REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED D Changes in accordance with NOR 5962-R130-92. 92-01-30 M. A. Frye E Add case outline U. Add device types 09 and 10. Remove vendor 27014 from drawing. Editorial changes throughout. 93-10-15 M. A. Frye F Changes in accordance with NOR 5962-R118-94. 94-02-16 M. A. Frye G Updated boilerplate. Added device types 11-21. Removed vendors 1FN41, 18324, 34335, and 61394 from drawing. Added vendor 65786 to drawing. Removed margin test methods from drawing. 97-06-11 Raymond Monnin H Boilerplate update, part of 5 year review. ksr 06-07-17 Raymond Monnin J Update drawing to meet current MIL-PRF-38535 requirements. - glg 15-02-12 Charles Saffle K Correct sheet 2, paragraph 1.2; sheet 5, VIL2 test title; sheet 6, VOH test title; and sheet 7, delete duplicate tCE test. - glg 15-06-05 Charles Saffle THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE IS 67268 REV SHEET REV K K SHEET 15 16 REV STATUS REV K K K K K K K K K K K K K K OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY DLA LAND AND MARITIME James E. Jamison STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A COLUMBUS, OHIO 43218-3990 CHECKED BY Charles Reusing APPROVED BY Michael A. Frye DRAWING APPROVAL DATE 87-02-12 REVISION LEVEL K http://www.landandmaritime.dla.mil MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 262,144-BIT (32K x 8) UV ERASABLE PROM, MONOLITHIC SILICON SIZE CAGE CODE A 14933 SHEET DSCC FORM 2233 APR 97 1 OF 5962-86063 16 5962-E348-15 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: For device class M: 5962-86063 01 X A Drawing number Device type (see 1.2.2) Case outline (see 1.2.4) Lead finish (see 1.2.5) 86063 01 Q X A Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) For device classes Q and V: 5962 - Federal stock class designator \ RHA designator (see 1.2.1) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type 01,11 02,12 03,13 04,14 05,15 06,16 07,17 08,18 09,19 10,20 21 Generic number (see 6.6) (see 6.6) (see 6.6) (see 6.6) (see 6.6) (see 6.6) (see 6.6) (see 6.6) (see 6.6) (see 6.6) (see 6.6) Circuit Access time 32K x 8-bit UV EPROM 32K x 8-bit UV EPROM 32K x 8-bit UV EPROM 32K x 8-bit UV EPROM 32K x 8-bit UV EPROM 32K x 8-bit UV EPROM 32K x 8-bit UV EPROM 32K x 8-bit UV EPROM 32K x 8-bit UV EPROM 32K x 8-bit UV EPROM 32K x 8-bit UV EPROM 200 ns 250 ns 300 ns 170 ns 150 ns 120 ns 90 ns 70 ns 55 ns 45 ns 35 ns 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class M Q or V Device requirements documentation Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Certification and qualification to MIL-PRF-38535 STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86063 A REVISION LEVEL K SHEET 2 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator X Y Z U GDIP1-T28 or CDIP2-T28 CQCC1-N32 See figure 1 CDIP3-T28 or GDIP4-T28 Terminals Package style 1/ 28 32 32 28 Dual-in-line Rectangular leadless chip carrier J-lead chip carrier Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. Storage temperature ------------------------------------------Input voltages with respect to ground -----------------------Output voltages with respect to ground --------------------VPP supply voltage with respect to ground ----------------Power dissipation (PD) 2/ --------------------------------------Lead temperature (soldering, 10 seconds) -----------------Thermal resistance, junction-to-case (ΘJC): Case outlines X, Y, and U ------------------------------Case outline Z ---------------------------------------------Junction temperature (TJ) --------------------------------------- -65°C to +150°C +6.5 V dc to -0.3 V dc VCC+0.3 V dc to GND -0.3 V dc +14.0 V dc to -0.6 V dc +500 mW +300°C See MIL-STD-1835 13°C/W +150°C 1.4 Recommended operating conditions. Case operating temperature (TC) ----------------------------Supply voltage (VCC) ---------------------------------------------- -55°C to +125°C +4.5 V dc to +5.5 V dc 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 1/ Lid shall be transparent to permit ultraviolet light erasure. 