To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.) Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand names are mentioned in the document, these names have in fact all been changed to Renesas Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself. Renesas Technology Home Page: http://www.renesas.com Renesas Technology Corp. Customer Support Dept. April 1, 2003 Cautions Keep safety first in your circuit designs! 1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corporation or a third party. 2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corporation by various means, including the Renesas Technology Corporation Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corporation for further details on these materials or the products contained therein. 2SH28 Silicon N Channel IGBT High Speed Power Switching ADE-208-790A(Z) 2nd. Edition May 1999 Features • High speed switching • Low on-voltage Outline TO–220AB C G 1 E 2 3 1. Gate 2. Collector (Flange) 3. Emitter 2SH28 Absolute Maximum Ratings (Ta = 25°C) Item Symbol Ratings Unit Collector to Emitter voltage VCES 600 V Gate to Emitter voltage VGES ±20 V Collector current IC 20 A Collector peak current ic(peak) 40 A 60 W Note1 Collector dissipation PC Channel temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C Note: 1. Value at Tc = 25°C Electrical Characteristics (Ta = 25°C) Item Symbol Min Typ Max Unit Test Conditions Zero gate voltage collector current I CES — — 100 µA VCE = 600V, VGE = 0 Gate to emitter leak current I GES — — ±1 µA VGE = ± 20 V, VCE = 0 Gate to emitter cutoff voltage VGE(off) 6.0 — 8.0 V I C = 20 mA, VCE = 10V Collector to emitter saturation VCE(sat) voltage — 2.1 2.6 V I C = 20 A, VGE = 15V Input capacitance Cies — 1200 — pF VCE = 10V, VGE = 0 f = 1MHz Switching time tr — 150 — ns I C = 20 A t on — 230 — ns RL = 15 Ω tf — 300 600 ns VGS = ±15V t off — 450 900 ns Rg = 50 Ω 2 2SH28 Main Characteristics Power vs. Temperature Derating Maximum Safe Operation Area 100 I C (A) 30 s m 1 20 I C (A) 5 Collector Current Collector Current I C (A) 15 V 1 0.5 t) 3 10 30 100 300 1000 Collector to Emitter Voltage VCE (V) Typical Output Characteristics 50 2 ho Reverse Bias SOA ) °C 25 1 1s = 50 100 150 200 Case Temperature Tc (°C) 10 s( Tc n( Ta = 25 °C 0.01 20 m 10 0.1 0.03 0 = tio ra 0.3 PW e Op 20 µs 1 40 0 10 3 Collector Current 60 10 DC Channel Dissipation Pch (W) 80 12 V 10 V 16 Pulse Test 12 8 9V 4 VGE = 8 V 0.2 Tc = 25 °C 0.1 0 200 400 600 800 Collector to Emitter Voltage VCE (V) 0 2 4 6 8 10 Collector to Emitter Voltage VCE (V) 3 2SH28 Collector to Emitter Saturation Voltage vs. Gate to Emitter Voltage Typical Transfer Characteristics 16 12 Tc = 75°C 25°C 8 –25°C 4 0 4 8 12 Collector to Emitter Saturation Voltage V CE(sat) (V) Gate to Emitter Voltage 4 Collector to Emitter Saturation Voltage V CE(sat) (V) V CE = 10 V Pulse Test 16 25°C –25°C 0.5 V GE = 15 V Pulse Test 0.1 0.1 1 3 0.3 10 30 Collector Current I C (A) I C = 20 A 2 5A 1 10 A 4 8 12 Gate to Emitter Voltage 16 20 V GE (V) 10000 2 0.2 3 Typical Capacitance vs. Collecotor to Emitter Voltage Tc = 75°C 1 Pulse Test 4 V GE (V) Collecot to Emitter Saturation Voltage vs. Collector Current 10 5 5 0 20 3000 Capacitance C (pF) Collector Current I C (A) 20 VGE = 0 f = 1 MHz 1000 Cies 300 100 30 Coes 10 Cres 3 1 100 0 10 20 30 40 50 Collector to Emitter Voltage V CE (V) 2SH28 Switching Characteristics 12 VGE I C = 20 A 200 V CC = 400 V 300 V 200 V 100 8 4 VCE 20 40 60 80 Gate Charge Qg (nc) 500 Switching Time t (ns) 300 16 V GE (V) V CC = 200 V 300 V 400 V 400 0 1000 20 Gate to Emitter Voltage Collector to Emitter Voltage V CE (V) Dynamic Input Characteristics 500 0 100 tf 200 100 t d(on) 20 V CC = 300V, V GE = ±15 V Rg = 50 Ω , Ta = 25°C Switching Characteristics Switching Time t (ns) Switching Time t (ns) tf tr t d(off) t d(on) 10 1 1 10 I C (A) 20 Switching Characteristics 500 300 3 5 2 Collector Current 1000 1000 30 tr 50 10 1 2000 100 t d(off) 3 10 30 100 300 Gate Resistance Rg ( Ω ) 200 tr 100 t d(off) 50 20 I C = 20A, R L= 15 Ω V GE = ±15 V 1000 tf 10 25 t d(on) I C = 20A, RL = 15 Ω V GE = ±15 V, Rg = 50 Ω 50 75 100 Case Temperature Tc (°C) 125 5 2SH28 Normalized Transient Thermal Impedance vs. Pulse Width Normalized Transient Thermal Impedance γ s (t) 3 Tc = 25°C 1 D=1 0.5 0.3 0.2 0.1 θ ch – c(t) = γ s (t) • θ ch – c θ ch – c = 2.08 °C/W, Tc = 25 °C 0.1 0.05 PDM 0.02 1 lse 0.0 t pu o h 1s 0.03 0.01 10 µ D= PW T PW T 100 µ 1m 10 m 100 m Pulse Width PW (S) Switching Time Test Circuit 1 10 Waveform 90% 10% 0 Vin Ic Monitor 90% V CE Vin Monitor VCE Monitor Rg 10% RL td(on) tr ton D.U.T. 90% V CC Vin ± 15 V Ic 10% td(off) tf toff 6 2SH28 Package Dimensions Unit: mm 9.5 + 0.1 4.44±0.2 f 3.6 – 0.08 8.0 1.26±0.15 1.27±0.1 1.5 max 7.8 ±0.5 0.76 ±0.1 2.54 ±0.5 2.54 ±0.5 14.0 ±0.5 1.2±0.1 15.0 ±0.3 18.5 ±0.5 6.4 – 0.1 + 0.2 2.79 ±0.2 1.27 10.16±0.2 0.5±0.1 2.7 max Hitachi Code TO–220AB SC–46 EIAJ — JEDEC 7 2SH28 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Straße 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Copyright © Hitachi, Ltd., 1998. All rights reserved. Printed in Japan. 8