AOS Semiconductor Product Reliability Report AO7400, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com This AOS product reliability report summarizes the qualification result for AO7400. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AO7400 passes AOS quality and reliability requirements. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AO7400 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V, in the small SOT323 footprint. It can be used for a wide variety of applications, including load switching, low current inverters and low current DC-DC converters. -RoHS Compliant -Halogen Free Detailed information refers to datasheet. II. Die / Package Information: AO7400 Standard sub-micron Low voltage N channel Package Type SC70 (SOT323) Lead Frame Cu Die Attach Ag epoxy Bonding Au wire Mold Material Epoxy resin with silica filler MSL (moisture sensitive level) Level 1 based on J-STD-020 Process Note * based on information provided by assembler and mold compound supplier III. Result of Reliability Stress for AO7400 Test Item Test Condition Time Point Lot Attribution Total Sample size Number of Failures MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c HTGB Temp = 150 °c, Vgs=100% of Vgsmax Standard - 4 lots 605pcs 0 JESD22A113 168hrs 500 hrs 1000 hrs 2 lots 385pcs 0 JESD22A108 0 JESD22A108 220pcs 0 JESD22A110 3 lots 77pcs / lot HTRB Temp = 150 °c, Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs 2 lots 130 +/- 2°°c, 85%RH, 33.3 psi, Vgs = 100% of Vgs max 121°°c, 29.7psi, RH=100% 100 hrs 4 lots 96 hrs (Note A*) 3 lots 55 pcs / lot 165pcs 0 JESD22A102 -65°°c to 150°°c, air to air 250 / 500 cycles (Note A*) 4 lots 55 pcs / lot 220pcs 0 JESD22A104 (Note A*) 55 pcs / lot 385pcs 3 lots 77pcs / lot HAST Pressure Pot Temperature Cycle Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 7 MTTF = 16536 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AO7400). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.83 x 10 / [2x (4x77x168+6x77x1000) x258] = 7 9 8 MTTF = 10 / FIT = 1.45 x 10 hrs = 16536 years Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s )] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u = The use junction temperature in degree (Kelvin), K = C+273.16 -5 K = Boltzmann’s constant, 8.617164 X 10 eV / K