PCN 150106

Product Change Notice
Notice: #150106 MSL 4 Upgrade
Date: January 6, 2015
To Our Valued Customer:
We appreciate your use of VI Chip products. Our commitment to customer satisfaction is demonstrated by our notification
to you of the following change.
Description:
The FULL and HALF sized VI Chip packages will be upgraded from MSL 6 (245 °C) & MSL 5 (225 °C) to MSL 4 (245 °C)
by the use of a new mold compound.
For more information on MSL (Moisture Sensitivity Level), please refer to the latest version of IPC-M-109 obtainable
through www.ipc.org
Products Affected:
All VI Chip products in the FULL and HALF size packages.
Schedule / Date codes:
Affected products with a date code of 1528 (July 6, 2015) will have the new mold compound and will be marked on
shipping materials as MSL 4 capable.
Data sheets will be updated on July 6, 2015.
Action Required:
No actions are required.
This improvement may allow for improvements in customer assembly processes.
Contact your local Vicor representative for more information.
Technical Marketing contact:
Ian Mazsa
[email protected]
978-749-3247
Vicor, 25 Frontage Road, Andover MA01810,
Tel: (978) 470-2900, FAX: (978) 475-6715
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