2/ Must withstand the added PD due to short circuit test; e.g., IOS. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86063 A REVISION LEVEL K SHEET 3 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table(s). The truth table shall be as specified on figure 3. 3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices shall be as specified on figure 3. When required in screening (see 4.2 herein) or qualification conformance inspection, groups A, B, or C (see 4.4), the devices shall be programmed by the manufacturer prior to test. A minimum of 50 percent of the total number of cells shall be programmed. 3.2.3.2 Programmed devices. The requirements for supplying programmed devices are not a part of this drawing. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. 3.6 Processing EPROMS. All testing requirements and quality assurance provisions herein shall be satisfied by the manufacturer prior to delivery. 3.6.1 Erasure of EPROMS. When specified, devices shall be erased in accordance with the procedures and characteristics specified in 4.5. 3.6.2 Programmability of EPROMS. When specified, devices shall be programmed to the specified pattern using the procedures and characteristics specified in 4.6. 3.6.3 Verification of state of EPROMS. When specified, devices shall be verified as either programmed to the specified pattern or erased. As a minimum, verification shall consist of performing a functional test (subgroup 7) to verify that all bits are in the proper state. Any bit that does not verify to be in the proper state shall constitute a device failure and shall be removed from the lot. 3.7 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MILPRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.8 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.9 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86063 A REVISION LEVEL K SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55°C < TC < +125°C VSS = 0 V; 4.5 V < VCC < 5.5 V unless otherwise specified Group A subgroups Device types Limits Min Unit Max Input load current ILI VIN = 0 V to 5.5 V 1, 2, 3 All +10 µA Output leakage current ILO 1/ VOUT = 0 V to 5.5 V 1, 2, 3 All +10 µA Operating current (TTL inputs) ICC1 VCC = VPP 2/ 3/ 1, 2, 3 11-20 60 01-05 06 50 65 07 08 09 10 21 01,02 03 04,05 06 07,11-20 08,09 10 21 70 90 115 130 85 25 CE = OE = VIL 00-7 = 0 mA f = 1/tACC (maximum) Operating current (CMOS inputs) ICC2 Standby current (TTL inputs) ISB1 1, 2, 3 1, 2, 3 CE = VIH VCC = 5.5 V, f = 0 MHz 01-05 3 06,07 5 mA ISB2 1, 2, 3 45 11-21 25 01-07 300 µA 45 mA 08,09,10 VPP read current IPP Input low voltage (TTL + 10% supply) VIL1 4/ Input low voltage (CMOS) mA 40 55 60 90 100 85 08,09,10 Standby current (CMOS inputs) mA VPP = VCC = 5.5 V 1, 2, 3 11-21 25 01-10 200 11-21 10 µA 1, 2, 3 All -0.1 5/ 0.8 V VIL2 4/ 1, 2, 3 All -0.2 5/ 0.2 V Input high voltage (TTL + 10% supply) VIH1 4/ 1, 2, 3 All 2.0 VCC + 1.0 5/ V Input high voltage (CMOS) VIH2 4/ 1, 2, 3 All VCC 0.2 VCC + 0.2 5/ V VPP = VCC See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86063 A REVISION LEVEL