Surface Mount Ceramic Capacitor Products

Version 16.4
Ceramic Chip Capacitors
Table of Contents
How to Order - AVX Part Number Explanation...........2-3
Automotive MLCC
C0G (NP0) Dielectric
General Specifications .........................................................51-52
Capacitance Range..............................................................53-55
General Specifications .................................................................4
Specifications and Test Methods.................................................5
Capacitance Range ..................................................................6-7
U Dielectric
RF/Microwave C0G (NP0) Capaciators (RoHS)
General Information and Capacitance Range ....................8-10
RF/Microwave C0G (NP0) Capaciators (Sn/Pb)
General Information and Capacitance Range ..................11-12
RF/Microwave C0G (NP0) Capaciators (RoHS)
AEC-Q200 Qualified..........................................................13-14
Designer Kits ..............................................................................15
X8R/X8L Dielectric
General Specifications .........................................................16-17
Specifications and Test Methods...............................................18
X7R Dielectric
General Specifications ...............................................................19
Specifications and Test Methods...............................................20
Capacitance Range..............................................................21-22
X7S Dielectric
General Specifications ...............................................................23
Specifications and Test Methods...............................................24
Capacitance Range....................................................................25
X5R Dielectric
General Specifications ...............................................................26
Specifications and Test Methods...............................................27
Capacitance Range..............................................................28-29
Y5V Dielectric
General Specifications ...............................................................30
Specifications and Test Methods...............................................31
Capacitance Range....................................................................32
MLCC Gold Termination (AU Series)
General Specifications ...............................................................33
Capacitance Range..............................................................34-39
MLCC Tin/Lead Termination (LD Series)
General Specifications ...............................................................40
Capacitance Range..............................................................41-46
MLCC Low Profile
General Specifications / Capacitance Range............................47
UltraThin Ceramic Capacitors
General Specifications .........................................................48-50
APS for COTS+ Applications
General Specifications ...............................................................56
Capacitance Range..............................................................57-59
MLCC with FLEXITERM®
General Description....................................................................60
Specifications and Test Methods.........................................61-62
Capacitance Range..............................................................63-64
FLEXISAFE MLC Chips
General Specifications and Capacitance Range.......................65
Capacitor Array
Capacitor Array (IPC) ...........................................................66-69
Automotive Capacitor Array (IPC)..............................................70
Part and Pad Layout Dimensions ..............................................71
Low Inductance Capacitors
Introduction ...................................................................72-73
LICC (Low Inductance Chip Capacitors) ..........................74-77
IDC (InterDigitated Capacitors) ............................................78-81
LGA (Low Inductance Capacitors) ...................................82-84
LICA (Low Inductance Decoupling Capacitor Arrays) ........85-86
High Temperature MLCCs
AT Series 200ºC & 250ºC Rated MLCCs ..........................87-92
High Voltage MLC Chips
600V to 5000V Applications ............................................93-97
Tin/Lead Termination “B” - 600V to 5000V Applications ....98-99
FLEXITERM® - 600V to 5000V Applications..................100-104
600V to 3000V Automotive Applications – AEC-Q200 ...105-106
MIL-PRF-55681/Chips
CDR01 thru CDR06 .........................................................107-108
CDR31 thru CDR35 .........................................................109-112
MLCC Medical
MQ Series ........................................................................113-121
Packaging of Chip Components.....................................122
Embossed Carrier Configuration - 8 & 12mm Tape...123
Paper Carrier Configuration - 8 & 12mm Tape............124
Basic Capacitor Formulas ................................................125
General Description ...................................................126-130
Surface Mounting Guide ...........................................131-135
How to Order
Part Number Explanation
Commercial Surface Mount Chips
EXAMPLE: 08055A101JAT2A
0805
5
A
101
J*
A
T
2
A**
Size
(L" x W")
0101*
0201
0402
0603
0805
1206
1210
1812
1825
2220
2225
Voltage
Dielectric
Capacitance
Tolerance
Failure
Terminations
Packaging
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
D = 35V
5 = 50V
1 = 100V
2 = 200V
7 = 500V
A = NP0(C0G)
C = X7R
D = X5R
F = X8R
G = Y5V
U = U Series
W = X6S
Z = X7S
2 Sig. Fig +
No. of Zeros
Examples:
100 = 10 pF
101 = 100 pF
102 = 1000 pF
223 = 22000 pF
224 = 220000 pF
105 = 1μF
106 = 10μF
107 = 100μF
For values below
10 pF, use “R”
in place of
Decimal point, e.g.,
9.1 pF = 9R1.
Special
Code
*EIA 01005
Contact Factory for
Special Voltages
F
*
E
V
= 63V
= 75V
= 150V
= 250V
9 = 300V
X = 350V
8 = 400V
B = ±.10 pF
T = Plated Ni
Rate
C = ±.25 pF
and Sn
A = N/A
D = ±.50 pF 4 = Automotive 7 = Gold Plated
F = ±1%
U = Conductive
(≥ 10 pF)
Expoxy for
G = ±2%
Hybrid
(≥ 10 pF)
Applications
J = ±5%
Z = FLEXITERM®
K = ±10%
*X = FLEXITERM®
M = ±20%
with 5% min
Z = +80%,
lead (X7R &
-20%
X8R only)
P = +100%,
-0%
Contact
Available
2 = 7" Reel
4 = 13" Reel
U = 4mm TR
(01005)
Contact
Factory For
Multiples
A = Std
K = 30K (0603 2mm pitch)
22K (0805/1206
<0.030"/ 0.76mm)
H = 18K (0603/0805/1206
<0.037” / 0.94mm)
J = 15K (0805/1206
<0.050” / 1.27mm)
1 = 12K (0805/1206
<0.055 / 1.4mm)
**Non std options upon
approval from the factory
Factory For
1 = Pd/Ag Term
* B, C & D tolerance for ≤10 pF values.
Standard Tape and Reel material (Paper/Embossed) depends upon chip size and thickness.
See individual part tables for tape material type for each capacitance value.
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
For Tin/Lead Terminations, please refer to LD Series
High Voltage MLC Chips
EXAMPLE: 1808AA271KA11A
1808
AVX
Style
0805
1206
1210
1808
1812
1825
2220
2225
3640
A
A
271
K
A
T
2
Voltage
Temperature Capacitance Capacitance
Failure
Packaging/
Termination
C = 600V/630V Coefficient
Code
Tolerance
Rate
Marking
1= Pd/Ag
(2 significant digits C0G: J = ±5%
2 = 7" Reel
A = 1000V
A = C0G
A=Not
T = Plated Ni
+ no. of zeros)
K = ±10% Applicable
4 = 13" Reel
S = 1500V
C = X7R
and Sn
Examples:
M = ±20%
G = 2000V
B = 5% Min Pb
10 pF = 100 X7R: K = ±10%
W = 2500V
Z = FLEXITERM®
100 pF = 101
M = ±20%
H = 3000V
*X = FLEXITERM®
1,000 pF = 102
Z = +80%,
J = 4000V
with 5% min
22,000 pF = 223
-20%
K = 5000V
lead (X7R only)
220,000 pF = 224
1 μF = 105
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
For Tin/Lead Terminations, please refer to LD Series
*
A
Special
Code
A = Standard
Not RoHS Compliant
For RoHS compliant products,
please select correct termination style.
2
REV 1
How to Order
Part Number Explanation
Capacitor Array
EXAMPLE: W2A43C103MAT2A
W
2
A
4
3
Style
Case Array Number
Size
of Caps
W = RoHS
L = SnPb 1 = 0405
2 = 0508
3 = 0612
C
Voltage
Z = 10V
Y = 16V
3 = 25V
5 = 50V
1 = 100V
103
M
Dielectric Capacitance
A = NP0 Code (In pF)
C = X7R 2 Sig Digits +
Number of
D = X5R
Zeros
A
T
2A
Capacitance
Failure
Termination
Tolerance
Rate
Code
J = ±5% A = Commercial T = Plated Ni and Sn
K = ±10% 4 = Automotive Z = FLEXITERM®
M = ±20%
*B = 5% min lead
*X = FLEXITERM®
with 5% min lead
Packaging &
Quantity
Code
2A = 7" Reel
(4000)
4A = 13" Reel
(10000)
2F = 7" Reel
(1000)
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
Low Inductance Capacitors (LICC)
EXAMPLE: 0612ZD105MAT2A
0612
Z
D
105
M
A
Size
0306
0508
0612
*LD16
*LD17
*LD18
Voltage
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
Dielectric
C = X7R
D = X5R
Capacitance
Code (In pF)
2 Sig. Digits +
Number of Zeros
Capacitance
Tolerance
K = ±10%
M = ±20%
T
Failure Rate Terminations
A = N/A
T = Plated Ni
and Sn
*B = 5% min
lead
2
A
Packaging
Available
2 = 7" Reel
4 = 13" Reel
Thickness
See Page 77
for Codes
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
Interdigitated Capacitors (IDC)
EXAMPLE: W3L16D225MAT3A
W
3
L
6
1
Style
Case
Low
Voltage
Number
Inductance
of
W = RoHS Size
4 = 4V
L = SnPb 2 = 0508 ESL = 50pH Terminals
6 = 6.3V
3 = 0612 ESL = 60pH 1 = 8 Terminals Z = 10V
Y = 16V
225
D
Dielectric
C = X7R
D = X5R
M
Capacitance Capacitance
Code (In pF)
Tolerance
M = ±20
2 Sig. Digits +
Number of
Zeros
A
Failure
Rate
A = N/A
T
3
Termination Packaging
T = Plated Ni Available
and Sn
1=7" Reel
*B = 5% min 3=13" Reel
Lead
A
Thickness
Max. Thickness
mm (in.)
A=0.95 (0.037)
S=0.55 (0.022)
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
Low Inductance Decoupling Capacitor Arrays (LICA)
EXAMPLE: LICA3T183M3FC4AA
LICA
Style
&
Size
3
T
102
M
3
Voltage Dielectric Cap/Section Capacitance Height
5V = 9 D = X5R
(EIA Code)
Tolerance
Code
10V = Z T = T55T 102 = 1000 pF M = ±20% 6 = 0.500mm
25V = 3 S = High K 103 = 10 nF
P = GMV 3 = 0.650mm
T55T 104 = 100 nF
1 = 0.875mm
5 = 1.100mm
*
Not RoHS Compliant
7 = 1.600mm
REV 1
F
Termination
*F = C4 Solder
Balls- 97Pb/3Sn
H = C4 Solder
Balls–Low ESR
P = Cr-Cu-Au
N = Cr-Ni-Au
X = None
C
4
A
A
# of
Inspection
Code
Reel Packaging
Caps/Part
Code
Face
M = 7" Reel
1 = one A = Standard
A = Bar
R = 13" Reel
6 = 2"x2" Waffle Pack 2 = two B = Established B = No Bar
Reliability
C = Dot, S55S
8 = 2"x2" Black Waffle 4 = four
Testing
Dielectrics
Pack
D = Triangle
7 = 2"x2" Waffle Pack
w/ termination
facing up
A = 2"x2" Black Waffle
Pack
NOTE: Contact factory for
w/ termination
availability of Termination and
facing up
Tolerance Options for Specific
C = 4"x4" Waffle Pack
Part Numbers.
w/ clear lid
3
C0G (NP0) Dielectric
General Specifications
C0G (NP0) is the most popular formulation of the
“temperature-compensating,” EIA Class I ceramic
materials. Modern C0G (NP0) formulations contain
neodymium, samarium and other rare earth oxides.
C0G (NP0) ceramics offer one of the most stable capacitor
dielectrics available. Capacitance change with temperature
is 0 ±30ppm/°C which is less than ±0.3% ⌬C from -55°C
to +125°C. Capacitance drift or hysteresis for C0G (NP0)
ceramics is negligible at less than ±0.05% versus up to
±2% for films. Typical capacitance change with life is less
than ±0.1% for C0G (NP0), one-fifth that shown by most
other dielectrics. C0G (NP0) formulations show no aging
characteristics.
PART NUMBER (see page 2 for complete part number explanation)
0805
5
A
101
J
Size
(L" x W")
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
500V = 7
Dielectric
C0G (NP0) = A
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
B
C
D
F
G
J
K
=
=
=
=
=
=
=
Capacitance
Tolerance
±.10 pF (<10pF)
±.25 pF (<10pF)
±.50 pF (<10pF)
±1% (≥ 10 pF)
±2% (≥ 10 pF)
±5%
±10%
A
T
2
Failure
Rate
A = Not
Applicable
Terminations
T = Plated Ni
and Sn
Contact
Factory For
1 = Pd/Ag Term
7 = Gold Plated
NOT RoHS
COMPLIANT
A
Packaging
2 = 7" Reel
4 = 13" Reel
U = 4mm TR
(01005)
Special
Code
A = Std.
Product
Contact Factory
For Multiples
⌬ Capacitance vs. Frequency
+2
Typical Capacitance Change
Envelope: 0 ± 30 ppm/°C
% ⌬ Capacitance
+0.5
0
-0.5
+1
0
-1
-2
1KHz
-55 -35 -15 +5 +25 +45 +65 +85 +105 +125
10 KHz
100 KHz
10 MHz
Variation of Impedance with Cap Value
Impedance vs. Frequency
0805 - C0G (NP0)
10 pF vs. 100 pF vs. 1000 pF
10
100
10 pF
1.0
100 pF
1000 pF
10
100
1000
Impedance, ⍀
1,000
1
0
0
100
Frequency, MHz
40
60
80
100
Variation of Impedance with Ceramic Formu
Impedance vs. Frequency
1000 pF - C0G (NP0) vs X7R
0805
X7R
NPO
1.0
0.1
10
20
10.00
1206
0805
1812
1210
10,000
0.1
100
Temperature °C
Variation of Impedance with Chip Size
Impedance vs. Frequency
1000 pF - C0G (NP0)
100,000
10.0
1,000
Frequency
Temperature °C
Impedance, ⍀
1 MHz
Insulation Resistance vs Temperature
10,000
Impedance, ⍀
% ⌬ Capacitance
Temperature Coefficient
Insulation Resistance (Ohm-Farads)
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
Contact factory for non-specified capacitance values.
1000
1.00
0.10
0.01
10
100
1000
Frequency, MHz
Frequency, MHz
4
041816
C0G (NP0) Dielectric
Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
Insulation Resistance
NP0 Specification Limits
-55ºC to +125ºC
Within specified tolerance
<30 pF: Q≥ 400+20 x Cap Value
≥30 pF: Q≥ 1000
100,000MΩ or 1000MΩ - μF,
whichever is less
Dielectric Strength
No breakdown or visual defects
Q
Resistance to
Flexure
Stresses
Appearance
Capacitance
Variation
±5% or ±.5 pF, whichever is greater
Q
Meets Initial Values (As Above)
Insulation
Resistance
Solderability
Appearance
Capacitance
Variation
Resistance to
Solder Heat
Thermal
Shock
Load Life
Q
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Q
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Q
(C=Nominal Cap)
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Load
Humidity
Q
Insulation
Resistance
Dielectric
Strength
041816
No defects
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 MHz ± 10% for cap ≤ 1000 pF
1.0 kHz ± 10% for cap > 1000 pF
Voltage: 1.0Vrms ± .2V
Charge device with rated voltage for
60 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Note: Charge device with 150% of rated
voltage for 500V devices.
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
≥ Initial Value x 0.3
≥ 95% of each terminal should be covered
with fresh solder
No defects, <25% leaching of either end terminal
90 mm
Dip device in eutectic solder at 230 ± 5ºC
for 5.0 ± 0.5 seconds
≤ ±2.5% or ±.25 pF, whichever is greater
Meets Initial Values (As Above)
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24 ± 2
hours before measuring electrical properties.
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
Step 1: -55ºC ± 2º
30 ± 3 minutes
≤ ±2.5% or ±.25 pF, whichever is greater
Step 2: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Step 3: +125ºC ± 2º
30 ± 3 minutes
Meets Initial Values (As Above)
Step 4: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Repeat for 5 cycles and measure after
24 hours at room temperature
No visual defects
≤ ±3.0% or ± .3 pF, whichever is greater
≥ 30 pF:
≥10 pF, <30 pF:
<10 pF:
Q≥ 350
Q≥ 275 +5C/2
Q≥ 200 +10C
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
Charge device with twice rated voltage in
test chamber set at 125ºC ± 2ºC
for 1000 hours (+48, -0).
Remove from test chamber and stabilize at
room temperature for 24 hours
before measuring.
No visual defects
≤ ±5.0% or ± .5 pF, whichever is greater
≥ 30 pF:
≥10 pF, <30 pF:
<10 pF:
Q≥ 350
Q≥ 275 +5C/2
Q≥ 200 +10C
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
Remove from chamber and stabilize at
room temperature for 24 ± 2 hours
before measuring.
5
C0G (NP0) Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
0101*
0201
0402
0603
0805
1206
Soldering
Packaging
Reflow Only
All Paper
Reflow Only
All Paper
Reflow/Wave
All Paper
Reflow/Wave
All Paper
Reflow/Wave
Paper/Embossed
Reflow/Wave
Paper/Embossed
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.014 ± 0.006)
50
100
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
16
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
P
P
P
P
P
P
P
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
25
50
100
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
P
P
N
P
P
N
P
P
N
P
P
P
P
P
P
P
P
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
50
100
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
P
M
P
M
P
M
P
M
P
M
P
M
P
M
P
P
P
16
25
W
16
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
25
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
16
25
200
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
䉲
䉲
䉲
䉲
Letter
Max.
Thickness
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
16
25
50
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
L
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
16
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
P
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
P
200
16
25
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
Q
Q
Q
Q
Q
Q
Q
500
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
P
200
500
T
䉲
䉲
䉲
SIZE
0.40 ± 0.02
0.60 ± 0.09
(0.016 ± 0.0008) (0.024 ± 0.004)
0.20 ± 0.02
0.30 ± 0.09
(0.008 ± 0.0008) (0.011 ± 0.004)
0.10 ± 0.04
0.15 ± 0.05
(0.004 ± 0.0016) (0.006 ± 0.002)
16
25
50
A
B
A
B
A
B
A
A
B
A
A
B
A
A
B
A
A
B
A
A
B
A
A
B
A
A
B
A
A
B
A
A
B
A
A
B
A
A
B
A
A
B
A
A
B
A
A
B
A
A
B
A
A
B
A
A
B
A
A
B
A
A
B
A
A
B
A
A
B
A
A
B
A
A
䉲
mm
(in.)
mm
(W) Width
(in.)
(t) Terminal mm
(in.)
WVDC
Cap
0.5
(pF)
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
Cap
0.010
(μF)
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
WVDC
(L) Length
16
25
0101*
A
0.33
(0.013)
B
0.22
(0.009)
50
0201
C
0.56
(0.022)
PAPER
t
16
25
50
0402
E
0.71
(0.028)
50
100
200
0603
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
50
100
50
0805
M
1.27
(0.050)
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
PAPER and EMBOSSED available for 01005
100
1206
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
*EIA 01005
6
041816
C0G (NP0) Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
1210
1812
1825
2220
2225
Reflow Only
Paper/Embossed
Reflow Only
All Embossed
Reflow Only
All Embossed
Reflow Only
All Embossed
Reflow Only
All Embossed
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
50
100
200
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
0.61 ± 0.36
(0.024 ± 0.014)
50
100
200
4.50 ± 0.30
(0.177 ± 0.012)
6.40 ± 0.40
(0.252 ± 0.016)
0.61 ± 0.36
(0.024 ± 0.014)
50
100
200
5.70 ± 0.40
(0.225 ± 0.016)
5.00 ± 0.40
(0.197 ± 0.016)
0.64 ± 0.39
(0.025 ± 0.015)
50
100
200
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
0.64 ± 0.39
(0.025 ± 0.015)
50
100
200
Cap
(pF)
500
䉲
L
䉲
041816
A
0.33
(0.013)
25
W
䉲
J
J
J
J
P
P
P
P
P
P
P
P
P
P
P
N
N
J
J
J
J
P
P
P
P
P
P
P
P
P
P
P
N
N
25
50
SIZE
Letter
Max.
Thickness
500
䉲
Cap
(μF)
25
䉲
(t) Terminal
T
䉲
(W) Width
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
0.5
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
WVDC
䉲
(L) Length
䉲
SIZE
Soldering
Packaging
J
J
J
P
P
P
P
P
P
P
P
P
P
P
J
K
K
P
P
P
P
P
P
P
100
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
P
P
P
P
P
P
N
500
K
K
K
K
K
K
K
K
K
K
K
K
K
K
P
P
P
Q
Q
X
X
Z
Z
Z
25
K
K
K
K
K
K
K
K
K
K
K
M
M
M
P
P
P
Q
Q
X
X
Z
Z
Z
50
1210
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
N
N
N
N
N
N
N
N
N
P
Q
Q
Q
Q
Q
Q
Q
X
X
X
X
Y
Y
Z
100
N
N
N
N
N
P
P
P
P
P
Q
Q
Q
M
M
M
M
P
Q
Q
Q
Y
Y
M
M
M
M
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
200
500
50
1812
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
M
M
M
M
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
M
M
M
M
M
M
X
X
X
X
X
X
X
X
X
X
X
Y
100
200
X
X
X
X
X
X
X
X
X
X
X
Y
Y
Z
Z
Z
50
1825
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
X
X
X
X
X
X
X
X
X
X
X
100
X
X
X
X
X
X
X
X
X
X
200
2220
X
2.29
(0.090)
Y
2.54
(0.100)
t
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
X
X
X
X
X
Z
50
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
Y
Y
Y
Y
Z
Z
Z
Z
100
P
P
P
P
P
P
P
P
P
P
P
P
P
P
Y
Y
Y
Y
Y
Y
200
2225
Z
2.79
(0.110)
7
RF/Microwave C0G (NP0)
Capacitors (RoHS)
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
GENERAL INFORMATION
are met on each value producing lot to lot uniformity.
Sizes available are EIA chip sizes 0402, 0603, 0805, and
1210.
“U” Series capacitors are C0G (NP0) chip capacitors specially designed for “Ultra” low ESR for applications in the
communications market. Max ESR and effective capacitance
DIMENSIONS: inches (millimeters)
0402
0603
0805
1210
A
A
C
B
A
A
C
B
D
E
B
B
C
C
D
D
E D
D
D
E
inches (mm)
E
Size
A
B
C
D
0402
0603
0805
1210
0.039±0.004 (1.00±0.1)
0.060±0.010 (1.52±0.25)
0.079±0.008 (2.01±0.2)
0.126±0.008 (3.2±0.2)
0.020±0.004 (0.50±0.1)
0.030±0.010 (0.76±0.25)
0.049±0.008 (1.25±0.2)
0.098±0.008 (2.49±0.2)
0.022 (0.55mm) max
0.036 (0.91mm) max
0.040±0.005 (1.02±0.127)
0.050±0.005 (1.27±0.127)
N/A
0.010±0.005 (0.25±0.13)
0.020±0.010 (0.51±0.255)
0.025±0.015 (0.635±0.381)
N/A
0.030 (0.76) min
0.020 (0.51) min
0.040 (1.02) min
HOW TO ORDER
0805
1
Case Size
U
100
Dielectric =
Ultra Low ESR
0402
0603
0805
1210
A
T
Capacitance
Tolerance Code
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
Voltage Code
3 = 25V
5 = 50V
1 = 100V
2 = 200V
J
Capacitance
EIA Capacitance Code in pF.
First two digits = significant figures or “R” for
decimal place.
Third digit = number of zeros or after “R” significant figures.
2
A
Termination
Special Code
T= Plated Ni and
Sn
A = Standard
Failure Rate
Code
A = Not Applicable
Packaging
Code
2 = 7" Reel
4 = 13" Reel
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
ELECTRICAL CHARACTERISTICS
Capacitance Values and Tolerances:
Size 0402 - 0.2 pF to 30 pF @ 1 MHz
Size 0603 - 1.0 pF to 100 pF @ 1 MHz
Size 0805 - 1.6 pF to 160 pF @ 1 MHz
Size 1210 - 2.4 pF to 1000 pF @ 1 MHz
Temperature Coefficient of Capacitance (TC):
0±30 ppm/°C (-55° to +125°C)
Insulation Resistance (IR):
1012 Ω min. @ 25°C and rated WVDC
1011 Ω min. @ 125°C and rated WVDC
Working Voltage (WVDC):
Size
0402
0603
0805
1210
8
-
Working Voltage
50, 25 WVDC
200, 100, 50 WVDC
200, 100 WVDC
200, 100 WVDC
Dielectric Working Voltage (DWV):
250% of rated WVDC
Equivalent Series Resistance Typical (ESR):
0402
0603
0805
1210
-
See Performance Curve, page 9
See Performance Curve, page 9
See Performance Curve, page 9
See Performance Curve, page 9
Marking: Laser marking EIA J marking standard
(except 0603) (capacitance code and
tolerance upon request).
MILITARY SPECIFICATIONS
Meets or exceeds the requirements of MIL-C-55681
041816
RF/Microwave C0G (NP0)
Capacitors (RoHS)
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
CAPACITANCE RANGE
100
110
120
130
140
150
160
180
200
220
270
300
330
360
390
430
470
510
560
620
680
750
820
910
1000
B,C,J,K,M
F,G,J,K,M
200V
100V
50V
N/A
F,G,J,K,M N/A 100V 200V 200V
50V
50V
N/A 200V
100V
100V
N/A
200V
100V
䉱
B,C,J,K,M 50V 200V 200V 200V
F,G,J,K,M
䉱
䉱
䉱
䉱
䉱
䉱
䉱
䉱
䉱
䉱
䉱
B,C,D
B,C,J,K,M
7.5
8.2
9.1
10
11
12
13
15
18
20
22
24
27
30
33
36
39
43
47
51
56
68
75
82
91
䉱
50V 200V 200V 200V
䉱
䉱
䉱
䉱
䉱
䉱
B,C,D
B,C,D
䉱
䉱
B,C
B,C,D
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
䉱
N/A N/A
䉱
N/A
䉱
50V
Size
Available
Cap (pF) Tolerance 0402 0603 0805 1210
䉱
B,C
Size
Available
Cap (pF) Tolerance 0402 0603 0805 1210
䉱
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
Size
Available
Cap (pF) Tolerance 0402 0603 0805 1210
䉱
Size
Available
Cap (pF) Tolerance 0402 0603 0805 1210
ULTRA LOW ESR, “U” SERIES
TYPICAL ESR vs. FREQUENCY
0603 “U” SERIES
TYPICAL ESR vs. FREQUENCY
0402 “U” SERIES
1
1
3.9 pF
4.7 pF
5.1 pF
6.8 pF
10.0 pF
15.0 pF
ESR (ohms)
ESR (ohms)
10 pF
15 pF
3.3 pF
0.1
0.01
0.01
0
500
1000
1500
2000
2500
0
500
1000
1500
2000
Frequency (MHz)
Frequency (MHz)
TYPICAL ESR vs. FREQUENCY
0805 “U” SERIES
TYPICAL ESR vs. FREQUENCY
1210 “U” SERIES
2500
1
1
100 pF
10.0 pF
ESR (ohms)
ESR (ohms)
0.1
0.1
0.1
10 pF
100 pF
300 pF
0.01
0.01
0
500
1000
1500
Frequency (MHz)
2000
2500
0
500
1000
1500
2000
Frequency (MHz)
ESR Measured on the Boonton 34A
041816
9
10
0.1
1.0
1.0
10
10
1210
0603
Capacitance (pF)
0402
100
0805
TYPICAL
SERIES RESONANT FREQUENCY
“U” SERIES CHIP
1000
RF/Microwave C0G (NP0) Capacitors
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
041816
Frequency (GHz)
RF/Microwave C0G (NP0)
Capacitors (Sn/Pb)
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
GENERAL INFORMATION
are met on each value producing lot to lot uniformity.
Sizes available are EIA chip sizes 0402, 0603, 0805, and
1210.
“U” Series capacitors are C0G (NP0) chip capacitors specially
designed for “Ultra” low ESR for applications in the communications market. Max ESR and effective capacitance
DIMENSIONS: inches (millimeters)
0402
0603
0805
1210
A
A
C
B
A
A
C
B
D
E
B
B
C
C
D
D
E D
D
E
D
inches (mm)
E
Size
A
B
C
D
0402
0603
0805
1210
0.039±0.004 (1.00±0.1)
0.060±0.010 (1.52±0.25)
0.079±0.008 (2.01±0.2)
0.126±0.008 (3.2±0.2)
0.020±0.004 (0.50±0.1)
0.030±0.010 (0.76±0.25)
0.049±0.008 (1.25±0.2)
0.098±0.008 (2.49±0.2)
0.022 (0.55mm) max
0.036 (0.91mm) max
0.040±0.005 (1.02±0.127)
0.050±0.005 (1.27±0.127)
N/A
0.010±0.005 (0.25±0.13)
0.020±0.010 (0.51±0.254)
0.025±0.015 (0.635±0.381)
N/A
0.030 (0.76) min
0.020 (0.51) min
0.040 (1.02) min
HOW TO ORDER
LD05
1
Case Size
U
100
Dielectric =
Ultra Low
ESR
LD02 = 0402
LD03 = 0603
LD05 = 0805
LD10 = 1210
A
B
Capacitance
Tolerance
Code
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
Voltage Code
3 = 25V
5 = 50V
1 = 100V
2 = 200V
J
Capacitance
EIA Capacitance Code in pF.
2
A
Termination
Special Code
*B = 5% min lead
A = Standard
Failure Rate
Code
Packaging
Code
A = Not Applicable
2 = 7" Reel
4 = 13" Reel
First two digits = significant figures
or “R” for decimal place.
Third digit = number of zeros or after
“R” significant figures.
*
ELECTRICAL CHARACTERISTICS
Not RoHS Compliant
Capacitance Values and Tolerances:
Size 0402 - 0.2 pF to 22 pF @ 1 MHz
Size 0603 - 1.0 pF to 100 pF @ 1 MHz
Size 0805 - 1.6 pF to 160 pF @ 1 MHz
Size 1210 - 2.4 pF to 1000 pF @ 1 MHz
Temperature Coefficient of Capacitance (TC):
0±30 ppm/°C (-55° to +125°C)
Insulation Resistance (IR):
1012 Ω min. @ 25°C and rated WVDC
1011 Ω min. @ 125°C and rated WVDC
Working Voltage (WVDC):
Size
0402
0603
0805
1210
REV 1
-
Working Voltage
50, 25 WVDC
200, 100, 50 WVDC
200, 100 WVDC
200, 100 WVDC
Dielectric Working Voltage (DWV):
250% of rated WVDC
Equivalent Series Resistance Typical (ESR):
0402
0603
0805
1210
-
See Performance Curve, page 12
See Performance Curve, page 12
See Performance Curve, page 12
See Performance Curve, page 12
Marking: Laser marking EIA J marking standard
(except 0603) (capacitance code and
tolerance upon request).
