V I S H AY I N T E R T E C H N O L O G Y, I N C . www.vishay.com Film Capacitors Application Note Soldering Guidelines for Film Capacitors Vishay recommends that users observe the following guidelines for soldering our film capacitors. Adherence to these recommendations will help to safeguard product specifications and reliability while preventing damage to the capacitors during soldering. SOLDERING GUIDELINES AND RECOMMENDED WAVE SOLDERING PROFILE With regard to the resistance to soldering heat and the solderability, our products comply with “IEC 60384-1” and the additional type specifications. The recommended wave soldering profile for our leaded components is defined as follows: Temperature (°C) Total contact time < 5 s 260 Maximum solder temperature tp Tp Tp - 5 °C Tpreheat Tmax. t Tcomponent (body) Tsolder profile Preheating < 150 Time (s) Tp: Peak temperature of the component body (top) Tmax.: Maximum application temperature of the component Temperature of the component body (top) Revision: 04-Aug-15 Document Number: 28171 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 APPLICATION NOTE 0 Application Note www.vishay.com Vishay Soldering Guidelines for Film Capacitors The PSL (Process Sensitivity Level) is classified according JEDEC standard J-STD-075 “Classification of Non-IC Electronic Components for Assembly Processes” and summarized in following tables per product family and pitch size of the component: RADIAL POLYESTER TYPES PRODUCT PITCH SIZE FAMILY 5 mm 7.5 mm 22.5 mm 27.5 mm W4C (1)(3) W4C (1)(3) W4C (1)(3) W4C (1)(3) W4C (1)(3) W4C (1)(3) W4C (1)(3) W4C (1)(3) W4C (1)(3) W4C (1)(3) W4C (1)(3) W4C (1)(3) W4C (1)(3) MKT 1820 W4C (1)(3) W4C (1)(3) W4C (1)(3) W4C (1)(3) W4C (1)(3) MKT 1822 W4C (1)(3) W4C (1)(3) W4C (1)(3) W4C (1)(3) W4C (1)(3) MKT 1710 W4C (1)(3) W4C (1)(3) W4C (1)(3) W4C (1)(3) W4C (1)(3) MKT 303 MKT 365 W4Y (2)(4)) W4Y (2)(4) MKT 366 W4Y (2)(4) W4Y (2)(4) MKT 367 W4Y (2)(4) W4Y (2)(4) MKT 368 MKT 369 MKT 370 10 mm 15 mm W4C (1)(3) W4C (1)(3) W4C (1)(3) W4C (1)(3) W4Y (2)(4) W4C (1)(3) MKT 372 MKT 373/MKT 373M MKT 468 MKT 470 W4Y (2)(4) MKT 1817 W4Y (2)(4) MKT 1772 52.5 mm W4Y (2)(4) MKT 371 MKT 1818 37.5 mm W4Y (2)(4) W4C (1)(3) Notes (1) No risk (2) Risk for parameter change if PSL is not strictly followed (3) C: The component has a preheat limitation of 150 °C (4) Y: Temperature is measured at the body top and must be kept as follows: During preheating: Tmax. 125 °C During soldering: Tp 135 °C, tp 30 s, t 50 s Document Number: 28171 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 APPLICATION NOTE Revision: 04-Aug-15 Application Note www.vishay.com Vishay Soldering Guidelines for Film Capacitors RADIAL POLYPROPYLENE TYPES PRODUCT PITCH SIZE FAMILY 5 mm 7.5 mm 10 mm 15 mm 22.5 mm 27.5 mm MKP 375 W4C (1)(6) W4C (1)(6) W4C (1)(6) MKP 376 W4C (1)(6) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4C (1)(6) MKP 378 W4Y (2)(5) W4Y (2)(5) W4C (1)(6) W4Y (2)(5) W4C (1)(6) W4C (1)(6) W4C (1)(6) MKP 336 1 W4Y (2)(5) W4C (1)(6) W4C (1)(6) W4C (1)(6) MKP 336 2 W4Y (2)(5) W4C (1)(6) W4C (1)(6) W4C (1)(6) MKP 336 6 W4Y (2)(5) W4C (1)(6) MKP 338 1 (2)(5) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4Y (2)(5) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4C (1)(6) MKP 379 MKP 380 37.5 mm 52.5 mm W4C (1)(6) W4C (1)(6) W4Y (3)(4) MMKP 383 MKP 385 MKP 416/MKP 417/MKP 418/ MKP 419/MKP 420 W4Y (3)(4) MKP 422 W4Y (3)(4) W4Y (3)(5) W4Y W4Y (3)(5) MKP 338 2 MKP 338 4 MKP 338 6 W4Y (3)(5) W4Y (2)(5) W4C (1)(6) W4C (1)(6) W4C (1)(6) MKP 339 W4Y (3)(5) W4Y (2)(5) W4C (1)(6) W4C (1)(6) W4C (1)(6) (3)(5) (2)(5) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4Y (2)(5) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4Y (2)(5) W4C (1)(6) W4C (1)(6) W4C (1)(6) (2)(5) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4C (1) W4Y (3)(5) W4Y (2)(5) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4Y (2)(5) W4Y (2)(5) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4C (1)(6) W4C (1)(6) MKP 339M W4Y MKP 339T W4Y (3)(5) MKP 479 MKP 1778 KP1830 W4Y W4Y (3)(4) MKP 1840/MKP 1840M MKP 1841/MKP 1841M W4Y W4Y (2)(4) MKP 1848 W4C (1)(6) Notes No risk (2) Risk for parameter change if PSL is not strictly followed (3) Risk for product damage if PSL is not strictly followed (4) Y: Temperature is measured at the body top and must be kept as follows: During preheating: Tmax. 100 °C During soldering: Tp 110 °C, tp 20 s, t 30 s (5) Y: Temperature is measured at the body top and must be kept as