Reliability Report

AOS Semiconductor
Product Reliability Report
AOB10B60D,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOB10B60D.
Accelerated environmental tests are performed on a specific sample size, and then followed by
electrical test at end point. Review of final electrical test result confirms that AOB10B60D passes
AOS quality and reliability requirements.
Table of Contents:
I.
II.
III.
IV.
V.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
Appendix: Test data
I. Product Description:
TM
The Alpha IGBT line of products offers best-in-class performance in conduction and switching
losses, with robust short circuit capability. They are designed for ease of paralleling, minimal gate
spike under high dV/dt conditions and resistance to oscillations. The soft copackage diode is
targeted for minimal losses in motor control applications.
Details refer to the datasheet.
II. Die / Package Information:
Process
Package Type
Lead Frame
Die Attach
Bonding
Mold Material
Moisture Level
AOB10B60D
Standard sub-micron
TM
600V Alpha IGBT with Diode
TO263
Bare Cu
Soft solder
Al wire
Epoxy resin with silica filler
Up to Level 1
2
III. Result of Reliability Stress for AOB10B60D
Test Item
Test Condition
Time
Point
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
reflow@260°c
Temp = 150°c ,
Vge=100% of
Vgemax
-
9 lots
168hrs
500 hrs
1000 hrs
3 lots
5 lots
Temp = 150°c ,
Vce=80% of
Vcemax
168hrs
500 hrs
1000 hrs
3 lots
5 lots
77 pcs / lot
130°c , 85%RH,
33.3 psi, Vce =
80% of Vcemax
before arcing
(typically ≤42V)
121°c , 29.7psi,
RH=100%
96 hrs
9 lots
693pcs
-65°c to 150°c ,
air to air,
250 / 500
cycles
HTGB
HTRB
HAST
Pressure Pot
Lot
Attribution
9 lots
(Note A*)
Temperature
Cycle
Number
of
Failures
Reference
Standard
2079pcs
0
JESD22A113
616pcs
0
JESD22A108
0
JESD22A108
0
JESD22A110
0
JESD22A102
0
JESD22A104
77 pcs / lot
616pcs
(Note A*)
96 hrs
Total
Sample size
9 lots
(Note A*)
77 pcs / lot
693pcs
77 pcs / lot
693pcs
77 pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 3.52
MTTF = 32413 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AOB10B60D). Failure Rate Determination is based on
JEDEC Standard JESD 85. FIT means one failure per billion hours.
2
9
Failure Rate (FIT) = Chi x 10 / [2 (N) (H) (Af)]
9
= 1.84 x 10 / [2x (6x77x500 +10x77x1000) x259] = 3.52
9
8
MTTF = 10 / FIT = 2.84 x 10 hrs = 32413 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
Af
259
87
32
13
5.64
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 x 10-5eV / K
130 deg C
150 deg C
2.59
1
3