K SHEET 5 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55°C < TC < +125°C VSS = 0 V; 4.5 V < VCC < 5.5 V unless otherwise specified Group A subgroups Device types Min Output low voltage VOL IOL = 2.1 mA, VCC = 5.5 V 1, 2, 3 All Output high voltage VOH IOH = -400 µA 1, 2, 3 All Output short-circuit current IOS 5/ 6/ VO = 0 V 1, 2, 3 All VPP read voltage VPPR 1, 2, 3 All Input capacitance CIN 9/ VIN = 0 V f = 1 MHz See 4.4.1c 4 Output capacitance COUT 9/ VOUT = 0 V f = 1 MHz See 4.4.1c Functional tests Address to output delay CE to output delay tACC tCE Limits 2.4 Max 0.45 V 0.45 V -100 mA VCC V All 12 pF 4 All 14 pF See 4.4.1e 7, 8A,8B All CE = OE = VIL 7/ 8/ 9, 10, 11 01,11 200 02,12 03,13 04,14 05,15 16,16 07,17 08,18 09,19 10,20 21 250 300 170 150 120 90 70 55 45 35 01,11 200 02,12 03,13 04,14 05,15 16,16 07,17 08,18 09,19 10,20 21 250 300 170 150 120 90 70 55 45 40 9, 10, 11 OE = VIL 7/ 8/ VCC 0.7 Unit ns ns See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86063 A REVISION LEVEL K SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Symbol OE to output delay tOE Conditions -55°C < TC < +125°C VSS = 0 V; 4.5 V < VCC < 5.5 V unless otherwise specified Group A subgroups Device types Limits Min 9, 10, 11 CE = VIL 7/ 8/ tDF 5/ 9, 10, 11 01 02,11-13 03 04,05 14,15 06,08,16 07,17 09,18 10,19 20,21 Max 60 11,13 01 02 03 04,05 14,15 06,08,16 07,17 09,18 10,19,21 20 OE high to output float Unit ns 75 100 150 70 40 35 30 25 20 15 0 55 60 105 50 40 35 30 25 20 15 ns 1/ 2/ 3/ 4/ 5/ 6/ Connect all address inputs and OE to VIH and measure ILO with the output under test connected to VOUT. Devices 11-20 operate at VCC = Maximum, IOUT = 0 mA, f = 5 Mhz. Device 21 operates at VCC = Maximum, IOUT = 0 mA, f = 10 Mhz. Tests for all input and control pins. Guaranteed if not tested. VPP may be one diode drop below VCC. It may be connected directly to VCC. Also, VCC must be applied simultaneously or before VPP and be removed simultaneously or after VPP. 7/ See figures 4 and 5. 8/ Equivalent ac test conditions (actual load conditions vary by tester): Output load: 1 TTL gate and CL = 100 pF. Input rise and fall times < 20 ns, Input pulse levels: 0.45 V and 2.4 V. Timing measurement reference levels: Inputs = 0.8 V and 2.0 V, Outputs = 0.8 V and 2.0 V. 9/ All pins not being tested are to be grounded. 3.10 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.11 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 42 (see MIL-PRF-38535, appendix A). STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86063 A REVISION LEVEL K SHEET 7 Case Z Inches .006 .010 .017 .021 .025 .026 .032 .035 .045 .050 .073 .103 .140 .167 .300 .390 .430 .445 .465 .485 .490 .495 .530 .545 .565 .585 .595 mm 0.15 0.25 0.43 0.53 0.63 0.66 0.81 0.89 1.14 1.27 1.85 2.62 3.56 4.24 7.62 9.90 10.90 11.36 11.83 12.34 12.40 12.67 13.53 13.81 14.46 14.97 15.11 FIGURE 1. Case outline. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86063 A REVISION LEVEL K SHEET 8 Device types 01 thru 21 Case outlines X, U Terminal number Y, Z Terminal number 1 VPP NC 2 A12 VPP 3 A7 A12 4 A6 A7 5 A5 A6 6 A4 A5 7 A3 A4 8 A2 A3 9 A1 A2 10 A0 A1 11 O0 A0 12 O1 NC 13 O2 O0 14 GND O1 15 O3 O2 16 O4 GND 17 O5 NC 18 O6 O3 19 O7 O4 20 CE O5 21 A10 O6 22 OE O7 23 A11 CE 24 A9 A10 25 A8 OE 26 A13 NC 27 A14 A11 28 VCC A9 29 --- A8 30 --- A13 31 --- A14 32 --- VCC NC = no connection FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86063 A REVISION LEVEL K SHEET 9 Mode CE OE VPP 2/ Outputs Read VIL VIL VCC DOUT Output disable VIL VIH VCC High Z Standby VIH X 1/ VCC High Z Program VIL VIH VPP 2/ DIN Program verify VIH VIL VPP 2/ DOUT VIH VIH VPP 2/ High Z Program inhibit 1/ X can be either VIL or VIH. 2/ For VPP see 4.6. FIGURE 3. Truth table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86063 A REVISION LEVEL K SHEET 10 FIGURE 4. Output load circuit. