Transient Voltage Suppression Diodes Surface Mount – 4000W > 4.0SMDJ24A 4.0SMDJ24A RoHS Pb e3 Description Uni-directional The 4.0SMDJ24A is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. Features • 4000W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycles):0.01% • For surface mounted applications in order to optimize board space • Low profile package • Typical failure mode is short from over-specified voltage or current • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c • IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact) • ESD protection of data lines in accordance with IEC 61000-4-2 • EFT protection of data lines in accordance with IEC 61000-4-4 • Built-in strain relief • VBR @ TJ= VBR@25°C x (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%) Agency Approvals AGENCY AGENCY FILE NUMBER E230531 Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted) Parameter Symbol Value Unit Peak Pulse Power Dissipation at TA=25ºC by 10/1000µs Waveform (Fig.2)(Note 1), (Note 2) PPPM 4000 W Power Dissipation on Infinite Heat Sink at TL=50OC PD 6.5 W Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3) IFSM 300 A VF 3.5 V Maximum Instantaneous Forward Voltage at 100A for Unidirectional Only Operating Temperature Range TJ -65 to 150 °C Storage Temperature Range TSTG -65 to 175 °C Typical Thermal Resistance Junction to Lead RθJL 15 °C/W Typical Thermal Resistance Junction to Ambient RθJA 75 °C/W Notes: 1. Non-repetitive current pulse , per Fig. 4 and derated above TJ (initial) =25OC per Fig. 3. 2. Mounted on copper pad area of 0.31x0.31” (8.0 x 8.0mm) to each terminal. 3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only, duty cycle=4 per minute maximum. Functional Diagram Applications Bi-directional Cathode • Glass passivated chip junction • Fast response time: typically less than 1.0ps from 0V to BV min • Excellent clamping capability • Low incremental surge resistance • High temperature to reflow soldering guaranteed: 260°C/40sec at terminals • Meet MSL level1, per J-STD-020, LF maximun peak of 260°C • Matte tin lead–free plated • Halogen free and RoHS compliant • Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD609A.01) TVS devices are ideal for the protection of I/O Interfaces, VCC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic applications. Anode Uni-directional Electrical Characteristics (T =25°C unless otherwise noted) A Part Number 4.0SMDJ24A Reverse Stand off Marking Voltage VR (Volts) 4PEZ 24.0 Breakdown Voltage VBR (Volts) @ IT MIN MAX Test Current IT (mA) 26.70 29.50 1 Maximum Clamping Voltage VC @ Ipp (10/1000µS) (V) Maximum Clamping Voltage VC @ Ipp (8/20µS) (V) Maximum Peak Pulse CurrentIpp (10/1000µS) (A) Maximum Peak Pulse Current Ipp (8/20µS) (A) Maximum Reverse Leakage IR @ VR (µA) 38.9 51.0 103.0 650.0 2 1 © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/20/15 Transient Voltage Suppression Diodes Surface Mount – 4000W > 4.0SMDJ24A I-V Curve Characteristics Uni-directional Vc VBR VR V IR VF IT Ipp PPPM VR VBR VC IR VF Peak Pulse Power Dissipation -- Max power dissipation Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation Breakdown Voltage -- Maximum voltage that flows though the TVS at a specified test current (IT) Clamping Voltage -- Peak voltage measured across the TVS at a specified Ippm (peak impulse current) Reverse Leakage Current -- Current measured at VR Forward Voltage Drop for Uni-directional Ratings and Characteristic Curves (T =25°C unless otherwise noted) A Figure 1 - TVS Transients Clamping Waveform Figure 2 - Peak Pulse Power Rating 1000 PPPM-Peak Pulse Power (KW) Voltage Transients Voltage or Current Voltage Across TVS Current Through TVS TJ initial = Tamb 