Product Notice Notice: #090723 Date: July 31st 2009 To Our Valued Customers: We appreciate your use of V•I Chip products. Our commitment to customer satisfaction is demonstrated by our notification to you of a documentation correction. Description: Recent dimensional checks indicated that V•I Chip product height was within published dimensions but was towards the higher end of the specification. This dimension takes into account known variations in internal pcb thickness selected for product family, number of layers, one or two ply material etc. and is a normal part of V•I Chip design. The package height as documented will change from 0.260 +/- 0.01” to 0.265 +/- 0.01” (a less than 2% adjustment in mean height). As an example, the ‘earlier’ and ‘revised’ package dimensional drawings for BCM products are attached, and the relevant dimension shown below: Earlier Height = 0.260” +/- 0.010” Revised Height = 0.265” +/- 0.010” This is a change to documentation only, to reflect actual dimensions. There are no changes to the product itself. Documentation to be corrected includes datasheets, 3D mechanical models, applicable technical specifications. Products Affected: All V.I Chip products (BCM, PRM, VTM). Schedule: As new products and documentation is released, it will use the new dimension. All existing documentation will be revised by the end of August 2009. There are no ‘datecode’ specific changes. V.I Chip Inc. (a Vicor Company), 25 Frontage Road, Andover MA01810, Tel: (978) 470-2900, FAX: (978) 475-6715 p1/2 Action Required: There are no changes to actual device Fit/Form/Function. However, customers with multiple V•I Chips using a common heatsink may like to review mechanical tolerancing and any thermal implications, though any effects are expected to be negligible. Technical marketing contact: Vicky Landry V•I Chip Inc. 25 Frontage Road Andover, MA 01810 (978) 749-3311 [email protected] V.I Chip Inc. (a Vicor Company), 25 Frontage Road, Andover MA01810, Tel: (978) 470-2900, FAX: (978) 475-6715 p2/2