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86063 A REVISION LEVEL K SHEET 11 Notes: 1. tDF is specified from OE or CE , whichever occurs first. 2. OE may be delayed up to tACC – tOE after the falling edge of CE without impact on tACC. FIGURE 5. Switching waveforms. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86063 A REVISION LEVEL K SHEET 12 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA = +125°C, minimum. b. Interim and final electrical test parameters shall be as specified in table IIA herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MILPRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 5 and 6 of table I of method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (CIN and COUT measurements) shall be measured only for initial qualification and after any process or design changes which may affect input or output capacitance. Capacitance shall be measured between the designated terminal and GND at a frequency equal to 1 MHz. Sample size is 15 devices with no failures, and all input and output terminals tested. d. All devices selected for testing shall be programmed with a checkerboard pattern or equivalent. After completion of all testing, the devices shall be erased and verified (except devices submitted for groups C and D testing). e. Subgroups 7 and 8 shall include verification of the pattern specified in 4.4.1d. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86063 A REVISION LEVEL K SHEET 13 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. b. TA = +125°C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. d. All devices selected for testing shall be programmed with a checkerboard pattern or equivalent. After completion of all testing, the devices shall be erased and verified. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MILSTD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ± 5°C, after exposure, to the subgroups specified in table IIA herein. 4.5 Erasing procedure. The recommended erasure procedure for the device is exposure to shortwave ultraviolet light which has a wavelength of 2537 Angstroms (Å). The integrated` dose (i.e., UV intensity x exposure time) for erasure should be a 2 minimum of 15 Ws/cm . The erasure time with this dosage is approximately 15 to 20 minutes using an ultraviolet lamp with a 12000 μW/ cm2 power rating. The device should be placed within 1 inch of the lamp tubes during erasure. The maximum integrated dose the device can be exposed to without damage is 7258 Ws/ cm2 (1 week at 12000 μW/ cm2). Exposure of EPROMS to high intensity UV light for long periods may cause permanent damage. 4.6 Programming procedure. The programming procedures shall be as specified by the device manufacturer and shall be made available upon request. 4.7 Delta measurements for device class V. Delta measurements, as specified in table IIA, shall be made and recorded before and after the required burn-in screens and steady-state life tests to determine delta compliance. The electrical parameters to be measured, with associated delta limits are listed in table IIB. The device manufacturer may, at his option, either perform delta measurements or within 24 hours after burn-in perform final electrical parameter tests, subgroups 1, 7, and 9. