SEMiX501D17Fs
Absolute Maximum Ratings
Symbol
Conditions
Values
Unit
Tc = 85 °C
494
A
Tc = 100 °C
417
A
Tj = 25 °C
2740
A
Tj = 150 °C
2140
A
Tj = 25 °C
37538
A²s
Tj = 150 °C
22898
A²s
VRSM
1700
V
VRRM
1700
V
-40 ... 150
°C
-40 ... 125
°C
1 min
4000
V
1s
4800
V
Rect. Diode
ID
IFSM
i2t
SEMiX® 13
Tj = 150 °C
sinus 180°
10 ms
10 ms
Tj
Module
Tstg
SEMiX501D17Fs
Visol
Features
Characteristics
• Terminal height 17 mm
• Chips soldered directly to isolated
substrate
• UL recognised file no. E63532
Symbol
Typical Applications*
• Fast Input Bridge Rectifier for AC/DC
motor control
• Power supply
• High frequency applications
AC sinus 50Hz
Conditions
min.
typ.
max.
Unit
Rectifier Diode
VF
Tj = 25 °C, IF = 300 A, chiplevel
1.90
V
V(TO)
Tj = 125 °C, chiplevel
1.10
V
rT
Tj = 125 °C, chiplevel
2.7
mΩ
IRD
Tj = 125 °C, VRD = VRRM
Rth(j-c)
sin. 180
per diode
14.4
mA
0.165
K/W
K/W
Module
RCC'+EE'
Rth(c-s)
measured per
switch
TC = 25 °C
0.7
mΩ
TC = 125 °C
1
mΩ
0.04
K/W
per chip
K/W
per module
Ms
to heat sink (M5)
3
5
Nm
Mt
to terminals (M6)
2.5
5
Nm
a
5 * 9,81
m/s²
w
350
g
Temperature Sensor
R100
B100/125
Tc=100°C (R25=5 kΩ)
R(T)=R100exp[B100/125(1/T-1/T100)]; T[K];
493 ± 5%
Ω
3550
±2%
K
D
© by SEMIKRON
Rev. 4.0 – 25.04.2016
1
SEMiX501D17Fs
Fig. 4L: Power dissipation per module vs. direct current
Fig. 4R: Power dissipation per module vs. case
temperature
Fig. 6: Transient thermal impedance vs. time
Fig. 7: On-state characteristics
Fig. 8: Surge overload current vs. time
2
Rev. 4.0 – 25.04.2016
© by SEMIKRON
SEMiX501D17Fs
spring configuration
SEMiX 13
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, chapter IX.
*IMPORTANT INFORMATION AND WARNINGS
The specifications of SEMIKRON products may not be considered as guarantee or assurance of product characteristics
("Beschaffenheitsgarantie"). The specifications of SEMIKRON products describe only the usual characteristics of products to be expected in
typical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective
application in advance. Application adjustments may be necessary. The user of SEMIKRON products is responsible for the safety of their
applications embedding SEMIKRON products and must take adequate safety measures to prevent the applications from causing a physical
injury, fire or other problem if any of SEMIKRON products become faulty. The user is responsible to make sure that the application design is
compliant with all applicable laws, regulations, norms and standards. Except as otherwise explicitly approved by SEMIKRON in a written
document signed by authorized representatives of SEMIKRON, SEMIKRON products may not be used in any applications where a failure of
the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is
given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation,
warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the
applications or use of any product; neither does it convey any license under its patent rights, copyrights, trade secrets or other intellectual
property rights, nor the rights of others. SEMIKRON makes no representation or warranty of non-infringement or alleged non-infringement of
intellectual property rights of any third party which may arise from applications. Due to technical requirements our products may contain
dangerous substances. For information on the types in question please contact the nearest SEMIKRON sales office. This document
supersedes and replaces all information previously supplied and may be superseded by updates. SEMIKRON reserves the right to make
changes.
© by SEMIKRON
Rev. 4.0 – 25.04.2016
3