Integrated Circuits Package Information Tape and Reel Information A separate 'Tape and Reel' document is also available from the CML website Publication No: //Dastardly/publications/PACKAGES/Packs.indd - Issue 18 - April2016 1 CML Microcircuits Package Information 2 CML CERAMIC PACKAGE STYLES ENG 16-pin Ceramic DIL.0.3" pitch (CER1) (CML) 16-pin Ceramic DIL.0.6" pitch (CER2) (CML) 24-pin Ceramic DIL.0.6" pitch (CER3) (CML) 44-Lead LCC Package (LCC1) (CML) 28-pin Ceramic DIL.0.6" pitch (CER4) (CML) 40-pin Ceramic DIL.0.6" pitch (CER5) (CML) 68-Lead J Bend Package (CML) 44-Lead J Bend Package (CML) Notes Past CML / MX-COM Package variations Old CML Current CMX Old MX-COM Legend Cerdip - ceramic dual-in-line CLCC - ceramic leaded chip carrier DIL - dual-in-line LQFP - low-profile quad flat pack PDIP - plastic dual-in-line PLCC - plastic leaded chip carrier SSOP - shrunk small-outline package SOIC - small-outline integrated circuit TQFP - thin quad flat pack TSSOP - thin shrunk small-outline package VQFN - very-thin quad flat pack Note: For the purposes of this document, the physical IC connection descriptions of 'lead', 'leadless' and 'pin', etc. are represented by the single term of 'pin'. 3 CML Microcircuits Package Information ...... 28-Pin SOIC, DW (D1) DIM. A * * B ALTERNATIVE PIN LOCATION MARKING E W L T PIN 1 X Y C K1 H K P J A B C E F H J K K1 L P T W X Y TYP. MIN. MAX. 0.697 (17.70) 0.711 (18.06) 0.286 (7.26) 0.299 (7.59) 0.088 (2.24) 0.105 (2.67) 0.390 (9.90) 0.419 (10.64) 0.650 (16.51) 0.003 (0.08) 0.020 (0.51) 0.018 (0.46) 0.013 (0.33) 0.041 (1.04) 0.041 (1.04) 0.050 (1.27) 0.016 (0.41) 0.050 (1.27) 0.0125 (0.32) 0.009 (0.23) 45° 0° 10° 7° NOTE : F * A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees Co-Planarity of leads within 0.004” (0.1mm) 24-Pin SOIC, DW (D2) DIM. A * * B ALTERNATIVE PIN LOCATION MARKING E W L T PIN 1 X Y C K K1 H P J F A B C E F H J K K1 L P T W X Y TYP. MIN. MAX. 0.613 (15.57) 0.597 (15.16) 0.286 (7.26) 0.299 (7.59) 0.093 (2.36) 0.105 (2.67) 0.390 (9.90) 0.419 (10.64) 0.550 (14.1) 0.003 (0.08) 0.020 (0.51) 0.020 (0.51) 0.013 (0.33) 0.041 (1.04) 0.041 (1.04) 0.050 (1.27) 0.016 (0.41) 0.050 (1.27) 0.0125 (0.32) 0.009 (0.23) 45° 10° 0° 7° NOTE : * A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees Co-Planarity of leads within 0.004” (0.1mm) 4 CML Microcircuits Package Information ...... 20-Pin SOIC, DW (D3) DIM. A * * B ALTERNATIVE PIN LOCATION MARKING E W L T PIN 1 X Y K C K1 P J H F A B C E F H J K K1 L P T W X Y TYP. MIN. MAX. 0.495 (12.57) 0.510 (12.95) 0.286 (7.26) 0.299 (7.59) 0.088 (2.24) 0.105 (2.67) 0.390 (9.90) 0.419 (10.64) 0.450 (11.43) 0.003 (0.08) 0.020 (0.51) 0.020 (0.51) 0.013 (0.33) 0.041 (1.04) 0.041 (1.04) 0.050 (1.27) 0.016 (0.41) 0.050 (1.27) 0.0125 (0.32) 0.009 (0.23) 45° 10° 0° 7° NOTE : * A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees Co-Planarity of leads within 0.004” (0.1mm) 16-Pin SOIC, DW (D4) DIM. MIN. TYP. MAX. A * * ALTERNATIVE PIN LOCATION MARKING B E W L T PIN 1 X Y C K1 H K P J F A B C E F H J K K1 L P T W X Y 0.395 (10.03) 0.413 (10.49) 0.286 (7.26) 0.299 (7.59) 0.088 (2.24) 0.105 (2.67) 0.390 (9.90) 0.419 (10.64) 0.350 (8.89) 0.003 (0.08) 0.020 (0.51) 0.020 (0.51) 0.013 (0.33) 0.041 (1.04) 0.041 (1.04) 0.050 (1.27) 0.016 (0.41) 0.050 (1.27) 0.0125 (0.32) 0.009 (0.23) 45° 10° 0° 7° NOTE : * A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees Co-Planarity of leads within 0.004” (0.1mm) 5 CML Microcircuits Package Information ...... 