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86063 A REVISION LEVEL K SHEET 14 TABLE IIA. Electrical test requirements. 1/ 2/ 3/ 4/ 5/ 6/ Line no. Test requirements Subgroups (in accordance with MIL-STD-883, TM 5005, table I) Subgroups (in accordance with MIL-PRF-38535, table III) Device class M 1/ 2/ 3/ 4/ 5/ 6/ 1 Interim electrical parameters (see 4.2) 2 Static burn-in (method 1015) 3 Same as line 1 4 Dynamic burn-in (method 1015) 5 Same as line 1 6 Final electrical parameters (see 4.2) 7 Device class Q Device class V 1, 7, 9 Not required Not required Not Required 1*, 7* ∆ Required Required Required 1*, 7* ∆ 1*, 2, 3, 7*, 8A,8B, 9 1*, 2, 3, 7*, 8A,8B, 9 1*, 2, 3, 7*, 8A, 8B, 9, 10, 11 Group A test requirements (see 4.4) 1, 2, 3, 4***, 7, 8A, 8B, 9, 10**, 11** 1, 2, 3, 4***, 7, 8A, 8B, 9, 10**, 11** 1, 2, 3, 4***, 7, 8A, 8B, 9, 10**, 11** 8 Group C end-point electrical parameters (see 4.4) 2, 8A, 10 2, 8A, 10 1, 2, 3, 7, 8A, 8B, 9, 10, 11 ∆ 9 Group D end-point electrical parameters (see 4.4) 2, 8A, 10 2, 8A, 10 2, 3, 8A, 8B 10 Group E end-point electrical parameters (see 4.4) 1, 7, 9 1, 7, 9 1, 7, 9 (*) indicates PDA applies to subgroups 1 and 7. (**) indicates that subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. (***) see 4.4.1c. Any subgroups at the same temperature may be combined when using a multifunction tester. Subgroups 7 and 8 shall consist of verifying the applicable data pattern, see 4.4.1d. Δ indicates delta limit (see table IIB) shall be required where specified, and the delta values shall be computed with reference to the previous interim electrical parameters (see line 1). Table IIB. Delta limits at +25°C. Parameter 1/ Device types All ISB2 + 10% of the specified value in Table I ILI + 10% of the specified value in Table I ILO + 10% of the specified value in Table I 1/ The above parameter shall be recorded before and after the required burn-in and life tests to determine the delta. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86063 A REVISION LEVEL K SHEET 15 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.1.2 Substitutability. Device class Q devices will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108. 6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43216-5000, or telephone (614) 692-0540. 6.5 Symbols, definitions, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535, MIL-STD-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in MIL-HDBK103 and QML-38535. The vendors listed in QML-38535 and MIL-HDBK-103 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DLA Land and Maritime-VA. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-86063 A REVISION LEVEL K SHEET 16 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 15-06-05 Approved sources of supply for SMD 5962-86063 are listed below for immediate acquisition only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-8606301UA 0C7V7 0C7V7 0C7V7 WS27C256L-20TMB QP27C256R-20/UA AT27C256R-20/UA 5962-8606301XA 0C7V7 0C7V7 57300 0C7V7 WS27C256L-20DMB AT27C256R-20/XA AS27C256-20JM QP27C256R-20/XA 5962-8606301YA 0C7V7 0C7V7 57300 0C7V7 WS27C256L-20CMB AT27C256R-20/YA AS27C256-20ECAM QP27C256-200/YA 5962-8606301YC 0C7V7 0C7V7 0C7V7 WS27C256L-20CMB AT27C256R-20/YC QP27C256R-20/YC 5962-8606301ZA 0C7V7 QP27C256-200/ZA 5962-8606302UA 0C7V7 0C7V7 0C7V7 WS27C256L-25TMB AT27C256R-25/UA QP27C256-250/UA 5962-8606302XA 0C7V7 0C7V7 57300 0C7V7 WS27C256L-25DMB AT27C256R-25/XA AS27C256-25JM QP27C256-250/XA 5962-8606302YA 0C7V7 0C7V7 57300 0C7V7 WS27C256L-25CMB AT27C256R-25/YA AS27C256-25ECAM QP27C256-250/YA 5962-8606302YC 0C7V7 0C7V7 0C7V7 WS27C256L-25CMB AT27C256R-25/YC QP27C256-250/YC 5962-8606302ZA 0C7V7 QP27C256-250/ZA 5962-8606303UA 0C7V7 0C7V7 0C7V7 WS27C256L-30TMB AT27C256R-30/UA QP27C256-300/UA 5962-8606303XA 0C7V7 0C7V7 57300 0C7V7 WS27C256L-30DMB AT27C256R-30/XA AS27C256-30JM QP27C256-300/XA See footnotes at end of table. 