MILITARY SPECIFICATIONS
Meets or exceeds the requirements of MIL-C-55681
11
RF/Microwave C0G (NP0)
Capacitors (Sn/Pb)
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
CAPACITANCE RANGE
100
110
120
130
140
150
160
180
200
220
270
300
330
360
390
430
470
510
560
620
680
750
820
910
1000
B,C,J,K,M
F,G,J,K,M
200V
100V
50V
N/A
F,G,J,K,M N/A 100V 200V 200V
50V
50V
N/A 200V
100V
100V
N/A
200V
100V
䉱
B,C,J,K,M 50V 200V 200V 200V
F,G,J,K,M
䉱
䉱
䉱
䉱
䉱
䉱
䉱
䉱
䉱
䉱
䉱
B,C,D
B,C,J,K,M
7.5
8.2
9.1
10
11
12
13
15
18
20
22
24
27
30
33
36
39
43
47
51
56
68
75
82
91
䉱
50V 200V 200V 200V
䉱
䉱
䉱
䉱
䉱
䉱
B,C,D
B,C,D
䉱
䉱
B,C
B,C,D
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
䉱
N/A N/A
䉱
N/A
䉱
50V
Size
Available
Cap (pF) Tolerance LD02 LD03 LD05 LD10
䉱
B,C
Size
Available
Cap (pF) Tolerance LD02 LD03 LD05 LD10
䉱
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
Size
Available
Cap (pF) Tolerance LD02 LD03 LD05 LD10
䉱
Size
Available
Cap (pF) Tolerance LD02 LD03 LD05 LD10
ULTRA LOW ESR, “U” SERIES
TYPICAL ESR vs. FREQUENCY
0603 “U” SERIES
TYPICAL ESR vs. FREQUENCY
0402 “U” SERIES
1
1
3.9 pF
4.7 pF
5.1 pF
6.8 pF
10.0 pF
15.0 pF
ESR (ohms)
ESR (ohms)
10 pF
15 pF
3.3 pF
0.1
0.01
0.01
0
500
1000
1500
2000
2500
0
500
1000
1500
2000
Frequency (MHz)
Frequency (MHz)
TYPICAL ESR vs. FREQUENCY
0805 “U” SERIES
TYPICAL ESR vs. FREQUENCY
1210 “U” SERIES
2500
1
1
100 pF
10.0 pF
ESR (ohms)
ESR (ohms)
0.1
0.1
0.1
10 pF
100 pF
300 pF
0.01
0.01
0
500
1000
1500
Frequency (MHz)
2000
2500
0
500
1000
1500
2000
Frequency (MHz)
ESR Measured on the Boonton 34A
12
REV 1
RF/Microwave Automotive C0G (NP0)
Capacitors (RoHS), AEC Q200 Qualified
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
GENERAL INFORMATION
DIMENSIONS: mm (inches)
Automotive “U” Series capacitors are C0G (NP0) chip capacitors
specially designed for “Ultra” low ESR for applications in the
automotive market. Max ESR and effective capacitance are met on
each value producing lot to lot uniformity. Sizes available are EIA
chip sizes 0402 and 0603.
0402
0603
A
A
C
B
C
B
D
Size
0402
0603
A
B
1.00±0.1
(0.039±0.004)
1.52±0.25
(0.060±0.010)
E
D
C
D
E
0.50±0.1
0.60 max
N/A
(0.020±0.004) (0.024)
0.76±0.25
0.91 max
0.25±0.13
(0.030±0.010) (0.036) (0.010±0.005)
N/A
0.76 min
(0.030)
HOW TO ORDER
0402
1
Case Size
U
100
Dielectric =
Ultra Low ESR
0402
0603
4
Capacitance
Tolerance Code
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
Voltage Code
5 = 50V
1 = 100V
2 = 200V
J
Capacitance
T
2
A
Termination
Special Code
T= Plated Ni and Sn
A = Standard
Failure Rate
Code
Packaging
Code
4 = Automotive
2 = 7" Reel
4 = 13" Reel
EIA Capacitance Code in pF.
First two digits = significant figures
or “R” for decimal place.
Third digit = number of zeros or
after “R” significant figures.
ELECTRICAL CHARACTERISTICS
Capacitance Values and Tolerances:
Dielectric Working Voltage (DWV):
Size 0402 - 0.2 pF to 22 pF @ 1 MHz
Size 0603 - 1.0 pF to 100 pF @ 1 MHz
250% of rated WVDC
Temperature Coefficient of Capacitance (TC):
0±30 ppm/°C (-55° to +125°C)
0402 - See Performance Curve
0603 - See Performance Curve
Insulation Resistance (IR):
Automotive Specifications
1012 Ω min. @ 25°C and rated WVDC
1011 Ω min. @ 125°C and rated WVDC
Meets or exceeds the requirements of AEC Q200
Equivalent Series Resistance Typical (ESR):
Working Voltage (WVDC):
Size
Working Voltage
0402 - 50, 25 WVDC
0603 - 200, 100, 50 WVDC
REV 1
13
RF/Microwave Automotive C0G (NP0)
Capacitors (RoHS), AEC Q200 Qualified
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
CAPACITANCE RANGE
100
110
120
130
140
150
160
180
200
220
270
300
330
360
390
430
470
510
560
620
680
750
820
910
1000
B,C,J,K,M
F,G,J,K,M
200V
100V
50V
N/A
䉱
䉱
䉱
䉱
B,C,D
B,C,J,K,M
B,C,J,K,M 50V 200V
䉱
䉱
䉱
䉱
B,C,D
7.5
8.2
9.1
10
11
12
13
15
18
20
22
24
27
30
33
36
39
43
47
51
56
68
75
82
91
50V 200V
Available
Cap (pF) Tolerance
Size
0402 0603
F,G,J,K,M N/A 100V
50V
50V
N/A
F,G,J,K,M
䉱
䉱
B,C
B,C,D
B,C,D
Size
0402 0603
䉱
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
䉱
N/A
Available
Cap (pF) Tolerance
䉱
50V
Size
0402 0603
䉱
B,C
Available
Cap (pF) Tolerance
䉱
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
Size
0402 0603
䉱
Available
Cap (pF) Tolerance
ULTRA LOW ESR, “U” SERIES
TYPICAL ESR vs. FREQUENCY
0402 “U” SERIES
TYPICAL ESR vs. FREQUENCY
0603 “U” SERIES
1
1
3.9 pF
4.7 pF
5.1 pF
6.8 pF
10.0 pF
15.0 pF
ESR (ohms)
ESR (ohms)
10 pF
15 pF
3.3 pF
0.1
0.1
0.01
0.01
0
500
1000
1500
0
2500
2000
500
1000
1500
2000
2500
Frequency (MHz)
Frequency (MHz)
TYPICAL SERIES RESONANT FREQUENCY
“U” SERIES CHIP
10
Frequency (GHz)
0402
0603
1.0
0.1
1.0
10
100
1000
Capacitance (pF)
14
REV 1
Designer Kits
Communication Kits “U” Series
“U” SERIES KITS
0402
0603
Kit 5000 UZ
Kit 4000 UZ
Cap.
Cap.
Value Tolerance Value Tolerance
pF
pF
Cap.
Cap.
Value Tolerance Value Tolerance
pF
pF
0.5
1.0
1.5
1.8
2.2
2.4
3.0
3.6
B (±0.1pF)
4.7
5.6
6.8
8.2
10.0
12.0
15.0
B (±0.1pF)
J (±5%)
***25 each of 15 values
1.0
1.2
1.5
1.8
2.0
2.4
2.7
3.0
3.3
3.9
4.7
5.6
B (±0.1pF)
6.8
7.5
8.2
10.0
12.0
15.0
18.0
22.0
27.0
33.0
39.0
47.0
B (±0.1pF)
J (±5%)
***25 each of 24 values
0805
Kit 3000 UZ
Kit 3500 UZ
Cap.
Cap.
Value Tolerance Value Tolerance
pF
pF
Cap.
Cap.
Value Tolerance Value Tolerance
pF
pF
1.0
1.5
2.2
2.4
2.7
3.0
3.3
3.9
4.7
5.6
7.5
8.2
9.1
10.0
12.0
B (±0.1pF)
J (±5%)
***25 each of 30 values
REV 1
1210
15.0
18.0
22.0
24.0
27.0
33.0
36.0
39.0
47.0
56.0
68.0
82.0
100.0
130.0
160.0
J (±5%)
2.2
2.7
4.7
5.1
6.8
8.2
9.1
10.0
13.0
15.0
18.0
20.0
24.0
27.0
30.0
B (±0.1pF)
J (±5%)
36.0
39.0
47.0
51.0
56.0
68.0
82.0
100.0
120.0
130.0
240.0
300.0
390.0
470.0
680.0
J (±5%)
***25 each of 30 values
15
X8R/X8L Dielectric
General Specifications
AVX has developed a range of multilayer ceramic capacitors designed for use in applications up to 150ºC.
These capacitors are manufactured with an X8R and an X8L dielectric material. X8R material has
capacitance variation of ±15% between -55ºC and +150ºC. The X8L material has capacitance variation of
±15% between -55ºC to 125ºC and +15/-40% from +125ºC to +150ºC.
The need for X8R and X8L performance has been driven by customer requirements for parts that operate
at elevated temperatures. They provide a highly reliable capacitor with low loss and stable capacitance
over temperature.
They are ideal for automotive under the hood sensors, and various industrial applications. Typical industrial
application would be drilling monitoring system. They can also be used as bulk capacitors for high
temperature camera modules.
Both X8R and X8L dielectric capacitors are automotive AEC-Q200 qualified. Optional termination systems, tin,
FLEXITERM® and conductive epoxy for hybrid applications are available. Providing this series with our
FLEXITERM® termination system provides further advantage to customers by way of enhanced resistance to
both, temperature cycling and mechanical damage.
PART NUMBER (see page 2 for complete part number explanation)
0805
5
F
104
K
4
T
Capacitance Capacitance
Failure
Terminations
Tolerance
Code (In pF)
Rate
T = Plated Ni
J = ± 5%
4 = Automotive
2 Sig. Digits +
and Sn
K = ±10%
A = Not
Number of
Z = FLEXITERM®
M
=
±
20%
Applicable
Zeros
U = Conductive
e.g. 10μF = 106
Epoxy for
Hybrid apps
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
Size
0603
0805
1206
Voltage
16V = Y
25V = 3
50V = 5
100V = 1
Dielectric
X8R = F
X8L = L
X8R
SIZE
Soldering
331
471
681
102
152
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
WVDC
Cap
330
(pF)
470
680
1000
1500
2200
3300
4700
6800
Cap 0.01
(μF) 0.015
0.022
0.033
0.047
0.068
0.1
0.15
0.22
0.33
0.47
0.68
1
WVDC
SIZE
Letter
Max.
Thickness
16
0805
Reflow/Wave
1206
Reflow/Wave
25V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
25V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
25V
50V
25V
25V
50V
0603
A
0.33
(0.013)
C
0.56
(0.022)
25V
G
0.90
(0.035)
SIZE
Soldering
50V
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
0805
E
0.71
(0.028)
PAPER
A
Packaging
2 = 7" Reel
4 = 13" Reel
Special
Code
A = Std.
Product
X8L
0603
Reflow/Wave
50V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
2
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
331
471
681
102
152
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
50V
1206
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
0603
Reflow/Wave
WVDC
Cap
330
(pF)
470
680
1000
1500
2200
3300
4700
6800
Cap 0.01
(μF) 0.015
0.022
0.033
0.047
0.068
0.1
0.15
0.22
0.33
0.47
0.68
1
WVDC
25V
G
G
G
G
G
G
25V
50V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
50V
SIZE
0603
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
0805
Reflow/Wave
100V
G
G
G
G
G
G
G
G
G
G
25V
J
J
J
J
J
J
J
N
N
N
100V
25V
1206
Reflow/Wave
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
100V
J
J
J
J
J
J
J
J
J
J
J
J
N
N
50V
100V
16V
J
J
J
M
M
M
16V
0805
X
2.29
(0.090)
Y
2.54
(0.100)
25V
50V
100V
J
J
M
M
J
J
J
J
J
J
J
J
J
J
J
J
J
J
P
P
J
J
J
J
J
J
J
J
J
J
J
M
Q
Q
Q
25V
50V
100V
1206
Z
2.79
(0.110)
= AEC-Q200
Qualified
041816
X8R/X8L Dielectric
General Specifications
APPLICATIONS FOR X8R AND X8L CAPACITORS
•
•
•
•
All market sectors with a 150°C requirement
Automotive on engine applications
Oil exploration applications
Hybrid automotive applications
– Battery control
– Inverter / converter circuits
– Motor control applications
– Water pump
• Hybrid commercial applications
– Emergency circuits
– Sensors
– Temperature regulation
ADVANTAGES OF X8R AND X8L MLC CAPACITORS
• Both ranges are qualified to the highest automotive
AEC-Q200 standards
• Excellent reliability compared to other capacitor
technologies
• RoHS compliant
• Low ESR / ESL compared to other technologies
• Tin solder finish
• FLEXITERM® available
• Epoxy termination for hybrid available
• 100V range available
ENGINEERING TOOLS FOR HIGH VOLTAGE MLC CAPACITORS
•
•
•
•
Samples
Technical Articles
Application Engineering
Application Support
X8R/X8L Dielectric
0805, 50V, X8R/X8L Typical Temperature Coefficient
10.00
X8R
Cap change %
0.00
-10.00
X8L
-20.00
-30.00
-40.00
-50.00
-55 -35 -15
0
20
25
35
45
65 85 105 125 130 135 140 150
Temperature (°C)
041816
17
X8R/X8L Dielectric
Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
Insulation Resistance
X8R/X8L Specification Limits
-55ºC to +150ºC
Within specified tolerance
≤ 2.5% for ≥ 50V DC rating
≤ 3.5% for 25V DC and 16V DC rating
100,000MΩ or 1000MΩ - μF,
whichever is less
Dielectric Strength
No breakdown or visual defects
Dissipation Factor
Resistance to
Flexure
Stresses
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Solderability
Resistance to
Solder Heat
Thermal
Shock
Load Life
Load
Humidity
18
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
No defects
≤ ±12%
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 kHz ± 10%
Voltage: 1.0Vrms ± .2V
Charge device with rated voltage for
120 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Note: Charge device with 150% of rated
voltage for 500V devices.
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
Meets Initial Values (As Above)
≥ Initial Value x 0.3
≥ 95% of each terminal should be covered
with fresh solder
No defects, <25% leaching of either end terminal
90 mm
Dip device in eutectic solder at 230 ± 5ºC
for 5.0 ± 0.5 seconds
≤ ±7.5%
Meets Initial Values (As Above)
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24 ± 2
hours before measuring electrical properties.
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
Step 1: -55ºC ± 2º
30 ± 3 minutes
≤ ±7.5%
Step 2: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Step 3: +125ºC ± 2º
30 ± 3 minutes
Meets Initial Values (As Above)
Step 4: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Repeat for 5 cycles and measure after
24 ± 2 hours at room temperature
No visual defects
≤ ±12.5%
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
No visual defects
≤ ±12.5%
Charge device with 1.5 rated voltage (≤ 10V) in
test chamber set at 150ºC ± 2ºC
for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
Meets Initial Values (As Above)
041816
X7R Dielectric
General Specifications
X7R formulations are called “temperature stable” ceramics and
fall into EIA Class II materials. X7R is the most popular of these
intermediate dielectric constant materials. Its temperature variation of capacitance is within ±15% from -55°C to +125°C. This
capacitance change is non-linear.
Capacitance for X7R varies under the influence of electrical operating conditions such as voltage and frequency.
X7R dielectric chip usage covers the broad spectrum of
industrial applications where known changes in capacitance
due to applied voltages are acceptable.
PART NUMBER (see page 2 for complete part number explanation)
0805
5
C
103
M
A
T
Size
(L" x W")
Voltage
4V = 4
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
500V = 7
Dielectric
X7R = C
Capacitance
Code (In pF)
2 Sig. Digits +
Number of Zeros
Capacitance
Tolerance
J = ± 5%*
K = ±10%
M = ± 20%
Failure
Rate
A = Not
Applicable
*≤1μF only,
contact factory for
additional values
2
Terminations
T = Plated Ni
and Sn
7 = Gold Plated*
Z= FLEXITERM®**
A
Packaging
2 = 7" Reel
4 = 13" Reel
Special
Code
A = Std. Product
Contact
Factory For
Multiples
*Optional termination
**See FLEXITERM®
X7R section
X7R Dielectric
Typical Temperature Coefficient
⌬ Capacitance vs. Frequency
+30
10
+20
% ⌬ Capacitance
0
-5
-10
-15
-20
0
20
40
60
0
-10
-20
-30
1KHz
-25
-60 -40 -20
+10
80 100 120 140
10 KHz
100 KHz
Variation of Impedance with Cap Va
Impedance vs. Frequency
1,000 pF vs. 10,000 pF - X7R
0805
10
1206
0805
1210
1,000 pF
Impedance, ⍀
Impedance, ⍀
10,000 pF
1.00
0.10
Frequency, MHz
041816
100
0
0
20
40
1000
1.0
0.1
1
10
80
100
120
Variation of Impedance with Chip S
Impedance vs. Frequency
100,000 pF - X7R
10
1206
0805
1210
1.0
0.1
.01
.01
60
Temperature °C
Variation of Impedance with Chip S
Impedance vs. Frequency
10,000 pF - X7R
10.00
100
10 MHz
1,000
Frequency
Temperature °C
0.01
10
1 MHz
Insulation Resistance vs Tempera
10,000
Impedance, ⍀
% Cap Change
5
Insulation Resistance (Ohm-Farads)
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
Contact factory for non-specified capacitance values.
100
Frequency, MHz
1,000
1
10
100
1,000
Frequency, MHz
19
X7R Dielectric
Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
Insulation Resistance
X7R Specification Limits
-55ºC to +125ºC
Within specified tolerance
≤ 2.5% for ≥ 50V DC rating
≤ 3.0% for 25V DC rating
≤ 3.5% for 25V and 16V DC rating
≤ 5.0% for ≤ 10V DC rating
100,000MΩ or 1000MΩ - μF,
whichever is less
Dielectric Strength
No breakdown or visual defects
Dissipation Factor
Resistance to
Flexure
Stresses
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Solderability
Resistance to
Solder Heat
Thermal
Shock
Load Life
Load
Humidity
20
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
No defects
≤ ±12%
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 kHz ± 10%
Voltage: 1.0Vrms ± .2V
Charge device with rated voltage for
120 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Note: Charge device with 150% of rated
voltage for 500V devices.
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
Meets Initial Values (As Above)
≥ Initial Value x 0.3
≥ 95% of each terminal should be covered
with fresh solder
No defects, <25% leaching of either end terminal
90 mm
Dip device in eutectic solder at 230 ± 5ºC
for 5.0 ± 0.5 seconds
≤ ±7.5%
Meets Initial Values (As Above)
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24 ± 2
hours before measuring electrical properties.
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
Step 1: -55ºC ± 2º
30 ± 3 minutes
≤ ±7.5%
Step 2: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Step 3: +125ºC ± 2º
30 ± 3 minutes
Meets Initial Values (As Above)
Step 4: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Repeat for 5 cycles and measure after
24 ± 2 hours at room temperature
No visual defects
≤ ±12.5%
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
No visual defects
≤ ±12.5%
Charge device with 1.5 rated voltage (≤ 10V) in
test chamber set at 125ºC ± 2ºC
for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
Meets Initial Values (As Above)
041816
X7R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
0101*
0201
0402
0603
0805
1206
Soldering
Packaging
Reflow Only
Paper/Embossed
Reflow Only
All Paper
Reflow/Wave
All Paper
Reflow/Wave
All Paper
Reflow/Wave
Paper/Embossed
Reflow/Wave
Paper/Embossed
0.60 ± 0.09
(0.024 ± 0.004)
0.30 ± 0.09
(0.011 ± 0.004)
0.15 ± 0.05
(0.006 ± 0.002)
10 16 25
A
A A
A
A A
A
A A
A
A A
A
A A
A
A A
A
A A
A
A A
A
A A
A
A A
A
A A
A
A A
A
A A
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
10 16 25
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.014 ± 0.006)
16 25 50
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
16 25 50
(L) Length
(W) Width
(t) Terminal
Cap
(pF)
Cap
(μF)
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
0.01
0.015
0.022
0.033
0.047
0.068
0.1
0.15
0.22
0.33
0.47
0.68
1.0
2.2
4.7
10
22
47
100
Letter
Max.
Thickness
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
101
151
221
331
471
681
102
152
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
225
475
106
226
476
107
WVDC
0.40 ± 0.02
(0.016 ± 0.0008)
0.20 ± 0.02
(0.008 ± 0.0008)
0.10± 0.04
(0.004 ± 0.0016)
16
B
B
B
B
B
B
B
B
B
SIZE
0101
A
0.33
(0.013)
50
A
A
A
A
A
6.3
50
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
6.3
G
G
J
J
J
J
J
C
C
C
10
G
G
G
J
J
J
J
J
100 200 6.3
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
P
16
B
0.22
(0.009)
10
16
25
50
6.3
0201
C
E
0.56
0.71
(0.022)
(0.028)
PAPER
10
16
25
50
6.3
10
16
0402
G
0.90
(0.035)
25
50
100 200 6.3
0603
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
10
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
P
P
P
10
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
P
P
16
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
P
P
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
100 200
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
N
6.3
J
J
J
J
J
J
J
J
J
J
J
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
Q
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
Q
Q
Q
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
P
P
Q
Q
Q
Q
J
J
J
J
J
J
J
J
J
J
J
P
Q
Q
Q
Q
Q
Q
Q**
Q
100 200
6.3
10
16
25
50
100 200 500
0805
N
1.40
(0.055)
P
Q
1.52
1.80
(0.060)
(0.071)
EMBOSSED
J
J
J
J
J
J
M
M
M
M
P
P
K
K
K
K
M
M
M
M
P
P
P
X
X
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
Q
Q
Q
Q
N
P**
50
10
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
16 25 50 100 200 500
1206
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
PAPER and EMBOSSED available for 01005
NOTE: Contact factory for non-specified capacitance values
*EIA 01005
**Contact Factory for Specifications
041816
21
X7R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
1210
1812
1825
2220
2225
Soldering
Packaging
Reflow Only
Paper/Embossed
Reflow Only
All Embossed
Reflow Only
All Embossed
Reflow Only
All Embossed
Reflow Only
All Embossed
4.50 ± 0.30
(0.177 ± 0.012)
6.40 ± 0.40
(0.252 ± 0.016)
0.61 ± 0.36
(0.024 ± 0.014)
50
100
200
5.70 ± 0.40
(0.225 ± 0.016)
5.00 ± 0.40
(0.197 ± 0.016)
0.64 ± 0.39
(0.025 ± 0.015)
50
100
200
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
0.64 ± 0.39
(0.025 ± 0.015)
50
100
200
16
500
16
25
25
500
L
䉲
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
X
X
Z
Z
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
X
X
Z
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
P
P
Z
Z
Z
Z
Z
Z
10
16
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
X
X
Z
Z
Z
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
M
P
Q
Q
X
Z
Z
Z
Z
J
J
J
J
J
J
J
J
J
J
M
M
Z
Z
M
M
M
M
M
M
P
Q
Q
Q
Q
X
K
K
K
K
K
K
K
K
K
K
K
M
M
Z
Z
Z
Z
B
0.22
(0.009)
K
K
K
K
K
K
K
K
K
K
K
M
M
Z
Z
Z
Z
K
K
K
K
K
K
K
K
K
M
P
Q
X
Z
Z
Z
K
K
K
K
K
K
K
P
P
X
X
K
P
P
X
Z
Z
Z
Z
Z
Z
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
P
M
M
M
M
M
M
M
M
M
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Z
Z
W
T
t
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Z
Z
Z
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
100
200
500
50
P
P
P
P
P
P
P
P
P
P
P
P
P
X
X
P
P
P
P
P
P
P
X
X
X
X
X
X
Z
Z
100
200
Z
50
100
200
500
16
25
1210
A
0.33
(0.013)
500
䉲
SIZE
Letter
Max.
Thickness
200
䉲
10
䉲
Cap
(μF)
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
0.01
0.015
0.022
0.033
0.047
0.068
0.1
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
22
47
100
䉲
Cap
(pF)
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
0.61 ± 0.36
(0.024 ± 0.014)
50
100
200
䉲
(t) Terminal
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
25
50
100
䉲
(W) Width
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
101
151
221
331
471
681
102
152
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
155
225
335
475
106
226
476
107
WVDC
䉲
(L) Length
C
E
0.56
0.71
(0.022)
(0.028)
PAPER
50
100
200
500
50
1812
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
100
200
25
1825
M
1.27
(0.050)
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
50
2220
X
2.29
(0.090)
2225
Y
2.54
(0.100)
Z
2.79
(0.110)
NOTE: Contact factory for non-specified capacitance values
22
041816
X7S Dielectric
General Specifications
GENERAL DESCRIPTION
X7S formulations are called “temperature stable” ceramics and
fall into EIA Class II materials. Its temperature variation of
capacitance s within ±22% from –55°C to +125°C. This
capacitance change is non-linear.
Capacitance for X7S varies under the influence of electrical
operating conditions such as voltage and frequency.
X7S dielectric chip usage covers the broad spectrum of
industrial applications where known changes in capacitance due
to applied voltages are acceptable.
PART NUMBER (see page 2 for complete part number explanation)
1206
Z
Z
105
M
A
T
2
A
Size
(L" x W")
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
1 = 100V
2 = 200V
Dielectric
Z = X7S
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
Capacitance
Tolerance
K = ±10%
M = ±20%
Failure
Rate
A = N/A
Terminations
T = Plated Ni
and Sn
Packaging
2 = 7" Reel
4 = 13" Reel
Special
Code
A = Std.
Product
NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.
X7S Dielectric
Typical Temperature Coefficient
⌬ Capacitance vs. Frequency
10
+30
+20
% ⌬ Capacitance
% Cap Change
5
0
-5
-10
-15
-20
-25
-60 -40 -20
+10
0
-10
-20
-30
1KHz
0 20 40 60 80 100 120 140
Temperature (°C)
10 KHz
100 KHz
1 MHz
10 MHz
Insulation Resistance (Ohm-Farads)
TYPICAL ELECTRICAL CHARACTERISTICS
Insulation Resistance vs Temperature
10,000
1,000
100
0
0
20
40
Variation of Impedance with Cap Value
Impedance vs. Frequency
1,000 pF vs. 10,000 pF - X7S
0805
10
Impedance, ⍀
Impedance, ⍀
10,000 pF
1.00
0.10
0.01
10
100
Frequency, MHz
090215
1000
1.0
0.1
1
10
120
1206
0805
1210
1.0
0.1
.01
.01
100
10
Impedance, ⍀
1206
0805
1210
1,000 pF
80
Variation of Impedance with Chip Size
Impedance vs. Frequency
100,000 pF - X7S
Variation of Impedance with Chip Size
Impedance vs. Frequency
10,000 pF - X7S
10.00
60
Temperature °C
Frequency
100
Frequency, MHz
1,000
1
10
100
1,000
Frequency, MHz
23
X7S Dielectric
Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
Insulation Resistance
X7S Specification Limits
-55ºC to +125ºC
Within specified tolerance
≤ 5.0% for ≥ 100V DC rating
≤ 5.0% for ≥ 25V DC rating
≤ 10.0% for ≥ 10V DC rating
≤ 10.0% for ≤ 10V DC rating
100,000MΩ or 1000MΩ - μF,
whichever is less
Dielectric Strength
No breakdown or visual defects
Dissipation Factor
Resistance to
Flexure
Stresses
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Solderability
Resistance to
Solder Heat
Thermal
Shock
Load Life
Load
Humidity
24
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
No defects
≤ ±12%
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 kHz ± 10%
Voltage: 1.0Vrms ± .2V
For Cap > 10 μF, 0.5Vrms @ 120Hz
Charge device with rated voltage for
120 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
Meets Initial Values (As Above)
≥ Initial Value x 0.3
≥ 95% of each terminal should be covered
with fresh solder
No defects, <25% leaching of either end terminal
90 mm
Dip device in eutectic solder at 230 ± 5ºC
for 5.0 ± 0.5 seconds
≤ ±7.5%
Meets Initial Values (As Above)
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24 ± 2
hours before measuring electrical properties.
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
Step 1: -55ºC ± 2º
30 ± 3 minutes
≤ ±7.5%
Step 2: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Step 3: +125ºC ± 2º
30 ± 3 minutes
Meets Initial Values (As Above)
Step 4: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Repeat for 5 cycles and measure after
24 ± 2 hours at room temperature
No visual defects
≤ ±12.5%
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
No visual defects
≤ ±12.5%
Charge device with 1.5 rated voltage (≤ 10V) in
test chamber set at 125ºC ± 2ºC
for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
Meets Initial Values (As Above)
090215
X7S Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
0402
0603
0805
1206
1210
Reflow/Wave
All Paper
Reflow/Wave
All Paper
Reflow/Wave
Paper/Embossed
Reflow/Wave
Paper/Embossed
Reflow Only
Paper/Embossed
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
6.3
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.014 ± 0.006)
6.3
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
4
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
10
50
100
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
6.3
Cap
(pF)
A
0.33
(0.013)
䉲
Letter
Max.
Thickness
L
W
䉲
䉲
SIZE
䉲
Cap
(μF
䉲
(t) Terminal
T
䉲
(W) Width
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
0.010
0.015
0.022
0.033
0.047
0.068
0.10
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
22
47
100
WVDC
䉲
(L) Length
䉲
SIZE
Soldering
Packaging
t
C
C
C
C
G
G
G
G
N
N
N
N
Q
Q*
Z
6.3
6.3
4
0402
0603
0805
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
10
50
100
1206
M
1.27
(0.050)
N
1.40
(0.055)
6.3
1210
P
Q
1.52
1.90
(0.060)
(0.075)
EMBOSSED
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
*Contact Factory for Specifications
090215
25
X5R Dielectric
General Specifications
GENERAL DESCRIPTION
• General Purpose Dielectric for Ceramic Capacitors
• EIA Class II Dielectric
• Temperature variation of capacitance is within ±15%
from -55°C to +85°C
• Well suited for decoupling and filtering applications
• Available in High Capacitance values (up to 100μF)
PART NUMBER (see page 2 for complete part number explanation)
1210
4
D
107
M
A
T
2
A
Size
(L" x W")
0101**
0201
0402
0603
0805
1206
1210
1812
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
D = 35V
5 = 50V
1 = 100V
Dielectric
D = X5R
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
Capacitance
Tolerance
K = ±10%
M = ±20%
Failure
Rate
A = N/A
Terminations
T = Plated Ni
and Sn
Packaging
2 = 7" Reel
4 = 13" Reel
U = 4mm TR
(01005)
Special
Code
A = Std.
**EIA 01005
NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.
Contact factory for non-specified capacitance values.
Temperature Coefficient
20
% ⌬ Capacitance
15
10
5
0
-5
-10
-15
-20
-60
-40
-20
0
+20
+40
Temperature °C
26
+60
+80
Insulation Resistance (Ohm-Farads)
TYPICAL ELECTRICAL CHARACTERISTICS
Insulation Resistance vs Temperature
10,000
1,000
100
0
0
20
40
60
80
100
120
Temperature °C
041816
X5R Dielectric
Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
Insulation Resistance
X5R Specification Limits
-55ºC to +85ºC
Within specified tolerance
≤ 2.5% for ≥ 50V DC rating
≤ 3.0% for 25V, 35V DC rating
≤ 12.5% Max. for 16V DC rating and lower
Contact Factory for DF by PN
10,000MΩ or 500MΩ - μF,
whichever is less
Dielectric Strength
No breakdown or visual defects
Dissipation Factor
Resistance to
Flexure
Stresses
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Solderability
Resistance to
Solder Heat
Thermal
Shock
Load Life
Load
Humidity
041816
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
No defects
≤ ±12%
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 kHz ± 10%
Voltage: 1.0Vrms ± .2V
For Cap > 10 μF, 0.5Vrms @ 120Hz
Charge device with rated voltage for
120 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
Meets Initial Values (As Above)
≥ Initial Value x 0.3
≥ 95% of each terminal should be covered
with fresh solder
No defects, <25% leaching of either end terminal
90 mm
Dip device in eutectic solder at 230 ± 5ºC
for 5.0 ± 0.5 seconds
≤ ±7.5%
Meets Initial Values (As Above)
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24 ± 2
hours before measuring electrical properties.
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
Step 1: -55ºC ± 2º
30 ± 3 minutes
≤ ±7.5%
Step 2: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Step 3: +85ºC ± 2º
30 ± 3 minutes
Step 4: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
≤ ±12.5%
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Meets Initial Values (As Above)
No visual defects
≤ ±12.5%
Repeat for 5 cycles and measure after
24 ± 2 hours at room temperature
Charge device with 1.5X rated voltage in
test chamber set at 85ºC ± 2ºC for 1000 hours
(+48, -0). Note: Contact factory for *optional
specification part numbers that are tested at
< 1.5X rated voltage.
