XS170

XS170
Multifunction Telecom Switch
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
350
100
50
Description
Units
VP
mArms / mADC

The XS170 integrated circuit device combines a
350V, 100mA, 50, normally open (1-Form-A) relay
with an optocoupler in a single package. The relay
uses optically coupled MOSFET technology to
provide 3750Vrms of input to output isolation.
Features
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• FCC Compatible
• VDE Compatible
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Small 8-Pin Package
• Machine Insertable, Wave Solderable
• Surface Mount and Tape & Reel Versions Available
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
Telecom circuit designers, using the XS170, can now
take advantage of two discrete functions in a single
component that uses less space than traditional
discrete component solutions.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950 Certified Component:
TUV Certificate: B 10 05 49410 006
Ordering Information
Part #
XS170
XS170P
XS170PTR
XS170S
XS170STR
Description
8-Pin DIP (50/Tube)
8-Pin Flatpack (50/Tube)
8-Pin Flatpack (50/Tube)
8-Pin Surface Mount (50/Tube)
8-Pin Surface Mount (1000/Reel)
Pin Configuration
+ LED - Relay
– LED - Relay
Collector - Phototransistor
Emitter - Phototransistor
1
8
2
7
3
6
4
5
Load - Relay (MOSFET Output)
Load - Relay (MOSFET Output)
LED - Phototransistor –/+
LED - Phototransistor +/–
Switching Characteristics
of Normally Open Devices
Form-A
IF
90%
10%
ILOAD
Pb
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INTEGRATED CIRCUITS DIVISION
XS170
Absolute Maximum Ratings @ 25ºC
Parameter
Relay Blocking Voltage
Reverse Input Voltage
Input Power Dissipation 1
Relay Input Control Current
Peak (10ms)
Detector Input Control Current
Total Power Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate linearly 6.67 mW / ºC
Ratings
350
5
150
50
1
100
800
3750
-40 to +85
-40 to +125
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Units
VP
V
mW
mA
A
mA
mW
Vrms
°C
°C
Electrical Characteristics @25ºC: Relay Section
Parameter
Output Characteristics
Load Current, Continuous
Continuous
Peak
On-Resistance
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
Conditions
Symbol
Min
Typ
Max
Units
t=10ms
IL=120mA
VL=350V
IL
ILPK
RON
ILEAK
-
33
-
100
±350
50
1
mArms / mADC
mAP