24-Pin SSOP (D5) A Z * * E B L T PIN 1 X Y H P J DIM. MIN. A B C E F H J L P T X Y Z 7.90 5.00 1.67 7.40 TYP. MAX. 8.50 5.60 2.00 8.20 7.15 0.21 0.38 0.05 0.22 0.55 0.95 0.65 0.25 8° 0.09 0° 7° 9° 4° 12° NOTE : C * F A & B are reference data and do not include mold deflash or protrusions. All dimensions in mm Angles are in degrees Co-Planarity of leads within 0.1mm 28-Pin SSOP (D6) A Z E B ALTERNATIVE PIN LOCATION MARKING * * L T PIN 1 X Y H P J DIM. MIN. A B C E F H J L P T X Y Z 9.90 5.00 1.67 7.40 TYP. MAX. 10.50 5.60 2.00 8.20 8.45 0.05 0.22 0.55 0.21 0.38 0.95 0.65 0.09 0° 0.25 8° 7° 9° 4° 12° NOTE : C * F A & B are reference data and do not include mold deflash or protrusions. All dimensions in mm Angles are in degrees Co-Planarity of leads within 0.1mm 6 CML Microcircuits Package Information ...... 28-Pin TSSOP (E1) A * * E B L T PIN 1 X Y C J H F MIN. A B C E F H J L P T X Y 9.60 4.30 -------6.20 TYP. MAX. 9.80 4.50 1.20 6.60 8.45 0.05 0.17 0.45 0.15 0.30 0.75 0.65 0.08 0° 0.20 8° 12° NOTE : * P A & B are reference data and do not include mold deflash or protrusions. All dimensions in mm Angles are in degrees 24-Pin TSSOP (E2) A * * E B L T PIN 1 X Y C H DIM. J F DIM. MIN. A B C E F H J L P T X Y 7.70 4.30 -------6.20 TYP. MAX. 7.90 4.50 1.20 6.60 7.15 0.15 0.30 0.75 0.05 0.17 0.45 0.65 0.20 8° 0.08 0° 12° NOTE : * P A & B are reference data and do not include mold deflash or protrusions. All dimensions in mm Angles are in degrees 7 CML Microcircuits Package Information ...... 20-Pin TSSOP (E3) DIM. A * * E B L T PIN 1 X Y C J H F TYP. MAX. 6.60 4.50 1.20 6.60 6.40 4.30 -------6.20 5.85 0.15 0.30 0.75 0.05 0.17 0.45 0.65 0.20 8° 0.08 0° 12° NOTE : * P A & B are reference data and do not include mold deflash or protrusions. All dimensions in mm Angles are in degrees 16-Pin TSSOP (E4) A * * E B L T PIN 1 X Y C H A B C E F H J L P T X Y MIN. J F DIM. MIN. A B C E F H J L P T X Y 4.90 4.30 -------6.20 TYP. MAX. 5.10 4.50 1.20 6.60 4.55 0.15 0.30 0.75 0.05 0.17 0.45 0.65 0.20 8° 0.08 0° 12° NOTE : * P A & B are reference data and do not include mold deflash or protrusions. All dimensions in mm Angles are in degrees 8 CML Microcircuits Package Information ...... 24-Pin PLCC; LG (L1) D A C P B J ID EN T K L X W E1 G E F (PIN 1) D IM . M IN . TYP. M AX. 0.390 (9.91) 0.404 (10.26) A * B 0.390 (9.91) 0.404 (10.26) * C 0.098 (2.49) 0.616 (15.65) D 0.616 (15.65) E 0.524 (13.31) E1 0.250 (6.35) F 0.250 (6.35) G 0.004 (0.10) H 0.022 (0.56) 0.018 (0.46) J 0.055 (1.40) 0.045 (1.14) K 0.033 (0.84) K1 0.031 (0.80) 0.039 (1.00) L 0.049 (1.24) 0.051 (1.30) P 0.006 (0.15) 0.009 (0.23) T 45° W 6° X 6° Z T K1 H * Z N O TE : A & B are reference datum 's and do notinclude m old deflash orprotrusions. Alldim ensions in inches (m m .) Angles are in degrees 24-Pin PLCC; LS (L2) C E B K Y DA J E1 W W H T PIN 1 K1 P G F DIM. * BA * C D E E1 F G H J K K1 P T W Y * MIN. TYP. MAX. 0.409 (10.40) 0.382 (9.70) 0.409 (10.40) 0.382 (9.70) 0.128 (3.25) 0.146 (3.70) 0.435 (11.05) 0.417 (10.59) 0.417 (10.59) 0.435 (11.05) 0.366 (9.30) 0.250 (6.35) 0.250 (6.35) 0.023 (0.58) 0.018 (0.46) 0.022 (0.56) 0.048 (1.22) 0.059 (1.50) 0.049 (1.24) 0.051 (1.30) 0.006 (0.15) 0.009 (0.23) 60° 30° 6° NOTE : A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees 9 48-Pin LQFP (L4) D IDENT C A (PIN 1) DIM. * * P B E J MAX. 7.11 7.11 1.60 9.25 9.25 0.15 0.28 0.76 6.91 A B C D E H J L P T X Y 6.91 1.40 8.74 8.74 0.05 0.10 0.35 0.50 0.13 0° 11° 7° 13° NOTE : Y * A & B are reference data and do not include mold deflash or protrusions. All dimensions in mm Angles are in degrees Co-Planarity of leads within 0.1mm T H X TYP. MIN. L CML Microcircuits Package Information ...... 