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
Meets Initial Values (As Above)
27
X5R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
Case Size
Soldering
Packaging
(L) Length
(W) Width
(t) Terminal
Voltage:
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
Cap (μF)
0.01
0.015
0.022
0.033
0.047
0.068
0.1
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
22
47
100
Voltage:
Cap (pF)
0101*
Reflow Only
Paper/Embossed
0201
Reflow Only
All Paper
0402
Reflow/Wave
All Paper
0603
Reflow/Wave
All Paper
0805
Reflow/Wave
Paper/Embossed
0.40 ± 0.02
(0.016 ± 0.0008)
0.20 ± 0.02
(0.008 ± 0.0008
0.10 ± 0.04
(0.004 ± 0.0016)
6.3
16
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
B
0.60 ± 0.09
(0.024 ± 0.004)
0.30 ± 0.09
(0.011 ± 0.004)
0.15 ± 0.05
(0.006 ± 0.002)
6.3
10
16
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006
10
16
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.014 ± 0.006)
10
16
25
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
10
16
25
mm
(in.)
mm
(in.)
mm
(in.)
101
151
221
331
471
681
102
152
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
155
225
335
475
106
226
476
107
6.3
Case Size
Letter
Max.
Thickness
B
16
4
A
A
A
A
A
B
0.22
(0.009)
4
6.3
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
A
A
A
A
A
A
A
A
F
F
F
F
F
F
4
6.3
10
F
16
25
E
E
E
E
E
4
6.3
10
0201
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
25
50
4
6.3
35
50
G
G
G
G
G
G
G
G
G
G
J
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
G
4
6.3
35
50
C
C
C
C
C
C
C
C
A
0101*
A
0.33
(0.013)
A
A
A
A
A
A
A
25
A
A
A
A
A
A
A
A
A
A
A
A
A
C
C
C
C
C
C
C
C
E
E
16
25
50
G
G
G
G
J
J
K
K
G
J
J
J
K
J
J
J
J
K
4
6.3
10
0402
F
0.40
(0.016)
G
0.90
(0.035)
J
0.94
(0.037)
G
G
G
G
G
J
G
G
J
G
J
16
25
35
50
N
P
P
P
P
4
N
N
N
P
P
N
N
P
P
P
6.3
10
0603
K
1.02
(0.040)
M
1.27
(0.050)
N
P
1.40
1.52
(0.055)
(0.060)
EMBOSSED
PAPER and EMBOSSED available for 01005
N
N
N
N
N
N
N
N
N
P
P
N
N
N
N
N
N
N
N
P
P
N
N
P
P
N
P
P
N
P
P
P
P
16
25
35
50
0805
Q
1.78
(0.070)
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
NOTE: Contact factory for non-specified capacitance values
*EIA 01005
28
041816
X5R Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
Case Size
Soldering
Packaging
(L) Length
(W) Width
(t) Terminal
Voltage:
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
Cap (μF)
0.01
0.015
0.022
0.033
0.047
0.068
0.1
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
22
47
100
Voltage
Cap (pF)
mm
(in.)
mm
(in.)
mm
(in.)
4
101
151
221
331
471
681
102
152
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
155
225
335
475
106
226
476
107
X
X
X
X
X
4
6.3
Q
X
X
X
X
X
6.3
10
1210
Reflow Only
Paper/Embossed
1812
Reflow Only
All Embossed
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
16
25
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
10
16
25
4.50 ± 0.30
(0.177 ± 0.012
3.20 ± 0.20
(0.126 ± 0.008
0.61 ± 0.36
(0.024 ± 0.014)
10
16
25
35
50
100
4
6.3
X
X
Q
Q
Q
Q
X
X
X
X
Z
Z
Z
Z
Z
Z
Z
25
Z
Z
Z
Z
35
50
Q
Q
Q
Q
Q
X
X
X
X
X
X
X
X
X
X
X
10
16
25
35
B
0.22
(0.009)
50
Q
50
100
Z
Z
Z
4
X
Z
Z
Z
6.3
1206
A
0.33
(0.013)
35
Q
Q
Q
X
X
X
X
Case Size
Letter
Max.
Thickness
1206
Reflow/Wave
Paper/Embossed
C
0.56
(0.022)
PAPER
Q
X
Z
Z
Z
10
Q
Z
Z
Z
Z
16
4
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
35
50
35
50
Z
4
1210
E
0.71
(0.028)
6.3
6.3
10
16
25
1812
M
1.27
(0.050)
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
NOTE: Contact factory for non-specified capacitance values
*EIA 01005
041816
29
Y5V Dielectric
General Specifications
Y5V formulations are for general-purpose use in a limited
temperature range. They have a wide temperature
characteristic of +22% –82% capacitance change over the
operating temperature range of –30°C to +85°C.
These characteristics make Y5V ideal for decoupling
applications within limited temperature range.
PART NUMBER (see page 2 for complete part number explanation)
3
G
104
Z
A
T
2
A
Size
(L" x W")
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
Dielectric
Y5V = G
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
Capacitance
Tolerance
Z = +80 –20%
Failure
Rate
A = Not
Applicable
Terminations
T = Plated Ni
and Sn
Packaging
2 = 7" Reel
4 = 13" Reel
Special
Code
A = Std.
Product
Capacitance Change
vs. DC Bias Voltage
+20
+10
0
-10
-20
-30
-40
-50
-60
-70
-80
+40
+20
⌬ c/c (%)
0
-20
-40
-60
-80
-55
-35 -15
-100
0
+5 +25 +45 +65 +85 +105 +125
Temperature °C
10,000
0.1 ␮F - 0603
Impedance vs. Frequency
1,000
|Z| (Ohms)
|Z| (Ohms)
60
80
100
100
0
10
1
0.22 ␮F - 0805
Impedance vs. Frequency
1,000,000
Frequency (Hz)
10,000,000
10
1
0.01
10,000
+30
+40
+50
+60
+70
+80
+90
1,000
1 ␮F - 1206
Impedance vs. Frequency
100
10
1
0.1
0.1
100,000
+20
Temperature °C
100
100
0.1
30
40
1,000
% DC Bias Voltage
1,000
0.01
10,000
20
Insulation Resistance vs. Tempera
10,000
|Z| (Ohms)
% ⌬ Capacitance
Temperature Coefficient
Insulation Resistance (Ohm-Farads)
0805
100,000
1,000,000
Frequency (Hz)
10,000,000
0.01
10,000
100,000
1,000,000
10,000,000
Frequency (Hz)
041816
Y5V Dielectric
Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
Insulation Resistance
Y5V Specification Limits
-30ºC to +85ºC
Within specified tolerance
≤ 5.0% for ≥ 50V DC rating
≤ 7.0% for 25V DC rating
≤ 9.0% for 16V DC rating
≤ 12.5% for ≤ 10V DC rating
10,000MΩ or 500MΩ - μF,
whichever is less
Dielectric Strength
No breakdown or visual defects
Dissipation Factor
Resistance to
Flexure
Stresses
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Solderability
Resistance to
Solder Heat
Thermal
Shock
Load Life
Load
Humidity
041816
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
No defects
≤ ±30%
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 kHz ± 10%
Voltage: 1.0Vrms ± .2V
For Cap > 10 μF, 0.5Vrms @ 120Hz
Charge device with rated voltage for
120 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
Meets Initial Values (As Above)
≥ Initial Value x 0.1
≥ 95% of each terminal should be covered
with fresh solder
No defects, <25% leaching of either end terminal
90 mm
Dip device in eutectic solder at 230 ± 5ºC
for 5.0 ± 0.5 seconds
≤ ±20%
Meets Initial Values (As Above)
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24 ± 2
hours before measuring electrical properties.
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
Step 1: -30ºC ± 2º
30 ± 3 minutes
≤ ±20%
Step 2: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Step 3: +85ºC ± 2º
30 ± 3 minutes
Meets Initial Values (As Above)
Step 4: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Repeat for 5 cycles and measure after
24 ±2 hours at room temperature
No visual defects
≤ ±30%
≤ Initial Value x 1.5 (See Above)
≥ Initial Value x 0.1 (See Above)
Meets Initial Values (As Above)
No visual defects
≤ ±30%
Charge device with twice rated voltage in
test chamber set at 85ºC ± 2ºC
for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
≤ Initial Value x 1.5 (See above)
≥ Initial Value x 0.1 (See Above)
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
Meets Initial Values (As Above)
31
Y5V Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
0201
0402
0603
0805
1206
1210
Soldering
Packaging
Reflow Only
All Paper
Reflow/Wave
All Paper
Reflow/Wave
All Paper
Reflow/Wave
Paper/Embossed
Reflow/Wave
Paper/Embossed
Reflow Only
Paper/Embossed
0.60 ± 0.09
(0.024 ± 0.004)
0.30 ± 0.09
(0.011 ± 0.004)
0.15 ± 0.05
(0.006 ± 0.002)
6.3
10
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
10
16
25
1.60 ± 0.15
(0.063 ± 0.006)
.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.014 ± 0.006)
16
25
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
16
25
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
.50 ± 0.25
(0.020 ± 0.010)
16
25
Cap
(μF)
50
50
A
A
A
A
A
C
C
C
G
C
C
G
K
C
G
C
J
G
G
G
G
J
N
N
N
N
N
N
P
N
N
N
Q
32
M
M
M
Q
P
Q
K
Q
X
Q
6.3
10
6
0201
A
0.33
(0.013)
W
L
50
T
t
G
22.0
47.0
Letter
Max.
Thickness
10
䉲
2.2
4.7
10.0
WVDC
50
A
A
0.33
0.47
1.0
SIZE
10
䉲
10
䉲
0.047
0.10
0.22
50
䉲
4700
0.010
0.022
6
䉲
Cap
(pF)
䉲
(t) Terminal
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
10
16
25
䉲
(W) Width
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
820
1000
2200
䉲
(L) Length
C
0.56
(0.022)
10
16
25
50
10
0402
E
0.71
(0.028)
PAPER
G
0.90
(0.035)
16
25
50
0603
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
10
16
25
50
10
0805
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
16
25
50
N
X
N
Q
X
Z
10
16
1206
X
2.29
(0.090)
Y
2.54
(0.100)
N
Q
25
50
1210
Z
2.79
(0.110)
041816
MLCC Gold Termination – AU Series
General Specifications
AVX Corporation will support those customers for
commercial and military Multilayer Ceramic Capacitors with
a termination consisting of Gold. This termination is
indicated by the use of a “7” or “G” in the 12th position of
the AVX Catalog Part Number. This fulfills AVX’s
commitment to providing a full range of products to our
customers. Please contact the factory if you require
additional information on our MLCC Gold Termination.
PART NUMBER
AU03
Size
AU01 - 0201
AU02 - 0402
AU03 - 0603
AU05 - 0805
AU06 - 1206
AU10 - 1210
AU12 - 1812
AU13 - 1825
AU14 - 2225
AU16 - 0306
AU17 - 0508
AU18 - 0612
Y
C
Dielectric
Voltage
6.3V = 6 C0G (NP0) = A
X7R = C
10V = Z
X5R = D
16V = Y
25V = 3
35V = D
50V = 5
100V = 1
200V = 2
500V = 7
104
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
K
B
C
D
F
G
J
K
M
=
=
=
=
=
=
=
=
Capacitance
Tolerance
±.10 pF (<10pF)
±.25 pF (<10pF)
±.50 pF (<10pF)
±1% (≥ 10 pF)
±2% (≥ 10 pF)
±5%
±10%
±20%
A
7
2
A
Failure
Rate
A = Not
Applicable
Terminations
G* = 1.9 μ" to
7.87 μ"
Packaging
2 = 7" Reel
4 = 13" Reel
U = 4mm TR
(01005)
Special
Code
A = Std.
Product
7 = 100 μ"
minimum
Contact
Factory
For
Multiples*
* Contact factory for availability.
041416
33
MLCC Gold Termination – AU Series
Capacitance Range (NP0 Dielectric)
PREFERRED SIZES ARE SHADED
SIZE
AU01
AU02
AU03
AU05
AU06
Soldering
Reflow/Epoxy/
Wire Bond*
All Paper
Reflow/Epoxy/
Wire Bond*
All Paper
Reflow/Epoxy/
Wire Bond
All Paper
Reflow/Epoxy/
Wire Bond
Paper/Embossed
Reflow/Epoxy/
Wire Bond
Paper/Embossed
Cap
(pF)
Cap
(μF)
䉲
䉲
L
W
16
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
䉲
䉲
SIZE
16
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.014 ± 0.006)
25
50
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
100
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
16
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
100
16
25
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
50
100
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
16
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
200
16
25
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
50
100
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
P
M
P
M
P
M
P
M
P
M
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
Q
Q
Q
500
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
P
200
500
䉲
Terminal
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
25
50
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
䉲
(t)
0.60 ± 0.09
(0.024 ± 0.004
0.30 ± 0.09
(0.011 ± 0.004)
0.15 ± 0.05
(0.006 ± 0.002)
16
25
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
T
䉲
(W) Width
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
0.5
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
WVDC
䉲
Packaging
(L) Length
16
25
16
AU01
t
25
50
16
AU02
25
50
AU03
50
100
AU05
50
100
AU06
* Contact factory
Letter
Max.
Thickness
34
A
0.33
(0.013)
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
041416
MLCC Gold Termination – AU Series
Capacitance Range (NP0 Dielectric)
PREFERRED SIZES ARE SHADED
AU10
AU12
AU13
AU14
Reflow/Epoxy/
Wire Bond*
Paper/Embossed
Reflow/Epoxy/
Wire Bond*
All Embossed
Reflow/Epoxy/
Wire Bond*
All Embossed
Reflow/Epoxy/
Wire Bond*
All Embossed
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
50
100
200
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
0.61 ± 0.36
(0.024 ± 0.014)
50
100
200
4.50 ± 0.30
(0.177 ± 0.012)
6.40 ± 0.40
(0.252 ± 0.016)
0.61 ± 0.36
(0.024 ± 0.014)
100
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
0.64 ± 0.39
(0.025 ± 0.015)
100
Packaging
Terminal
Cap
(pF)
500
50
200
50
䉲
L
䉲
041416
A
0.33
(0.013)
25
200
W
䉲
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
25
50
SIZE
* Contact factory
Letter
Max.
Thickness
500
䉲
Cap
(μF)
25
䉲
(t)
T
䉲
(W) Width
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
0.5
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
WVDC
䉲
(L) Length
䉲
SIZE
Soldering
J
J
J
J
J
J
J
J
J
J
M
M
J
J
J
J
M
M
M
Q
Q
100
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
M
500
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
25
50
AU10
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
K
K
K
K
K
K
K
K
K
M
M
M
M
K
K
K
K
K
P
P
P
P
P
X
M
M
M
M
P
Q
Q
Q
Q
X
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
P
P
P
P
P
100
200
500
50
AU12
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
100
200
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
P
P
P
P
Q
Q
50
AU13
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
t
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
Y
Y
P
P
P
P
P
P
P
P
P
P
P
P
P
P
Y
Y
Y
Y
100
200
AU14
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
35
MLCC Gold Termination – AU Series
Capacitance Range (X7R Dielectric)
PREFERRED SIZES ARE SHADED
SIZE
AU02
AU03
AU05
AU06
Soldering
Reflow/Epoxy
Wire Bond*
All Paper
Reflow/Epoxy
Wire Bond*
All Paper
Reflow/Epoxy
Wire Bond*
Paper/Embossed
Reflow/Epoxy
Wire Bond*
Paper/Embossed
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
16
25
50
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.014 ± 0.006)
16
25
50
10
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
16
25
50
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
Packaging
(L) Length
(W) Width
(t)
Terminal
Cap
(pF)
Cap
(μF
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
0.010
0.015
0.022
0.033
0.047
0.068
0.10
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
22
47
100
WVDC
SIZE
C
C
C
C
C
C
C
C
6.3
10
C
C
C
C
C
C
C
C
C
C*
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
100
200
G
G
G
G
G
G
G
G
G
G
G
G
G
G
6.3
J*
J*
J*
J*
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N*
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
100
200
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
N
6.3
P*
P*
P*
P*
10
16
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
25 50
100
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
P
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
Q
Q
Q
Q
Q*
Q*
Q*
Q*
Q*
10
16
25
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
P
P
Q
Q
J
J
J
J
J
J
J
J
J
J
J
M
Q
Q
Q
Q
Q
Q
J
J
J
J
J
J
M
M
M
M
P
P
50
100
200
500
K
K
K
K
M
M
M
M
P
P
Q*
16
25
50
6.3
10
16
AU02
25
50
100
200
6.3
10
AU03
16
25
50
100
200
6.3
AU05
500
AU06
* Contact factory
Letter
Max.
Thickness
36
A
0.33
(0.013)
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
041416
MLCC Gold Termination – AU Series
Capacitance Range (X7R Dielectric)
PREFERRED SIZES ARE SHADED
AU10
AU12
Reflow/Epoxy/
Wire Bond*
Paper/Embossed
Reflow/Epoxy/
Wire Bond*
All Embossed
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
25
50
100
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
0.61 ± 0.36
(0.024 ± 0.014)
100
200
Packaging
16
200
500
50
500
䉲
W
L
䉲
䉲
Cap
(μF
10
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
0.64 ± 0.39
(0.025 ± 0.015)
50
100
䉲
Cap
(pF)
䉲
(t) Terminal
4.50 ± 0.30
(0.177 ± 0.012)
6.40 ± 0.40
(0.252 ± 0.016)
0.61 ± 0.36
(0.024 ± 0.014)
50
100
T
䉲
(W) Width
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
0.010
0.015
0.022
0.033
0.047
0.068
0.10
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
22
47
100
WVDC
AU14
䉲
(L) Length
AU13
Reflow/Epoxy/ Reflow/Epoxy/
Wire Bond*
Wire Bond*
All Embossed All Embossed
䉲
SIZE
Soldering
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
X
X
X
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
X
X
X
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
P
P
Z
Z
Z
Z
Z
10
16
25
SIZE
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
X
X
Z
Z
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
M
P
Q
Q
X
Z
Z
Z
J
J
J
J
J
J
J
J
J
J
M
M
Z
Z
M
M
M
M
M
M
P
Q
Q
50
100
200
500
K
K
K
K
K
K
K
K
K
K
K
M
M
Z
Z
Z
Z
K
K
K
K
K
K
K
K
K
M
P
Q
X
Z
Z
50
100
AU10
K
K
K
K
K
K
K
P
P
X
K
P
P
X
Z
Z
Z
M
M
M
M
M
M
M
M
M
M
M
M
M
M
200
500
50
AU12
t
M
M
M
M
M
M
M
M
M
M
M
P
P
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
100
50
AU13
P
P
P
P
P
P
P
P
P
P
P
P
P
X
100
AU14
* Contact factory
Letter
Max.
Thickness
041416
A
0.33
(0.013)
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
37
MLCC Gold Termination – AU Series
Capacitance Range (X5R Dielectric)
PREFERRED SIZES ARE SHADED
SIZE
AU01
AU02
AU03
AU05
AU06
AU10
Soldering
Reflow/Epoxy/
Wire Bond*
All Paper
Reflow/Epoxy/
Wire Bond*
All Paper
Reflow/Epoxy/
Wire Bond*
All Paper
Reflow/Epoxy/
Wire Bond*
Paper/Embossed
Reflow/Epoxy/
Wire Bond*
Paper/Embossed
Reflow/Epoxy/
Wire Bond*
Paper/Embossed
A
A
A
A
A
A
C
330
470
680
A
A
A
A
A
A
A
A
A
A
A
A
C
C
C
1000
1500
2200
A
A
A
A
A
A
A
A
A
A
C
C
C
3300
4700
6800
A
A
A
A
A
A
0.010
0.015
0.022
A
A
A
A
0.033
0.047
0.068
A
A
0.10
0.15
0.22
A
SIZE
C
C
C
C
C
C
C
C
C
C
G
G
G
G
G
G
G
G
G
G
G
G
C*
G
G
C* C*
G
G
G
G
J*
G
C*
6.3 10 16 25
T
t
G
G
3.3
4.7
10
22
47
100
WVDC
W
6.3 10 25 50
C
C
1.0
1.5
2.2
L
䉲
C
C
C
0.33
0.47
0.68
4
䉲
A
A
A
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
6.3 10 16 25 35 50
䉲
A
A
A
2.01 ± 0.20
3.20 ± 0.20
(0.079 ± 0.008)
(0.126 ± 0.008)
1.25 ± 0.20
1.60 ± 0.20
(0.049 ± 0.008)
(0.063 ± 0.008)
0.50 ± 0.25
0.50 ± 0.25
(0.020 ± 0.010)
(0.020 ± 0.010)
10 16 25 35 50 6.3 10 16 25 35 50
䉲
Cap
(μF)
4
100
150
220
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.014 ± 0.006)
4 6.3 10 16 25 35 50 6.3
䉲
Cap
(pF)
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
6.3 10 16 25 50
䉲
(t) Terminal
0.60 ± 0.09
(0.024 ± 0.004)
0.30 ± 0.09
(0.011 ± 0.004)
0.15 ± 0.05
(0.006 ± 0.002)
6.3 10 16 25
䉲
(W) Width
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
䉲
Packaging
(L) Length
AU12
4
6.3 10
AU01
16
25 50
G
G* G* J*
J*
J* J* J*
J* J* J*
K*
J*
4 6.3 10
AU02
G
G
G
N
G
G
G
N
N
N
G
N
N
N
N
N
N
Q
N
N
N
N
N
N
N
N
N
N
N
N
P*
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q*
N N
N N N* N*
P* P* P*
Q
Q
Q
P*
Q* Q* Q*
Q*
16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50
AU03
AU05
X
X
Z Z
Z*
Z* Z*
4 6.3 10
AU06
X
X
Z
X
Q
Z
Z
Z
Z
Z
16 25
AU10
X
Z
35 50
6.3 10 25 50
AU12
* Contact factory
Letter
Max.
Thickness
A
0.33
(0.013)
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
= *Optional Specifications – Contact factory
NOTE: Contact factory for non-specified capacitance values
38
041416
MLCC Gold Termination – AU Series
AU16/AU17/AU18
SIZE
Packaging
mm
(in.)
mm
(in.)
Length
Width
Cap Code
WVDC
AU16
(0306)
AU17
(0508)
AU18
(0612)
Embossed
Embossed
Embossed
0.81 ± 0.15
(0.032 ± 0.006)
1.60 ± 0.15
(0.063 ± 0.006)
1.27 ± 0.25
(0.050 ± 0.010)
2.00 ± 0.25
(0.080 ± 0.010)
1.60 ± 0.25
(0.063 ± 0.010)
3.20 ± 0.25
(0.126 ± 0.010)
4 6.3 10 16
PHYSICAL DIMENSIONS AND
PAD LAYOUT
25 6.3 10
16
25
50 6.3 10 16
25
50
102
Cap 0.001
A
A
A
A
S
S
S
S
V
S
S
S
S
V
222
(μF) 0.0022
A
A
A
A
S
S
S
S
V
S
S
S
S
V
332
0.0033
A
A
A
A
S
S
S
S
V
S
S
S
S
V
472
0.0047
A
A
A
A
S
S
S
S
V
S
S
S
S
V
682
0.0068
A
A
A
A
S
S
S
S
V
S
S
S
S
V
103
0.01
A
A
A
A
S
S
S
S
V
S
S
S
S
V
153
0.015
A
A
A
A
S
S
S
S
V
S
S
S
S
W
223
0.022
A
A
A
A
S
S
S
S
V
S
S
S
S
W
333
0.033
A
A
A
S
S
S
V
V
S
S
S
S
W
473
0.047
A
A
A
S
S
S
V
A
S
S
S
S
W
683
0.068
A
A
A
S
S
S
A
A
S
S
S
V
W
104
0.1
A
A
A
S
S
V
A
A
S
S
S
V
W
154
0.15
A
A
S
S
V
S
S
S
W
W
224
0.22
A
A
S
S
A
S
S
V
W
334
0.33
V
V
A
S
S
V
474
0.47
V
V
A
S
S
V
684
0.68
A
A
V
V
W
A
A
A
105
1
155
1.5
225
335
475
4.7
685
6.8
106
10
A
V
V
W
W
2.2
A
A
3.3
A
A
Solid = X7R
= X5R
mm (in.)
= X7S
mm (in.)
mm (in.)
AU16
(0306)
AU17
(0508)
AU18
(0612)
Code Thickness
Code Thickness
Code Thickness
A
0.56 (0.022)
S
0.56 (0.022)
S
V
0.76 (0.030)
V
0.76 (0.030)
A
1.02 (0.040)
W
1.02 (0.040)
A
1.27 (0.050)
t
W
T
L
PHYSICAL DIMENSIONS
AU16
(0306)
AU17
(0508)
AU18
(0612)
mm (in)
L
W
t
0.81 ± 0.15
(0.032 ± 0.006)
1.27 ± 0.25
(0.050 ± 0.010)
1.60 ± 0.25
(0.063 ± 0.010)
1.60 ± 0.15
(0.063 ± 0.006)
2.00 ± 0.25
(0.080 ± 0.010)
3.20 ± 0.25
(0.126 ± 0.010)
0.13 min.
(0.005 min.)
0.13 min.
(0.005 min.)
0.13 min.
(0.005 min.)
T - See Range Chart for Thickness and Codes
PAD LAYOUT DIMENSIONS
AU16
(0306)
AU17
(0508)
AU18
(0612)
mm (in)
C
A
B
0.31 (0.012)
1.52 (0.060)
0.51 (0.020)
0.51 (0.020)
2.03 (0.080)
0.51 (0.020)
0.76 (0.030)
3.05 (0.120)
0.635 (0.025)
0.56 (0.022)
“B”
C
041416
“A”
C
39
MLCC Tin/Lead Termination “B”
General Specifications
AVX Corporation will support those customers for
commercial and military Multilayer Ceramic Capacitors with
a termination consisting of 5% minimum lead. This
termination is indicated by the use of a “B” in the 12th
position of the AVX Catalog Part Number. This fulfills AVX’s
commitment to providing a full range of products to our
customers. AVX has provided in the following pages a full
range of values that we are currently offering in this special
“B” termination. Please contact the factory if you require
additional information on our MLCC Tin/Lead Termination
“B” products.
Not RoHS Compliant
PART NUMBER (see page 2 for complete part number explanation)
LD05
5
A
101
Size
LD02 - 0402
LD03 - 0603
LD04 - 0504*
LD05 - 0805
LD06 - 1206
LD10 - 1210
LD12 - 1812
LD13 - 1825
LD14 - 2225
LD20 - 2220
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
35V = D
50V = 5
100V = 1
200V = 2
500V = 7
Dielectric
C0G (NP0) = A
X7R = C
X5R = D
X8R = F
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
J
B
C
D
F
G
J
K
M
A
B
2
Capacitance
Failure
Terminations
Packaging
Tolerance
Rate
2 = 7" Reel
B = 5% min lead
= ±.10 pF (<10pF) A = Not X = FLEXITERM® 4 = 13" Reel
= ±.25 pF (<10pF) Applicable
with 5% min
= ±.50 pF (<10pF)
Contact Factory
lead**
= ±1% (≥ 10 pF)
For
= ±2% (≥ 10 pF)
Multiples
**X7R only
= ±5%
= ±10%
= ±20%
A
Special
Code
A = Std.
Product
*LD04 has the same CV ranges as LD03.
NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.
Contact factory for non-specified capacitance values.
NP0
X7R
X7S
X5R
Y5V
40
See FLEXITERM® section
for CV options
Refer to page 4 for Electrical Graphs
Refer to page 19 for Electrical Graphs
Refer to page 23 for Electrical Graphs
Refer to page 26 for Electrical Graphs
Refer to page 30 for Electrical Graphs
REV 01
MLCC Tin/Lead Termination “B”
Capacitance Range (NP0 Dielectric)
PREFERRED SIZES ARE SHADED
SIZE
LD02
LD03
LD05
LD06
Soldering
Packaging
Reflow/Wave
All Paper
Reflow/Wave
All Paper
Reflow/Wave
Paper/Embossed
Reflow/Wave
Paper/Embossed
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
16
25
50
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.014 ± 0.006)
25
50
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
Cap
(μF)
䉲
REV 01
A
0.33
(0.013)
L
W
䉲
䉲
Letter
Max.
Thickness
䉲
SIZE
16
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
100
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
16
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
100
16
25
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
16
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
200
16
25
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
50
100
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
P
M
P
M
P
M
P
M
P
M
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
Q
Q
Q
500
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
P
200
500
䉲
Cap
(pF)
䉲
(t) Terminal
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
50
100
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
T
䉲
(W) Width
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
0.5
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
WVDC
䉲
(L) Length
16
25
50
t
16
LD02
C
0.56
(0.022)
25
50
LD03
E
0.71
(0.028)
PAPER
G
0.90
(0.035)
J
0.94
(0.037)
50
100
LD05
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
50
100
LD06
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
41
MLCC Tin/Lead Termination “B”
Capacitance Range (NP0 Dielectric)
PREFERRED SIZES ARE SHADED
LD10
LD12
LD13
LD14
Reflow Only
Paper/Embossed
Reflow Only
All Embossed
Reflow Only
All Embossed
Reflow Only
All Embossed
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
50
100
200
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
0.61 ± 0.36
(0.024 ± 0.014)
50
100
200
4.50 ± 0.30
(0.177 ± 0.012)
6.40 ± 0.40
(0.252 ± 0.016)
0.61 ± 0.36
(0.024 ± 0.014)
100
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
0.64 ± 0.39
(0.025 ± 0.015)
100
Cap
(pF)
50
200
50
䉲
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
25
50
J
J
J
J
J
J
J
J
J
J
M
M
J
J
J
J
M
M
M
Q
Q
100
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
M
500
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
M
M
M
M
M
M
M
M
25
50
LD10
A
0.33
(0.013)
500
L
䉲
42
25
200
W
䉲
SIZE
Letter
Max.
Thickness
500
䉲
Cap
(μF)
25
䉲
(t) Terminal
T
䉲
(W) Width
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
0.5
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
WVDC
䉲
(L) Length
䉲
SIZE
Soldering
Packaging
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
K
K
K
K
K
K
K
K
K
M
M
M
M
K
K
K
K
K
P
P
P
P
P
X
M
M
M
M
P
Q
Q
Q
Q
X
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
P
P
P
P
P
100
200
500
50
LD12
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
100
200
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
P
P
P
P
Q
Q
50
LD13
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
t
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
Y
Y
P
P
P
P
P
P
P
P
P
P
P
P
P
P
Y
Y
Y
Y
100
200
LD14
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
REV 01
MLCC Tin/Lead Termination “B”
Capacitance Range (X8R Dielectric)
SIZE
271
331
471
681
102
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
684
824
105
Cap
(pF)
Cap
(μF)
LD03
25V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
WVDC
270
330
470
680
1000
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.01
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.1
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.68
0.82
1
WVDC
25V
SIZE
Letter
Max.
Thickness
REV 01
A
0.33
(0.013)
LD05
25V
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
50V
25V
LD03
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
G
0.90
(0.035)
J
0.94
(0.037)
LD06
50V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
50V
25V
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
M
M
M
M
M
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
M
M
M
25V
LD05
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
50V
LD06
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
43
MLCC Tin/Lead Termination “B”
Capacitance Range (X7R Dielectric)
PREFERRED SIZES ARE SHADED
SIZE
LD02
LD03
LD05
LD06
Soldering
Packaging
Reflow/Wave
All Paper
Reflow/Wave
All Paper
Reflow/Wave
Paper/Embossed
Reflow/Wave
Paper/Embossed
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
16
25
50
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.014 ± 0.006)
16
25
50
10
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
16
25
50
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
P*
P
P*
(L) Length
(W) Width
(t)
Terminal
Cap
(pF)
Cap
(μF
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
0.010
0.015
0.022
0.033
0.047
0.068
0.10
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
22
47
100
WVDC
SIZE
Letter
Max.