follows: During preheating: Tmax. 110 °C During soldering: Tp 120 °C, tp 20 s, t 30 s (6) C: The component has a preheat limitation of 150 °C Revision: 04-Aug-15 Document Number: 28171 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 APPLICATION NOTE (1) Application Note www.vishay.com Vishay Soldering Guidelines for Film Capacitors AXIAL POLYESTER TYPES PRODUCT BODY LENGTH FAMILY MKT 1813 11 mm 14 mm 19 mm 26.5 mm 31.5 mm 41.5 mm W4Y (3)(5) W4Y (3)(5) W4C (2)(4) W4C (1)(4) W4C (1)(4) W4C (1)(4) W4C (2)(4) W4C (1)(4) W4C (1)(4) W4C (1)(4) F1773 Notes (1) No risk (2) Risk for parameter change if PSL is not strictly followed (3) Risk for product damage if PSL is not strictly followed (4) C: The component has a preheat limitation of 150 °C (5) Y: Temperature is measured at the body top and must be kept as follows: During preheating: Tmax. 125 °C During soldering: Tp 135 °C, tp 30 s, t 50 s AXIAL POLYPROPYLENE TYPES PRODUCT BODY LENGTH FAMILY MKP 1839 / MKP 1839 HQ MKP 1845 11 mm 14 (17) mm 19 (22) mm 26.5 (29) mm 31.5 (34) mm 41.5 (44) mm W4Y (3)(4) W4Y (3)(4) W4Y (3)(5) W4Y (2)(5) W4Y (1)(5) W4Y (1)(5) W4Y (3)(4) W4Y (3)(5) W4Y (2)(5) W4Y (1)(5) W4Y (1)(5) Notes (1) No risk (2) Risk for parameter change if PSL is not strictly followed (3) Risk for product damage if PSL is not strictly followed (4) Y: Temperature is measured at the body top and must be kept as follows: During preheating: Tmax. 100 °C During soldering: Tp 110 °C, tp 20 s, t 30 s (5) Y: Temperature is measured at the body top and must be kept as follows: During preheating: Tmax. 110 °C During soldering: Tp 120 °C, tp 20 s, t 30 s WARNINGS Y X Revision: 04-Aug-15 Document Number: 28171 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 APPLICATION NOTE Excessive soldering heat (preheating or soldering above the recommended limits) can result in product damage and malfunctioning and should be thus strictly avoided. If PSL limits have been exceeded at any point in time during the soldering process, the products could possibly show a change in certain parameters (e.g. capacitance value, tan , insulation resistance, breakdown level, etc.) Exceeding PSL limits can even result in destruction of the product. Warning signs include a bulged or deformed product encapsulation. Such an appearance may also be the result of other causes, such as interruptions, cooling malfunctioning of the soldering machine, etc. Axial components can better protected from direct heat conducted by the PCB, when a distance is kept from the product to the PCB as follows: Application Note www.vishay.com Vishay Soldering Guidelines for Film Capacitors TRIMMER CAPACITORS FAMILY PRODUCT BODY LENGTH ALL SIZES 808 / 809 W4Y (3)(4) Notes (1) No risk (2) Risk for parameter change if PSL is not strictly followed (3) Risk for product damage if PSL is not strictly followed (4) Y: Temperature is measured at the body top and must be kept as follows: During preheating: Tmax. 85 °C During soldering: Tp 100 °C, tp 20 s, t 30 s Due to the sensitivity of these electromechanical components, it is critical to solder these components in a wave soldering method. We recommend to use manual soldering, see below. SOLDERING CONDITIONS FOR MANUAL SOLDERING 1. Use a soldering iron with sufficient wattage and a regulated temperature. The adequacy of the soldering iron can be judged by the amount of time needed to reflow the solder. Beginning at 650 °F (343 °C), adjust the temperature so that the solder reflows within 1.5 s to 3 s. - If the solder reflow occurs in less than 1 s to 1.5 s, this indicates that the tip temperature is excessive. - If more than 3 s to 3.5 s are needed for solder reflow, either the tip temperature is insufficient or the tip is cooling down when applied to the circuit board. 2. Apply a small amount of flux to the component termination and the pad layout. 3. After tinning the iron, place the iron tip on the circuit pad at the edge furthest from the component. The soldering should be completed in 1.5 s to 3 s. If it is necessary to keep the iron on longer than 3 s, replace the component with a fresh device. 4. Add the solder at the solder tip to ensure that it flows from the pad to the termination of the component. Be careful not to add too much solder. The minimum is the best. 5. Never touch the component being worked on or any adjacent components with the soldering iron. Document Number: 28171 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 APPLICATION NOTE Revision: 04-Aug-15