100 10 0.31x0.31" (8.0x8.0mm) 1 Copper Pad Area 0.001 0.01 0.1 1 td-Pulse Width (ms) 10 Time continues on next page. Additional Infomarion Datasheet Resources Samples 2 © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/20/15 Transient Voltage Suppression Diodes Surface Mount – 4000W > 4.0SMDJ24A Ratings and Characteristic Curves (T =25°C unless otherwise noted) (Continued) A Figure 3 - Peak Pulse Power Derating Curve Figure 4 - Pulse Waveform 150 IPPM- Peak Pulse Current, % IRSM Peak Pulse Power (PPP) or Current (IPP) Derating in Percentage % 100 80 60 40 20 0 0 25 50 75 100 125 150 TJ - Initial Junction Temperature (ºC) TJ=25°C Pulse Width(td) is defined as the point where the peak current decays to 50% of IPPM Peak Value IPPM 100 Half Value IPPM IPPM ( ) 2 50 0 175 10/1000µsec. Waveform as defined by R.E.A td 0 1.0 2.0 3.0 4.0 t-Time (ms) Figure 6 - Maximum Non-Repetitive Peak Forward Surge Current Uni-Directional Only Figure 5 - Typical Transient Thermal Impedance 100 450 400 10 IFSM - Peak Forward Surve Current(A) Transient Thermal Impedance (°C/W) tr=10µsec 1 0.1 0.01 0.001 350 300 250 200 150 100 50 0.01 0.1 1 10 100 1000 0 1 TP - Pulse Duration (s) 10 100 Number of Cycles at 60 Hz IF- Peak Forward Current(A) Figure 7 - Peak Forward Voltage Drop vs Peak Forward Current (Typical Values) 100 10 1 0.1 0.01 0.00 1.00 2.00 3.00 4.00 5.00 6.00 7.00 8.00 VF-Peak Forward Voltage(V) 3 © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/20/15 Transient Voltage Suppression Diodes Surface Mount – 4000W > 4.0SMDJ24A Soldering Parameters Lead–free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus Temp (TA) to peak 3°C/second max TS(max) to TA - Ramp-up Rate 3°C/second max Reflow - Temperature (TA) (Liquidus) 217°C - Time (min to max) (ts) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C tp TP Ramp-up TL Temperature (T) Reflow Condition tL Critical Zone TL to TP Ts(max) Ramp-down Ts(min) ts Preheat 25˚C t 25˚C to Peak Time (t) Environmental Specifications Physical Specifications High Temp. Storage JESD22-A103 HTRB JESD22-A108 Weight 0.007 ounce, 0.21 grams Temperature Cycling JESD22-A104 Case JEDEC DO214AB. Molded plastic body over glass passivated junction MSL JEDEC-J-STD-020, Level 1 Polarity Color band denotes positive end (cathode) except Bidirectional. H3TRB JESD22-A101 Terminal Matte Tin-plated leads, Solderable per JESD22-B102 RSH JESD22-A111 Dimensions DO-214AB (SMC J-Bend) Dimensions Cathode Band (for Uni-directional products only) A C A B H D F E G J K L I Solder Pads (all dimensions in mm) © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/20/15 4 Inches Millimeters Min Max Min Max 0.114 0.126 2.900 3.200 B 0.260 0.280 6.600 7.110 C 0.220 0.245 5.590 6.220 D 0.079 0.103 2.060 2.620 E 0.030 0.060 0.760 1.520 F - 0.008 - 0.203 G 0.305 0.320 7.750 8.130 H 0.006 0.012 0.152 0.305 I 0.129 - 3.300 - 2.400 J 0.094 - K - 0.165 L 0.094 - 4.200 2.400 - Transient Voltage Suppression Diodes Surface Mount – 4000W > 4.0SMDJ24A Part Numbering System Part Marking System 4.0SMDJ 24 A Cathode Band F (for Uni-directional products only) 4PEZ 5% VBR VOLTAGE TOLERANCE YMXXX Littelfuse Logo Marking Code Trace Code Marking Y:Year Code M: Month Code XXX: Lot Code VR VOLTAGE SERIES Packaging Options Part number Component Package 4.0SMDJ24A DO-214AB Packaging Option Quantity 3000 Tape & Reel - 16mm tape/13” reel Packaging Specification EIA STD RS-481 Tape and Reel Specification 0.157 (4.0) 0.63 (16.0) Cathode 0.315 (8.0) Optional 7” 7.0 (187) 13” 13.0 (330) 0.80 (20.2) Arbor Hole Dia. 0.65 (16.4) 0.059 DIA (1.5) Cover tape Dimensions are in inches (and millimeters). Direction of Feed 5 © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/20/15