SKKT 107B16 E
Absolute Maximum Ratings
Symbol
Conditions
Values
Unit
Tc = 85 °C
119
A
Tc = 100 °C
91
A
190
A
2250
A
Chip
IT(AV)
ITRMS
ITSM
SEMIPACK® 1
Thyristor Modules
SKKT 107B16 E
i2t
sinus 180°
continuous operation
10 ms
10 ms
Tj = 25 °C
Tj = 130 °C
1900
A
Tj = 25 °C
25313
A²s
Tj = 130 °C
18050
A²s
VRSM
1700
V
VRRM
1600
V
VDRM
1600
V
(di/dt)cr
Tj = 130 °C
140
A/µs
(dv/dt)cr
Tj = 130 °C
1000
V/µs
-40 ... 130
°C
-40 ... 125
°C
1 min
3000
V
1s
3600
V
Tj
Module
Features
Tstg
• Heat transfer through aluminium oxide
ceramic isolated metal baseplate
• UL recognized, file no. E63532
Visol
Typical Applications*
Characteristics
• DC motor control (e. g. for machine
tools)
• AC motor soft starters
• Temperature control (e. g. for ovens,
chemical processes)
• Professional light dimming (studios,
theaters)
Symbol
a.c.; 50 Hz; r.m.s.
Conditions
min.
typ.
max.
Unit
Chip
VT
Tj = 25 °C, IT = 300 A
1.6
1.75
V
VT(TO)
Tj = 130 °C
0.8
0.9
V
rT
Tj = 130 °C
2.80
3.35
mΩ
20
mA
IDD;IRD
Tj = 130 °C, VDD = VDRM; VRD = VRRM
tgd
Tj = 25 °C, IG = 1 A, diG/dt = 1 A/µs
1
µs
tgr
VD = 0.67 * VDRM
2
µs
tq
Tj = 130 °C
200
µs
IH
Tj = 25 °C
150
250
mA
IL
Tj = 25 °C, RG = 33 Ω
300
600
mA
VGT
Tj = 25 °C, d.c.
2.5
V
IGT
Tj = 25 °C, d.c.
100
mA
VGD
Tj = 130 °C, d.c.
0.25
V
IGD
Tj = 130 °C, d.c.
4
mA
per chip
0.19
K/W
per module
0.095
K/W
per chip
0.2
K/W
per module
0.1
K/W
per chip
0.21
K/W
per module
0.105
K/W
Rth(j-c)
Rth(j-c)
Rth(j-c)
continuous DC
sin. 180°
rec. 120°
Module
Rth(c-s)
chip
0.22
module
K/W
0.11
K/W
Ms
to heatsink M5
4.25
5.75
Mt
to terminals M5
2.55
3.45
Nm
5 * 9,81
m/s²
a
w
75
Nm
g
SKKT
© by SEMIKRON
Rev. 2.0 – 09.03.2016
1
SKKT 107B16 E
Fig. 1L: Power dissipation per thyristor/diode vs. on-state
current
Fig. 1R: Max. power dissipation per chip vs. ambient
temperature
Fig. 2L: Max. power dissipation of one module vs. rms
current
Fig. 2R: Max. power dissipation of one module vs. case
temperature
Fig. 3L: Max. power dissipation of two modules vs. direct
current
Fig. 3R: Max. power dissipation of two modules vs. case
temperature
2
Rev. 2.0 – 09.03.2016
© by SEMIKRON
SKKT 107B16 E
Fig. 4L: Max. power dissipation of three modules vs.
direct current
Fig. 4R: Max. power dissipation of three modules vs.
case temperature
Fig. 5: Recovered charge vs. current decrease
Fig. 6: Transient thermal impedance vs. time
Fig. 7: On-state characteristics
Fig. 8: Surge overload current vs. time
© by SEMIKRON
Rev. 2.0 – 09.03.2016
3
SKKT 107B16 E
Fig. 9: Gate trigger characteristics
SKKT...B
SEMIPACK 1
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, chapter IX.
*IMPORTANT INFORMATION AND WARNINGS
The specifications of SEMIKRON products may not be considered as guarantee or assurance of product characteristics
("Beschaffenheitsgarantie"). The specifications of SEMIKRON products describe only the usual characteristics of products to be expected in
4
Rev. 2.0 – 09.03.2016
© by SEMIKRON
SKKT 107B16 E
typical applications, which may still vary depending on the specific application. Therefore, products must be tested for the respective
application in advance. Application adjustments may be necessary. The user of SEMIKRON products is responsible for the safety of their
applications embedding SEMIKRON products and must take adequate safety measures to prevent the applications from causing a physical
injury, fire or other problem if any of SEMIKRON products become faulty. The user is responsible to make sure that the application design is
compliant with all applicable laws, regulations, norms and standards. Except as otherwise explicitly approved by SEMIKRON in a written
document signed by authorized representatives of SEMIKRON, SEMIKRON products may not be used in any applications where a failure of
the product or any consequences of the use thereof can reasonably be expected to result in personal injury. No representation or warranty is
given and no liability is assumed with respect to the accuracy, completeness and/or use of any information herein, including without limitation,
warranties of non-infringement of intellectual property rights of any third party. SEMIKRON does not assume any liability arising out of the
applications or use of any product; neither does it convey any license under its patent rights, copyrights, trade secrets or other intellectual
property rights, nor the rights of others. SEMIKRON makes no representation or warranty of non-infringement or alleged non-infringement of
intellectual property rights of any third party which may arise from applications. Due to technical requirements our products may contain
dangerous substances. For information on the types in question please contact the nearest SEMIKRON sales office. This document
supersedes and replaces all information previously supplied and may be superseded by updates. SEMIKRON reserves the right to make
changes.
© by SEMIKRON
Rev. 2.0 – 09.03.2016
5