Thickness
A
0.33
(0.013)
C
C
C
C
C
C
C
C
C
6.3
10
C
C
C
C
C
C
C
C
C
C*
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
100
200
G
G
G
G
G
G
G
G
G
G
G
G
G
G
6.3
J*
J*
J*
J*
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N*
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
100
200
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
N
6.3
P*
P*
10
16
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
25 50
100
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
P
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
Q
Q
Q
Q
Q*
Q*
Q*
Q*
Q*
Q
10
16
25
200
J
J
J
J
J
J
J
J
J
J
J
J
J
J
P
P
Q
Q
J
J
J
J
J
J
J
J
J
J
J
P
Q
Q
Q
Q
Q
Q
J
J
J
J
J
J
M
M
M
M
P
P
50
100
200
500
K
K
K
K
M
M
M
M
P
P
Q*
16
25
50
6.3
10
16
LD02
C
0.56
(0.022)
25
50
100
200
6.3
10
LD03
E
0.71
(0.028)
PAPER
G
0.90
(0.035)
J
0.94
(0.037)
16
25
50
100
200
6.3
LD05
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
500
LD06
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
= Under Development
44
REV 01
MLCC Tin/Lead Termination “B”
Capacitance Range (X7R Dielectric)
PREFERRED SIZES ARE SHADED
LD10
LD12
LD13
LD20
LD14
Reflow Only
Paper/Embossed
Reflow Only
All Embossed
Reflow Only
All Embossed
Reflow Only
All Embossed
Reflow Only
All Embossed
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
25
50
100
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
0.61 ± 0.36
(0.024 ± 0.014)
100
200
4.50 ± 0.30
(0.177 ± 0.012)
6.40 ± 0.40
(0.252 ± 0.016)
0.61 ± 0.36
(0.024 ± 0.014)
50
100
5.70 ± 0.40
(0.225 ± 0.016)
5.00 ± 0.40
(0.197 ± 0.016)
0.64 ± 0.39
(0.025 ± 0.015)
50
100
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
0.64 ± 0.39
(0.025 ± 0.015)
50
100
16
50
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
X
X
X
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
X
X
X
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
P
P
Z
Z
Z
Z
Z
10
16
25
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
X
X
Z
Z
Z
Z
Z
J
J
J
J
J
J
J
J
J
J
J
J
M
P
Q
Q
X
Z
Z
Z
J
J
J
J
J
J
J
J
J
J
M
M
Z
Z
M
M
M
M
M
M
P
Q
Q
K
K
K
K
K
K
K
K
K
K
K
M
M
Z
Z
Z
Z
25
200
L
W
T
C
0.56
(0.022)
K
K
K
K
K
K
K
K
K
M
P
Q
X
Z
Z
K
K
K
K
K
K
K
P
P
X
K
P
P
X
Z
Z
Z
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
P
P
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Z
t
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Z
Z
Z
X
X
X
X
X
X
X
X
X
X
X
M
M
M
M
M
M
M
M
M
M
M
M
M
M
M
100
200
50
P
P
P
P
P
P
P
P
P
P
P
P
P
X
Z
50
100
200
500
50
LD10
A
0.33
(0.013)
500
䉲
REV 01
500
䉲
SIZE
Letter
Max.
Thickness
200
䉲
Cap
(μF
10
䉲
Cap
(pF)
䉲
(t) Terminal
䉲
(W) Width
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
100
150
220
330
470
680
1000
1500
2200
3300
4700
6800
0.010
0.015
0.022
0.033
0.047
0.068
0.10
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
22
47
100
WVDC
䉲
(L) Length
䉲
SIZE
Soldering
Packaging
E
0.71
(0.028)
PAPER
G
0.90
(0.035)
100
200
LD12
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
500
50
100
25
LD13
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
50
LD20
X
2.29
(0.090)
Y
2.54
(0.100)
100
LD14
Z
2.79
(0.110)
45
MLCC Tin/Lead Termination “B”
Capacitance Range (X5R Dielectric)
PREFERRED SIZES ARE SHADED
LD02
LD03
LD05
LD06
LD10
Reflow/Wave
All Paper
Reflow/Wave
All Paper
Reflow/Wave
Paper/Embossed
Reflow/Wave
Paper/Embossed
Reflow/Wave
Paper/Embossed
Cap
(pF)
1000
1500
2200
C
C
C
3300
4700
6800
C
C
0.010
0.015
0.022
C
C
C
C
0.033
0.047
0.068
C
C
C
C
C
C
1.0
1.5
2.2
C
SIZE
Letter
Max.
Thickness
T
t
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
C* C*
G
G
G
G
G
J*
G*
G* J*
J*
J*
J*
K*
J*
J*
J*
C* C* C*
G
C*
J*
J*
G
G
G
N
G
G
G
N
N
N
G
N
N
N
4 6.3 10 16
25 50
4
C
0.56
(0.022)
N
N
N
P
6.3 10 16 25 35 50
G
0.90
(0.035)
J
0.94
(0.037)
Q
N
N
P
N
N
N
N
N* N*
P
P*
Q
Q
Q
Q
Q
Q
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Q
Z
X
X
X
Z
X
X
Z
Z
Z
Z Z Z Z
Z*
Z* Z
6.3 10 16 25 35 50 6.3 10 16 25 35 50 4 6.3 10 16 25 35 50 6.3 10
LD03
E
0.71
(0.028)
PAPER
N
N
N
N
N
N
P*
LD02
A
0.33
(0.013)
W
䉲
C*
3.3
4.7
10
22
47
100
WVDC
L
25 50
C
0.10
0.15
0.22
0.33
0.47
0.68
䉲
C
C
C
4
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
6.3 10 16 25 35 50 6.3 10
䉲
C
330
470
680
4
2.01 ± 0.20
3.20 ± 0.20
(0.079 ± 0.008)
(0.126 ± 0.008)
1.25 ± 0.20
1.60 ± 0.20
(0.049 ± 0.008)
(0.063 ± 0.008)
0.50 ± 0.25
0.50 ± 0.25
(0.020 ± 0.010)
(0.020 ± 0.010)
6.3 10 16 25 35 50 6.3 10 16 25 35 50
䉲
Cap
(μF)
100
150
220
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.014 ± 0.006)
6.3 10 16 25 35 50
䉲
(t) Terminal
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
4 6.3 10 16 25 50
䉲
(W) Width
mm
(in.)
mm
(in.)
mm
(in.)
WVDC
䉲
(L) Length
LD12
䉲
SIZE
Soldering
Packaging
LD05
K
1.02
(0.040)
M
1.27
(0.050)
LD06
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
LD10
X
2.29
(0.090)
25 50
LD12
Y
2.54
(0.100)
Z
2.79
(0.110)
*Optional Specifications – Contact factory
NOTE: Contact factory for non-specified capacitance values
46
REV 01
MLCC Low Profile
General Specifications
GENERAL DESCRIPTION
AVX introduces the LT series comprising a range of low
profile products in our X5R and X7R dielectric. X5R is a
Class II dielectric with temperature varation of
capacitance within ±15% from –55°C to +85°C. Offerings
include 0201, 0402, 0603, 0805 1206, and 1210
packages in compact, low profile designs. The LT series
is ideal for decoupling and filtering applications where
height clearance is limited.
AVX is also expanding the low profile products in our X7R
dielectric. X7R is a Class II dielectric with temperature
variation of capacitance within ±15% from -55ºC to
+125ºC. Please contact the factory for availability of any
additional values not listed.
PART NUMBER (see page 2 for complete part number explanation)
LT05
Z
D
475
K
A
T
2
S
Size
LT01 - 0201
LT02 - 0402
LT03 - 0603
LT05 - 0805
LT06 - 1206
LT10 - 1210
Voltage
4V = 4
6.3V = 6
10V = Z
16V = Y
25V = 3
Dielectric
X5R = D
X7R = C
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
Capacitance
Tolerance
K = ±10%
M = ±20%
Failure
Rate
A = Not
Applicable
Terminations
T = Plated Ni
and Sn
Packaging
2 = 7" Reel
4 = 13" Reel
Special
Code
See table below
Contact
Factory
For
Multiples
NOTE: Contact factory for availability of tolerance options for specific part numbers.
SIZE
WVDC
0.10
0.22
0.47
1.0
1.5
2.2
4.7
10
22
47
WVDC
Cap
(μF)
SIZE
LT01
4
Z
6.3
Z
Q
LT02
4
6.3
Q
C
S
4
6.3
LT01
4
LT03
10
16
S
4
6.3
S
C
C
S
6.3
10
16
4
LT02
LT05
16
25
S
X
X
X
S
X
6.3
X
6.3
16
LT03
25
10
X
X
X
S
X
6.3
10
LT06
16
25
X
X
6.3
16
25
50
X
X
X
X
W
X
W
W
X
X
X
X
X
W
X
W
W
6.3
10
16
25
50
X
X
16
LT05
25
LT10
10
LT06
16
25
W
W
16
25
LT10
= X7R
Letter
Max.
Thickness
REV 01
J
0.15
(0.006)
Z
0.22
(0.009)
Q
C
0.25
0.36
(0.010)
(0.014)
PAPER
S
0.56
(0.022)
X
0.95
(0.038)
W
1.02
(0.040)
EMBOSSED
47
UltraThin Ceramic Capacitors
UT Series
The Ultrathin (UT) series of ceramic capacitors is a new product offering from AVX. The UT
series was designed to meet the stringent thickness requirements of our customers. AVX
developed a new termination process (FCT - Fine Copper Termination) that provides
unbeatable flatness and repeatability. The series includes products < 0.35mm in height
and is targeted for applications such as Smart cards, Memory modules, High Density SIM
cards, Mobile phones, MP3 players, and embedded solutions.
HOW TO ORDER
UT
02
3
D
103
M
A
T
2
D
Style
Ultra
Thin
Case
Size
0402
Rated
Voltage
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
Temperature
Characteristic
D = X5R
C = X7R
Coded
Cap
(in pF)
2 Significant
Digits + Number
of Zeros
Cap
Tolerance
± 20%
Termination
Style
Commercial
Termination
T = 100% Sn
C = Cu
G = Au
Packaging
2 = 7" Reel
15,000 pcs
4 = 13" Reel
50,000 pcs
Thickness
D = 0.30mm max
E = 0.25mm max
F = 0.15mm max
(only availabe in
Cu Termination)
RECOMMENDED SOLDER
PAD DIMENSIONS (Sn Termination)
L
mm (inches)
BL
W
0.50
(0.020)
L
BL
End View
T
Top View
Side View
0.50
(0.020)
TYPICAL Cu THICKNESS
1.70
(0.067)
TT
TT
10.0 ± 4.00
0.40 ± 0.16
μM
mil
PART DIMENSIONS
Thickness
L
1.00 ± 0.10
(0.039±0.004)
1.00 ± 0.10
(0.039±0.004)
1.00 ± 0.10
(0.039±0.004)
D
E
F
0.60
(0.024)
mm (inches)
W
0.50 ± 0.10
(0.020 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
T
0.25 ± 0.05
(0.010 ± 0.002)
0.20 ± 0.05
(0.008 ± 0.002)
0.125 ± 0.025
(0.005 ± 0.001)
BL
0.27 ± 0.05
(0.0108 ± 0.002)
0.27 ± 0.05
(0.0108 ± 0.002)
0.27 ± 0.05
(0.0108 ± 0.002)
CAP RANGE (THICKNESS CODE)
X5R
Cap (nF)
1
10
22
33
47
68
100
48
6.3V
10V
D
16V
Thickness Code
E
25V
50V
6.3V
10V
X7R
F
16V
6.3V
10V
Cap (nF)
1
10
6.3V
Thickness Code
D
10V
16V
25V
F
6.3V
UltraThin Ceramic Capacitors
UT Series Specifications and Test Methods – Cu Termination
Parameter/Test
Operating Temperature Range
Capacitance
Dissipation Factor
Specification Limits
-55ºC to +85ºC
Within specified tolerance
≤ 3.0% for ≥ 25V DC rating
≤ 12.5% for ≤ 16V DC rating
Insulation Resistance
100 MΩ - μF
Dielectric Strength
No breakdown or visual defects
Resistance to
Flexure
Stresses
Load Life
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
No defects
≤ ±12%
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 kHz ± 10%
Voltage: 1.0Vrms ± .2V
Charge device with rated voltage for
120 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
1-5 seconds, with charge and discharge
current limited to 50 mA (max)
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
Meets Initial Values (As Above)
≥ Initial Value x 0.3
90 mm
No visual defects
≤ ±20%
≤ Initial Value x 2.0 (As Above)
≥ Initial Value x 0.3 (As Above)
Meets Initial Values (As Above)
Charge device with 1.5X rated voltage
in test chamber set at
85ºC ± 2ºC for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
49
UltraThin Ceramic Capacitors
UT Series Specifications and Test Methods – Sn Termination
Parameter/Test
Operating Temperature Range
Capacitance
Dissipation Factor
Insulation Resistance
100 MΩ - μF
Dielectric Strength
No breakdown or visual defects
Resistance to
Flexure
Stresses
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Solderability
Resistance to
Solder Heat
Load Life
Load
Humidity
50
Specification Limits
-55ºC to +85ºC
Within specified tolerance
≤ 3.0% for ≥ 25V DC rating
≤ 12.5% for ≤ 16V DC rating
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
No defects
≤ ±12%
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 kHz ± 10%
Voltage: 1.0Vrms ± 0.2V
Charge device with rated voltage for
120 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
1-5 seconds, with charge and discharge
current limited to 50 mA (max)
Deflection: 2mm
Test Time: 30 seconds
Meets Initial Values (As Above)
≥ Initial Value x 0.3
≥ 95% of each terminal should be covered
with fresh solder
No defects, <25% leaching of either end terminal
Dip device in eutectic solder at 245 ± 5ºC
for 5.0 ± 0.5 seconds
≤ ±7.5%
Meets Initial Values (As Above)
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24 ± 2
hours before measuring electrical properties.
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
≤ ±12%
≤ Initial Value x 2.0 (As Above)
≥ Initial Value x 0.3 (As Above)
Meets Initial Values (As Above)
No visual defects
≤ ±12%
Charge device with 1.5X rated voltage
in test chamber set at
85ºC ± 2ºC for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
≤ Initial Value x 2.0 (As Above)
≥ Initial Value x 0.3 (As Above)
Meets Initial Values (As Above)
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
Automotive MLCC
Automotive
GENERAL DESCRIPTION
AVX Corporation has supported the Automotive Industry requirements for
Multilayer Ceramic Capacitors consistently for more than 10 years. Products
have been developed and tested specifically for automotive applications and
all manufacturing facilities are QS9000 and VDA 6.4 approved.
As part of our sustained investment in capacity and state of the art
technology, we are now transitioning from the established Pd/Ag electrode
system to a Base Metal Electrode system (BME).
AVX is using AECQ200 as the qualification vehicle for this transition. A detailed
qualification package is available on request and contains results on a range
of part numbers including:
• X7R dielectric components containing BME electrode and copper
terminations with a Ni/Sn plated overcoat.
• X7R dielectric components, BME electrode with epoxy finish for conductive glue mounting.
• X7R dielectric components BME electrode and soft terminations with a
Ni/Sn plated overcoat.
• NP0 dielectric components containing Pd/Ag electrode and silver termination with a Ni/Sn plated overcoat.
HOW TO ORDER
0805
Size
0402
0603
0805
1206
1210
1812
5
Voltage
10V = Z
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
500V = 7
A
104
K
4
T
2
A
Dielectric
NP0 = A
X7R = C
X8R = F
Capacitance
Code (In pF)
2 Significant
Digits + Number
of Zeros
e.g. 10μF = 106
Capacitance
Tolerance
F = ±1%
(≥10pF)*
G = ±2%
(≥10pF)*
J = ±5%
(≤1μF)
K = ±10%
M = ±20%
Failure Rate
4 = Automotive
Terminations
T = Plated Ni and Sn
Z = FLEXITERM®**
U = Conductive Epoxy**
Packaging
2 = 7" Reel
4 = 13" Reel
Special Code
A = Std. Product
**X7R & X8R only
*NPO only
Contact factory for availability of Tolerance Options for Specific Part Numbers.
NOTE: Contact factory for non-specified capacitance values.
0402 case size available in T termination only.
COMMERCIAL VS AUTOMOTIVE MLCC PROCESS COMPARISON
Administrative
Commercial
Standard Part Numbers.
No restriction on who purchases these parts.
Automotive
Specific Automotive Part Number. Used to control
supply of product to Automotive customers.
Design
Minimum ceramic thickness of 0.020"
Minimum Ceramic thickness of 0.029" (0.74mm)
on all X7R product.
Dicing
Side & End Margins = 0.003" min
Side & End Margins = 0.004" min
Cover Layers = 0.003" min
Lot Qualification
(Destructive Physical
Analysis - DPA)
As per EIA RS469
Increased sample plan –
stricter criteria.
Visual/Cosmetic Quality
Standard process and inspection
100% inspection
Application Robustness
Standard sampling for accelerated
wave solder on X7R dielectrics
Increased sampling for accelerated wave solder on
X7R and NP0 followed by lot by lot reliability testing.
All Tests have Accept/Reject Criteria 0/1
041816
51
Automotive MLCC
NP0/X7R Dielectric
FLEXITERM® FEATURES
a) Bend Test
The capacitor is soldered to the PC Board as shown:
b) Temperature Cycle testing
FLEXITERM® has the ability to withstand at least 1000
cycles between –55°C and +125°C
1mm/sec
90 mm
Typical bend test results are shown below:
Style
Conventional Term
0603
>2mm
0805
>2mm
1206
>2mm
52
Soft Term
>5
>5
>5
041816
Automotive MLCC - NP0
Capacitance Range
0603
Reflow/Wave
Soldering
100
120
150
180
220
270
330
390
470
510
560
680
820
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
103
10pF
12
15
18
22
27
33
39
47
51
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
10nF
25V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
25V
50V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
50V
0805
Reflow/Wave
100V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
100V
25V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
25V
0603
Letter
Max.
Thickness
041816
A
0.33
(0.013)
C
0.56
(0.022)
1206
Reflow/Wave
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
100V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
25V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
100V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
200V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
500V
J
J
J
50V
100V
25V
50V
100V
200V
500V
0805
E
0.71
(0.028)
PAPER
1210
Reflow Only
G
0.90
(0.035)
25V
50V
100V
200V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
P
P
P
J
M
M
M
M
25V
50V
100V
200V
1206
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
1210
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
53
Automotive MLCC - X7R
Capacitance Range
Soldering
221
271
331
391
471
561
681
821
102
182
222
332
472
103
123
153
183
223
273
333
473
563
683
823
104
124
154
224
334
474
684
105
155
225
335
475
106
226
Cap 220
(pF) 270
330
390
470
560
680
820
1000
1800
2200
3300
4700
Cap 0.01
(μF) 0.012
0.015
0.018
0.022
0.027
0.033
0.047
0.056
0.068
0.082
0.01
0.12
0.15
0.22
0.33
0.47
0.68
1
1.5
2.2
3.3
4.7
10
22
0402
Reflow/Wave
16V
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
25V
C
C
C
C
C
C
C
C
C
C
C
C
C
50V
C
C
C
C
C
C
C
C
C
C
C
C
C
0603
Reflow/Wave
10V
16V
25V
50V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
25V
50V
10V
16V
0402
54
100V 200V
G
G
G
G
G
G
G
G
16V
Letter
Max.
Thickness
0805
Reflow/Wave
A
0.33
(0.013)
C
0.56
(0.022)
25V
50V
100V 200V
16V
25V
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
N
N
16V
25V
0603
E
0.71
(0.028)
PAPER
G
0.90
(0.035)
100V 200V
J
J
J
J
J
J
M
M
M
M
M
M
M
M
M
M
M
N
N
N
N
N
50V
1206
Reflow/Wave
J
J
J
J
J
J
100V 200V
16V
25V
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
Q
Q
Q
Q
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
P
P
Q
Q
Q
Q
16V
0805
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
25V
50V
1210
Reflow Only
100V 200V 500V
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
Q
Q
Q
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
100V 200V 500V
16V
25V
50V
100V
50V
100V
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
P
P
P
P
P
X
X
X
Z
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
P
P
P
Q
Q
Z
Z
Z
Z
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
P
P
Q
Q
Z
Z
Z
Z
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
P
P
P
Q
Q
X
X
Z
Z
Z
Z
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
X
X
X
X
X
Z
Z
Z
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
X
X
X
X
X
Z
16V
25V
50V
1206
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
1812
Reflow Only
1210
X
2.29
(0.090)
Y
2.54
(0.100)
100V
50V
100V
1812
2220
Reflow Only
25V
Z
25V
50V
100V
Z
Z
Z
50V
100V
2220
Z
2.79
(0.110)
041816
Automotive MLCC - X8R
Capacitance Range
SIZE
Soldering
271
331
471
681
102
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
684
824
105
Cap
(pF)
Cap
(μF)
0603
Reflow/Wave
25V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
WVDC
270
330
470
680
1000
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.01
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.1
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.68
0.82
1
WVDC
25V
SIZE
Letter
Max.
Thickness
041816
A
0.33
(0.013)
0805
Reflow/Wave
50V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
25V
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
50V
25V
0603
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
G
0.90
(0.035)
J
0.94
(0.037)
1206
Reflow/Wave
50V
25V
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
M
M
M
M
M
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
M
M
M
25V
0805
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
50V
1206
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
55
APS Series for Higher Reliability Applications
Surface Mount NPO, X7R and X8R/L MLCCs
AVX’s APS series of multilayer ceramic capacitors offers the customer a higher
reliability solution with an ultralow failure rate, ≤1ppb, in a variety of case sizes and
voltages. The APS range encompasses a wide range of dielectric types to meet
the customer’s requirements from low temperature/voltage capacitance change
dielectric, NPO, to high preforming capacitance voltage X7R to high temperature
reliability dielectrics, X8R/L.
APS capacitors have a wider capacitance range than MIL spec parts that satisfies
the need for higher CV demands and board space saving requirements. Each
production lot is extensively tested and removes the requirement for customer
specific drawings. The testing regime uses many of the MIL-STD test methods as
per MIL-PRF-55681 and has a field failure rate of less than 1 ppb. The APS testing
series uses AVX’s unique in-house maverick testing detection system that
eliminates infant mortality failures.
Applications suitable for APS include Industrial, Telecommunications, Aviation, and
Military. The APS is available with a range of different termination finishes,
Flexiterm®, Nickel / Tin and Tin with Pb1. Flexiterm® technology delivers improved
thermo-mechanical stress resistance.
Dielectric
NPO
X7R
X8R
X8L
AVX’S APS RELIABILITY
TEST SUMMARY
• 100 % Visual Inspection
• DPA
• IR, DF, Cap, DWV
• Maverick Lot Review
• Thermal Shock
• 85/85 Testing
• Life Testing 125°C 2xRV
• C of C with every Order
• Quarterly Data Package
Temperature/Percentage Cap Change
-30ppm +30ppm from -55°C to + 125°C
-15% +15% from -55°C to + 125°C
-15% +15% from -55°C to + 150°C
-15% +40% from -55°C to + 150°C
FEATURES
• The APS range has extensive reliability testing as standard resulting in an
ultralow failure rate, ≤1ppb.
• The APS range is available with Flexiterm® that deliver’s high thermo-mechanical
stress resistance.
• High CV range enabling board space saving requirements.
HOW TO ORDER
AP03
Size
AP03=0603
AP05=0805
AP06=1206
AP10=1210
AP12=1812
AP20=2220
5
Voltage
16V = Y
25V = 3
50V = 5
100V = 1
200V = 2
500V = 7
A
104
K
Dielectric
NP0 = A
X7R = C
X8R = F
X8L = L
Capacitance
Code (In pF)
2 Significant Digits +
Number of Zeros
e.g. 10μF = 106
Capacitance
Tolerance
J = ±5%
K = ±10%
M = ±20%
Q
T
2
Failure Rate
Packaging
Terminations
Q = APS T = Plated Ni and Sn** 2 = 7" Reel
®
4 = 13" Reel
Z = FLEXITERM **
B =10% min lead
X = FLEXITERM® with
10% min lead
A
Special Code
A = Std. Product
Z,X for X7R only
**RoHS compiant
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
56
REV 01
NP0 APS Series
Capacitance Range
AP03 = 0603
100
120
150
180
220
270
330
390
470
510
560
680
820
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
103
10pF
12
15
18
22
27
33
39
47
51
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
10nF
25V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
25V
50V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
50V
AP05 = 0805
100V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
100V
25V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
25V
AP03 = 0603
Letter
Max.
Thickness
A
0.33
(0.013)
C
0.56
(0.022)
AP06 = 1206
100V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
25V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
100V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
200V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
500V
J
J
J
50V
100V
25V
50V
100V
200V
500V
AP05 = 0805
E
0.71
(0.028)
PAPER
AP10 = 1210
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
G
0.90
(0.035)
AP06 = 1206
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
25V
50V
100V
200V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
J
M
M
M
M
50V
100V
200V
25V
AP10 = 1210
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
TS 16949, ISO 9001Certified
REV 01
57
X7R APS Series
Capacitance Range
AP03 = 0603
102
182
222
332
472
103
123
153
183
223
273
333
473
563
683
823
104
124
154
224
334
474
684
105
155
225
335
475
106
226
Cap 1000
(pF) 1800
2200
3300
4700
0.01
0.012
0.015
0.018
0.022
0.027
0.033
0.047
0.056
0.068
0.082
0.1
0.12
0.15
0.22
0.33
0.47
0.68
Cap 1.0
(μF) 1.5
2.2
3.3
4.7
10
22
16V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
25V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
50V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
AP05 = 0805
100V 200V
G
G
G
G
G
G
G
16V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
N
N
N
N
25V
50V
100V 200V
16V
AP03 = 0603
58
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
AP06 = 1206
100V 200V
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
M
M
M
M
16V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
Q
Q
25V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
Q
Q
Q
Q
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
P
P
Q
Q
100V 200V 500V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
J
M
J
M
J
M
J
M
J
M
M
Q
Q
Q
Q
Q
AP10 = 1210
16V
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
P
P
P
P
P
X
X
X
25V
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
P
P
P
Q
Q
Z
Z
Z
50V
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
P
P
Q
Q
Z
Z
Z
Z
AP12 = 1812 AP20 = 2220
100V
K
K
K
K
K
K
K
K
K
K
K
K
K
M
M
M
M
P
P
P
Q
Q
X
X
Z
Z
50V
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
X
X
X
X
X
Z
Z
Z
100V
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
K
M
X
X
X
X
X
Z
25V
50V
Z
16V
Letter
Max.
Thickness
25V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
A
0.33
(0.013)
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
25V
50V
100V 200V
16V
25V
AP05 = 0805
G
0.90
(0.035)
J
0.94
(0.037)
K
1.02
(0.040)
50V
100V 200V 500V
16V
AP06 = 1206
M
1.27
(0.050)
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
25V
50V
AP10 = 1210
X
2.29
(0.090)
Y
2.54
(0.100)
100V
50V
100V
Z
25V
50V
AP12 = 1812 AP20 = 2220
Z
2.79
(0.110)
REV 01
X8R/L APS Series
Capacitance Range
X8R
SIZE
331
471
681
102
152
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
WVDC
Cap
330
(pF)
470
680
1000
1500
2200
3300
4700
6800
Cap 0.01
(μF) 0.015
0.022
0.033
0.047
0.068
0.1
0.15
0.22
0.33
0.47
0.68
1
WVDC
SIZE
Letter
Max.
Thickness
X8L
0603
25V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
0805
50V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
25V
50V
0603
A
0.33
(0.013)
C
0.56
(0.022)
25V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
25V
1206
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
25V
50V
25V
E
0.71
(0.028)
PAPER
G
0.90
(0.035)
50V
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
0805
SIZE
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
331
471
681
102
152
222
332
472
682
103
153
223
333
473
683
104
154
224
334
474
684
105
50V
1206
J
0.94
(0.037)
K
1.02
(0.040)
M
1.27
(0.050)
0603
WVDC
Cap
330
(pF)
470
680
1000
1500
2200
3300
4700
6800
Cap 0.01
(μF) 0.015
0.022
0.033
0.047
0.068
0.1
0.15
0.22
0.33
0.47
0.68
1
WVDC
25V
G
G
G
G
G
G
25V
50V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
50V
SIZE
0603
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
0805
100V
G
G
G
G
G
G
G
G
G
G
25V
J
J
J
J
J
J
J
N
N
N
100V
25V
1206
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
100V
J
J
J
J
J
J
J
J
J
J
J
J
N
N
50V
100V
16V
J
J
J
M
M
M
16V
0805
X
2.29
(0.090)
Y
2.54
(0.100)
25V
50V
100V
J
J
M
M
J
J
J
J
J
J
J
J
J
J
J
J
J
J
P
P
J
J
J
J
J
J
J
J
J
J
J
M
Q
Q
Q
25V
50V
100V
1206
Z
2.79
(0.110)
TS 16949, ISO 9001Certified
REV 01
59
MLCC with FLEXITERM®
General Specifications
GENERAL DESCRIPTION
With increased requirements from the automotive industry for additional
component robustness, AVX recognized the need to produce a MLCC with
enhanced mechanical strength. It was noted that many components may be
subject to severe flexing and vibration when used in various under the hood
automotive and other harsh environment applications.
To satisfy the requirement for enhanced mechanical strength, AVX had to
find a way of ensuring electrical integrity is maintained whilst external forces
are being applied to the component. It was found that the structure of the
termination needed to be flexible and after much research and development,
AVX launched FLEXITERM ® . FLEXITERM ® is designed to enhance the
mechanical flexure and temperature cycling performance of a standard
ceramic capacitor with an X7R dielectric. The industry standard for
flexure is 2mm minimum. Using FLEXITERM®, AVX provides up to
5mm of flexure without internal cracks. Beyond 5mm, the capacitor
will generally fail “open”.
As well as for automotive applications FLEXITERM® will provide Design
Engineers with a satisfactory solution when designing PCB’s which may be
subject to high levels of board flexure.
PRODUCT ADVANTAGES
• High mechanical performance able to withstand, 5mm bend test
guaranteed.
• Increased temperature cycling performance, 3000 cycles and beyond.
• Flexible termination system.
• Reduction in circuit board flex failures.
• Base metal electrode system.
• Automotive or commercial grade products available.
APPLICATIONS
High Flexure Stress Circuit Boards
• e.g. Depanelization: Components near edges
of board.
Variable Temperature Applications
• Soft termination offers improved reliability performance in applications where there is temperature variation.
• e.g. All kind of engine sensors: Direct
connection to battery rail.
Automotive Applications
• Improved reliability.
• Excellent mechanical performance and
thermo mechanical performance.
HOW TO ORDER
0805
5
C
104
K
Style
0603
0805
1206
1210
1812
2220
Voltage
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
1 = 100V
2 = 200V
Dielectric
C = X7R
F = X8R
Capacitance
Code (In pF)
2 Sig Digits +
Number of Zeros
e.g., 104 = 100nF
Capacitance
Tolerance
J = ±5%*
K = ±10%
M = ±20%
*≤1μF only
A
Z
Failure
Terminations
Rate
Z = FLEXITERM®
A=Commercial For FLEXITERM®
4 = Automotive with Tin/Lead
termination see
AVX LD Series
2
A
Packaging
2 = 7" reel
4 = 13" reel
Special Code
A = Std. Product
NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.
60
041816
MLCC with FLEXITERM®
Specifications and Test Methods
BOARD BEND TEST PROCEDURE
PERFORMANCE TESTING
According to AEC-Q200
AEC-Q200 Qualification:
• Created by the Automotive Electronics
Council
• Specification defining stress
test qualification for
passive components
Testing:
Key tests used to compare
soft termination to
AEC-Q200 qualification:
• Bend Test
• Temperature Cycle Test
Test Procedure as per AEC-Q200:
Sample size:
20 components
Span: 90mm
Minimum deflection spec: 2 mm
LOADING
KNIFE
• Components soldered onto FR4 PCB (Figure 1)
MOUNTING
ASSEMBLY
• Board connected electrically to the test equipment
(Figure 2)
DIGITAL
CALIPER
BEND TESTPLATE
CONNECTOR
CONTROL
PANEL
CONTROL PANEL
Fig 1 - PCB layout with electrical connections
BOARD BEND TEST RESULTS
Fig 2 - Board Bend test
equipment
0603
Substrate Bend (mm)
NPO
X7R
X7R soft term
1206
12
10
8
6
4
2
0
NPO
X7R
0805
Substrate Bend (mm)
12
10
8
6
4
2
0
12
10
8
6
4
2
0
Substrate Bend (mm)
Substrate Bend (mm)
AEC-Q200 Vrs AVX FLEXITERM® Bend Test
12
10
8
6
4
2
0
NPO
X7R
AVX ENHANCED SOFT
TERMINATION BEND TEST
PROCEDURE
X7R soft term
1210
X7R soft term
NPO
X7R
Bend Test
The capacitor is soldered to the printed circuit
board as shown and is bent up to 10mm at
1mm per second:
Max. = 10mm
X7R soft term
TABLE SUMMARY
90mm
Typical bend test results are shown below:
Style
Conventional Termination
FLEXITERM®
0603
>2mm
>5mm
0805
>2mm
>5mm
1206
>2mm
>5mm
TEMPERATURE CYCLE TEST PROCEDURE
Test Procedure as per AEC-Q200:
The test is conducted to determine the resistance of the
component when it is exposed to extremes of alternating
high and low temperatures.