44-Pin PLCC; LH (L6) C D K A N Y J IDENT * * B E J1 W PIN 1 H T M P G TYP. DIM. MIN. A B C D E F G H J J1 K M N P T W Y 0.650 (16.51) 0.650 (16.51) MAX. 0.656 (16.66) 0.656 (16.66) 0.180 (4.57) 0.695 (17.65) 0.695 (17.65) 0.685 (17.40) 0.685 (17.40) 0.500 (12.7) 0.500 (12.7) 0.020 (0.51) 0.021 (0.53) 0.013 (0.33) 0.029 (0.74) 0.070 (1.78) 0.062 (1.57) 0.062 (1.57) 0.050 (1.27) 0.010 (0.25) 0.30 (7.62) x 45° 7° NOTE : * F A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees 10 44-Pin LQFP; L7 D C A MIN. A B C D E H J L P T X Y 9.90 9.90 1.40 11.80 11.80 * * P E B DIM. J (PIN 1) IDENT Y MAX. 0.04 10.11 10.11 1.60 12.20 12.20 0.16 0.24 0.40 0.45 0.75 0.80 0.20 7° 14° 0.09 0° 10° NOTE : * A & B are reference data and do not include mold deflash or protrusions. All dimensions in mm Angles in degrees T Co-Planarity of leads within 0.1mm H X TYP. L CML Microcircuits Package Information ...... 100-Pin LQFP; L8 D A 75 76 51 50 * * B E 100 1 26 25 IDENT (PIN 1) DIM. MIN. A B C D E H J L M P T X 13.8 13.8 1.40 15.8 15.8 0.05 0.17 0.45 TYP. MAX. 14.2 14.2 1.60 16.2 16.2 0.15 0.27 0.75 1.00 0.50 0.09 0.20 0° 7° NOTES : All dimensions in mm M J P C Angles in degrees * Each lead centerline is located within 0.08 mm of its true position (T.P.) at maximum material condition T X A & B are reference data and do not include mold deflash or protrusions. H Co-Planarity of leads within 0.1mm L 11 64-Pin LQFP; L9 D C A DIM. * * P B E J (PIN 1) TYP. 9.80 MAX. 10.20 10.20 1.60 12.20 12.20 0.15 0.27 0.75 9.80 1.40 11.80 11.80 0.05 0.17 0.45 0.50 0.09 0° 11° 0.20 7° 13° NOTE : Y * A & B are reference data and do not include mold deflash or protrusions. All dimensions in mm Angles are in degrees Co-Planarity of leads within 0.1mm T X A B C D E H J L P T X Y MIN. H L CML Microcircuits Package Information ...... 8-Pin PDIP; P (P1) A B PIN 1 J1 Z E Y T M K H L E1 K1 C P J D IM . M IN . TYP. M AX. 0.346 (8.790) 0.400 (10.16) A * B 0.240 (6.10) 0.260 (6.60) * C 0.145 (3.68) 0.200 (5.08) 0.390 (9.91). E 0.300 (7.62) 0.325 (8.25) E1 0.290 (7.37) 0.30 (7.62) F 0.030 (0.76) H 0.023 (0.58) J 0.015 (0.38) 0.065 (1.65) J1 0.045 (1.14) 0.062 (1.58) K 0.062 (1.58) K1 0.150 (3.81) L 0.121 (3.07) 0.029 (0.74) M 0.100 (2.54) P T 0.008 (0.20) 0.015 (0.38) 7° Y Z 5° N O TE : F e reference datum 's and do * Anot& iBnclarude m old deflash orprotrusions. Alldim ensions in inches (m m .) Angles are in degrees 12 CML Microcircuits Package Information ...... 16-Pin PDIP; P (P3) DIM. A * AB *C Z B E1 E E E1 F H J J1 K K1 L M P T Y Z Y T M PIN 1 K K1 H L J J1 C P F MIN. TYP. MAX. 0.740 (18.80) 0.810 (20.57) 0.240 (6.10) 0.262 (6.65) 0.127 (3.23) 0.200 (5.08) 0.300 (7.62) 0.390 (9.91). 