 10pF
DDC_TI = “L”
RL = 4.7KΩ
CL = 10pF
STATUS PINS(HPD)
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© 2011 ROHM Co., Ltd. All rights reserved.
4/16
2011.01 - Rev.A
Technical Note
BU16025MUV
●Electrical characteristic curves (Reference data)
Unless Otherwise noted Ta=25℃, Vcc=3.3V
Stand-by Current 2
Stand-by Current 1
0.10
2.00
IST [mA]
IST [mA]
0.08
0.06
0.04
0.02
1.50
1.00
0.50
0.00
0.00
0.8
1.3
1.8
2.3
2.8
3
3.3
VCC [V]
3.2
3.4
3.6
VCC [V]
Fig.1 Stand-by Current 1(Ist)
OEB = “Vcc”, DDC_EN= “0V”
Fig.2 Stand-by Current 2(Ist2)
OEB = “Vcc”, DDC_EN= “Vcc”
Circuit Current
120.00
ICC [mA]
100.00
80.00
60.00
40.00
20.00
0.00
3
3.2
3.4
3.6
VCC [V]
Fig.3 Circuit Current(Vcc + AVcc) (Icc)
OEB = “Vcc”, DDC_EN= “0V”
Fig.4 Eye Diagram of BU16025MUV
2.25Gbps Data rate when PRE = “L”,
Test Equipment DTG5334(tektronix),
DSA80000B(Agilent)
Fig.6 Eye Diagram of BU16025MUV
2.7Gbps Data rate when PRE = “H”,
Test Equipment DTG5334(tektronix),
DSA80000B(Agilent)
Fig.5 Eye Diagram of BU16025MUV
2.25Gbps Data rate when PRE = “H”,
Test Equipment DTG5334(tektronix),
DSA80000B(Agilent)
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© 2011 ROHM Co., Ltd. All rights reserved.
5/16
2011.01 - Rev.A
Technical Note
BU16025MUV
●Measurement symbol and circuit diagram
AVcc
RT
ZO=RT
TMDS
Driver
RT
TMDS
Receiver
ZO=RT
Fig 7 TMDS Output driver
Vcc
RINT
RINT
RT
Y
A
VID
VA
TMDS
Driver
TMDS
Receiver
CL
VY
0.5pF
AVCC
RT
Z
B
VZ
VB
VID = VA - VB
Vswing = VY - VZ
VA
Vcc V
VB
Vcc-0.4 V
0.4 V
VIC
VID(pp)
0V
-0.4 V
tPLH
tPHL
80%
100%
Vswing
VOD(O)
0V Differential
20%
tf
VOD(U)
Fig8
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© 2011 ROHM Co., Ltd. All rights reserved.
0%
tr
Test circuit and definition
6/16
2011.01 - Rev.A
Technical Note
BU16025MUV
VY
VOH
50%
VZ
VOL
tsk(D)
Fig9 Definition of differential intra pair skew
TrTX(80% to 20%)
SDA
SCL
SDA_SINK
SCL_SINK
tpdHL
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tpdLH
1.8V
TrTX(80% to 20%)
1.8V
tpdHL
1.8V
Fig10
© 2011 ROHM Co., Ltd. All rights reserved.
80%
20%
1.8V
Vol
SDA_SINK
SCL_SINK
SDA
SCL
TfTX(80% to 20%)
TfTX(80% to 20%)
80%
20%
tpdLH
Vol
DDC timing definitions
7/16
2011.01 - Rev.A
Technical Note
BU16025MUV
●Block diagram and pin configuration
RINT
24
38
23
39
22
40
21
41
20
BU16025
(48-pin QFN)
42
43
44
19
18
17
A4
Y4
Selectable
Equalizer
B4
TMDS
Driver
Z4
VCC
RINT
A3
Y3
Selectable
Equalizer
B3
TMDS
Driver
Z3
VCC
RINT
Y2
A2
Selectable
Equalizer
B2
TMDS
Driver
Z2
VCC
12
10
GND
Z1
Y1
Vcc
Z2
Y2
GND
Z3
Y3
Vcc
Z4
Y4
RINT
EQ
Vcc
PRE
HPDINV
GND
REXT
HPD
SDAx
SCLx
TEST0
HDMIID_EN
GND
11
13
9
48
8
14
7
47
6
15
5
46
4
16
3
45
2
VCC
25
26
27
28
29
30
31
I2C_ONB
DDCEN
GND
HPD_SINK
SDAy
SCLy
GND
Vcc
OEB
32
33
34
GND
SELREF
DDC_TI
35
PRE
REXT
EQ
37
1
GND
B1
A1
Vcc
B2
A2
GND
B3
A3
Vcc
B4
A4
36
OEB
Y1
A1
Selectable
Equalizer
TMDS
Driver
Z1
B1
I2C slave for Dual
mode configuration
0.4V
SCL
I2C_ONB
HDMIID_EN
SCL_SINK
1.8V
SDA
0.4V
SDA_SINK
DDCEN
1.8V
SELREF
HPD
HPD_SINK
HPD_INV
Fig.11
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© 2011 ROHM Co., Ltd. All rights reserved.