• Sample lot size quantity 77 pieces
• TC chamber cycle from -55ºC to +125ºC for 1000 cycles
• Interim electrical measurements at 250, 500, 1000 cycles
• Measure parameter capacitance dissipation factor,
insulation resistance
Test Temperature Profile (1 cycle)
+1250 C
• The board is placed on 2 supports 90mm
apart (capacitor side down)
• The row of capacitors is aligned with the
load stressing knife
Max. = 10mm
• The load is applied and the deflection where
the part starts to crack is recorded (Note:
Equipment detects the start of the crack
using a highly sensitive current detection
circuit)
• The maximum deflection capability is 10mm
+250 C
-550 C
1 hour 12mins
041816
61
MLCC with FLEXITERM®
Specifications and Test Methods
BEYOND 1000 CYCLES: TEMPERATURE CYCLE TEST RESULTS
0603
10
8
% Failure
% Failure
8
6
4
2
0
6
4
2
0
0
500 1000 1500 2000 2500 3000
0
1206
10
500 1000 1500 2000 2500 3000
1210
10
8
% Failure
8
% Failure
0805
10
6
4
2
0
6
4
2
0
0
500 1000 1500 2000 2500 3000
0
Soft Term - No Defects up to 3000 cycles
500 1000 1500 2000 2500 3000
AEC-Q200 specification states
1000 cycles compared to AVX
3000 temperature cycles.
FLEXITERM® TEST SUMMARY
• Qualified to AEC-Q200 test/specification with the exception
of using AVX 3000 temperature cycles (up to +150°C bend
test guaranteed greater than 5mm).
• FLEXITERM® provides improved performance compared to
standard termination systems.
WITHOUT SOFT TERMINATION
Major fear is of latent board flex failures.
62
• Board bend test improvement by a factor of 2 to 4 times.
• Temperature Cycling:
– 0% Failure up to 3000 cycles
– No ESR change up to 3000 cycles
WITH SOFT TERMINATION
Far superior mechanical performance.
Generally open failure mode beyond
5mm flexure.
041816
MLCC with FLEXITERM®
X8R Dielectric Capacitance Range
SIZE
Soldering
271
331
471
681
102
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
684
824
105
Cap
(pF)
Cap
(μF)
0603
Reflow/Wave
25V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
WVDC
270
330
470
680
1000
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.01
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.1
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.68
0.82
1
WVDC
25V
SIZE
Letter
Max.
Thickness
A
0.33
(0.013)
0805
Reflow/Wave
50V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
25V
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
50V
25V
0603
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
G
0.90
(0.035)
J
0.94
(0.037)
1206
Reflow/Wave
50V
25V
50V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
M
M
M
M
M
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
M
M
M
25V
0805
K
1.02
(0.040)
M
1.27
(0.050)
N
1.40
(0.055)
P
Q
1.52
1.78
(0.060)
(0.070)
EMBOSSED
50V
1206
X
2.29
(0.090)
Y
2.54
(0.100)
Z
2.79
(0.110)
AEC-Q200 Qualified
041816
63
MLCC with FLEXITERM®
X7R Dielectric Capacitance Range
Capacitance
Code
Soldering
101
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
564
684
824
105
225
335
475
106
226
Cap 100
(pF) 220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
Cap .010
(μF) .012
.015
.018
.022
.027
.033
.039
.047
.056
.068
.082
.1
.12
.15
.18
.22
.27
.33
.39
.47
.56
.68
.82
1
2.2
3.3
4.7
10
22
0603
0805
Reflow/Wave
Reflow/Wave
10V
16V
25V
50V
100V
200V
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
10V
J
16V
J
25V
50V
100V
200V
64
A
0.33
(0.013)
C
0.56
(0.022)
E
0.71
(0.028)
PAPER
Reflow/Wave
25V
50V
100V
200V
16V
25V
50V
100V
200V
E
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
N
E
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
P
P
P
E
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
P
P
P
E
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
N
E
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
E
J
J
J
J
J
J
J
J
J
J
J
J
N
N
N
N
N
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
Q
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
Q
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
N
Q
Q
Q
Q
N
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
M
M
M
M
P
P
P
P
10V
16V
N
N
25V
50V
100V
200V
16V
J
0.94
(0.037)
K
1.02
(0.040)
25V
50V
100V
200V
25V
50V
100V
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
J
J
J
J
J
J
J
J
J
J
J
J
J
M
M
M
P
P
P
P
P
Q
Q
Q
Z
Z
Z
X
Z
Z
Z
Z
P
X
X
X
Z
Q
Q
Z
Z
Z
Z
16V
25V
N
1.40
(0.055)
P
1.52
(0.060)
50V
100V
Y
2.54
(0.100)
Reflow Only
25V
50V
100V
50V
100V
K
K
K
K
K
K
K
K
M
M
Q
X
K
K
K
K
K
K
K
K
M
M
Q
X
X
Z
Z
Z
K
K
K
K
K
M
M
M
P
P
X
X
Z
Z
X
X
X
X
X
X
X
X
X
X
X
X
Q
X
Z
Z
7
Q
X
Z
25V
1210
Q
X
1.78
2.29
(0.070)
(0.090)
EMBOSSED
2220
Reflow Only
16V
1206
M
1.27
(0.050)
1812
Reflow Only
16V
0805
G
0.90
(0.035)
1210
10V
0603
Letter
Max.
Thickness
1206
50V
100V
1812
Z
2.79
(0.110)
Z
50V
100V
2220
7
3.30
(0.130)
041816
FLEXISAFE MLC Chips
For Ultra Safety Critical Applications
AVX have developed a range of components specifically for safety
critical applications.
Utilizing the award-winning FLEXITERM™ layer in conjunction with the
cascade design previously used for high voltage MLCCs, a range of
ceramic capacitors is now available for customers who require
components designed with an industry leading set of safety features.
The FLEXITERM™ layer protects the component from any damage to
the ceramic resulting from mechanical stress during PCB assembly or
use with end customers. Board flexure type mechanical damage
accounts for the majority of MLCC failures. The addition of the cascade
structure protects the component from low insulation resistance failure
resulting from other common causes for failure; thermal stress damage,
repetitive strike ESD damage and placement damage. With the inclusion
of the cascade design structure to complement the FLEXITERM™ layer,
the FLEXISAFE range of capacitors has unbeatable safety features.
HOW TO ORDER
FS03
5
C
104
K
Q
Z
2
A
Size
FS03 = 0603
FS05 = 0805
FS06 = 1206
FS10 = 1210
Voltage
16V = Y
25V = 3
50V = 5
100V = 1
Dielectric
X7R = C
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
e.g. 10μF =106
Capacitance
Tolerance
J = ±5%
K = ±10%
M = ±20%
Failure
Rate
A = Commercial
4 = Automotive
Q = APS
Terminations
Z = FLEXITERMTM
*X = FLEXITERMTM
with 5% min lead
Packaging
2 = 7" Reel
4 = 13" Reel
Special
Code
A = Std. Product
*Not RoHS Compliant
FLEXISAFE X7R RANGE
Capacitance
Code
Soldering
FS03 = 0603
16
102
182
222
332
472
103
123
153
183
223
273
333
473
563
683
823
104
124
154
224
334
474
Reflow/Wave
25
50
FS05 = 0805
100
16
Reflow/Wave
25
50
FS06 = 1206
100
16
Reflow/Wave
25
50
FS10 = 1210
16
Reflow Only
25
50
μF .0012
.0018
.0022
.0033
.0047
.01
.012
.015
.018
.022
.027
.033
.047
.056
.068
.082
.1
.12
.15
.22
.33
.47
Qualified
041816
65
Capacitor Array
Capacitor Array (IPC)
BENEFITS OF USING CAPACITOR
ARRAYS
AVX capacitor arrays offer designers the opportunity to
lower placement costs, increase assembly line output
through lower component count per board and to reduce
real estate requirements.
Reduced Costs
Placement costs are greatly reduced by effectively placing
one device instead of four or two. This results in increased
throughput and translates into savings on machine time.
Inventory levels are lowered and further savings are made
on solder materials, etc.
Space Saving
Space savings can be quite dramatic when compared to
the use of discrete chip capacitors. As an example, the
0508 4-element array offers a space reduction of >40% vs.
4 x 0402 discrete capacitors and of >70% vs. 4 x 0603
discrete capacitors. (This calculation is dependent on the
spacing of the discrete components.)
Increased Throughput
Assuming that there are 220 passive components placed in a
mobile phone:
A reduction in the passive count to 200 (by replacing
discrete components with arrays) results in an increase in
throughput of approximately 9%.
A reduction of 40 placements increases throughput by 18%.
For high volume users of cap arrays using the very latest
placement equipment capable of placing 10 components per
second, the increase in throughput can be very significant and
can have the overall effect of reducing the number of placement machines required to mount components:
If 120 million 2-element arrays or 40 million 4-element arrays
were placed in a year, the requirement for placement
equipment would be reduced by one machine.
During a 20Hr operational day a machine places 720K
components. Over a working year of 167 days the machine
can place approximately 120 million. If 2-element arrays are
mounted instead of discrete components, then the number
of placements is reduced by a factor of two and in the
scenario where 120 million 2-element arrays are placed there
is a saving of one pick and place machine.
Smaller volume users can also benefit from replacing
discrete components with arrays. The total number of placements is reduced thus creating spare capacity on placement
machines. This in turn generates the opportunity to increase
overall production output without further investment in new
equipment.
W2A (0508) Capacitor Arrays
4 pcs 0402 Capacitors
=
1 pc 0508 Array
1.88
(0.074)
1.0
1.4
(0.055) (0.039)
5.0 (0.197)
AREA = 7.0mm2 (0.276 in2)
2.1 (0.083)
AREA = 3.95mm2 (0.156 in2)
The 0508 4-element capacitor array gives a PCB space saving of over 40%
vs four 0402 discretes and over 70% vs four 0603 discrete capacitors.
W3A (0612) Capacitor Arrays
4 pcs 0603 Capacitors
=
1 pc 0612 Array
2.0
(0.079)
2.3
1.5
(0.091) (0.059)
6.0 (0.236)
AREA = 13.8mm2 (0.543 in2)
3.2 (0.126)
AREA = 6.4mm2 (0.252 in2)
The 0612 4-element capacitor array gives a PCB space saving of over 50%
vs four 0603 discretes and over 70% vs four 0805 discrete capacitors.
66
REV 01
Capacitor Array
Capacitor Array (IPC)
GENERAL DESCRIPTION
AVX is the market leader in the development and manufacture of
capacitor arrays. The array family of products also includes the 0612
4-element device as well as 0508 2-element and 4-element series,
all of which have received widespread acceptance in the
marketplace.
AVX capacitor arrays are available in X5R, X7R and NP0 (C0G)
ceramic dielectrics to cover a broad range of capacitance values.
Voltage ratings from 6.3 Volts up to 100 Volts are offered. AVX
also now offers a range of automotive capacitor arrays qualified to
AEC-Q200 (see separate table).
Key markets for capacitor arrays are Mobile and Cordless Phones,
Digital Set Top Boxes, Computer Motherboards and Peripherals
as well as Automotive applications, RF Modems, Networking
Products, etc.
0508 - 2 Element
0612 - 4 Element
0508 - 4 Element
AVX Capacitor Array - W2A41A***K
S21 Magnitude
0
-5
-10
S21 mag. (dB)
-15
-20
-25
-30
5pF
10pF
15pF
22pF
33pF
39pF
68pF
-35
-40
0.01
0.1
1
10
Frequency (GHz)
HOW TO ORDER
W
2
Style
Case
Size
W = RoHS
L = SnPb 2 = 0508
3 = 0612
A
Array
4
3
C
103
M
A
Number
Voltage Dielectric Capacitance Capacitance
Failure
of Caps
Code
Tolerance
Rate
6 = 6V
A = NP0
2 = 2 Element Z = 10V
J = ±5%
A = Commercial
C = X7R 2 Sig Digits +
4 = 4 Element Y = 16V
Number of
K = ±10% 4 = Automotive
D = X5R
Zeros
M = ±20%
3 = 25V
5 = 50V
1 = 100V
T
2A
Termination
Code
Packaging &
Quantity
Code
2A = 7" Reel
(4000)
4A = 13" Reel
(10000)
2F = 7" Reel
(1000)
*T = Plated Ni
and Sn
*Z = FLEXITERM®
*B = 5% min lead
*X = FLEXITERM®
with 5% min
lead
*RoHS Compliant
*Not RoHS Compliant
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
REV 01
67
Capacitor Array
Capacitance Range – NP0/C0G
SIZE
# Elements
W2 = 0508
4
W3 = 0612
4
Soldering
Packaging
Reflow/Wave
Paper/Embossed
1.30 ± 0.15
(0.051 ± 0.006)
2.10 ± 0.15
(0.083 ± 0.006)
0.94
(0.037)
Reflow/Wave
Paper/Embossed
1.60 ± 0.150
(0.063 ± 0.006)
3.20 ± 0.20
(0.126 ± 0.008)
1.35
(0.053)
Length
Width
mm
(in.)
mm
(in.)
mm
(in.)
Max.
Thickness
WVDC
1R0
Cap 1.0
1R2
(pF) 1.2
1R5
1.5
1R8
1.8
2R2
2.2
2R7
2.7
3R3
3.3
3R9
3.9
4R7
4.7
5R6
5.6
6R8
6.8
8R2
8.2
100
10
120
12
150
15
180
18
220
22
270
27
330
33
390
39
470
47
560
56
680
68
820
82
101
100
121
120
151
150
181
180
221
220
271
270
331
330
391
390
471
470
561
560
681
680
821
820
102
1000
122
1200
152
1500
182
1800
222
2200
272
2700
332
3300
392
3900
472
4700
562
5600
682
6800
822
8200
16
25
50
16
25
50
= Supported Values
68
REV 01
Capacitor Array
Capacitance Range – X7R
SIZE
# Elements
W2 = 0508
2
W2 = 0508
4
W3 = 0612
4
Soldering
Packaging
Reflow/Wave
All Paper
1.30 ± 0.15
(0.051 ± 0.006)
2.10 ± 0.15
(0.083 ± 0.006)
0.94
(0.037)
Reflow/Wave
Paper/Embossed
1.30 ± 0.15
(0.051 ± 0.006)
2.10 ± 0.15
(0.083 ± 0.006)
0.94
(0.037)
Reflow/Wave
Paper/Embossed
1.60 ± 0.150
(0.063 ± 0.006)
3.20 ± 0.20
(0.126 ± 0.008)
1.35
(0.053)
Length
Width
Max.
Thickness
WVDC
101 Cap
121 (pF)
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
392
472
562
682
822
103 Cap
123 (μF)
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
474
564
684
824
105
125
155
185
225
335
475
106
226
476
107
REV 01
mm
(in.)
mm
(in.)
mm
(in.)
6
10
16
25
50
100
6
10
16
25
50
100
6
10
16
25
50
100
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
0.10
0.12
0.15
0.18
0.22
0.27
0.33
0.47
0.56
0.68
0.82
1.0
1.2
1.5
1.8
2.2
3.3
4.7
10
22
47
100
69
Automotive Capacitor Array (IPC)
As the market leader in the development and manufacture of capacitor
arrays AVX is pleased to offer a range of AEC-Q200 qualified arrays to
compliment our product offering to the Automotive industry. Both the
AVX 0612 and 0508 4-element capacitor array styles are qualified to the
AEC-Q200 automotive specifications.
AEC-Q200 is the Automotive Industry qualification standard and a
detailed qualification package is available on request.
All AVX automotive capacitor array production facilities are certified to
ISO/TS 16949:2002.
0508 - 4 Element
0612 - 4 Element
HOW TO ORDER
W
3
A
Case
Style
Size
W = RoHS
L = SnPb 2 = 0508
3 = 0612
Y
4
C
Array Number Voltage Dielectric
A = NP0
of Caps Z = 10V
Y = 16V
C = X7R
3 = 25V
F = X8R
5 = 50V
1 = 100V
104
K
4
Capacitance
Code (In pF)
Significant
Digits +
Number of
Zeros
e.g. 10μF=106
Capacitance
Tolerance
*J = ±5%
*K = ±10%
M = ±20%
T
2A
Failure Rate
Packaging
Terminations
& Quantity
4 = Automotive *T = Plated Ni and Sn
Code
*Z = FLEXITERM®
2A = 7" Reel
B = 5% min lead
(4000)
X = FLEXITERM®
with 5% min lead 4A = 13" Reel
(10000)
2F = 7" Reel
*RoHS compliant
(1000)
*Contact factory for availability by part number for K = ±10% and J = ±5% tolerance.
NP0/C0G
X7R
SIZE
W2 = 0508
W3 = 0612
SIZE
W2 = 0508
W2 = 0508
No. of Elements
WVDC
1R0
Cap 1.0
1R2
(pF) 1.2
1R5
1.5
1R8
1.8
2R2
2.2
2R7
2.7
3R3
3.3
3R9
3.9
4R7
4.7
5R6
5.6
6R8
6.8
8R2
8.2
100
10
120
12
150
15
180
18
220
22
270
27
330
33
390
39
470
47
560
56
680
68
820
82
101
100
121
120
151
150
181
180
221
220
271
270
331
330
391
390
471
470
561
560
681
680
821
820
102
1000
122
1200
152
1500
182
1800
222
2200
272
2700
332
3300
392
3900
472
4700
562
5600
682
6800
822
8200
4
4
No. of Elements
WVDC
101
Cap 100
121
(pF) 120
151
150
181
180
221
220
271
270
331
330
391
390
471
470
561
560
681
680
821
820
102
1000
122
1200
152
1500
182
1800
222
2200
272
2700
332
3300
392
3900
472
4700
562
5600
682
6800
822
8200
103 Cap 0.010
123
(μF) 0.012
153
0.015
183
0.018
223
0.022
273
0.027
333
0.033
393
0.039
473
0.047
563
0.056
683
0.068
823
0.082
104
0.10
124
0.12
154
0.15
224
0.22
2
4
16
25
50
100
16
25
50
100
= X7R
16
25
50
100
16
25
50
W3 = 0612
100
10
16
4
25
50
100
Not RoHS Compliant
= NPO/COG
LEAD-FREE COMPATIBLE
COMPONENT
For RoHS compliant products,
please select correct termination style.
70
REV 01
Capacitor Array
PART & PAD LAYOUT DIMENSIONS
millimeters (inches)
0612 - 4 Element
0508 - 4 Element
0508 - 2 Element
W
S
W
S
S
S
P
X
X
P
S
S
T
T
BW
X
X
W
P
T
BW
C/L
OF CHIP
BW
C/L OF CHIP
C/L OF CHIP
C
L
C
L
C
L
BL
L
BL L
BL
L
PAD LAYOUT
PAD LAYOUT
PAD LAYOUT
E
E
E
D
D
D
A
A
B
A
B
C
B
C
C
PART DIMENSIONS
PAD LAYOUT DIMENSIONS
0508 - 2 Element
0508 - 2 Element
L
W
1.30 ± 0.15
2.10 ± 0.15
(0.051 ± 0.006) (0.083 ± 0.006)
T
0.94 MAX
(0.037 MAX)
BW
BL
0.43 ± 0.10
0.33 ± 0.08
(0.017 ± 0.004) (0.013 ± 0.003)
P
S
1.00 REF
0.50 ± 0.10
(0.039 REF) (0.020 ± 0.004)
0508 - 4 Element
L
W
1.30 ± 0.15
2.10 ± 0.15
(0.051 ± 0.006) (0.083 ± 0.006)
W
1.60 ± 0.20
3.20 ± 0.20
(0.063 ± 0.008) (0.126 ± 0.008)
REV 01
B
C
D
E
1.32
(0.052)
2.00
(0.079)
0.46
(0.018)
1.00
(0.039)
0508 - 4 Element
T
0.94 MAX
(0.037 MAX)
BW
BL
0.25 ± 0.06
0.20 ± 0.08
(0.010 ± 0.003) (0.008 ± 0.003)
P
X
S
0.50 REF
0.75 ± 0.10
0.25 ± 0.10
(0.020 REF) (0.030 ± 0.004) (0.010 ± 0.004)
0612 - 4 Element
L
A
0.68
(0.027)
A
B
C
D
E
0.56
(0.022)
1.32
(0.052)
1.88
(0.074)
0.30
(0.012)
0.50
(0.020)
0612 - 4 Element
T
1.35 MAX
(0.053 MAX)
BW
BL
+0.25
0.41 ± 0.10
0.18 -0.08
(0.016 ± 0.004) (0.007+0.010 )
-0.003
P
X
S
0.76 REF
1.14 ± 0.10
0.38 ± 0.10
(0.030 REF) (0.045 ± 0.004) (0.015 ± 0.004)
A
B
C
D
E
0.89
(0.035)
1.65
(0.065)
2.54
(0.100)
0.46
(0.018)
0.76
(0.030)
71
Low Inductance Capacitors
Introduction
The signal integrity characteristics of a Power Delivery
Network (PDN) are becoming critical aspects of board level
and semiconductor package designs due to higher operating
frequencies, larger power demands, and the ever shrinking
lower and upper voltage limits around low operating voltages.
These power system challenges are coming from mainstream
designs with operating frequencies of 300MHz or greater,
modest ICs with power demand of 15 watts or more, and
operating voltages below 3 volts.
The classic PDN topology is comprised of a series of
capacitor stages. Figure 1 is an example of this architecture
with multiple capacitor stages.
An ideal capacitor can transfer all its stored energy to a load
instantly. A real capacitor has parasitics that prevent
instantaneous transfer of a capacitor’s stored energy. The
true nature of a capacitor can be modeled as an RLC
equivalent circuit. For most simulation purposes, it is possible
to model the characteristics of a real capacitor with one
capacitor, one resistor, and one inductor. The RLC values in
this model are commonly referred to as equivalent series
capacitance (ESC), equivalent series resistance (ESR), and
equivalent series inductance (ESL).
The ESL of a capacitor determines the speed of energy
transfer to a load. The lower the ESL of a capacitor, the faster
that energy can be transferred to a load. Historically, there
has been a tradeoff between energy storage (capacitance)
and inductance (speed of energy delivery). Low ESL devices
typically have low capacitance. Likewise, higher capacitance
devices typically have higher ESLs. This tradeoff between
ESL (speed of energy delivery) and capacitance (energy
storage) drives the PDN design topology that places the
fastest low ESL capacitors as close to the load as possible.
Low Inductance MLCCs are found on semiconductor
packages and on boards as close as possible to the load.
Slowest Capacitors
Fastest Capacitors
Semiconductor Product
VR
Bulk
Board-Level
Package-Level
Die-Level
Low Inductance Decoupling Capacitors
Figure 1 Classic Power Delivery Network (PDN) Architecture
LOW INDUCTANCE CHIP CAPACITORS
INTERDIGITATED CAPACITORS
The key physical characteristic determining equivalent series
inductance (ESL) of a capacitor is the size of the current loop
it creates. The smaller the current loop, the lower the ESL. A
standard surface mount MLCC is rectangular in shape with
electrical terminations on its shorter sides. A Low Inductance
Chip Capacitor (LICC) sometimes referred to as Reverse
Geometry Capacitor (RGC) has its terminations on the longer
side of its rectangular shape.
When the distance between terminations is reduced, the size
of the current loop is reduced. Since the size of the current
loop is the primary driver of inductance, an 0306 with a
smaller current loop has significantly lower ESL then an 0603.
The reduction in ESL varies by EIA size, however, ESL is
typically reduced 60% or more with an LICC versus a
standard MLCC.
The size of a current loop has the greatest impact on the ESL
characteristics of a surface mount capacitor. There is a
secondary method for decreasing the ESL of a capacitor.
This secondary method uses adjacent opposing current
loops to reduce ESL. The InterDigitated Capacitor (IDC)
utilizes both primary and secondary methods of reducing
inductance. The IDC architecture shrinks the distance
between terminations to minimize the current loop size, then
further reduces inductance by creating adjacent opposing
current loops.
An IDC is one single capacitor with an internal structure that
has been optimized for low ESL. Similar to standard MLCC
versus LICCs, the reduction in ESL varies by EIA case size.
Typically, for the same EIA size, an IDC delivers an ESL that
is at least 80% lower than an MLCC.
72
REV 01
Low Inductance Capacitors
Introduction
LAND GRID ARRAY (LGA) CAPACITORS
LOW INDUCTANCE CHIP ARRAYS (LICA®)
Land Grid Array (LGA) capacitors are based on the first Low
ESL MLCC technology created to specifically address the
design needs of current day Power Delivery Networks (PDNs).
This is the 3rd low inductance capacitor technology
developed by AVX. LGA technology provides engineers with
new options. The LGA internal structure and manufacturing
technology eliminates the historic need for a device to be
physically small to create small current loops to minimize
inductance.
The first family of LGA products are 2 terminal devices. A
2 terminal 0306 LGA delivers ESL performance that is equal
to or better than an 0306 8 terminal IDC. The 2 terminal 0805
LGA delivers ESL performance that approaches the 0508
8 terminal IDC. New designs that would have used 8 terminal
IDCs are moving to 2 terminal LGAs because the layout is
easier for a 2 terminal device and manufacturing yield is better
for a 2 terminal LGA versus an 8 terminal IDC.
LGA technology is also used in a 4 terminal family of products
that AVX is sampling and will formerly introduce in 2008.
Beyond 2008, there are new multi-terminal LGA product
families that will provide even more attractive options for PDN
designers.
The LICA® product family is the result of a joint development
effort between AVX and IBM to develop a high performance
MLCC family of decoupling capacitors. LICA was introduced
in the 1980s and remains the leading choice of designers in
high performance semiconductor packages and high
reliability board level decoupling applications.
LICA® products are used in 99.999% uptime semiconductor
package applications on both ceramic and organic
substrates. The C4 solder ball termination option is the
perfect compliment to flip-chip packaging technology.
Mainframe class CPUs, ultimate performance multi-chip
modules, and communications systems that must have the
reliability of 5 9’s use LICA®.
LICA® products with either Sn/Pb or Pb-free solder balls are
used for decoupling in high reliability military and aerospace
applications. These LICA® devices are used for decoupling of
large pin count FPGAs, ASICs, CPUs, and other high power
ICs with low operating voltages.
When high reliability decoupling applications require the very
lowest ESL capacitors, LICA® products are the best option.
470 nF 0306 Impedance Comparison
1
0306 2T-LGA
0306 LICC
0306 8T-IDC
Impedance (ohms)
0603 MLCC
0.1
0.01
0.001
1
10
100
1000
Frequency (MHz)
Figure 2 MLCC, LICC, IDC, and LGA technologies deliver different levels of equivalent series inductance (ESL).
REV 01
73
Low Inductance Ceramic
Capacitors LICC
0306/0508/0612 RoHS Compliant
GENERAL DESCRIPTION
The key physical characteristic determining equivalent series
inductance (ESL) of a capacitor is the size of the current loop
it creates. The smaller the current loop, the lower the ESL.
A standard surface mount MLCC is rectangular in shape with
electrical terminations on its shorter sides. A Low Inductance
Chip Capacitor (LICC) sometimes referred to as Reverse
Geometry Capacitor (RGC) has its terminations on the longer
sides of its rectangular shape. The image on the right shows
the termination differences between an MLCC and an LICC.
When the distance between terminations is reduced, the size
of the current loop is reduced. Since the size of the current
loop is the primary driver of inductance, an 0306 with a
smaller current loop has significantly lower ESL then an
0603. The reduction in ESL varies by EIA size, however, ESL
is typically reduced 60% or more with an LICC versus a
standard MLCC.
LICC
MLCC
PERFORMANCE CHARACTERISTICS
Capacitance Tolerances
Operation
Temperature Range
AVX LICC products are available with a lead-free finish of
plated Nickel/Tin.
K = ±10%; M = ±20%
X7R = -55°C to +125°C
X5R = -55°C to +85°C
X7S = -55°C to +125°C
X7R, X5R = ±15%; X7S = ±22%
4, 6.3, 10, 16, 25 VDC
4V, 6.3V = 6.5% max; 10V = 5.0% max;
16V = 3.5% max; 25V = 3.0% max
100,000MΩ min, or 1,000MΩ per
μF min.,whichever is less
Temperature Coefficient
Voltage Ratings
Dissipation Factor
Insulation Resistance
(@+25°C, RVDC)
HOW TO ORDER
0612
Z
D
105
M
A
T
2
A*
Size
0306
0508
0612
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
Dielectric
C = X7R
D = X5R
W = X6S
Z = X7S
Capacitance
Code (In pF)
2 Sig. Digits +
Number of Zeros
Capacitance
Tolerance
K = ±10%
M = ±20%
Failure Rate
A = N/A
Terminations
T = Plated Ni
and Sn
Packaging
Available
2 = 7" Reel
4 = 13" Reel
Thickness
Thickness
mm (in)
0.56 (0.022)
0.76 (0.030)
1.02 (0.040)
1.27 (0.050)
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
TYPICAL IMPEDANCE CHARACTERISTICS
Impedance (Ohms)
10
MLCC_1206
1
0.1
LICC_0612
0.01
0.001
1
10
100
1000
Frequency (MHz)
74
041416
Low Inductance Ceramic
Capacitors LICC
0306/0508/0612 RoHS Compliant
SIZE
0306
0508
0612
Packaging
Embossed
Embossed
Embossed
0.81 ± 0.15
(0.032 ± 0.006)
1.60 ± 0.15
(0.063 ± 0.006)
1.27 ± 0.25
(0.050 ± 0.010)
2.00 ± 0.25
(0.080 ± 0.010)
1.60 ± 0.25
(0.063 ± 0.010)
3.20 ± 0.25
(0.126 ± 0.010)
mm
(in.)
mm
(in.)
Length
Width
Cap Code
WVDC4
10 16
25
16
25
50 6.3
10
16
25
50
102
Cap 0.001
A
A
A
A
S
S
S
S
V
S
S
S
S
V
222
(μF) 0.0022
A
A
A
A
S
S
S
S
V
S
S
S
S
V
332
0.0033
A
A
A
A
S
S
S
S
V
S
S
S
S
V
472
0.0047
A
A
A
A
S
S
S
S
V
S
S
S
S
V
682
0.0068
A
A
A
A
S
S
S
S
V
S
S
S
S
V
103
0.01
A
A
A
A
S
S
S
S
V
S
S
S
S
V
153
0.015
A
A
A
A
S
S
S
S
V
S
S
S
S
W
223
0.022
A
A
A
A
S
S
S
S
V
S
S
S
S
W
333
0.033
A
A
A
S
S
S
V
V
S
S
S
S
W
473
0.047
A
A
A
S
S
S
V
A
S
S
S
S
W
683
0.068
A
A
A
S
S
S
A
A
S
S
S
V
W
104
0.1
A
A
A
S
S
V
A
A
S
S
S
V
W
154
0.15
A
A
S
S
V
S
S
S
W
W
224
0.22
A
A
S
S
A
S
S
V
W
334
0.33
V
V
A
S
S
V
474
0.47
V
V
A
S
S
V
684
0.68
A
A
V
V
W
A
A
A
105
1
155
1.5
225
335
475
4.7
685
6.8
106
10
4
6.3
A
6.3 10
PHYSICAL DIMENSIONS AND
PAD LAYOUT
V
V
W
W
2.2
A
A
3.3
A
A
= X5R
mm (in.)