0.290 (7.37) 0.325 (8.26) 0.70 (17.78) 0.015 (0.38) 0.015 (0.38) 0.040 (1.02) 0.040 (1.02) 0.023 (0.58) 0.065 (1.65) 0.056 (1.42) 0.064 (1.63) 0.056 (1.42) 0.064 (1.63) 0.121 (3.07) 0.150 (3.81) 0.028 (0.71) 0.100 (2.54) 0.008 (0.20) 0.015 (0.38) 7° 5° NOTE : * A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees 24-Pin PDIP; P (P4) A DIM. Z B E E1 *A * BC E E1 F H J J1 K K1 L M P T Y Z Y PIN1 T M K H L K1 C J J1 P F MIN. TYP. MAX. 1.200 (30.48) 1.270 (32.26) 0.500 (12.70) 0.555 (14.10) 0.142(3.61) 0.220 (5.59) 0.600 (15.24) 0.670 (17.02) 0.590 (14.99) 0.625 (15.88) 1.10 (27.94) 0.015 (0.38) 0.045 (1.14) 0.015 (0.38) 0.023 (0.58) 0.040 (1.02) 0.065 (1.65) 0.066 (1.68) 0.074 (1.88) 0.060 (1.52) 0.074 (1.88) 0.121 (3.07) 0.160 (4.06) 0.180 (4.58) 0.100 (2.54) 0.008 (0.20) 0.015 (0.38) 7° 4° NOTE : * A & B are reference datum's and do not include mold deflash or protrusions. All dimensions in inches (mm.) Angles are in degrees 13 CML Microcircuits Package Information ...... 64-Pin VQFN (Q1) A Index Area 1 DIM. C * * P B J Top View J 0.80 7.00 7.00 0.00 0.18 0.20 0.30 0 9.00 BSC 0.90 1.00 7.80 7.80 0.05 0.30 0.25 0.50 0.15 0.40 0.50 0.20 NOTE : A & B are reference data and do not include mold deflash or protrusions. * K All dimensions in mm Angles are in degrees Exposed G Metal Pad H MAX. 9.00 BSC A B C F G H J K L L1 P T F C TYP. MIN. Index Area 1 T Index Area 2 L L1 Pin1 Dot Dot Index Area 2 Bottom View Chamfer Index Area 1 is located directly above Index Area 2 Depending on the method of lead termination at the edge of the package, pull back (L1) may be present. L minus L1 to be equal to, or greater than 0.3mm The underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal conductivity and mechanical strength of the package fixing. Where advised, an electrical connection to this metal pad may also be required 56-Pin VQFN (Q2) Index Area 1 A DIM. C * * P B J Top View J K * H Exposed G Metal Pad T 0.80 4.25 4.25 0.00 0.18 0.20 0.30 0 MAX. 8.00 BSC 0.90 0.25 1.00 6.25 6.25 0.05 0.30 0.50 0.15 0.40 0.50 0.20 NOTE : A & B are reference data and do not include mold deflash or protrusions. Index Area 1 L Pin1 TYP. 8.00 BSC All dimensions in mm Angles are in degrees F C MIN. A B C F G H J K L L1 P T Index Area 2 L1 Dot Dot Chamfer Bottom View Index Area 1 is located directly above Index Area 2 Index Area 2 Depending on the method of lead termination at the edge of the package, pull back (L1) may be present. L minus L1 to be equal to, or greater than 0.3mm The underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal conductivity and mechanical strength of the package fixing. Where advised, an electrical connection to this metal pad may also be required 14 CML Microcircuits Package Information ...... 48-Pin VQFN (Q3) Index Area 1 A DIM. C * * P B J Top View 0.80 4.60 4.60 0.00 0.18 0.20 0.30 0 7.00 BSC 0.90 1.00 5.65 5.65 0.05 0.30 0.25 0.50 0.15 0.40 0.50 0.20 NOTE : K A & B are reference data and do not include mold deflash or protrusions. * F All dimensions in mm Angles are in degrees Exposed Metal Pad G H MAX. 7.00 BSC A B C F G H J K L L1 P T J C TYP. MIN. Index Area 1 T Index Area 2 L L1 Pin1 Dot Dot Chamfer Bottom View Index Area 1 is located directly above Index Area 2 Index Area 2 Depending on the method of lead termination at the edge of the package, pull back (L1) may be present. L minus L1 to be equal to, or greater than 0.3mm The underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal conductivity and mechanical strength of the package fixing. Where advised, an electrical connection to this metal pad may also be required 40-Pin VQFN (Q4) Index Area 1 A C * * P B J Top View J H MIN. A B C F G H J K L L1 P T 