Product Change Notice Notice: #150106 MSL 4 Upgrade Date: January 6, 2015 To Our Valued Customer: We appreciate your use of VI Chip products. Our commitment to customer satisfaction is demonstrated by our notification to you of the following change. Description: The FULL and HALF sized VI Chip packages will be upgraded from MSL 6 (245 °C) & MSL 5 (225 °C) to MSL 4 (245 °C) by the use of a new mold compound. For more information on MSL (Moisture Sensitivity Level), please refer to the latest version of IPC-M-109 obtainable through www.ipc.org Products Affected: All VI Chip products in the FULL and HALF size packages. Schedule / Date codes: Affected products with a date code of 1528 (July 6, 2015) will have the new mold compound and will be marked on shipping materials as MSL 4 capable. Data sheets will be updated on July 6, 2015. Action Required: No actions are required. This improvement may allow for improvements in customer assembly processes. Contact your local Vicor representative for more information. Technical Marketing contact: Ian Mazsa [email protected] 978-749-3247 Vicor, 25 Frontage Road, Andover MA01810, Tel: (978) 470-2900, FAX: (978) 475-6715 p1/1