= X7S
mm (in.)
mm (in.)
0306
0508
0612
Code Thickness
Code Thickness
Code Thickness
0.56 (0.022)
T
L
PHYSICAL DIMENSIONS
0306
0508
0612
mm (in)
t
L
W
0.81 ± 0.15
(0.032 ± 0.006)
1.27 ± 0.25
(0.050 ± 0.010)
1.60 ± 0.25
(0.063 ± 0.010)
1.60 ± 0.15
(0.063 ± 0.006)
2.00 ± 0.25
(0.080 ± 0.010)
3.20 ± 0.25
(0.126 ± 0.010)
0.13 min.
(0.005 min.)
0.13 min.
(0.005 min.)
0.13 min.
(0.005 min.)
T - See Range Chart for Thickness and Codes
PAD LAYOUT DIMENSIONS
Solid = X7R
A
t
W
S
0.56 (0.022)
S
V
0.76 (0.030)
V
0.76 (0.030)
A
1.02 (0.040)
W
1.02 (0.040)
A
1.27 (0.050)
= X6S
0306
0508
0612
mm (in)
C
A
B
0.31 (0.012)
1.52 (0.060)
0.51 (0.020)
2.03 (0.080)
0.76 (0.030)
0.76 (0.030)
3.05 (0.120)
0.635 (0.025)
0.51 (0.020)
0.56 (0.022)
“B”
C
041416
“A”
C
75
Low Inductance Capacitors
with SnPb Terminations
LD16/LD17/LD18 Tin-Lead Termination “B”
GENERAL DESCRIPTION
The key physical characteristic determining equivalent
series inductance (ESL) of a capacitor is the size of the
current loop it creates. The smaller the current loop, the
lower the ESL.
A standard surface mount MLCC is rectangular in shape
with electrical terminations on its shorter sides. A Low
Inductance Chip Capacitor (LICC) sometimes referred to
as Reverse Geometry Capacitor (RGC) has its
terminations on the longer sides of its rectangular shape.
The image on the right shows the termination differences
between an MLCC and an LICC.
When the distance between terminations is reduced, the
size of the current loop is reduced. Since the size of the
current loop is the primary driver of inductance, an 0306
with a smaller current loop has significantly lower ESL
then an 0603. The reduction in ESL varies by EIA size,
however, ESL is typically reduced 60% or more with an
LICC versus a standard MLCC.
AVX LICC products are available with a lead termination
for high reliability military and aerospace applications that
must avoid tin whisker reliability issues.
LICC
MLCC
PERFORMANCE CHARACTERISTICS
Capacitance Tolerances
Operation
Temperature Range
Temperature Coefficient
Voltage Ratings
Dissipation Factor
Not RoHS Compliant
Insulation Resistance
(@+25°C, RVDC)
K = ±10%; M = ±20%
X7R = -55°C to +125°C
X5R = -55°C to +85°C
X7S = -55°C to +125°C
X7R, X5R = ±15%; X7S = ±22%
4, 6.3, 10, 16, 25 VDC
4V, 6.3V = 6.5% max; 10V = 5.0% max;
16V = 3.5% max; 25V = 3.0% max
100,000MΩ min, or 1,000MΩ per
μF min.,whichever is less
HOW TO ORDER
LD18
Z
D
105
M
A
Size
LD16 = 0306
LD17 = 0508
LD18 = 0612
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16V
3 = 25V
5 = 50V
Dielectric
C = X7R
D = X5R
W = X6S
Capacitance
Code (In pF)
2 Sig. Digits +
Number of Zeros
Capacitance
Tolerance
K = ±10%
M = ±20%
B
Failure Rate Terminations
A = N/A
B = 5% min lead
2
A*
Packaging
Available
2 = 7" Reel
4 = 13" Reel
Thickness
Thickness
mm (in)
0.56 (0.022)
0.76 (0.030)
1.02 (0.040)
1.27 (0.050)
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
TYPICAL IMPEDANCE CHARACTERISTICS
Impedance (Ohms)
10
MLCC_1206
1
0.1
LICC_0612
0.01
0.001
1
10
100
1000
Frequency (MHz)
76
041416
Low Inductance Capacitors
with SnPb Terminations
LD16/LD17/LD18 Tin-Lead Termination “B”
SIZE
LD16
(0306)
Packaging
mm
(in.)
mm
(in.)
Length
Width
Cap Code
WVDC
LD17
(0508)
Embossed
Embossed
0.81 ± 0.15
(0.032 ± 0.006)
1.60 ± 0.15
(0.063 ± 0.006)
1.27 ± 0.25
(0.050 ± 0.010)
2.00 ± 0.25
(0.080 ± 0.010)
6.3 10
16
25
6.3
10
16
PHYSICAL DIMENSIONS AND
PAD LAYOUT
LD18
(0612)
25
Embossed
1.60 ± 0.25
(0.063 ± 0.010)
3.20 ± 0.25
(0.126 ± 0.010)
50
6.3
10
16
50
102
Cap 0.001
A
A
A
A
S
S
S
S
V
S
S
S
S
V
222
(μF) 0.0022
A
A
A
A
S
S
S
S
V
S
S
S
S
V
332
0.0033
A
A
A
A
S
S
S
S
V
S
S
S
S
V
472
0.0047
A
A
A
A
S
S
S
S
V
S
S
S
S
V
682
0.0068
A
A
A
A
S
S
S
S
V
S
S
S
S
V
103
0.01
A
A
A
A
S
S
S
S
V
S
S
S
S
V
153
0.015
A
A
A
A
S
S
S
S
V
S
S
S
S
W
223
0.022
A
A
A
A
S
S
S
S
V
S
S
S
S
W
333
0.033
A
A
A
S
S
S
V
V
S
S
S
S
W
473
0.047
A
A
A
S
S
S
V
A
S
S
S
S
W
683
0.068
A
A
A
S
S
S
A
A
S
S
S
V
W
104
0.1
A
A
A
S
S
V
A
A
S
S
S
V
W
154
0.15
A
A
S
S
V
S
S
S
W
W
224
0.22
A
A
S
S
A
S
S
V
W
334
0.33
V
V
A
S
S
V
474
0.47
V
V
A
S
S
V
684
0.68
A
A
V
V
W
105
1
A
A
A
155
1.5
A
225
V
V
W
W
2.2
A
A
335
3.3
A
475
4.7
685
6.8
106
10
= X6S
= X5R
mm (in.)
mm (in.)
mm (in.)
LD16
(0306)
LD17
(0508)
LD18
(0612)
Code Thickness
Code Thickness
Code Thickness
0.56 (0.022)
T
L
PHYSICAL DIMENSIONS
LD16
(0306)
LD17
(0508)
LD18
(0612)
mm (in)
t
L
W
0.81 ± 0.15
(0.032 ± 0.006)
1.27 ± 0.25
(0.050 ± 0.010)
1.60 ± 0.25
(0.063 ± 0.010)
1.60 ± 0.15
(0.063 ± 0.006)
2.00 ± 0.25
(0.080 ± 0.010)
3.20 ± 0.25
(0.126 ± 0.010)
0.13 min.
(0.005 min.)
0.13 min.
(0.005 min.)
0.13 min.
(0.005 min.)
T - See Range Chart for Thickness and Codes
PAD LAYOUT DIMENSIONS
Solid = X7R
A
t
W
25
S
0.56 (0.022)
S
V
0.76 (0.030)
V
0.76 (0.030)
A
1.02 (0.040)
W
1.02 (0.040)
A
1.27 (0.050)
LD16
(0306)
LD17
(0508)
LD18
(0612)
mm (in)
C
A
B
0.31 (0.012)
1.52 (0.060)
0.51 (0.020)
0.51 (0.020)
2.03 (0.080)
0.76 (0.030)
0.76 (0.030)
3.05 (0.120)
0.635 (0.025)
0.56 (0.022)
“B”
C
041416
“A”
C
77
IDC Low Inductance Capacitors (RoHS)
0306/0612/0508 IDC (InterDigitated Capacitors)
GENERAL DESCRIPTION
0612
+
–
+
–
0508
+
–
+
–
0306
TYPICAL IMPEDANCE
10
Impedance (Ohms)
Inter-Digitated Capacitors (IDCs) are used for both semiconductor
package and board level decoupling. The equivalent series
inductance (ESL) of a single capacitor or an array of capacitors in
parallel determines the response time of a Power Delivery Network
(PDN). The lower the ESL of a PDN, the faster the response time.
A designer can use many standard MLCCs in parallel to reduce
ESL or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC
devices are available in versions with a maximum height of 0.95mm
or 0.55mm.
IDCs are typically used on packages of semiconductor products
with power levels of 15 watts or greater. Inter-Digitated Capacitors
are used on CPU, GPU, ASIC, and ASSP devices produced on
0.13μ, 90nm, 65nm, and 45nm processes. IDC devices are used
on both ceramic and organic package substrates. These low ESL
surface mount capacitors can be placed on the bottom side or the
top side of a package substrate. The low profile 0.55mm maximum
height IDCs can easily be used on the bottom side of BGA
packages or on the die side of packages under a heat spreader.
IDCs are used for board level decoupling of systems with speeds of
300MHz or greater. Low ESL IDCs free up valuable board space by
reducing the number of capacitors required versus standard
MLCCs. There are additional benefits to reducing the number of
capacitors beyond saving board space including higher reliability
from a reduction in the number of components and lower
placement costs based on the need for fewer capacitors.
The Inter-Digitated Capacitor (IDC) technology was developed by
AVX. This is the second family of Low Inductance MLCC products
created by AVX. IDCs are a cost effective alternative to AVX’s first
generation low ESL family for high-reliability applications known as
LICA (Low Inductance Chip Array).
AVX IDC products are available with a lead-free finish of plated
Nickel/Tin.
MLCC_1206
1
LICC_0612
0.1
IDC_0612
0.01
0.001
1
10
100
1000
Frequency (MHz)
HOW TO ORDER
W
Style
3
L
1
6
IDC
Low
Number Voltage
Case
Inductance
of
4 = 4V
Size
Terminals 6 = 6.3V
2 = 0508
1 = 8 Terminals Z = 10V
3 = 0612
Y = 16V
4 = 0306
3 = 25V
D
225
M
T
A
3
Dielectric Capacitance Capacitance Failure Termination Packaging
Tolerance Rate T = Plated Ni
C = X7R Code (In pF)
Available
D = X5R 2 Sig. Digits + M = ±20% A = N/A
and Sn
1=7" Reel
Number of
Z = X7S
3=13" Reel
Zeros
A
Thickness
Max. Thickness
mm (in.)
A=Standard
S=0.55 (0.022)
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
PERFORMANCE CHARACTERISTICS
Capacitance Tolerance
Operation
Temperature Range
Temperature Coefficient
Voltage Ratings
Dissipation Factor
Insulation Resistance
(@+25°C, RVDC)
78
±20% Preferred
X7R = -55°C to +125°C
X5R = -55°C to +85°C
X7S = -55°C to +125°C
±15% (0VDC), ±22% (X7S)
4, 6.3, 10, 16, 25 VDC
≤ 6.3V = 6.5% max;
10V = 5.0% max;
≥ 16V = 3.5% max
100,000MΩ min, or 1,000MΩ per
μF min.,whichever is less
Dielectric Strength
No problems observed after 2.5 x RVDC
for 5 seconds at 50mA max current
CTE (ppm/C)
12.0
Thermal Conductivity 4-5W/M K
Terminations
Available
Plated Nickel and Solder
REV 01
IDC Low Inductance Capacitors (RoHS)
0306/0612/0508 IDC (InterDigitated Capacitors)
SIZE
W4 = 0306
W2 = Thin 0508
W2 = 0508
W3= Thin 0612
W3 = 0612
W3 = THICK 0612
Max.
mm
Thickness (in.)
WVDC
Cap
(μF)
0.010
0.55
(0.022)
0.55.
(0.022)
6.3
10
16
0.95
(0.037)
6.3
10
16
0.55
(0.022)
6.3 10
0.95
(0.037)
6.3
10
16
1.22
(0.048)
6.3
10
4
6.3
4
25
4
25
4
16
4
25
4
16
0.022
0.033
0.047
0.068
0.10
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
Consult factory for
additional requirements
PHYSICAL DIMENSIONS AND PAD LAYOUT
W
= X7R
= X5R
P
= X7S
T
E
D
BW
A
B
C
BL
L
PHYSICAL CHIP DIMENSIONS
SIZE
0306
0508
0612
REV 01
PAD LAYOUT
DIMENSIONS
millimeters (inches)
W
L
BW
BL
P
1.60 ± 0.20
(0.063 ± 0.008)
2.03 ± 0.20
(0.080 ± 0.008)
3.20 ± 0.20
(0.126 ± 0.008)
0.82 ± 0.10
(0.032 ± 0.006
1.27 ± 0.20
(0.050 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.25 ± 0.10
(0.010 ± 0.004)
0.30 ± 0.10
(0.012 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.20 ± 0.10
(0.008± 0.004)
0.25 ± 0.15
(0.010± 0.006)
0.25 ± 0.15
(0.010 ± 0.006)
0.40 ± 0.05
(0.015 ± 0.002)
0.50 ± 0.05
(0.020 ± 0.002)
0.80 ± 0.10
(0.031 ± 0.004)
SIZE
A
B
C
D
E
0.38
0.89
1.27
0.20
0.40
0306 (0.015) (0.035) (0.050) (0.008) (0.015)
0.64
1.27
1.91
0.28
0.50
0508 (0.025) (0.050) (0.075) (0.011) (0.020)
0.89
1.65
2.54
0.45
0.80
0612 (0.035) (0.065) (0.010) (0.018) (0.031)
79
IDC Low Inductance Capacitors (SnPb)
0306/0612/0508 IDC with Sn/Pb Termination
GENERAL DESCRIPTION
0612
+
–
+
–
0508
+
–
+
–
0306
TYPICAL IMPEDANCE
10
Impedance (Ohms)
Inter-Digitated Capacitors (IDCs) are used for both semiconductor
package and board level decoupling. The equivalent series
inductance (ESL) of a single capacitor or an array of capacitors in
parallel determines the response time of a Power Delivery Network
(PDN). The lower the ESL of a PDN, the faster the response time.
A designer can use many standard MLCCs in parallel to reduce
ESL or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC
devices are available in versions with a maximum height of 0.95mm
or 0.55mm.
IDCs are typically used on packages of semiconductor products
with power levels of 15 watts or greater. Inter-Digitated Capacitors
are used on CPU, GPU, ASIC, and ASSP devices produced on
0.13μ, 90nm, 65nm, and 45nm processes. IDC devices are used
on both ceramic and organic package substrates. These low ESL
surface mount capacitors can be placed on the bottom side or the
top side of a package substrate. The low profile 0.55mm maximum
height IDCs can easily be used on the bottom side of BGA
packages or on the die side of packages under a heat spreader.
IDCs are used for board level decoupling of systems with speeds of
300MHz or greater. Low ESL IDCs free up valuable board space by
reducing the number of capacitors required versus standard
MLCCs. There are additional benefits to reducing the number of
capacitors beyond saving board space including higher reliability
from a reduction in the number of components and lower
placement costs based on the need for fewer capacitors.
The Inter-Digitated Capacitor (IDC) technology was developed by
AVX. This is the second family of Low Inductance MLCC products
created by AVX. IDCs are a cost effective alternative to AVX’s first
generation low ESL family for high-reliability applications known as
LICA (Low Inductance Chip Array).
AVX IDC products are available with a lead termination for high
reliability military and aerospace applications that must avoid tin
whisker reliability issues.
MLCC_1206
1
LICC_0612
0.1
IDC_0612
0.01
0.001
1
10
100
1000
Frequency (MHz)
Not RoHS Compliant
HOW TO ORDER
L
3
L
1
6
D
225
M
B
A
3
Voltage Dielectric Capacitance Capacitance Failure Termination Packaging
Tolerance Rate B = 5% min.
C = X7R Code (In pF)
Available
4 = 4V
Lead
1=7" Reel
6 = 6.3V D = X5R 2 Sig. Digits + M = ±20% A = N/A
Number of
3=13" Reel
Z = 10V Z = X7S
Zeros
Y = 16V
3 = 25V
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
Style
IDC
Low
Number
Case
Inductance
of
Size
Terminals
2 = 0508
1 = 8 Terminals
3 = 0612
4 = 0306
A
Thickness
Max. Thickness
mm (in.)
A=Standard
S=0.55 (0.022)
PERFORMANCE CHARACTERISTICS
Capacitance Tolerance
Operation
Temperature Range
Temperature Coefficient
Voltage Ratings
Dissipation Factor
Insulation Resistance
(@+25°C, RVDC)
80
±20% Preferred
X7R = -55°C to +125°C
X5R = -55°C to +85°C
X7S = -55°C to +125°C
±15% (0VDC), ±22% (X7S)
4, 6.3, 10, 16, 25 VDC
≤ 6.3V = 6.5% max;
10V = 5.0% max;
≥ 16V = 3.5% max
100,000MΩ min, or 1,000MΩ per
μF min.,whichever is less
Dielectric Strength
No problems observed after 2.5 x RVDC
for 5 seconds at 50mA max current
CTE (ppm/C)
12.0
Thermal Conductivity 4-5W/M K
Terminations
Available
Plated Nickel and Solder
REV 01
IDC Low Inductance Capacitors (SnPb)
0306/0612/0508 IDC with Sn/Pb Termination
SIZE
W4 = 0306
W2 = Thin 0508
W2 = 0508
W3= Thin 0612
W3 = 0612
W3 = THICK 0612
Max.
mm
Thickness (in.)
WVDC
Cap
(μF)
0.010
0.55
(0.022)
0.55.
(0.022)
6.3
10
16
0.95
(0.037)
6.3
10
16
0.55
(0.022)
6.3 10
0.95
(0.037)
6.3
10
16
1.22
(0.048)
6.3
10
4
6.3
4
25
4
25
4
16
4
25
4
16
0.022
0.033
0.047
0.068
0.10
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
Consult factory for
additional requirements
PHYSICAL DIMENSIONS AND PAD LAYOUT
W
= X7R
= X5R
P
= X7S
T
E
D
BW
A
B
C
BL
L
PHYSICAL CHIP DIMENSIONS
SIZE
0306
0508
0612
REV 01
PAD LAYOUT
DIMENSIONS
millimeters (inches)
W
L
BW
BL
P
1.60 ± 0.20
(0.063 ± 0.008)
2.03 ± 0.20
(0.080 ± 0.008)
3.20 ± 0.20
(0.126 ± 0.008)
0.82 ± 0.10
(0.032 ± 0.006
1.27 ± 0.20
(0.050 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.25 ± 0.10
(0.010 ± 0.004)
0.30 ± 0.10
(0.012 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.20 ± 0.10
(0.008± 0.004)
0.25 ± 0.15
(0.010± 0.006)
0.25 ± 0.15
(0.010 ± 0.006)
0.40 ± 0.05
(0.015 ± 0.002)
0.50 ± 0.05
(0.020 ± 0.002)
0.80 ± 0.10
(0.031 ± 0.004)
SIZE
A
B
C
D
E
0.38
0.89
1.27
0.20
0.40
0306 (0.015) (0.035) (0.050) (0.008) (0.015)
0.64
1.27
1.91
0.28
0.50
0508 (0.025) (0.050) (0.075) (0.011) (0.020)
0.89
1.65
2.54
0.45
0.80
0612 (0.035) (0.065) (0.010) (0.018) (0.031)
81
LGA Low Inductance Capacitors
0204/0306/0805 Land Grid Array
Land Grid Array (LGA) capacitors are the latest family of low inductance MLCCs from AVX.
These new LGA products are the third low inductance family developed by AVX. The innovative LGA technology sets a new standard for low inductance MLCC performance.
Our initial 2 terminal versions of LGA technology deliver the performance of an 8 terminal
IDC low inductance MLCC with a number of advantages including:
• Simplified layout of 2 large solder pads compared to 8 small pads for IDCs
• Opportunity to reduce PCB or substrate contribution to system ESL by using multiple parallel vias in solder pads
• Advanced FCT manufacturing process used to create uniformly flat terminations on
the capacitor that resist “tombstoning”
• Better solder joint reliability
APPLICATIONS
Semiconductor Packages
• Microprocessors/CPUs
• Graphics Processors/GPUs
• Chipsets
• FPGAs
• ASICs
Board Level Device Decoupling
• Frequencies of 300 MHz or more
• ICs drawing 15W or more
• Low voltages
• High speed buses
0306 2 TERMINAL LGA COMPARISON WITH 0306 8 TERMINAL IDC
Impedance (Ω)
1
0.1
0.01
0.001
1
10
100
1000
Frequency (MHz)
82
011116
LGA Low Inductance Capacitors
0204/0306/0805 Land Grid Array
SIZE
LG12 (0204)
Length
mm (in.)
Width
mm (in.)
Temp. Char.
Working Voltage
0.50 (0.020)
1.00 (0.039)
X7S (Z)
6.3
4
(6)
(4)
Cap (μF)
X5R (D)
6.3
4
(6)
(4)
LG22 (0306)
X6S (W)
6.3
4
(6)
(4)
10
(Z)
X7R (C)
6.3
4
(6)
(4)
LGC2 (0805)
0.76 (0.030)
1.60 (0.063)
X5R (D)
X7S (Z)
6.3
4
6.3
4
(6)
(4)
(6)
(4)
X6S (W)
6.3
4
(6)
(4)
X7R (C)
6.3
4
(6)
(4)
2.06 (0.081)
1.32 (0.052)
X5R (D)
X7S (Z)
6.3
4
6.3
4
(6)
(4)
(6)
(4)
X6S (W)
6.3
4
(6)
(4)
0.010 (103)
0.022 (223)
0.047 (473)
0.100 (104)
0.220 (224)
0.330 (334)
0.470 (474)
1.000 (105)
2.200 (225)
= X7R
= X5R
= X7S
= X6S
HOW TO ORDER
LG
Style
1
2
6
Case Number of
Size
Terminals
1 = 0204
2
2 = 0306
C = 0805
Z
104
M
A
T
2
Working Temperature Coded
Cap
Termination Termination
Voltage Characteristic Cap Tolerance
Style
100% Sn*
4 = 4V
C = X7R
M = 20% A = “U” Land *Contact factory for
6 = 6.3V
D = X5R
other termination
Z = 10V
Z = X7S
finishes
W = X6S
L
T
iew
pV
BL
Top
T
Sid
e2
e1
Sid
Sid
w
Vie
e1
BL
BW
L
W
mm (inches)
Series
L
W
T
BW
BL
LG12 (0204)
0.5 ± 0.05
(0.020±0.002)
0.76 ± 0.10
(0.030 ± 0.004)
2.06 ± 0.10
(0.081 ± 0.004)
1.00 ± 0.10
(0.039 ± 0.004)
1.60 ± 0.10
(0.063 ± 0.004)
1.32 ± 0.10
(0.052 ± 0.004)
0.50 ± 0.05
(0.020 ± 0.002)
0.50 ± 0.05
(0.020 ± 0.002)
0.50 ± 0.05
(0.020 ± 0.002)
0.8 ± 0.10
(0.031 ± 0.004)
1.50 ±0.10
(0.059 ± 0.004)
1.14 ± 0.10
(0.045 ± 0.004)
0.13 ± 0.08
(0.005 ± 0.003)
0.28 ± 0.08
(0.011 ± 0.003)
0.90 ±0.08
(0.035 ± 0.003)
RECOMMENDED SOLDER PAD DIMENSIONS
G
PW1
011116
e2
Sid
BL
L
PART DIMENSIONS
PL
Standard
Geometry LGA
LGC2
To
W
LGC2 (0805)
Number of
Capacitors
BL
BW
LG22 (0306)
1
Packaging
Thickness
Tape & Reel S = 0.55mm
2 = 7" Reel
max
4 = 13" Reel
Reverse
Geometry LGA
LG12, LG22
L
S
mm (inches)
Series
PL
PW1
G
LG12 (0204)
LG22 (0306)
LGC2 (0805)
0.50 (0.020)
0.65 (0.026)
1.25 (0.049)
1.00 (0.039)
1.50 (0.059)
1.40 (0.055)
0.20 (0.008)
0.20 (0.008)
0.20 (0.008)
83
LGA Low Inductance Capacitors
0204/0306/0805 Land Grid Array – Tin/Lead Termination “B”
SIZE
PG12 (0204)
Length
mm (in.)
Width
mm (in.)
Temp. Char.
Working Voltage
0.50 (0.020)
1.00 (0.039)
X7S (Z)
6.3
4
(6)
(4)
Cap (μF)
X5R (D)
6.3
4
(6)
(4)
PG22 (0306)
X6S (W)
6.3
4
(6)
(4)
10
(Z)
PGC2 (0805)
0.76 (0.030)
1.60 (0.063)
X5R (D)
X7S (Z)
6.3
4
6.3
4
(6)
(4)
(6)
(4)
X7R (C)
6.3
4
(6)
(4)
X6S (W)
6.3
4
(6)
(4)
X7R (C)
6.3
4
(6)
(4)
2.06 (0.081)
1.32 (0.052)
X5R (D)
X7S (Z)
6.3
4
6.3
4
(6)
(4)
(6)
(4)
X6S (W)
6.3
4
(6)
(4)
0.010 (103)
0.022 (223)
0.047 (473)
0.100 (104)
0.220 (224)
0.330 (334)
0.470 (474)
1.000 (105)
2.200 (225)
= X7R
= X5R
= X7S
= X6S
HOW TO ORDER
PG
Style
1
2
6
Z
104
M
A
B
2
Working Temperature Coded
Cap
Termination Termination Packaging
Thickness Number of
Voltage Characteristic Cap Tolerance
Style
5% Min Lead Tape & Reel S = 0.55mm Capacitors
4 = 4V
C = X7R
M = 20% A = “U” Land
2 = 7" Reel
max
6 = 6.3V
D = X5R
4 = 13" Reel
Z = 10V
Z = X7S
W = X6S
Not RoHS Compliant
Case Number of
Size
Terminals
1 = 0204
2
2 = 0306
C = 0805
Reverse
Reverse
GeometryLGA
LGA
Geometry
PG12, LG22
PG22
LG12,
L
T
iew
pV
BL
L
Top
T
Sid
e2
e1
Sid
Sid
e1
BL
BW
L
W
mm (inches)
Series
L
W
T
BW
BL
PG12 (0204)
0.5 ± 0.05
(0.020±0.002)
0.76 ± 0.10
(0.030 ± 0.004)
2.06 ± 0.10
(0.081 ± 0.004)
1.00 ± 0.10
(0.039 ± 0.004)
1.60 ± 0.10
(0.063 ± 0.004)
1.32 ± 0.10
(0.052 ± 0.004)
0.50 ± 0.05
(0.020 ± 0.002)
0.50 ± 0.05
(0.020 ± 0.002)
0.50 ± 0.05
(0.020 ± 0.002)
0.8 ± 0.10
(0.031 ± 0.004)
1.50 ±0.10
(0.059 ± 0.004)
1.14 ± 0.10
(0.045 ± 0.004)
0.13 ± 0.08
(0.005 ± 0.003)
0.28 ± 0.08
(0.011 ± 0.003)
0.90 ±0.08
(0.035 ± 0.003)
RECOMMENDED SOLDER PAD DIMENSIONS
PL
G
PW1
e2
Sid
BL
L
PART DIMENSIONS
84
w
Vie
To
W
PGC2 (0805)
Standard
Standard
Geometry LGA
Geometry LGA
PGC2
LGC2
BL
BW
PG22 (0306)
1
S
mm (inches)
Series
PL
PW1
G
PG12 (0204)
PG22 (0306)
PGC2 (0805)
0.50 (0.020)
0.65 (0.026)
1.25 (0.049)
1.00 (0.039)
1.50 (0.059)
1.40 (0.055)
0.20 (0.008)
0.20 (0.008)
0.20 (0.008)
01116
Low Inductance Capacitors
LICA® (Low Inductance Decoupling Capacitor Arrays)
LICA® arrays utilize up to four separate capacitor sections in one ceramic body (see
Configurations and Capacitance Options). These designs exhibit a number of technical
advancements:
Low Inductance features–
Low resistance platinum electrodes in a low aspect ratio pattern
Double electrode pickup and perpendicular current paths
C4 “flip-chip” technology for minimal interconnect inductance
HOW TO ORDER
LICA
3
T
Style
&
Size
Voltage
5V = 9
10V = Z
25V = 3
102
M
F
3
Dielectric Cap/Section Capacitance Height
D = X5R
(EIA Code)
Tolerance
Code
T = T55T 102 = 1000 pF M = ±20% 6 = 0.500mm
S = High K 103 = 10 nF
P = GMV 3 = 0.650mm
T55T 104 = 100 nF
1 = 0.875mm
5 = 1.100mm
7 = 1.600mm
NOTE: Contact factory for availability of Termination
and Tolerance Options for Specific Part Numbers.
TABLE 1
Typical Parameters
T55T/S55S
Termination
F = C4 Solder
Balls- 97Pb/3Sn
H = C4 Solder Balls
Low ESR
G = Lead Free SAC
R = Cr-Cu-Au
N = Cr-Ni-Au
V = Eutectic LeadTin Bump37%Pb/63%Sn
X = None
Units
Co
Capacitance, 25°C
1.45 x Co
Capacitance, 55°C
0.7 x Co
Capacitance, 85°C
15
Dissipation Factor 25°
20
ESR (Nominal)
0.2
DC Resistance
300
IR (Minimum @25°) (Design Dependent)
500
Dielectric Breakdown, Min
8.5
Thermal Coefficient of Expansion
30
Inductance: (Design Dependent) (Nominal)
DC to 5 Gigahertz
Frequency of Operation
-55° to 125°C
Ambient Temp Range
Nanofarads
Nanofarads
Nanofarads
Percent
Milliohms
Ohms
Megaohms
Volts
ppm/°C 25-100°
Pico-Henries
4
A
A
# of
Inspection
Code
Reel Packaging
Caps/Part
Code
Face
M = 7" Reel
1 = one A = Standard
A = Bar
R = 13" Reel
B = No Bar
6 = 2"x2" Waffle Pack 2 = two B = COTS+
8 = 2"x2" Black Waffle 4 = four X = MIL-PRF-123 C = Dot, S55S
Dielectrics
Pack
D = Triangle
7 = 2"x2" Waffle Pack
w/ termination
facing up
A = 2"x2" Black Waffle
Pack
w/ termination
facing up
C = 4"x4" Waffle Pack
w/ clear lid
TERMINATION OPTIONS
SOLDER BALLS
TERMINATION OPTION F, H, G OR V
SOLDER BALL AND PAD DIMENSIONS
0.8 ±.03 (2 pics)
0.6 ±.100mm
C
} “Centrality”*
0.925 ±0.03mm
L = ±.06mm
0.925 ±0.03mm
Vertical and
Horizontal
Pitch=0.4 ±.02mm
Code Face
to Denote
Orientation
(Optional)
C4 Ball diameter:
.164 ±.03mm
"Ht" = (Hb +.096 ±.02mm typ)
"Hb" ±.06
"W" = ±.06mm
Pin A1 is the lower left hand ball.
*NOTE: The C4 pattern
will be within
0.1mm of the
center of the
LICA body, in
both axes.