0.80 2.75 2.75 0.00 0.18 0.20 0.30 0 TYP. MAX. 6.00 BSC 6.00 BSC 0.90 0.25 1.00 4.30 4.30 0.05 0.30 0.50 0.15 0.40 0.50 0.20 NOTE : K F C DIM. Index Area 1 L Pin1 A & B are reference data and do not include mold deflash or protrusions. All dimensions in mm Angles are in degrees Exposed Metal Pad G T * L1 Dot Index Area 2 Bottom View Index Area 2 Dot Chamfer Index Area 1 is located directly above Index Area 2 Depending on the method of lead termination at the edge of the package, pull back (L1) may be present. L minus L1 to be equal to, or greater than 0.3mm The underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal conductivity and mechanical strength of the package fixing. Where advised, an electrical connection to this metal pad may also be required 15 CML Microcircuits Package Information ...... 32-Pin VQFN (Q5) A Index Area 1 C * * P B J Top View DIM. MIN. A B C F G H J K L L1 P T 0.80 3.00 3.00 0.00 0.18 0.20 0.30 0 TYP. MAX. 5.00 BSC 5.00 BSC 0.90 1.00 3.80 3.80 0.05 0.30 0.25 0.55 0.15 0.50 0.20 J K NOTE : * F Exposed Metal Pad G C H TPin1 A & B are reference data and do not include mold deflash or protrusions. All dimensions in mm Angles are in degrees L Index Area 1 Index Area 2 L1 Index Area 2 Dot Dot Bottom View Chamfer Index Area 1 is located directly above Index Area 2 Depending on the method of lead termination at the edge of the package, pull back (L1) may be present. L minus L1 to be equal to, or greater than 0.3mm The underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal conductivity and mechanical strength of the package fixing. Where advised, an electrical connection to this metal pad may also be required 24-Pin VQFN (Q6) C A Index Area 1 DIM. * * P B J Top View A B C F G H J K L L1 P T MIN. TYP. MAX. 4.00 BSC 0.80 2.55 2.55 0.00 0.18 0.20 0.25 0 4.00 BSC 0.90 0.25 1.00 2.80 2.80 0.05 0.30 0.50 0.15 0.50 0.20 J K C NOTE : * F H T Exposed Metal Pad G Pin1 A & B are reference data and do not include mold deflash or protrusions. All dimensions in mm Angles are in degrees L L1 Index Area 1 Index Area 2 Dot Chamfer Dot Bottom View Index Area 2 Index Area 1 is located directly above Index Area 2 Depending on the method of lead termination at the edge of the package, pull back (L1) may be present. L minus L1 to be equal to, or greater than 0.3mm The underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal conductivity and mechanical strength of the package fixing. Where advised, an electrical connection to this metal pad may also be required 16 CML Microcircuits Package Information ...... 16-Pin VQFN (Q7) DIM. * * MIN. A B C F G H J K L L1 P T TYP. MAX. 4.00 BSC 0.80 2.55 2.55 0.00 0.25 0.20 4.00 BSC 0.90 1.00 2.80 2.80 0.05 0.35 0.30 0.50 0.15 0.30 0 0.65 0.20 NOTE : A & B are reference data and do not include mold deflash or protrusions. E xposed Metal P ad Al l dimensions in m m Angl es ar e in degr ees In de x Area 1 Dot Index Area 2 Dot Chamfer Index A rea 1 i s located directly above Ind ex Area 2 Depending on the method of lead termination at the edge of the package, pull back (L1) may be present. L minus L1 to be equal to, or greater than 0.3mm The underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal conductivity and mechanical strength of the package fixing. Where advised, an electrical connection to this metal pad may also be required \\Dastardly\Publications\PACKAGES\packs.indd 17