1 of 6 Vendor similar PIN 2/ STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued. DATE: 15-02-12 Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8606303YA 0C7V7 0C7V7 57300 0C7V7 WS27C256L-30CMB AT27C256R-30/YA AS27C256-30ECAM QP27C256-300/YA 5962-8606303YC 0C7V7 0C7V7 0C7V7 WS27C256L-30CMB AT27C256R-30/YC QP27C256-300/YC 5962-8606303ZA 0C7V7 QP27C256-30/ZA 5962-8606304UA 0C7V7 0C7V7 0C7V7 WS27C256L-17TMB AT27C256R-17/UA QP27C256-170/UA 5962-8606304XA 0C7V7 0C7V7 57300 0C7V7 WS27C256L-17DMB AT27C256R-17/XA AS27C256-17JM QP27C256-170/XA 5962-8606304YA 0C7V7 0C7V7 57300 0C7V7 WS27C256L-17CMB AT27C256R-17/YA AS27C256-17ECAM QP27C256-170/YA 5962-8606304YC 0C7V7 0C7V7 0C7V7 WS27C256L-17CMB AT27C256R-17/YC QP27C256-170/YC 5962-8606304ZA 0C7V7 QP27C256R-170/ZA 5962-8606305UA 0C7V7 0C7V7 0C7V7 WS27C256L-15TMB AT27C256R-15/UA QP27C256-150/UA 5962-8606305XA 0C7V7 0C7V7 57300 0C7V7 WS27C256L-15DMB AT27C256R-15/XA AS27C256-15JM QP27C256-150/XA 5962-8606305YA 0C7V7 0C7V7 57300 0C7V7 WS27C256L-15CMB AT27C256R-15/YA AS27C256-15ECAM QP27C256-150/YA 5962-8606305YC 0C7V7 0C7V7 0C7V7 WS27C256L-15CMB AT27C256R-15/YC QP27C256-150/YC 5962-8606305ZA 0C7V7 QP27C256-150/ZA 5962-8606306UA 0C7V7 0C7V7 AT27C256R-12/UA QP27C256-120/UA 5962-8606306XA 0C7V7 0C7V7 57300 0C7V7 WS27C256L-12DMB AT27C256R-12/XA AS27C256-12JM QP27C256-120/XA See footnotes at end of table. 2 of 6 STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued. DATE: 15-02-12 Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8606306YA 0C7V7 0C7V7 57300 0C7V7 WS27C256L-12CMB AT27C256R-12/YA AS27C256-12ECAM QP27C256-120/YA 5962-8606306YC 0C7V7 0C7V7 0C7V7 WS27C256L-12CMB AT27C256R-12/YC QP27C256-120/YC 5962-8606306ZA 0C7V7 QP27C256-120/ZA 5962-8606307UA 0C7V7 0C7V7 AT27C256R-90/UA QP27C256-90/UA 5962-8606307XA 0C7V7 57300 0C7V7 AT27C256R-90/XA AS27C256-90JM QP27C256-90/XA 5962-8606307YA 0C7V7 57300 0C7V7 AT27C256R-90/YA AS27C256-90ECAM QP27C256-90/YA 5962-8606307YC 0C7V7 0C7V7 AT27C256R-90/YC QP27C256-90/YC 5962-8606307ZA 0C7V7 QP27C256-90/ZA 5962-8606308UA 0C7V7 0C7V7 AT27C256R-70/UA QP27C256-70/UA 5962-8606308XA 0C7V7 0C7V7 57300 0C7V7 AT27C256R-70/XA 57C256F-70 AS27C256-70JM QP27C256-70/XA 5962-8606308YA 0C7V7 0C7V7 57300 0C7V7 AT27C256R-70/YA 57C256F-70 AS27C256-70ECAM QP27C256-70/YA 5962-8606308YC 0C7V7 0C7V7 0C7V7 AT27C256R-70/YC 57C256F-70 QP27C256-70/YC 5962-8606308ZA 0C7V7 QP27C256-70/ZA 5962-8606309UA 0C7V7 0C7V7 0C7V7 AT27C256R-55/UA 57C256F-55 QP27C256-55/UA 5962-8606309XA 0C7V7 0C7V7 57300 0C7V7 AT27C256R-55/XA 57C256F-55 AS27C256-55JM QP27C256-55/XA 5962-8606309YA 0C7V7 0C7V7 57300 0C7V7 AT27C256R-55/YA 57C256F-55 AS27C256-55ECAM QP27C256-55/YA See footnotes at end of table. 3 of 6 STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued. DATE: 15-02-12 Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-8606309YC 0C7V7 0C7V7 0C7V7 AT27C256R-55/YC 57C256F-55 QP27C256-55/YC 5962-8606310UA 0C7V7 0C7V7 0C7V7 AT27C256R-45/UA 57C256F-45 QP27C256-45/UA 5962-8606310XA 0C7V7 0C7V7 0C7V7 AT27C256R-45/XA 57C256F-45 QP27C256-45/XA 5962-8606310YA 0C7V7 0C7V7 0C7V7 AT27C256R-45/YA 57C256F-45 QP27C256-45/YA 5962-8606310YC 0C7V7 0C7V7 0C7V7 AT27C256R-45/YC 57C256F-45 QP27C256-45/YC 5962-8606311QXA 0C7V7 QP27C256-200/XA 5962-8606311QYA 0C7V7 