Code
(Body Height)
Width
(W)
Length
(L)
Height
Body (Hb)
1
3
5
6
7
1.600mm
1.600mm
1.600mm
1.600mm
1.600mm
1.850mm
1.850mm
1.850mm
1.850mm
1.850mm
0.875mm
0.650mm
1.100mm
0.500mm
1.600mm
TERMINATION OPTION R OR N
85
Low Inductance Capacitors
LICA® (Low Inductance Decoupling Capacitor Arrays)
TEMPERATURE VS CAPACITANCE CHANGE
TYPICAL S21 FOR LICA AT SINGLE VIA
Maximum
+45%
0
LICA T55T/S55S
CERAMIC
linear1.sch1.DB[S21]
Capacitance Change
-14
0%
-28
-42
Maximum
-30%
-56
-70
25°C
50°C
60°C
3
85°C
30
300
3000
Freq (MHz)
LICA COMMON PART NUMBER LIST
Part Number
LICA3T193M3FC4AA
LICA3T153P3FC4AA
LICA3T134M1FC1AA
LICA3T104P1FC1AA
LICA3T333M1FC4AA
LICA3T263P3FC4AA
LICA3T244M5FC1AA
LICA3T194P5FC1AA
LICA3T394M7FC1AB
LICA3T314P7FC1AB
Extended Range
LICAZT623M3FC4AB
LICA3T104M3FC1A
LICA3T803P3FC1A
LICA3T423M3FC2A
LICA3T333P3FC2A
LICA3S253M3FC4A
LICAZD753M3FC4AD
LICAZD504M3FC1AB
LICAZD604M7FC1AB
LICA3D193M3FC4AB
Voltage
Thickness (mm)
25
25
25
25
25
25
25
25
25
25
0.650
0.650
0.875
0.875
0.875
0.650
1.100
1.100
1.600
1.600
10
25
25
25
25
25
10
10
10
25
CONFIGURATION
Capacitors per
Package
4
4
1
1
4
4
1
1
1
1
0.650
0.650
0.650
0.650
0.650
0.650
0.650
0.650
1.600
0.650
4
1
1
2
2
4
4
1
1
4
Schematic
D
D
CAP
C
B1
A1
B1
D1
C1
B1
A1
D2
C2
B2
A2
CAP 2
A2
C2
D2
CAP 1
Code Face
B2
CAP 2
C1
A1
C2
A2
D3
B3
D4
B4
CAP 3
A3
A
Code Face
Schematic
D1
B
B2
D2
CAP 1
C1
C
A
Schematic
D1
C3
WAFFLE PACK OPTIONS FOR LICA®
Code Face
B
D1
C1
B1
A1
D2
C2
B2
A2
D3
C3
B3
A3
D4
C4
B4
A4
CAP 4
C4
A4
LICA® PACKAGING SCHEME “M” AND “R”
8mm conductive plastic tape on reel:
“M”=7" reel max. qty. 3,000, “R”=13" reel max. qty. 8,000
FLUOROWARE®
Code Face
to Denote
Orientation
Code Face
to Denote
Orientation
Wells for LICA® part, C4 side down
76 pieces/foot
1.75mm x 2.01mm x 1.27mm deep
on 4mm centers
0.64mm Push Holes
H20-080
Option "6"
100 pcs.
per 2" x 2"
package
Note: Standard configuration is
Termination side down
86
Option "C"
400 pcs. per
4" x 4" package
Code Face
to Denote
Orientation
(Typical)
1.75mm
Sprocket Holes: 1.55mm, 4mm pitch
AT Series
High Temperature MLCC – 200ºC & 250°C Rated
Present military specifications, as well as a majority of commercial applications, require a maximum operating temperature of 125°C. However,
the emerging market for high temperature electronics demands capacitors operating reliably at temperatures beyond 125°C. AVX’s new high
temperature chip capacitor product line, with verified capability of longterm operation up to 250°C is a response to both military and commercial business needs. The new capacitors demonstrate high current
handling capabilities, high volumetric efficiency, high insulation resistance
and low ESR/ESL. This product has been designed for the most demanding applications, such as “down-hole” oil exploration and aerospace
programs.
HOW TO ORDER
AT10
3
AVX
Style
AT03 = 0603
AT05 = 0805
AT06 = 1206
AT10 = 1210
AT12 = 1812
AT14 = 2225
Voltage
Code
16V = Y
25V = 3
50V = 5
T
104
K
A
T
2
Temperature Capacitance Code Capacitance Test Level
Termination
Packaging
Coefficient
(2 significant digits
Tolerance
A = Standard 1 = Pd/Ag
2 = 7" Reel
C0G 250ºC = A
+ no. of zeros)
J = ±5%
T = 100% Sn Plated 4 = 13" Reel
(RoHS Compliant) 9 = Bulk
C0G 200ºC = 2
101 = 100pF
K = ±10%
VHT 250ºC = T
102 = 1nF
M = ±20%
VHT 200ºC = 4
103 = 10nF
104 = 100nF
105 = 1μF
A
Special
Code
A = Standard
ELECTRICAL SPECIFICATIONS
Temperature Coefficient
C0G: A 0±30 ppm/°C, -55°C to +250°C
VHT: T ±15%, -55°C to +150°C
See TCC Plot for +250°C
Insulation Resistance 125°C (MIL-STD-202, Method 302)
10GΩ or 100MΩ.μF (whichever is less)
Insulation Resistance 200°C (MIL-STD-202, Method 302)
1GΩ or 10MΩ.μF (whichever is less)
Capacitance Test (MIL-STD-202, Method 305)
25°C, 1.0 ± 0.2 Vrms (open circuit voltage) @ 1kHz
Dissipation factor 25°C
C0G: 0.15% Max at 1.0 ± 0.2 Vrms (open circuit voltage) @ 1kHz
VHT: 2.5% Max at 1.0 ± 0.2 Vrms (open circuit voltage) @ 1kHz
Insulation Resistance 250°C (MIL-STD-202, Method 302)
100MΩ or 1MΩ.μF (whichever is less)
Direct Withstanding Voltage 25°C (Flash Test)
250% rated voltage for 5 seconds with 50mA max charging current
(500 Volt units @ 750VDC)
Insulation Resistance 25°C (MIL-STD-202, Method 302)
100GΩ or 1000MΩ.μF (whichever is less)
DIMENSIONS
millimeters (inches)
W
L
T
Size
(L) Length
AT03 = 0603 AT05 = 0805
AT06 = 1206 AT10 = 1210
AT12 = 1812 AT14 = 2225
1.60 ± 0.15
2.01 ± 0.20
3.20 ± 0.20
3.20 ± 0.20
4.50 ± 0.30
5.72 ± 0.25
(0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.177 ± 0.012) (0.225 ± 0.010)
(W) Width
0.81 ± 0.15
1.25 ± 0.20
1.60 ± 0.20
2.50 ± 0.20
3.20 ± 0.20
6.35 ± 0.25
(0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.126 ± 0.008) (0.250 ± 0.010)
(T) Thickness
1.02
1.30
1.52
1.70
2.54
2.54
Max.
(0.040)
(0.051)
(0.060)
(0.067)
(0.100)
(0.100)
(t) terminal min. 0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
max. 0.75 (0.030)
0.75 (0.030)
0.75 (0.030)
0.75 (0.030)
1.02 (0.040)
1.02 (0.040)
t
REV 02
87
AT Series
High Temperature MLCC – 200ºC & 250°C Rated
PERFORMANCE CHARACTERISTICS
Typical Temperature Coefficient of Capacitance (C0G Dielectric)
Typical Temperature Coefficient of Capacitance (VHT Dielectric)
15
1
0.8
0.6
-13.75
+30ppm/ºC TTC Limit
C (%)
C (%)
0.4
-42.5
0.2
0
-0.2
-0.4
-71.25
-30ppm/ºC TTC Limit
-0.6
-0.8
-100
-50
-25
0
25
50
75
100
125
150
175
200
225
250
-1
-50
-25
0
25
50
75
Temperature (°C)
100
125
150
175
200
225
250
Temperature (°C)
Typical Voltage Coefficient of Capacitance (C0G Dielectric)
Typical Voltage Coefficient of Capacitance (VHT Dielectric)
1
5
0.8
-5
-10
Legend:
Capacitor’s Rated
Voltage
0.6
16VDC
25VDC
50VDC
100VDC
200VDC
0.2
0.4
C (%)
C (%)
0
0
-0.2
-0.4
-15
-0.6
-0.8
-20
0
10
20
30
40
50
60
70
80
90
-1
100
0
10
20
Percentage of Rated Voltage
30
40
50
60
70
80
90
100
225
250
Percentage of Rated Voltage
Typical RC vs Temperature (C0G Dielectric)
Typical RC vs Temperature (VHT Dielectric)
1000000
10000
100000
1000
RC (Ω*F)
RC (Ω*F)
10000
100
1000
100
10
10
1
1
25
50
75
100
125
150
Temperature (°C)
88
175
200
225
250
25
50
75
100
125
150
175
200
Temperature (°C)
REV 02
AT Series
High Temperature MLCC – 200ºC & 250°C Rated
RELIABILITY
250°C Life Test @ 2x Rated Voltage (VHT Dielectric)
250°C Life Test @ 2x Rated Voltage (C0G Dielectric)
48000
AT05YT104
AT103T104
AT123T334
AT143T105
0.825
0.55
0.275
Capacitance (pF)
Capacitance ( F)
1.1
36000
AT143A473
AT123A123
24000
12000
0
0
0
250
500
750
0
1000
250
500
750
1000
Time (hrs)
Time (hrs)
VHT - Failure Rate @ 90% Confidence Level (%/1000 hours)
Temperature (°C)
50% Rated Voltage
100% Rated Voltage
200
0.002
0.017
250
0.026
0.210
*Typical 1210, 1812, 2225 Failure Rate Analysis based on 250°C testing and
voltage ratings specified on the following page.
C0G - Failure Rate @ 90% Confidence Level (%/1000 hours)
Temperature (°C)
50% Rated Voltage
100% Rated Voltage
200
0.006
0.047
250
0.074
0.590
*Typical 1812 and 2225 Failure Rate Analysis based on 250°C testing and voltage ratings specified on the following page.
FREQUENCY RESPONSE
Impedance Frequency Response (C0G Dielectric)
Impedance Frequency Response (VHT Dielectric)
1E+06
1E+05
AT05YT104
AT123T334
AT143T105
1E+02
1E+01
1E+00
1E-01
1E-02
1E+01
)
1E+03
AT43A473
AT123A123
1E+05
1E+04
Impedance (
Impedance (
)
1E+04
1E+03
1E+02
1E+01
1E+00
1E-01
1E+02
1E+03
1E+04
1E+05
1E+06
1E+07
1E+08
1E-02
1E+01
1E+02
1E+03
1E+04
1E+05
1E+06
1E+07
Frequency (Hz)
Frequency (Hz)
ESR Frequency Response (VHT Dielectric)
ESR Frequency Response (C0G Dielectric)
1E+08
1E+03
1E+03
AT05YT104
AT123T334
AT143T105
1E+02
AT43A473
AT123A123
1E+02
)
ESR (
ESR (
)
1E+01
1E+01
1E+00
1E-01
1E-01
1E-02
1E+01
1E-02
1E+02
1E+03
1E+04
1E+05
Frequency (Hz)
REV 02
1E+00
1E+06
1E+07
1E+08
1E-03
1E+01
1E+02
1E+03
1E+04
1E+05
1E+06
1E+07
1E+08
Frequency (Hz)
89
AT Series
High Temperature MLCC – 200ºC & 250°C Rated
CAPACITANCE RANGE
PREFERRED SIZES ARE SHADED
VHT
Temp. Coefficient: 4
Case Size
Soldering
(L) Length
mm
(in.)
(W) Width
mm
(in.)
(T) Thickness mm
(in.)
(t) Terminal
min
max
Rated Temp. (ºC)
Temp. Coefficeint
Voltage (V)
Cap 1000 102
(pF) 1200 122
1500 152
1800 182
2200 222
2700 272
3300 332
3900 392
4700 472
5600 562
6800 682
8200 822
Cap 0.010 103
(μF) 0.012 123
0.015 153
0.018 183
0.022 223
0.027 273
0.033 333
0.039 393
0.047 473
0.056 563
0.068 683
0.082 823
0.100 104
0.120 124
0.150 154
0.180 184
0.220 224
0.270 274
0.330 334
0.390 394
0.470 474
0.560 564
0.680 684
0.820 824
1.000 105
Voltage (V)
Rated Temp. (ºC)
Case Size
200ºC Rated
AT03 = 0603 AT05 = 0805
AT06 = 1206 AT10 = 1210
AT12 = 1812 AT14 = 2225
Reflow/Wave
Reflow/Wave
Reflow/Wave
Reflow Only
Reflow Only
Reflow Only
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
1.02
(0.040)
0.25 (0.010)
0.75 (0.030)
200
4
25
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
1.30
(0.051)
0.25 (0.010)
0.75 (0.030)
200
4
25
50
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
1.52
(0.060)
0.25 (0.010)
0.75 (0.030)
200
4
25
50
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
1.70
(0.067)
0.25 (0.010)
0.75 (0.030)
200
4
25
50
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
200
4
50
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
200
4
50
50
200
50
200
25
200
25
50
200
AT03 = 0603 AT05 = 0805
25
50
200
AT06 = 1206
25
50
200
AT10 = 1210 AT12 = 1812 AT14 = 2225
Voltage rating per table. Capacitance values specified at 25ºC, derate capacitance value based on TCC and VCC Plots on page 2.
NOTE: Contact factory for non-specified capacitance values.
90
REV 02
AT Series
High Temperature MLCC – 200ºC & 250°C Rated
CAPACITANCE RANGE
PREFERRED SIZES ARE SHADED
VHT
Temp. Coefficient: T
Case Size
Soldering
(L) Length
mm
(in.)
(W) Width
mm
(in.)
(T) Thickness mm
(in.)
(t) Terminal
min
max
Rated Temp. (ºC)
Temp. Coefficeint
Voltage (V)
Cap 1000 102
(pF) 1200 122
1500 152
1800 182
2200 222
2700 272
3300 332
3900 392
4700 472
5600 562
6800 682
8200 822
Cap 0.010 103
(μF) 0.012 123
0.015 153
0.018 183
0.022 223
0.027 273
0.033 333
0.039 393
0.047 473
0.056 563
0.068 683
0.082 823
0.100 104
0.120 124
0.150 154
0.180 184
0.220 224
0.270 274
0.330 334
0.390 394
0.470 474
0.560 564
0.680 684
0.820 824
1.000 105
Voltage (V)
Rated Temp. (ºC)
Case Size
250ºC Rated
AT03 = 0603 AT05 = 0805
AT06 = 1206 AT10 = 1210 AT12 = 1812 AT14 = 2225
Reflow/Wave
Reflow/Wave
Reflow/Wave
Reflow Only
Reflow Only
Reflow Only
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
1.02
(0.040)
0.25 (0.010)
0.75 (0.030)
250
T
16
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
1.30
(0.051)
0.25 (0.010)
0.75 (0.030)
250
T
16
25
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
1.52
(0.060)
0.25 (0.010)
0.75 (0.030)
250
T
16
25
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
1.70
(0.067)
0.25 (0.010)
0.75 (0.030)
250
T
16
25
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
250
T
25
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
250
T
25
25
250
25
250
16
250
16
25
250
AT03 = 0603 AT05 = 0805
16
25
250
AT06 = 1206
16
25
250
AT10 = 1210 AT12 = 1812 AT14 = 2225
Voltage rating per table. Capacitance values specified at 25ºC, derate capacitance value based on TCC and VCC Plots on page 2.
NOTE: Contact factory for non-specified capacitance values.
REV 02
91
AT Series
High Temperature MLCC – 200ºC & 250°C Rated
CAPACITANCE RANGE
PREFERRED SIZES ARE SHADED
C0G
Temp. Coefficient: 2
Case Size
Soldering
(L) Length
mm
(in.)
(W) Width
mm
(in.)
(T) Thickness mm
(in.)
(t) Terminal
min
max
Rated Temp. (ºC)
Temp. Coefficeint
Voltage (V)
Cap
100 101
(pF)
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
820 821
1000 102
1200 122
1500 152
1800 182
2200 222
2700 272
3300 332
3900 392
4700 472
5600 562
6800 682
8200 822
Cap 0.010 103
(μF) 0.012 123
0.015 153
0.018 183
0.022 223
0.027 273
0.033 333
0.039 393
0.047 473
0.056 563
0.068 683
0.082 823
0.100 104
Voltage (V)
Rated Temp. (ºC)
Case Size
C0G
200ºC Rated
AT05 = 0805 AT06 = 1206
AT10 = 1210 AT12 = 1812
AT14 = 2225
Reflow/Wave
Reflow/Wave
Reflow Only
Reflow Only
Reflow Only
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
1.30
(0.051)
0.25 (0.010)
0.75 (0.030)
200
2
50
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
1.52
(0.060)
0.25 (0.010)
0.75 (0.030)
200
2
50
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
1.70
(0.067)
0.25 (0.010)
0.75 (0.030)
200
2
50
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
200
2
50
2.75 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
200
2
50
50
200
50
200
50
200
50
200
50
200
AT05 = 0805 AT06 = 1206
AT10 = 1210
AT12 = 1812 AT14 = 2225
Temp. Coefficient: A
Case Size
Soldering
(L) Length
mm
(in.)
(W) Width
mm
(in.)
(T) Thickness mm
(in.)
(t) Terminal
min
max
Rated Temp. (ºC)
Temp. Coefficeint
Voltage (V)
Cap
100 101
(pF)
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
820 821
1000 102
1200 122
1500 152
1800 182
2200 222
2700 272
3300 332
3900 392
4700 472
5600 562
6800 682
8200 822
Cap 0.010 103
(μF) 0.012 123
0.015 153
0.018 183
0.022 223
0.027 273
0.033 333
0.039 393
0.047 473
0.056 563
0.068 683
0.082 823
0.100 104
Voltage (V)
Rated Temp. (ºC)
Case Size
250ºC Rated
AT05 = 0805 AT06 = 1206
AT10 = 1210 AT12 = 1812
AT14 = 2225
Reflow/Wave
Reflow/Wave
Reflow Only
Reflow Only
Reflow Only
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
1.30
(0.051)
0.25 (0.010)
0.75 (0.030)
250
A
25
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
1.52
(0.060)
0.25 (0.010)
0.75 (0.030)
250
A
25
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
1.70
(0.067)
0.25 (0.010)
0.75 (0.030)
250
A
25
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
250
A
25
2.75 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
250
A
25
25
250
25
250
25
250
25
250
25
250
AT05 = 0805 AT06 = 1206
AT10 = 1210
AT12 = 1812 AT14 = 2225
Voltage rating per table. Capacitance values specified at 25ºC, derate capacitance value based on TCC and VCC Plots on page 2.
NOTE: Contact factory for non-specified capacitance values.
92
REV 02
High Voltage MLC Chips
For 600V to 5000V Applications
High value, low leakage and small size are difficult parameters to obtain in
capacitors for high voltage systems. AVX special high voltage MLC chip
capacitors meet these performance characteristics and are designed for
applications such as snubbers in high frequency power converters,
resonators in SMPS, and high voltage coupling/dc blocking. These high
voltage chip designs exhibit low ESRs at high frequencies.
Larger physical sizes than normally encountered chips are used to make
high voltage MLC chip products. Special precautions must be taken in
applying these chips in surface mount assemblies. The temperature
gradient during heating or cooling cycles should not exceed 4ºC per
second. The preheat temperature must be within 50ºC of the peak
temperature reached by the ceramic bodies through the soldering process.
Chip sizes 1210 and larger should be reflow soldered only. Capacitors may
require protective surface coating to prevent external arcing.
For 1825, 2225 and 3640 sizes, AVX offers leaded version in either
thru-hole or SMT configurations (for details see section on high voltage
leaded MLC chips).
NEW 630V RANGE
HOW TO ORDER
1808
AVX
Style
0805
1206
1210
1808
1812
1825
2220
2225
3640
***
A
A
271
K
A
1
2
A
Voltage
Temperature Capacitance Code Capacitance
Test Level
Termination*
Packaging
Special
600V/630V = C
Coefficient
(2 significant digits
Tolerance
A = Standard 1 = Pd/Ag
2 = 7" Reel**
Code
1000V = A NPO (C0G) = A
+ no. of zeros)
C0G:J = ±5%
T = Plated
4 = 13" Reel A = Standard
1500V = S
X7R = C
Examples:
K = ±10%
Ni and Sn
(RoHS Compliant)
10 pF = 100
M = ±20%
2000V = G
100 pF = 101 X7R: K = ±10%
2500V = W
1,000 pF = 102
M = ±20%
3000V = H
22,000 pF = 223
Z = +80%,
4000V = J
220,000 pF = 224
-20%
5000V = K
1 μF = 105
*Note: Terminations with 5% minimum lead (Pb) is available, see pages 98 and 99 for LD style.
Leaded terminations are available, see pages 100-104.
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
** The 3640 Style is not available on 7" Reels.
*** AVX offers nonstandard chip sizes. Contact factory for details.
W
L
T
t
DIMENSIONS
millimeters (inches)
SIZE
(L) Length
0805
1206
1210*
1808*
1812*
1825*
2220*
2225*
3640*
2.10 ± 0.20
3.30 ± 0.30
3.30 ± 0.40
4.60 ± 0.50
4.60 ± 0.50
4.60 ± 0.50
5.70 ± 0.50
5.70 ± 0.50
9.14 ± 0.25
(0.083 ± 0.008) (0.130 ± 0.012) (0.130 ± 0.016) (0.181 ± 0.020) (0.181 ± 0.020) (0.181 ± 0.020) (0.224 ± 0.020) (0.224 ± 0.020) (0.360 ± 0.010)
(W) Width
1.25 ± 0.20
1.60 +0.30
2.50 ± 0.30
2.00 ± 0.20
3.20 ± 0.30
6.30 ± 0.40
5.00 ± 0.40
6.30 ± 0.40
10.2 ± 0.25
-0.10
(0.049 ±0.008) (0.063 +0.012
(0.098 ± 0.012) (0.079 ± 0.008) (0.126 ± 0.012) (0.248 ± 0.016) (0.197 ± 0.016) (0.248 ± 0.016) (0.400 ± 0.010)
-0.004 )
(T) Thickness
1.35
1.80
2.80
2.20
2.80
3.40
3.40
3.40
2.54
Max.
(0.053)
(0.071)
(0.110)
(0.087)
(0.110)
(0.134)
(0.134)
(0.134)
(0.100)
(t) terminal min. 0.50 ± 0.20
0.60 ± 0.20
0.75 ± 0.35
0.75 ± 0.35
0.75 ± 0.35
0.75 ± 0.35
0.85 ± 0.35
0.85 ± 0.35
0.76 (0.030)
max. (0.020 ± 0.008) (0.024 ± 0.008) (0.030 ± 0.014) (0.030 ± 0.014) (0.030 ± 0.014) (0.030 ± 0.014) (0.033 ± 0.014) (0.033 ± 0.014) 1.52 (0.060)
*Reflow Soldering Only
011916
93
High Voltage MLC Chips
For 600V to 5000V Applications
NP0 (C0G) Dielectric
Performance Characteristics
Capacitance Range
Capacitance Tolerances
Dissipation Factor
Operating Temperature Range
Temperature Characteristic
Voltage Ratings
Insulation Resistance (+25°C, at 500 VDC)
Insulation Resistance (+125°C, at 500 VDC)
Dielectric Strength
10 pF to 0.100 μF (25°C, 1.0 ±0.2 Vrms at 1kHz, for ≤ 1000 pF use 1 MHz)
±5%, ±10%, ±20%
0.1% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz, for ≤ 1000 pF use 1 MHz)
-55°C to +125°C
0 ±30 ppm/°C (0 VDC)
600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C)
100K MΩ min. or 1000 MΩ - μF min., whichever is less
10K MΩ min. or 100 MΩ - μF min., whichever is less
Minimum 120% rated voltage for 5 seconds at 50 mA max. current
NP0 (C0G) CAPACITANCE RANGE – PREFERRED SIZES ARE SHADED
Case Size
0805
1206
1210
1808
1812
Soldering
Reflow/Wave
Reflow/Wave
Reflow Only
Reflow Only
Reflow Only
3.30 ± 0.40
(0.130 ± 0.016)
2.50 ± 0.30
(0.098 ± 0.012)
2.80
(0.110)
0.75 ± 0.35
(0.030 ± 0.014)
630 1000 1500
4.60 ± 0.50
(0.181 ± 0.020)
2.00 ± 0.20
(0.079 ± 0.008)
2.20
(0.087)
0.75 ± 0.35
(0.030 ± 0.014)
1000 1500 2000 2500
4.60 ± 0.50
(0.177 ± 0.012)
3.20 ± 0.30
(0.126 ± 0.008)
2.80
(0.100)
0.75 ± 0.35
(0.030 ± 0.014)
1000 1500 2000 2500
(L) Length
(W) Width
(T) Thickness
(t) Terminal
mm
(in.)
mm
(in.)
mm
(in.)
min
max
Voltage (V)
Cap (pF)
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
750
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
1R5
1R8
2R2
2R7
3R3
3R9
4R7
5R6
6R8
8R2
100
120
150
180
220
270
330
390
470
560
680
820
101
121
151
181
221
271
331
391
471
561
681
751
821
102
122
152
182
222
272
332
392
472
562
682
822
Cap (μF)
0.010
0.012
2.10 ± 0.20
(0.085 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
1.35
(0.053)
0.50 ± 0.20
(0.020 ± 0.008)
600
630 1000
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
X
X
X
X
X
X
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
4000
600
630
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
103
E
E
123
F
F
0.015
153
G
G
0.018
183
G
G
0.022
223
0.033
333
0.047
473
0.056
563
0.068
683
0.100
104
600
630
Voltage (V)
600
Case Size
Letter
Max.
Thickness
94
630
1000
600
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
C
C
C
C
C
C
E
E
E
E
E
E
E
E
E
3.30 ± 0.30
(0.130 ± 0.012)
1.60 +0.30/-0.10
(0.063 +0.012/-0.004)
1.80
(0.071)
0.60 ± 0.20
(0.024 ± 0.008)
630 1000 1500 2000
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
D
D
X
X
D
D
X
M
D
D
X
M
C
C
X
M
C
C
X
C
C
C
X
C
C
C
X
C
E
E
X
C
E
E
X
E
E
E
X
E
E
E
C
E
E
E
C
E
E
E
C
E
E
E
C
E
E
E
C
E
C
E
E
E
E
E
E
E
E
E
E
E
E
E
600
630
0805
A
0.813
(0.032)
C
1.448
(0.057)
1000
1500
2000
600
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
E
E
E
E
E
600
1206
E
1.8034
(0.071)
F
2.2098
(0.087)
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
E
E
E
E
E
630
D
D
D
D
D
D
D
D
D
D
D
D
C
C
C
E
E
E
E
E
E
E
E
E
E
E
E
G
G
1000
D
D
D
D
D
D
D
D
D
C
C
C
C
C
E
E
E
E
E
E
E
E
F
G
G
F
1500
2000
D
D
D
D
D
D
D
D
D
C
C
C
C
C
E
E
E
E
E
E
E
E
F
G
G
F
2000
1210
G
2.794
(0.110)
X
0.940
(0.037)
600
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
E
E
E
E
E
E
E
E
F
600
630
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
E
E
E
E
E
E
E
E
F
630
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
F
F
F
F
1000
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
F
F
E
E
E
1500
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
F
F
E
E
E
2000
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
F
2500
3000
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
F
3000
4000
4000
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
F
E
E
F
F
G
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
E
F
F
G
G
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
E
F
F
G
G
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
G
G
G
G
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
G
G
G
G
E
E
E
E
E
E
E
E
E
F
F
F
F
G
G
1000
1500
2000
2500
3000
4000
1808
7
3.30
(0.130)
3000
1812
NOTE: Contact factory for non-specified capacitance values
011916
High Voltage MLC Chips
For 600V to 5000V Applications
NP0 (C0G) CAPACITANCE RANGE – PREFERRED SIZES ARE SHADED
Case Size
1825
2220
2225
3640
Soldering
Reflow Only
Reflow Only
Reflow Only
Reflow Only
(L) Length
mm
(in.)
mm
(in.)
(T) Thickness mm
(in.)
(t) Terminal
min
max
Voltage (V)
600
Cap (pF) 1.5 1R5
1.8 1R8
2.2 2R2
2.7 2R7
3.3 3R3
3.9 3R9
4.7 4R7
5.6 5R6
6.8 6R8
8.2 8R2
10 100
E
12 120
E
15 150
E
18 180
E
22 220
E
27 270
E
33 330
E
39 390
E
47 470
E
56 560
E
68 680
E
82 820
E
100 101
E
120 121
E
150 151
E
180 181
E
220 221
E
270 271
E
330 331
E
390 391
E
470 471
E
560 561
E
680 681
E
750 751
E
820 821
E
1000 102
E
1200 122
E
1500 152
E
1800 182
E
2200 222
E
2700 272
E
3300 332
E
3900 392
E
4700 472
E
5600 562
F
6800 682
F
8200 822 G
(W) Width
Cap (μF) 0.010 103
4.60 ± 0.50
(0.181 ± 0.020)
6.30 ± 0.40
(0.248 ± 0.016)
3.40
(0.134)
0.75 ± 0.35
(0.030 ± 0.014)
630 1000 1500 2000 2500 3000 4000 600
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
F
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
G
G
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
G
G
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
G
G
G
E
E
E
E
E
E
E
E
F
F
F
F
F
F
F
F
F
F
F
5.70 ± 0.50
(0.224 ± 0.020)
5.00 ± 0.40
(0.197 ± 0.016)
3.40
(0.134)
0.85 ± 0.35
(0.033 ± 0.014)
630 1000 1500 2000 2500 3000 4000 5000 600
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
7
7
7
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
G
G
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
G
G
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
5.70 ± 0.50
(0.225 ± 0.010)
6.30 ± 0.40
(0.250 ± 0.010)
3.40
(0.100)
0.85 ± 0.35
(0.033 ± 0.014)
630 1000 1500 2000 2500 3000 4000 5000 600
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
F
F
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
9.14 ± 0.25
(0.360 ± 0.010)
10.2 ± 0.25
(0.400 ± 0.010)
2.54
(0.100)
0.76 (0.030)
1.52 (0.060)
630 1000 1500 2000 2500 3000 4000 5000
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
0.012 123
G
G
G
G
G
0.015 153
G
G
G
G
G
0.018 183
G
G
G
G
G
0.022 223
G
G
G
G
G
0.033 333
G
G
G
G
0.047 473
G
G
G
G
0.056 563
G
G
0.068 683
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
0.100 104
Voltage (V)
600
630 1000 1500 2000 2500 3000 4000 600
Case Size
Letter
Max.