8/16
Block Diagram of BU16025MUV
2011.01 - Rev.A
Technical Note
BU16025MUV
●Pin Explanation
Pin
I/O
Explanations
Name
Number
B1, B2, B3, B4
38, 41, 44, 47
Input
TMDS Negative input
A1, A2, A3, A4
39, 42, 45, 48
Input
TMDS Positive input
Z1, Z2, Z3, Z4
23, 20, 17, 14
Output TMDS Negative input
Y1, Y2, Y3, Y4
22, 19, 16, 13
Output TMDS Positive input
EQ
1
Input
PRE
3
Input
HPDINV
4
Input
REXT
6
Input
HPD
7
SDAx
8
Inout
DDC Data line(*2 Vol = 0.5V)
SCLx
9
Inout
DDC Clock line(*2 Vol = 0.5V)
TEST0
10
Input
Open or Gnd
HDMIID_EN
11
Input
OEB
25
Input
SCLy
28
Inout
DDC Clock line(*2)
SDAy
29
Inout
DDC Data line(*2)
HPD_SINK
30
Input
Hot plug detect input(10kΩ internal pull down)
DDCEN
32
Input
I2C_ONB
33
Input
Equalizer gain setting(40kΩ internal pull down)
“L” 5dB “H” 15dB
TMDS Low output swing mode(Recommend High)
Low : OFF High : ON
HPD output select switch
Low : non-invert High : Invert and open drain output
TMDS Current control pin(via 1. 2kΩ to GND)
Output Hot plug detect output (*1)
(*3 )
HDMI ID Enable(40kΩ internal pull up)
Low : 0xFF(DVI) High : ASCII (HDMI)
TMDS line internal resistor and output enable switch
Low : ON(Enable)
High : High-Z
I2C Repeater Enable
Low : High-Z
High : Enable
2
(*3 )
Built-in I C Slave Enable Switch(90kΩ internal pull up)
Low : ON High : OFF
(*4)
DDC_TI
34
Input
DDC Data hold margin setting (40kΩinternal pull down)
DDC_TI = “L”
Delay from SDAx to SDAy = 570nsec, Delay from SCLx to SCLy = 20nsec
Delay from SDAy to SDAx = 370nsec, Delay from SCLy to SCLx = 20nsec
DDC_TI = “H”
Delay from SDAx to SDAy = 20nsec, Delay from SCLx to SCLy = 20nsec
Delay from SDAy to SDAx = 20ncec, Delay from SCLy to SCLx = 20nsec
SELREF
35
Input
SCLx/SDAx L level output voltage select ( 40kΩ internal pull down)
VCC
GND
(*1)
(*2)
(*3)
(*4)
2 ,15, 21,
26, 40, 46
5, 12, 18, 24, 27,
31, 36, 37, 43
-
Power
-
Ground
HPD_OFF mode sets Hot plug detect output to High impedance. Except HPD_OFF mode, HPD is always active.
SDAx/SCLx, SDAy/SCLy have different L level input and output voltage. Please refer recommended operating condition in detail
HDMIID_EN, I2C_ONB don’t need to be Enable except using internal I2C slave.
Data hold time increases when DDC_TI= “L”. But Data setup time and holdtime of Start condition decrease.
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© 2011 ROHM Co., Ltd. All rights reserved.