VL=50V, f=1MHz
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COUT
-
25
5
5
-
IL=120mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.4
0.9
-
0.7
1.2
-
2
1.4
10
mA
mA
V
A
-
CI/O
-
3
-
pF
IF=5mA, VL=10V
A
ms
pF
Electrical Characteristics @25ºC: Detector Section
Parameter
Output Characteristics
Phototransistor Blocking Voltage
Phototransistor Dark Current
Saturation Voltage
Current Transfer Ratio
Input Characteristics
Input Control Current
Input Voltage Drop
Input Current (Detector must be off)
Isolation, Input to Output
Common Characteristics
Input to Output Capacitance
2
Conditions
Symbol
Min
Typ
Max
Units
IC=10A
VCE=5V, IF=0mA
IC=2mA, IF=16mA
IF=6mA, VCE=0.5V
BVCEO
ICEO
VSAT
CTR
20
33
50
50
0.3
100
500
0.5
-
V
nA
V
%
IC=2mA, VCE=0.5V
IF=5mA
IC=1A, VCE=5V
-
IF
VF
IF
VI/O
0.9
5
3750
2
1.2
25
-
6
1.4
-
mA
V
A
Vrms
-
CI/O
-
3
-
pF
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INTEGRATED CIRCUITS DIVISION
XS170
RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
35
25
25
20
15
10
5
0
20
15
10
5
1.19
1.21
1.23
20
15
10
5
0
0
1.17
1.25
0.67
0.75
0.83
0.91
0.99
1.06
0.11
1.14
0.14
0.17
0.19
0.22
0.25
0.28
LED Forward Voltage Drop (V)
Turn-On Time (ms)
Turn-Off Time (ms)
Typical IF for Switch Operation
(N=50, IL=100mADC)
Typical IF for Switch Dropout
(N=50, IL=100mADC)
Typical On-Resistance Distribution
(N=50, IL=100mADC)
25
20
20
15
10
5
0
25
Device Count (N)
25
Device Count (N)
Device Count (N)
25
Device Count (N)
Device Count (N)
Device Count (N)
30
Typical Turn-Off Time
(N=50, IL=100mADC)
Typical Turn-On Time
(N=50, IL=100mADC)
15
10
5
0
0.44
0.50
0.56
0.62
0.69
0.75
20
15
10
5
0
0.81
0.44
0.50
LED Current (mA)
0.56
0.62
0.69
0.75
0.81
29.09 29.86 30.63 31.40 32.16 32.93 33.70
LED Current (mA)
On-Resistance (:)
Typical Blocking Voltage Distribution
(N=50)
Device Count (N)
25
20
15
10
5
0
424.0 429.3 434.5 439.7 444.9 450.1 455.4
Blocking Voltage (VP)
Typical Turn-On Time
vs. LED Forward Current
(IL=100mADC)
Typical LED Forward Voltage Drop
vs. Temperature
1.4
IF=50mA
IF=30mA
IF=20mA
IF=10mA
IF=5mA
1.2
1.0
0.8
-40
-20
0
20
40
60
Temperature (ºC)
80
100
120
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
Turn-Off Time (ms)
1.6
Turn-On Time (ms)
Forward Voltage (V)
1.8
0
5
10
15
20
25
30
35
40
LED Forward Current (mA)
45
50
Typical Turn-Off Time
vs. LED Forward Current
(IL=120mADC)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R03
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INTEGRATED CIRCUITS DIVISION
XS170
RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
1.8
IF=5mA
IF=10mA
IF=20mA
1.4
1.2
1.0
Turn-Off Time (ms)
0.8
0.6
0.4
0.2
0
-40
6
-20
0
20
40
60
80
100 120
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-40
30
20
10
0
-20
0
20
40
60
80
100
120
-40
-20
0
20
40
60
80
100 120
Typical IF for Switch Operation
vs. Temperature
(IL=100mADC)
Typical IF for Switch Dropout
vs. Temperature
(IF=100mADC)
Maximum Load Current
vs. Temperature
160
140
3
2
1
Load Current (mA)
5
LED Current (mA)
LED Current (mA)
40
Temperature (ºC)
6
4
3
2
1
0
0
20
40
60
80
80
IF=10mA
IF=5mA
IF=2mA
60
40
-40
-20
0
20
40
60
80
-40
100 120
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
Typical Load Current
vs. Load Voltage
(IF=5mA)
Typical Blocking Voltage
vs. Temperature
Typical Leakage vs. Temperature
Measured across Pins 4&6
Load Current (mA)
-3
100
0
0
100 120
Blocking Voltage (VP)
-20
120
20
455
0.016
450
0.014
445
0.012
440
435
430
-2
-1
0
1
2
3
4
0.010
0.008
0.006
0.002
-40
Load Voltage (V)
120
0.004
425
420
-4
50
Temperature (ºC)
4
120
100
80
60
40
20
0
-20
-40
-60
-80
-100
-120
60
Temperature (ºC)
5
-40
Typical On-Resistance
vs. Temperature
(IF=5mA, IL=100mADC)
70
Leakage (PA)
Turn-On Time (ms)
1.6
Typical Turn-Off Time
vs. Temperature
(IL=120mADC)
On-Resistance (:)
Typical Turn-On Time
vs. Temperature
(IL=100mADC)
-20
0
20
40
60
80
100
Temperature (ºC)
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Load Current (A)
Energy Rating Curve
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10Ps 100Ps 1ms 10ms 100ms
1s
10s
100s
Time
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
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R03
INTEGRATED CIRCUITS DIVISION
XS170
DETECTOR PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
8
4.0
7
3.5
3.0
2.5
2.0
1.5
1.0
12
6
5
4
IF=1mA
IF=2mA
IF=5mA
IF=10mA
IF=15mA
IF=20mA
3
2
1
0.5
0
2
4
6
8
10
12
14
Forward Current (mA)
16
18
20
0
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
Collector Current (mA)
4.5
0
Typical Collector Current
vs. Forward Current
(VCE=0.5V)
Typical Normalized CTR
vs. Temperature
(VCE=0.5V)
Normalized CTR (%)
Normalized CTR (%)
Typical Normalized CTR
vs. Forward Current
(VCE=0.5V)
10
8
6
4
2
0
0
2
4
6
8
10
12
14
16
18
20
Forward Current (mA)
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R03
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5
INTEGRATED CIRCUITS DIVISION
XS170
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
XS170 / XS170P / XS170S
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
XS170P
260ºC for 30 seconds
XS170 / XS170S
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a
wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
XS170
Mechanical Dimensions
XS170
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
PCB Hole Pattern
7.620 ± 0.254
(0.300 ± 0.010)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
3.302 ± 0.051
(0.130 ± 0.002)
0.457 ± 0.076
(0.018 ± 0.003)
7.620 ± 0.127
(0.300 ± 0.005)
7.239 TYP.
(0.285)
4.064 TYP
(0.160)
7.620 ± 0.127
(0.300 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
XS170P
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
9.398 ± 0.127
(0.370 ± 0.005)
Pin 1
2.286 MAX.
(0.090 MAX.)
2.54
(0.10)
0.635 ± 0.127
(0.025 ± 0.005)
8.70
(0.3425)
1.55
(0.0610)
0.203 ± 0.013
(0.008 ± 0.0005)
9.652 ± 0.381
(0.380 ± 0.015)
PCB Land Pattern
0.65
(0.0255)
2.159 ± 0.025
(0.085 ± 0.001)
0.457 ± 0.076
(0.018 ± 0.003)
0.864 ± 0.120
(0.034 ± 0.004)
Dimensions
mm
(inches)
XS170S
9.652 ± 0.381
(0.380 ± 0.015)
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
PCB Land Pattern
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
0.65
(0.0255)
4.445 ± 0.127
(0.175 ± 0.005)
Dimensions
mm
(inches)
0.813 ± 0.102
(0.032 ± 0.004)
R03
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7
INTEGRATED CIRCUITS DIVISION
XS170
XS170PTR Tape & Reel
2.00
(0.079)
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Embossment
W = 16.00
(0.63)
7.50
(0.295)
Bo = 10.30
(0.406)
K0 = 2.70
(0.106)
K1 = 2.00
(0.079)
Embossed Carrier
4.00
(0.157)
Ao = 10.30
(0.406)
P = 12.00
(0.472)
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
XS170STR Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
K0 =4.90
(0.193)
K1 =4.20
(0.165)
Embossed Carrier
Embossment
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
P=12.00
(0.472)
User Direction of Feed
Dimensions
mm
(inches)
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
8
Specification: DS-XS170-R03
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012