AOS Semiconductor Product Reliability Report AON7401, rev C Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com This AOS product reliability report summarizes the qualification result for AON7401. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AON7401 passes AOS quality and reliability requirements. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AON7401 uses advanced trench technology to provide excellent RDS(ON), and ultra-low low gate charge with a 25V gate rating. This device is suitable for use as a load switch or in PWM applications. -RoHS Compliant -Halogen-Free Detailed information refers to datasheet. II. Die / Package Information: AON7401 Standard sub-micron Low voltage P channel Package Type DFN 3x3A Lead Frame Cu Die Attach Ag epoxy Bonding Cu wire Mold Material Epoxy resin with silica filler MSL (moisture sensitive level) Level 1 based on J-STD-020 Process Note * based on information provided by assembler and mold compound supplier III. Result of Reliability Stress for AON7401 Test Item Test Condition Time Point Lot Attribution Total Sample size Number of Failures MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c HTGB - 11 lots 2299pcs 0 JESD22A113 Temp = 150 °c, Vgs=100% of Vgsmax 168hrs 500hrs 1000 hrs 1 lot 308pcs 0 JESD22A108 Temp = 150 °c, Vds=80% of Vdsmax 168hrs 500hrs 1000 hrs 77pcs / lot 308pcs 0 JESD22A108 HAST 130°°c, 85%RH, 33.3 psi, Vgs = 100% of Vgs max 100 hrs (Note A*) 11 lots 77pcs / lot 605pcs 0 JESD22A110 Pressure Pot 121°°c, 29.7psi, RH=100% 96 hrs (Note A*) 11 lots 55pcs / lot 847pcs 0 JESD22A102 Temperature Cycle -65°°c to 150°°c, air to air 250 / 500 cycles (Note A*) 11 lots 77pcs / lot 847pcs 0 JESD22A104 (Note A*) 77pcs / lot HTRB Standard 3 lots (Note A*) 1 lot 3 lots Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 7 MTTF = 15704 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AON7401). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.83 x 10 / [2x (2x77x168+ 6x77x1000) x258] = 7 9 8 MTTF = 10 / FIT = 1.38 x 10 hrs = 15704 years Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C Af 258 87 32 13 5.64 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u = The use junction temperature in degree (Kelvin), K = C+273.16 -5 K = Boltzmann’s constant, 8.617164 X 10 eV / K 130 deg C 150 deg C 2.59 1