9/16
2011.01 - Rev.A
Technical Note
BU16025MUV
●Look up table of I2C_ONB and HDMIID_EN pin
Pin setting
Name
OEB
Normal mode
(recommend)
HPD_OFF mode
TMDS_OFF mode
Output state
2
HDMI
ID_EN
IC
Buffer
Internal
I2C slave
HPD
TMDS
Internal R
H
H
OFF
OFF
active
ON
DDCEN I2C_ONB
L
L
L
H
H
H
active
OFF
active
ON
L
L
H
L
OFF
OFF
High Impedance
ON
L
H
H
L
active
OFF
High Impedance
ON
H
L
H
H
OFF
OFF
active
OFF
H
H
H
H
active
OFF
active
OFF
H
L
H
L
OFF
OFF
High Impedance
OFF
H
H
H
L
active
OFF
High Impedance
OFF
Display Port
Translator mode (HDMI)
-
H
L
H
active
(HDMI)
active
OFF
Display Port
Translator mode (DVI)
-
H
L
L
active
(DVI)
0xFF
active
OFF
None
-
L
L
-
OFF
OFF
active
OFF
HPD_TMDS_OFF mode
Display Port Translator mode
DisplayPort Translator mode are used to access internal I2C slave. I2C Slave register stores value like below. The ASCII
code of this value is ”DP-HDMI ADAPTOR<EOT>
Please read from address 0x00 to 0x0F at the read cycle.
Slave adr : 7'b100_0000
I2C_ONB
L
HDMIID_EN
Acknowledge
Address 0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F
(from slave)
H : HDMI Connect
Occur
Data
0x44 0x50 0x2D 0x48 0x44 0x4D 0x49 0x20 0x41 0x44 0x41 0x50 0x54 0x4F 0x52 0x04
L : DVI Connect
Occur
Data
0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF
None
Data
0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF
H
-
When I2C_ONB=1, slave adr 7'b100_0000 is disabled
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© 2011 ROHM Co., Ltd. All rights reserved.
10/16
2011.01 - Rev.A
Technical Note
BU16025MUV
2
I C Slave Read access to register block
step 1
0
I2C Start(Master)
S
step 2
7
6
5
4
3
2
1
0
I C Device Address Write(Master)
1
0
0
0
0
0
0
0
step 3
9
I2C Acknowledge(Slave)
A
step 4
7
6
5
4
3
2
1
0
I C Logic Address(Master)
0
0
0
0
0
0
0
0
step 5
9
0
2
S : Start Condition
Write
2
2
I C Acknowledge(Slave)
A
step 6
0
2
I C Stop(Master)
P
step 7
0
2
A : Acknowledge
P : Stop Condition
I C Start(Master)
S
step 8
7
6
5
4
3
2
1
1
0
0
0
0
0
0
2
I C General Address Read(Master)
1
Read
step 9
9
I2C Acknowledge(Slave)
A
step 10
I2C Read Data(Slave)
step 11
2
I C Not-Acknowledge(Master)
7
6
5
4
3
2
1
0
Data
Data
Data
Data
Data
Data
Data
Data
9
X
X : A (Acknowledge) or ~A (Not-Acknowledge)
When X =A, Address pointer is incremented and repeat step10.
2
When X =~ A, I C slave reg stops and moves to step12.
step 12
0
I2C Stop(Master)
P
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© 2011 ROHM Co., Ltd. All rights reserved.
11/16
2011.01 - Rev.A
Technical Note
BU16025MUV
●I/O equivalence circuit
TMDS Input Stage
Control Input Stage
VDD
VDD
50Ω
50Ω
Bx
Ax
I2C Input/Output Stage
PRE
OEB
DDCEN
HPDINV
HPD_SINK Input Stage
VDD
SCL_SINK
SDA_SINK
SCL
SDA
VDD
VDD
HPD_SINK
Control Input Stage
VDD
Control Input Stage
VDD
SELREF
EQ
DDC_TI
HPD Output Stage
TMDS Output Stage
Y
VDD
Z
I2C_ONB
HDMIID_EN
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© 2011 ROHM Co., Ltd. All rights reserved.
HPD
12/16
2011.01 - Rev.A
Technical Note
BU16025MUV
●Notes for use
1) Internal Resistor about HPD_SINK
For the reason HPD_SINK pin have internal resistor of 10kohm like below, don’t put external resistor.
