AOS Semiconductor Product Reliability Report AO4450/L, revA Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com This AOS product reliability report summarizes the qualification result for AO4450/L. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AO4450/L passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AO4450 uses advanced trench technology to provide excellent RDS(ON) and low gate charge. This device is suitable for use as a load switch or in PWM applications. Standard Product AO4450 is Pb-free (meets ROHS & Sony 259 specifications). AO4450L is a Green Product ordering option. AO4450 and AO4450L are electrically identical. -RoHS Compliant -AO4450L is Halogen Free Detailed information refers to datasheet. II. Die / Package Information: AO4450/L Standard sub-micron Low voltage N channel Package Type 8 lead SOIC Lead Frame Copper Die Attach Ag Epoxy Bonding Wire Au & Cu wire Mold Material Epoxy resin with silica filler Flammability Rating UL-94 V-0 MSL (moisture sensitive level) Level 1 based on J-STD-020 Process Note * based on information provided by assembler and mold compound supplier III. Result of Reliability Stress for AO4450/L Test Item Test Condition Time Point Lot Attribution Total Sample size Number of Failures MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c HTGB - 29 lots 3575pcs 0 JESD22A113 Temp = 150 °c, Vgs=100% of Vgsmax 168hrs 500 hrs 1000 hrs 231pcs 0 1 lot 2 lots JESD22A108 Temp = 150 °c, Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs 77pcs / lot 231pcs 0 1 lot 2 lots JESD22A108 130 +/- 2°°c, 85%RH, 33.3 psi, Vgs = 80% of Vgs max 121°°c, 29.7psi, RH=100% 100 hrs (Note A*) 16 lots 77pcs / lot 880pcs 0 JESD22A110 96 hrs (Note A*) 20 lots 55 pcs / lot 1100pcs 0 JESD22A102 -65°°c to 150°°c, air to air 250 / 500 cycles (Note A*) 29 lots 55 pcs / lot 1595pcs 0 JESD22A104 (Note A*) 55 pcs / lot (Note A*) HTRB HAST Pressure Pot Temperature Cycle Standard Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 9 MTTF = 12392 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AO4450/L). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.83 x 10 / [2 x(2x77x500+2x2x77x1000) x 258] = 9 9 8 MTTF = 10 / FIT = 1.09 x 10 hrs = 12392 years Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s )] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u = The use junction temperature in degree (Kelvin), K = C+273.16 K = Boltzmann’s constant, 8.617164 X 10-5eV / K