QP27C256-200/YA 5962-8606311UA 0C7V7 0C7V7 AT27C256R-20/UA QP27C256-200/UA 5962-8606311XA 0C7V7 57300 0C7V7 AT27C256R-20/XA AS27C256-20JM QP27C256-200/XA 5962-8606311YA 0C7V7 57300 0C7V7 AT27C256R-20/YA AS27C256-20ECAM QP27C256-200/YA 5962-8606312QXA 0C7V7 QP27C256-250/XA 5962-8606312QYA 0C7V7 QP27C256-250/YA 5962-8606312UA 0C7V7 0C7V7 AT27C256R-25/UA QP27C256-250/UA 5962-8606312XA 0C7V7 57300 0C7V7 AT27C256R-25/XA AS27C256-25JM QP27C256-250/XA 5962-8606312YA 0C7V7 57300 0C7V7 AT27C256R-25/YA AS27C256-25ECAM QP27C256-250/YA 5962-8606313QXA 0C7V7 QP27C256-300/XA 5962-8606313QYA 0C7V7 QP27C256-300/YA 5962-8606313UA 0C7V7 0C7V7 AT27C256R-30/UA QP27C256-300/UA 5962-8606313XA 0C7V7 57300 0C7V7 AT27C256R-30/XA AS27C256-30JM QP27C256-300/XA See footnotes at end of table. 4 of 6 Vendor similar PIN 2/ STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued. DATE: 15-02-12 Standard microcircuit drawing PIN 1/ Vendor CAGE number 5962-8606313YA 0C7V7 57300 0C7V7 AT27C256R-30/YA AS27C256-30ECAM QP27C256-300/YA 5962-8606314QXA 0C7V7 QP27C256-170/XA 5962-8606314QYA 0C7V7 QP27C256-170/YA 5962-8606314UA 0C7V7 0C7V7 AT27C256R-17/UA QP27C256-170/UA 5962-8606314XA 0C7V7 57300 0C7V7 AT27C256R-17/XA AS27C256-17JM QP27C256-170/XA 5962-8606314YA 0C7V7 57300 0C7V7 AT27C256R-17/YA AS27C256-17ECAM QP27C256-170/YA 5962-8606315QXA 0C7V7 QP27C256-150/XA 5962-8606315QYA 0C7V7 QP27C256-150/YA 5962-8606315UA 0C7V7 0C7V7 AT27C256R-15/UA QP27C256-150/UA 5962-8606315XA 0C7V7 57300 0C7V7 AT27C256R-15/XA AS27C256-15JM QP27C256-150/XA 5962-8606315YA 0C7V7 57300 0C7V7 AT27C256R-15/YA AS27C256-15ECAM QP27C256-150/YA 5962-8606316QXA 0C7V7 QP27C256-120/XA 5962-8606316QYA 0C7V7 QP27C256-120/YA 5962-8606316UA 0C7V7 0C7V7 AT27C256R-12/UA QP27C256-120/UA 5962-8606316XA 0C7V7 57300 0C7V7 AT27C256R-12/XA AS27C256-12JM QP27C256-120/XA 5962-8606316YA 0C7V7 57300 0C7V7 AT27C256R-12/YA AS27C256-12ECAM QP27C256-12/YA 5962-8606317QXA 0C7V7 QP27C256-90/XA 5962-8606317QYA 0C7V7 QP27C256-90/YA 5962-8606317UA 0C7V7 0C7V7 AT27C256R-90/UA QP27C256-90/UA 5962-8606317XA 0C7V7 57300 0C7V7 AT27C256R-90/XA AS27C256-90JM QP27C256-90/XA 5962-8606317YA 0C7V7 57300 0C7V7 AT27C256R-90/YA AS27C256-90ECAM QP27C256-90/YA See footnotes at end of table. 5 of 6 Vendor similar PIN 2/ STANDARD MICROCIRCUIT DRAWING BULLETIN – Continued. DATE: 15-02-12 Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-8606318QXA 0C7V7 QP27C256-70/XA 5962-8606318QYA 0C7V7 QP27C256-70/YA 5962-8606318UA 0C7V7 0C7V7 AT27C256R-70/UA QP27C256-70/UA 5962-8606318XA 0C7V7 57300 0C7V7 AT27C256R-70/XA AS27C256-70JM QP27C256-70/XA 5962-8606318YA 0C7V7 57300 0C7V7 AT27C256R-70/YA AS27C256-70ECAM QP27C256-70/YA 5962-8606319QXA 0C7V7 QP27C256-55/XA 5962-8606319QYA 0C7V7 QP27C256-55/YA 5962-8606319UA 0C7V7 0C7V7 AT27C256R-55/UA QP27C256-55/UA 5962-8606319XA 0C7V7 57300 0C7V7 AT27C256R-55/XA AS27C256-55JM QP27C256-55/XA 5962-8606319YA 0C7V7 57300 0C7V7 AT27C256R-55/YA AS27C256-55ECAM QP27C256-55/YA 5962-8606320QUA 0C7V7 QP27C256-45/UA 5962-8606320QXA 0C7V7 QP27C256-45/XA 5962-8606320QYA 0C7V7 QP27C256-45/YA 5962-8606321QUA 0C7V7 QP27C256-35/UA 5962-8606321QXA 0C7V7 QP27C256-35/XA 5962-8606321QYA 0C7V7 QP27C256-35/YA 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed, contact the Vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number Vendor name and address 0C7V7 e2v, Inc. dba: QP Semiconductor Inc. 765 Sycamore Drive Milpitas, CA 95035 57300 Micross Components 7725 N. Orange Blossom Trail Orlando, FL 32810-2696 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in this information bulletin. 6 of 6