Vcc
BU16025MUV
HPD_SINK
10kΩ
Fig12
HPD_SINK I/O schematic
2) About unused input pin
a. Unused inputs of TMDS recommend to OPEN
Vcc
RINT
RINT
RT
A
TMDS
Receiver
TMDS
Driver
B
Y
AVcc
Z
Fig 13
RT
TMDS Input Recommendation
b. Unused inputs of DDC recommend to pull up.
Vcc
Vcc
4.7k
4.7k
SCLy
SDAy
SCLx
SDAx
Fig 14 Unused DDC Buffers of R side
c. Unused input of HPD recommends to open
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© 2011 ROHM Co., Ltd. All rights reserved.
13/16
2011.01 - Rev.A
Technical Note
BU16025MUV
3) Serial connection of TMDS differential line
The serial connections of TMDS differential line like fig15 decrease the jitter tolerant characteristic. Especially when
system needs 1080p (12bit) data rate, deterioration of Jitter tolerance is outstanding. This problem also depends on
receiver IC characteristic. When 1080p (12bit) is required , Rohm doesn’t recommend cascade connect application.
Vcc
Vcc
RINT
RINT
RINT
RINT
RT
A
TMDS
Receiver
TMDS
Driver
B
Y
A
Z
B
Fig 15
TMDS
Receiver
TMDS
Driver
Y
AVCC
Z
RT
cascade connection notice
4) DDC line connections
DDC buffer of SDAx/SCLx and SDAy/SCLy have different low threshold level. Connect like below
Recommend application of BU16025MUV
Source Equipment
Repeater Equipment
BU16025MUV
MASTER
SDAx
SCLx
SDAy
SCLy
Sink Equipment
BU16025MUV
BU16025MUV
SDAy
SCLy
SDAy
SCLy
SDAx
SCLx
SDAx
SCLx
SLAVE
Recommend application of BU16025MUV and BU160xxKV(*)
Source Equipment
Repeater Equipment
BU16025MUV
MASTER
SDAx
SCLx
SDAy
SCLy
Sink Equipment
BU16025MUV
BU160xxKV(*)
SDAy
SCLy
SDA
SCL
SDAx
SCLx
SDA_SINK
SCL_SINK
SLAVE
(*)BU160xxKV → BU16006/16018/16027/16024KV
Fig 16
DDC connection notice
5) AC Coupling
This IC can also communicate using AC coupling capacitor with TMDS line. But even connecting AC coupling capacitor,
AC current may flow if input common mode voltage between two devices is different. This AC current may damage the
lower common mode voltage devices like PCIe or DisplayPort.
6) TMDS output offset voltage
Offset voltage may appear to TMDS output when there is no signal to TMDS input differential line. OE should be set to
“H” to avoid it.
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© 2011 ROHM Co., Ltd. All rights reserved.
14/16
2011.01 - Rev.A
Technical Note
BU16025MUV
●Thermal Derating Curve
Rohm standard 4layer board
Power Dissipation : Pd (W)
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
25
50
75
100
125
150
Ambient Temperature: Ta (℃)
Fig.17 Thermal Derating Curve
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© 2011 ROHM Co., Ltd. All rights reserved.
15/16
2011.01 - Rev.A
Technical Note
BU16025MUV
●Ordering part number
B
U
1
Part No.
6
0
2
5
M
Part No.
U
V
Package
MUV: VQFN48AV7070
-
E
2
Packaging and forming specification
E2: Embossed tape and reel
VQFN048AV7070
<Tape and Reel information>
7.0 ± 0.1
7.0±0.1
1.0MAX
4.7±0.1
1
12
1500pcs
E2
The direction is the 1pin of product is at the upper left when you hold
)
(0.22)
( reel on the left hand and you pull out the tape on the right hand
13
4.7 ± 0.1
0.4 ± 0.1
48
+0.03
0.02 -0.02
S
C0.2
Embossed carrier tape
Quantity
Direction
of feed
1PIN MARK
0.08 S
Tape
37
24
36
0.75
0.5
25
+0.05
0.25 -0.04
1pin
(Unit : mm)
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© 2011 ROHM Co., Ltd. All rights reserved.
Reel
16/16
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2011.01 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
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If you intend to export or ship overseas any Product or technology specified herein that may
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More detail product informations and catalogs are available, please contact us.
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http://www.rohm.com/contact/
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© 2011 ROHM Co., Ltd. All rights reserved.
R1120A