Strategy of High Frequency Components Business Corporate Officer Christian Block Copyright© 2015 TDK Corporation. All rights reserved. -1- Predicted Phone Volumes 2000 Phones [Mpcs] 1500 All phones Smartphones 1000 LTE phones 500 0 2015 2016 2017 2018 TDK’s estimation Copyright© 2015 TDK Corporation. All rights reserved. -2- Microacoustic Component Market [Mpcs] 50000 Components for Greater China market 45000 Microacoustic components [Mpcs] 40000 35000 30000 Discrete components 25000 Integrated components 20000 15000 10000 5000 0 2015 2016 2017 2018 TDK’s estimation Copyright© 2015 TDK Corporation. All rights reserved. -3- RF Front-end Module Market [Mpcs] 3000 RF front‐end modules [Mpcs] 2500 2000 LNA div FEM div FEM 1500 PAiD PAMiD FEMiD 1000 500 0 2015 2016 2017 2018 TDK’s estimation Copyright© 2015 TDK Corporation. All rights reserved. -4- Filter Technologies / Applications Copyright© 2015 TDK Corporation. All rights reserved. -5- TDK Wafer Level Package Technology Platforms • • • • • Wafer Level Packages for SAW, TC SAW (HQTCF) and BAW components Die Size Saw Package DSSP and Thin Film Acoustic Package TFAP All WLP platforms running in mass production Package height 0.25 mm max. for DSSP and 0.17 mm max. for TFAP Overmold capability SAW / DSSP Wafer Level Package Copyright© 2015 TDK Corporation. All rights reserved. SAW TC / TFAP BAW / TFAP Functional LN Wafer Functional Si Wafer Bare Die Package -6- Duplexers for Module Integration Minus 60% height reduction 2.0 x 1.6 x 0.45 mm3 *CSSPlus : 2.5 x 2.0 x 0.68 mm3 *CSSP3 Cu : 2.0 x 1.6 x 0.45 mm3 *e.g. 1.8 x 1.4 x 0.21 mm3 (w/o bumps) (with bumps : 0.28mm) *e.g.1.5 x 1.1 x 0.21 mm3 (w/o bumps) (with bumps : 0.28mm) *e.g.1.6 x 1.2 x 0.13 mm3 (w/o bumps) (with bumps : 0.20mm) CSSP3 DSSP1 DSSP1 TFAP BAW/LN *) package size depends on product Copyright© 2015 TDK Corporation. All rights reserved. -7- Technology Toolbox and Link to Strategies Power Amplifier • Switch Exploring ways how to serve the PA module market to full extent • Copyright© 2015 TDK Corporation. All rights reserved. Module assembly WLP SAW TCSAW BAW 9 9 9 9 9 • • Discrete component sales to serve the growing Chinese market • Continuously improving presence in reference designs of leading chipset vendors WLP component sales to module vendor partners Supply leading div FEM, LNA div FEM and FEMiD solutions -8- Cautionary Statements with Respect to Forward-Looking Statements Copyright© 2015 TDK Corporation. All rights reserved. -9-