Thickness
011916
630 1000 1500 2000 2500 3000 4000 5000 600
1825
A
0.813
(0.032)
C
1.448
(0.057)
2220
E
1.8034
(0.071)
F
2.2098
(0.087)
G
2.794
(0.110)
X
0.940
(0.037)
630 1000 1500 2000 2500 3000 4000 5000 600
630 1000 1500 2000 2500 3000 4000 5000
2225
7
3.30
(0.130)
3640
NOTE: Contact factory for non-specified capacitance values
95
High Voltage MLC Chips
For 600V to 5000V Applications
X7R Dielectric
Performance Characteristics
Capacitance Range
Capacitance Tolerances
Dissipation Factor
Operating Temperature Range
Temperature Characteristic
Voltage Ratings
Insulation Resistance (+25°C, at 500 VDC)
Insulation Resistance (+125°C, at 500 VDC)
Dielectric Strength
10 pF to 0.82 μF (25°C, 1.0 ±0.2 Vrms at 1kHz)
±10%; ±20%; +80%, -20%
2.5% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz)
-55°C to +125°C
±15% (0 VDC)
600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C)
100K MΩ min. or 1000 MΩ - μF min., whichever is less
10K MΩ min. or 100 MΩ - μF min., whichever is less
Minimum 120% rated voltage for 5 seconds at 50 mA max. current
X7R CAPACITANCE RANGE – PREFERRED SIZES ARE SHADED
Case Size
0805
1206
1210
1808
1812
Soldering
Reflow/Wave
Reflow/Wave
Reflow Only
Reflow Only
Reflow Only
3.30 ± 0.40
(0.130 ± 0.016)
2.50 ± 0.30
(0.098 ± 0.012)
2.80
(0.110)
0.75 ± 0.35
(0.030 ± 0.014)
630 1000 1500
4.60 ± 0.50
(0.181 ± 0.020)
2.00 ± 0.20
(0.079 ± 0.008)
2.20
(0.087)
0.75 ± 0.35
(0.030 ± 0.014)
1000 1500 2000 2500
4.60 ± 0.50
(0.177 ± 0.012)
3.20 ± 0.30
(0.126 ± 0.008)
2.80
(0.100)
0.75 ± 0.35
(0.030 ± 0.014)
1000 1500 2000 2500
(L) Length
mm
(in.)
mm
(in.)
mm
(in.)
min
max
(W) Width
(T) Thickness
(t) Terminal
Voltage (V)
Cap (pF)
Cap (μF)
2.10 ± 0.20
(0.085 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
1.35
(0.053)
0.50 ± 0.20
(0.020 ± 0.008)
600
630 1000
600
2000
600
630
600
630
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
E
E
E
E
E
F
F
E
E
F
F
E
E
E
E
E
F
E
E
E
E
E
E
E
E
F
E
E
E
F
F
E
E
E
E
E
F
E
E
E
E
E
E
E
E
F
E
E
E
E
F
F
E
E
E
E
E
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
E
E
E
E
E
F
F
E
E
E
E
E
F
F
E
E
E
E
E
G
G
C
E
E
E
E
E
E
E
C
E
E
E
E
E
E
F
E
E
E
E
E
E
F
F
E
E
E
E
E
G
G
E
E
E
E
F
F
F
E
E
E
E
E
G
C
C
E
E
E
E
E
G
F
E
E
E
E
F
F
E
E
E
E
E
G
G
C
C
C
E
E
E
C
C
C
E
E
E
E
F
E
E
E
E
F
F
E
E
E
F
F
G
G
E
F
E
E
E
F
E
E
E
F
F
G
C
C
C
C
E
E
G
E
E
F
E
E
E
F
E
E
E
F
F
G
562
C
C
C
C
E
G
E
E
E
F
E
E
E
F
E
E
E
G
G
G
6800
682
C
C
C
C
8200
822
C
C
C
C
E
E
E
E
E
E
E
F
E
E
E
G
G
E
E
E
E
E
E
E
E
E
E
G
G
0.010
103
C
C
C
0.015
153
C
C
E
C
E
E
E
E
E
E
E
E
E
F
G
G
E
E
E
E
E
F
F
F
E
E
F
G
0.018
183
C
C
E
0.022
223
C
C
E
E
E
E
E
F
F
F
E
E
G
E
E
E
F
F
F
E
E
G
0.027
273
0.033
333
E
E
E
E
F
F
E
E
G
E
E
E
E
F
F
E
E
0.039
G
393
E
E
F
F
E
E
G
0.047
473
E
E
F
F
E
E
G
0.056
563
F
F
F
F
F
F
0.068
683
F
F
F
F
F
F
0.082
823
F
F
F
F
0.100
104
F
F
F
F
0.150
154
G
G
0.220
224
G
G
0.270
274
0.330
334
0.390
394
0.470
474
0.560
564
0.680
684
0.820
824
1.000
105
600
630
100
101
X
X
C
C
C
E
E
E
E
E
E
E
E
120
121
X
X
C
C
C
E
E
E
E
E
E
E
E
150
151
X
X
C
C
C
E
E
E
E
E
E
E
E
180
181
X
X
C
C
C
E
E
E
E
E
E
E
E
220
221
X
X
C
C
C
E
E
E
E
E
E
E
E
270
271
X
X
C
C
C
E
E
E
E
E
E
E
E
330
331
X
X
C
C
C
E
E
E
E
E
E
E
390
391
X
X
C
C
C
E
E
E
E
E
E
470
471
X
X
C
C
C
E
E
E
E
E
560
561
X
X
C
C
C
E
E
E
E
680
681
X
X
C
C
C
E
E
E
750
751
X
X
C
C
C
E
E
E
820
821
X
X
C
C
C
E
E
1000
102
X
X
X
C
C
E
1200
122
X
X
X
C
C
1500
152
X
X
X
C
C
1800
182
X
X
X
C
2200
222
X
X
X
C
2700
272
C
C
3300
332
C
3900
392
C
4700
472
5600
Voltage (V)
600
Case Size
Letter
Max.
Thickness
96
600
3.30 ± 0.30
(0.130 ± 0.012)
1.60 +0.30/-0.10
(0.063 +0.012/-0.004)
1.80
(0.071)
0.60 ± 0.20
(0.024 ± 0.008)
630 1000 1500 2000
630
1000
600
630
0805
A
0.813
(0.032)
C
1.448
(0.057)
1000
1500
2000
600
1206
E
1.8034
(0.071)
F
2.2098
(0.087)
630
1000
1500
2000
1210
G
2.794
(0.110)
X
0.940
(0.037)
600
630
1000
1500
2000
2500
3000
3000
4000
4000
1000
1500
1808
7
3.30
(0.130)
2000
2500
3000
3000
4000
4000
1812
NOTE: Contact factory for non-specified capacitance values
011916
High Voltage MLC Chips
For 600V to 5000V Applications
X7R CAPACITANCE RANGE
PREFERRED SIZES ARE SHADED
Case Size
1825
2220
2225
3640
Soldering
Reflow Only
Reflow Only
Reflow Only
Reflow Only
(L) Length
mm
(in.)
mm
(in.)
(T) Thickness mm
(in.)
(t) Terminal
min
max
Voltage (V)
(W) Width
Cap (pF)
600
4.60 ± 0.50
(0.181 ± 0.020)
6.30 ± 0.40
(0.248 ± 0.016)
3.40
(0.134)
0.75 ± 0.35
(0.030 ± 0.014)
630 1000 1500 2000 2500 3000 4000 600
5.70 ± 0.50
(0.224 ± 0.020)
5.00 ± 0.40
(0.197 ± 0.016)
3.40
(0.134)
0.85 ± 0.35
(0.033 ± 0.014)
630 1000 1500 2000 2500 3000 4000 5000 600
5.70 ± 0.50
(0.225 ± 0.010)
6.30 ± 0.40
(0.250 ± 0.010)
3.40
(0.100)
0.85 ± 0.35
(0.033 ± 0.014)
630 1000 1500 2000 2500 3000 4000 5000 600
9.14 ± 0.25
(0.360 ± 0.010)
10.2 ± 0.25
(0.400 ± 0.010)
2.54
(0.100)
0.76 (0.030)
1.52 (0.060)
630 1000 1500 2000 2500 3000 4000 5000
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
750 751
820 821
1000 102
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
1200 122
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
1500 152
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
1800 182
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
2200 222
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
2700 272
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
3300 332
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
3900 392
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
4700 472
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
5600 562
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
6800 682
F
F
F
G
G
G
G
F
F
F
F
F
G
G
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
8200 822
F
F
F
G
G
G
G
F
F
F
G
G
G
G
F
F
F
F
F
G
G
G
G
G
G
G
G
G
Cap (μF) 0.010 103
F
F
F
G
G
G
G
F
F
F
G
G
G
G
F
F
F
F
F
G
G
G
G
G
G
G
G
G
0.015 153
F
F
F
G
G
G
F
F
F
G
G
G
F
F
F
G
G
G
G
G
G
G
G
G
G
G
0.018 183
F
F
F
G
G
F
F
F
G
G
G
F
F
F
G
G
G
G
G
G
G
G
G
G
0.022 223
F
F
F
G
G
F
F
F
G
G
F
F
F
G
G
G
G
G
G
G
G
G
0.027 273
F
F
F
G
F
F
F
G
G
F
F
F
G
G
G
G
G
G
G
0.033 333
F
F
F
G
F
F
F
G
F
F
F
G
G
G
G
G
G
0.039 393
F
F
F
G
F
F
F
G
F
F
F
G
G
G
G
G
0.047 473
F
F
F
P
F
F
F
G
F
F
F
G
G
G
G
G
0.056 563
F
F
F
G
F
F
F
G
F
F
F
G
G
G
G
G
0.068 683
F
F
G
F
F
G
F
F
F
G
G
G
G
G
0.082 823
F
F
G
F
F
G
F
F
G
G
G
0.100 104
F
F
G
F
F
G
F
F
G
G
G
0.150 154
F
F
F
F
G
F
F
G
G
G
0.220 224
F
F
F
F
G
F
F
G
G
0.270 274
F
F
F
F
F
F
G
G
0.330 334
F
F
F
F
F
F
G
G
0.390 394
F
F
F
F
F
F
G
G
0.470 474
F
F
F
F
F
F
G
G
0.560 564
G
G
G
G
F
F
G
G
G
G
G
G
G
G
0.680 684
0.820 824
1.000 105
Voltage (V)
600
630 1000 1500 2000 2500 3000 4000 600
Case Size
Letter
Max.
Thickness
011916
630 1000 1500 2000 2500 3000 4000 5000 600
1825
A
0.813
(0.032)
C
1.448
(0.057)
2220
E
1.8034
(0.071)
F
2.2098
(0.087)
G
2.794
(0.110)
X
0.940
(0.037)
630 1000 1500 2000 2500 3000 4000 5000 600
630 1000 1500 2000 2500 3000 4000 5000
2225
7
3.30
(0.130)
3640
NOTE: Contact factory for non-specified capacitance values
97
High Voltage MLC Chips
Tin/Lead Termination “B”
For 600V to 5000V Applications
NEW 630V RANGE
AVX Corporation will support those customers for commercial and military Multilayer Ceramic Capacitors with a termination consisting of 5% minimum lead. This
termination is indicated by the use of a “B” in the 12th position of the AVX Catalog Part Number. This fulfills AVX’s commitment to providing a full range of products to our customers. AVX has provided in the following pages, a full range of
values that we are offering in this “B” termination.
Larger physical sizes than normally encountered chips are used to make high voltage MLC chip product. Special precautions must be taken in applying these chips
in surface mount assemblies. The temperature gradient during heating or cooling
cycles should not exceed 4ºC per second. The preheat temperature must be
within 50ºC of the peak temperature reached by the ceramic bodies through the
soldering process. Chip sizes 1210 and larger should be reflow soldered only. Capacitors may require protective surface coating to prevent external arcing.
For 1825, 2225 and 3640 sizes, AVX offers leaded version in either thru-hole or
SMT configurations (for details see section on high voltage leaded MLC chips).
HOW TO ORDER
LD08
A
A
271
K
A
AVX
Style
LD05 - 0805
LD06 - 1206
LD10 - 1210
LD08 - 1808
LD12 - 1812
LD13 - 1825
LD20 - 2220
LD14 - 2225
LD40 - 3640
***
Voltage
600V/630V = C
1000V = A
1500V = S
2000V = G
2500V = W
3000V = H
4000V = J
5000V = K
Temperature
Coefficient
C0G = A
X7R = C
Capacitance Code
(2 significant digits
+ no. of zeros)
Examples:
10 pF = 100
100 pF = 101
1,000 pF = 102
22,000 pF = 223
220,000 pF = 224
1 μF = 105
Capacitance
Tolerance
C0G: J = ±5%
K = ±10%
M = ±20%
X7R: K = ±10%
M = ±20%
Z = +80%, -20%
B
1
A
Test
Termination
Packaging Special Code
Level
B = 5% Min Pb 2 = 7" Reel** A = Standard
A = Standard X = FLEXITERM® 4 = 13" Reel
with 5% min.
Pb*
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
* FLEXITERM is not available in the LD40 Style
** The LD40 Style is not available on 7" Reels.
*** AVX offers nonstandard chip sizes. Contact factory for details.
Not RoHS Compliant
W
L
T
DIMENSIONS
SIZE
(L) Length
t
LD05 (0805)
LD06 (1206)
LD10* (1210) LD08* (1808)
2.10 ± 0.20
3.30 ± 0.30
3.30 ± 0.40
4.60 ± 0.50
(0.083 ± 0.008) (0.130 ± 0.012) (0.130 ± 0.016) (0.181 ± 0.020)
(W) Width
1.25 ± 0.20
1.60 +0.30
2.50 ± 0.30
2.00 ± 0.20
-0.10
(0.049 ±0.008) (0.063 +0.012
(0.098 ± 0.012) (0.079 ± 0.008)
-0.004 )
(T) Thickness
1.35
1.80
2.80
2.20
Max.
(0.053)
(0.071)
(0.110)
(0.087)
(t) terminal min. 0.50 ± 0.20
0.60 ± 0.20
0.75 ± 0.35
0.75 ± 0.35
max. (0.020 ± 0.008) (0.024 ± 0.008) (0.030 ± 0.014) (0.030 ± 0.014)
millimeters (inches)
LD12* (1812)
4.60 ± 0.50
(0.181 ± 0.020)
3.20 ± 0.30
(0.126 ± 0.012)
2.80
(0.110)
0.75 ± 0.35
(0.030 ± 0.014)
LD13* (1825)
4.60 ± 0.50
(0.181 ± 0.020)
6.30 ± 0.40
(0.248 ± 0.016)
3.40
(0.134)
0.75 ± 0.35
(0.030 ± 0.014)
LD20* (2220)
5.70 ± 0.50
(0.224 ± 0.020)
5.00 ± 0.40
(0.197 ± 0.016)
3.40
(0.134)
0.85 ± 0.35
(0.033 ± 0.014)
LD14* (2225) LD40* (3640)
5.70 ± 0.50
9.14 ± 0.25
(0.224 ± 0.020) (0.360 ± 0.010)
6.30 ± 0.40
10.2 ± 0.25
(0.248 ± 0.016) (0.400 ± 0.010)
3.40
2.54
(0.134)
(0.100)
0.85 ± 0.35
0.76 (0.030)
(0.033 ± 0.014) 1.52 (0.060)
* Reflow soldering only.
Performance of SMPS capacitors can be simulated by downloading SpiCalci software program - http://www.avx.com/SpiApps/default.asp#spicalci
Custom values, ratings and configurations are also available.
98
011916
High Voltage MLC Chips
Tin/Lead Termination “B”
For 600V to 5000V Applications
C0G Dielectric
Performance Characteristics
Capacitance Range
Capacitance Tolerances
Dissipation Factor
Operating Temperature Range
Temperature Characteristic
Voltage Ratings
Insulation Resistance (+25°C, at 500 VDC)
Insulation Resistance (+125°C, at 500 VDC)
Dielectric Strength
10 pF to 0.047 μF
(25°C, 1.0 ±0.2 Vrms at 1kHz, for ≤ 1000 pF use 1 MHz)
±5%, ±10%, ±20%
0.1% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz, for ≤ 1000 pF use 1 MHz)
-55°C to +125°C
0 ±30 ppm/°C (0 VDC)
600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C)
100K MΩ min. or 1000 MΩ - μF min., whichever is less
10K MΩ min. or 100 MΩ - μF min., whichever is less
Minimum 120% rated voltage for 5 seconds at 50 mA max. current
HIGH VOLTAGE C0G CAPACITANCE VALUES
VOLTAGE
600/630
1000
1500
2000
2500
3000
4000
5000
min.
max.
min.
max.
min.
max.
min.
max.
min.
max.
min.
max.
min.
max.
min.
max.
LD05 (0805) LD06 (1206) LD10 (1210) LD08 (1808) LD12 (1812) LD13 (1825) LD20 (2220) LD14 (2225) LD40 (3640)
10pF
330pF
10pF
180pF
—
—
—
—
—
—
—
—
—
—
—
—
10 pF
1200 pF
10 pF
560 pF
10 pF
270 pF
10 pF
120 pF
—
—
—
—
—
—
—
—
100 pF
2700 pF
10 pF
1500 pF
10 pF
680 pF
10 pF
270 pF
—
—
—
—
—
—
—
—
100 pF
3300 pF
100 pF
2200 pF
10 pF
820 pF
10 pF
330 pF
10 pF
180 pF
10 pF
120 pF
10 pF
47 pF
—
—
100 pF
5600 pF
100 pF
3300 pF
10 pF
1800 pF
10 pF
1000 pF
10 pF
470 pF
10 pF
330 pF
10 pF
150 pF
—
—
1000 pF
0.012 μF
100 pF
8200 pF
100 pF
4700 pF
100 pF
1800 pF
10 pF
1200 pF
10 pF
820 pF
10 pF
330 pF
—
—
1000 pF
0.012 μF
1000 pF
0.010 μF
100 pF
4700 pF
100 pF
2200 pF
100 pF
1500 pF
10 pF
1000 pF
10 pF
470 pF
10 pF
220 pF
1000 pF
0.018 μF
1000 pF
0.010 μF
100 pF
5600 pF
100 pF
2700 pF
100 pF
1800 pF
10 pF
1200 pF
10 pF
560 pF
10 pF
270 pF
1000 pF
0.047 μF
1000 pF
0.022 μF
100 pF
0.010 μF
100 pF
6800 pF
100 pF
3900 pF
100 pF
2700 pF
100 pF
1200 pF
10 pF
820 pF
X7R Dielectric
Performance Characteristics
Capacitance Range
Capacitance Tolerances
Dissipation Factor
Operating Temperature Range
Temperature Characteristic
Voltage Ratings
Insulation Resistance (+25°C, at 500 VDC)
Insulation Resistance (+125°C, at 500 VDC)
Dielectric Strength
10 pF to 0.56 μF (25°C, 1.0 ±0.2 Vrms at 1kHz)
±10%; ±20%; +80%, -20%
2.5% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz)
-55°C to +125°C
±15% (0 VDC)
600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C)
100K MΩ min. or 1000 MΩ - μF min., whichever is less
10K MΩ min. or 100 MΩ - μF min., whichever is less
Minimum 120% rated voltage for 5 seconds at 50 mA max. current
HIGH VOLTAGE X7R MAXIMUM CAPACITANCE VALUES
VOLTAGE
600/630
1000
1500
2000
2500
3000
4000
5000
011916
min.
max.
min.
max.
min.
max.
min.
max.
min.
max.
min.
max.
min.
max.
min.
max.
0805
1206
1210
1808
1812
1825
2220
2225
3640
100pF
6800pF
100pF
1500pF
—
—
—
—
—
—
—
—
—
—
—
—
1000 pF
0.022 μF
100 pF
6800 pF
100 pF
2700 pF
10 pF
1500 pF
—
—
—
—
—
—
—
—
1000 pF
0.056 μF
1000 pF
0.015 μF
100 pF
5600 pF
100 pF
3300 pF
—
—
—
—
—
—
—
—
1000 pF
0.068 μF
1000 pF
0.018 μF
100 pF
6800 pF
100 pF
3300 pF
10 pF
2200 pF
10 pF
1800 pF
—
—
—
—
1000 pF
0.120 μF
1000 pF
0.039 μF
100 pF
0.015 μF
100 pF
8200 pF
10 pF
5600 pF
10 pF
3900 pF
—
—
—
—
0.010 μF
0.270 μF
1000 pF
0.100 μF
1000 pF
0.056 μF
100 pF
0.022 μF
100 pF
0.015 μF
100 pF
0.010 μF
—
—
—
—
0.010 μF
0.270 μF
1000 pF
0.120 μF
1000 pF
0.056 μF
1000 pF
0.027 μF
100 pF
0.018 μF
100 pF
0.012 μF
—
—
—
—
0.010 μF
0.330 μF
1000 pF
0.150 μF
1000 pF
0.068 μF
1000 pF
0.033 μF
100 pF
0.022 μF
100 pF
0.015 μF
—
—
—
—
0.010 μF
0.560 μF
0.010 μF
0.220 μF
1000 pF
0.100 μF
1000 pF
0.027 μF
1000 pF
0.022 μF
1000 pF
0.018 μF
100 pF
6800 pF
100 pF
3300 pF
99
High Voltage MLC Chips FLEXITERM®
For 600V to 5000V Applications
High value, low leakage and small size are difficult parameters to obtain in capacitors for high voltage systems. AVX special high voltage MLC chips capacitors
meet these performance characteristics and are designed for applications such
as snubbers in high frequency power converters, resonators in SMPS, and high
voltage coupling/DC blocking. These high voltage chip designs exhibit low ESRs
at high frequencies.
To make high voltage chips, larger physical sizes than are normally encountered
are necessary. These larger sizes require that special precautions be taken in
applying these chips in surface mount assemblies. In response to this, and to follow from the success of the FLEXITERM® range of low voltage parts, AVX is delighted to offer a FLEXITERM® high voltage range of capacitors, FLEXITERM®.
The FLEXITERM® layer is designed to enhance the mechanical flexure and temperature cycling performance of a standard ceramic capacitor, giving customers
a solution where board flexure or temperature cycle damage are concerns.
HOW TO ORDER
1808
AVX
Style
0805
1206
1210
1808
1812
1825
2220
2225
***
A
C
272
K
A
Voltage
Temperature Capacitance Code Capacitance
600V/630V = C Coefficient
(2 significant digits
Tolerance
C0G: J = ±5%
1000V = A
C0G = A
+ no. of zeros)
K = ±10%
1500V = S
X7R = C
Examples:
M = ±20%
2000V = G
10 pF = 100
2500V = W
100 pF = 101 X7R: K = ±10%
M = ±20%
3000V = H
1,000 pF = 102
Z = +80%,
4000V = J
22,000 pF = 223
-20%
5000V = K
220,000 pF = 224
1 μF = 105
Test Level
Z
1
A
Termination*
Packaging
Special
Z = FLEXITERM®
2 = 7" Reel
Code
100% Tin
4 = 13" Reel A = Standard
(RoHS Compliant)
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
*** AVX offers nonstandard chip sizes. Contact factory for details.
W
L
T
t
DIMENSIONS
SIZE
millimeters (inches)
0805
1206
1210*
1808*
1812*
1825*
2220*
2225*
2.10 ± 0.20
(0.083 ± 0.008)
1.25 ± 0.20
(0.049 ±0.008)
3.30 ± 0.30
(0.130 ± 0.012)
1.60 +0.30
-0.10
(0.063 +0.012
-0.004 )
3.30 ± 0.40
(0.130 ± 0.016)
2.50 ± 0.30
(0.098 ± 0.012)
4.60 ± 0.50
(0.181 ± 0.020)
2.00 ± 0.20
(0.079 ± 0.008)
4.60 ± 0.50
(0.181 ± 0.020)
3.20 ± 0.30
(0.126 ± 0.012)
4.60 ± 0.50
(0.181 ± 0.020)
6.30 ± 0.40
(0.248 ± 0.016)
5.70 ± 0.50
(0.224 ± 0.020)
5.00 ± 0.40
(0.197 ± 0.016)
5.70 ± 0.50
(0.224 ± 0.020)
6.30 ± 0.40
(0.248 ± 0.016)
(T) Thickness
1.35
Max.
(0.053)
(t) terminal min.
0.50 ± 0.20
max. (0.020 ± 0.008)
1.80
(0.071)
0.60 ± 0.20
(0.024 ± 0.008)
2.80
(0.110)
0.75 ± 0.35
(0.030 ± 0.014)
2.20
(0.087)
0.75 ± 0.35
(0.030 ± 0.014)
2.80
(0.110)
0.75 ± 0.35
(0.030 ± 0.014)
3.40
(0.134)
0.75 ± 0.35
(0.030 ± 0.014)
3.40
(0.134)
0.85 ± 0.35
(0.033 ± 0.014)
3.40
(0.134)
0.85 ± 0.35
(0.033 ± 0.014)
(L) Length
(W) Width
*Reflow Soldering Only
Performance of SMPS capacitors can be simulated by downloading SpiCalci software program - http://www.avx.com/SpiApps/default.asp#spicalci
Custom values, ratings and configurations are also available.
100
011916
High Voltage MLC Chips FLEXITERM®
For 600V to 5000V Applications
NP0 (C0G) Dielectric
Performance Characteristics
Capacitance Range
Capacitance Tolerances
Dissipation Factor
Operating Temperature Range
Temperature Characteristic
Voltage Ratings
Insulation Resistance (+25°C, at 500 VDC)
Insulation Resistance (+125°C, at 500 VDC)
Dielectric Strength
10 pF to 0.100 μF (+25°C, 1.0 ±0.2 Vrms, 1kHz)
±5%, ±10%, ±20%
0.1% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz)
-55°C to +125°C
0 ±30 ppm/°C (0 VDC)
600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C)
100K MΩ min. or 1000 MΩ - μF min., whichever is less
10K MΩ min. or 100 MΩ - μF min., whichever is less
Minimum 120% rated voltage for 5 seconds at 50 mA max. current
NP0 (C0G) CAPACITANCE RANGE
PREFERRED SIZES ARE SHADED
Case Size
0805
1206
1210
1808
1812
Soldering
Reflow/Wave
Reflow/Wave
Reflow Only
Reflow Only
Reflow Only
3.30 ± 0.40
(0.130 ± 0.016)
2.50 ± 0.30
(0.098 ± 0.012)
2.80
(0.110)
0.75 ± 0.35
(0.030 ± 0.014)
630 1000 1500
4.60 ± 0.50
(0.181 ± 0.020)
2.00 ± 0.20
(0.079 ± 0.008)
2.20
(0.087)
0.75 ± 0.35
(0.030 ± 0.014)
1000 1500 2000 2500
4.60 ± 0.50
(0.181 ± 0.020)
3.20 ± 0.30
(0.126 ± 0.012)
2.80
(0.110)
0.75 ± 0.35
(0.030 ± 0.014)
1000 1500 2000 2500
(L) Length
(W) Width
(T) Thickness
(t) Terminal
mm
(in.)
mm
(in.)
mm
(in.)
min
max
Voltage (V)
Cap (pF)
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
750
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
1R5
1R8
2R2
2R7
3R3
3R9
4R7
5R6
6R8
8R2
100
120
150
180
220
270
330
390
470
560
680
820
101
121
151
181
221
271
331
391
471
561
681
751
821
102
122
152
182
222
272
332
392
472
562
682
822
Cap (μF)
0.010
0.012
2.10 ± 0.20
(0.083 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
1.35
(0.053)
0.50 ± 0.20
(0.020 ± 0.008)
600
630 1000
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
X
X
X
X
X
X
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
4000
600
630
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
103
E
E
123
F
F
0.015
153
G
G
0.018
183
G
G
0.022
223
0.033
333
0.047
473
0.056
563
0.068
683
0.100
104
600
630
Voltage (V)
Case Size
011916
600
630
0805
1000
600
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
C
C
C
C
C
C
E
E
E
E
E
E
E
E
E
3.30 ± 0.30
(0.130 ± 0.012)
1.60 +0.30/-0.10
(0.063 +0.012/-0.004)
1.80
(0.071)
0.60 ± 0.20
(0.024 ± 0.008)
630 1000 1500 2000
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
D
D
X
X
D
D
X
M
D
D
X
M
C
C
X
M
C
C
X
C
C
C
X
C
C
C
X
C
E
E
X
C
E
E
X
E
E
E
X
E
E
E
C
E
E
E
C
E
E
E
C
E
E
E
C
E
E
E
C
E
C
E
E
E
E
E
E
E
E
E
E
E
E
E
600
630
1000
1206
1500
2000
600
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
E
E
E
E
E
600
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
E
E
E
E
E
630
D
D
D
D
D
D
D
D
D
D
D
D
C
C
C
E
E
E
E
E
E
E
E
E
E
E
E
G
G
1000
1210
D
D
D
D
D
D
D
D
D
C
C
C
C
C
E
E
E
E
E
E
E
E
F
G
G
1500
2000
D
D
D
D
D
D
D
D
D
C
C
C
C
C
E
E
E
E
E
E
E
E
F
G
G
2000
600
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
E
E
E
E
E
E
E
E
F
600
630
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
E
E
E
E
E
E
E
E
E
F
630
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
F
F
F
1000
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
F
F
E
E
E
1500
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
F
F
E
E
E
2000
1808
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
F
2500
3000
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
F
3000
4000
3000
4000
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
F
E
E
F
F
G
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
E
F
F
G
G
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
F
E
F
F
G
G
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
G
G
G
G
C
C
C
C
C
C
C
C
C
C
C
C
C
C
C
F
F
F
F
F
F
F
G
G
G
G
E
E
E
E
E
E
E
E
E
F
F
F
F
G
G
1000
1500
2000
2500
3000
4000
1812
101
High Voltage MLC Chips FLEXITERM®
For 600V to 5000V Applications
NP0 (C0G) CAPACITANCE RANGE
PREFERRED SIZES ARE SHADED
Case Size
1825
2220
2225
Soldering
Reflow Only
Reflow Only
Reflow Only
(L) Length
mm
(in.)
mm
(in.)
(T) Thickness mm
(in.)
(t) Terminal
min
max
Voltage (V)
600
Cap (pF) 1.5 1R5
1.8 1R8
2.2 2R2
2.7 2R7
3.3 3R3
3.9 3R9
4.7 4R7
5.6 5R6
6.8 6R8
8.2 8R2
10 100
E
12 120
E
15 150
E
18 180
E
22 220
E
27 270
E
33 330
E
39 390
E
47 470
E
56 560
E
68 680
E
82 820
E
100 101
E
120 121
E
150 151
E
180 181
E
220 221
E
270 271
E
330 331
E
390 391
E
470 471
E
560 561
E
680 681
E
750 751
E
820 821
E
1000 102
E
1200 122
E
1500 152
E
1800 182
E
2200 222
E
2700 272
E
3300 332
E
3900 392
E
4700 472
E
5600 562
F
6800 682
F
8200 822 G
(W) Width
4.60 ± 0.50
(0.181 ± 0.020)
6.30 ± 0.40
(0.248 ± 0.016)
3.40
(0.134)
0.75 ± 0.35
(0.030 ± 0.014)
630 1000 1500 2000 2500 3000 4000 600
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
G
Cap (μF) 0.010 103
G
G
G
0.012 123
G
G
G
0.015 153
G
G
G
0.018 183
G
G
G
0.022 223
G
G
G
0.033 333
G
G
G
0.047 473
G
G
G
0.056 563
G
G
G
0.068 683
G
G
G
0.100 104
G
G
G
102
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
G
G
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
G
G
G
E
E
E
E
E
E
E
E
F
F
F
F
F
F
F
F
F
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
630 1000 1500 2000 2500 3000 4000 600
Case Size
Letter
Max.
Thickness
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
G
G
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
C
1.448
(0.057)
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
G
G
G
G
G
2220
E
1.8034
(0.071)
F
2.2098
(0.087)
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
F
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
630 1000 1500 2000 2500 3000 4000 5000 600
1825
A
0.813
(0.032)
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
G
G
G
G
G
630 1000 1500 2000 2500 3000 4000 5000
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
G
600
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
2.54
(0.100)
0.85 ± 0.35
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
G
Voltage (V)
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
5.70 ± 0.50
(0.224 ± 0.020)
5.00 ± 0.40
(0.197 ± 0.016)
3.40
(0.134)
0.85 ± 0.35
(0.033 ± 0.014)
630 1000 1500 2000 2500 3000 4000 5000 600
G
2.794
(0.110)
X
0.940
(0.037)
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
G
G
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
F
F
G
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
G
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
630 1000 1500 2000 2500 3000 4000 5000
2225
NOTE: Contact factory for non-specified capacitance values
011916
High Voltage MLC Chips FLEXITERM®
For 600V to 5000V Applications
X7R Dielectric
Performance Characteristics
Capacitance Range
Capacitance Tolerances
Dissipation Factor
Operating Temperature Range
Temperature Characteristic
Voltage Ratings
Insulation Resistance (+25°C, at 500 VDC)
Insulation Resistance (+125°C, at 500 VDC)
Dielectric Strength
10 pF to 0.82 μF (25°C, 1.0 ±0.2 Vrms at 1kHz)
±10%; ±20%; +80%, -20%
2.5% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz)
-55°C to +125°C
±15% (0 VDC)
600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C)
100K MΩ min. or 1000 MΩ - μF min., whichever is less
10K MΩ min. or 100 MΩ - μF min., whichever is less
Minimum 120% rated voltage for 5 seconds at 50 mA max. current
X7R CAPACITANCE RANGE
PREFERRED SIZES ARE SHADED
Case Size
0805
1206
1210
1808
1812
Soldering
Reflow/Wave
Reflow/Wave
Reflow Only
Reflow Only
Reflow Only
3.30 ± 0.40
(0.130 ± 0.016)
2.50 ± 0.30
(0.098 ± 0.012)
2.80
(0.110)
0.75 ± 0.35
(0.030 ± 0.014)
630 1000 1500
4.60 ± 0.50
(0.181 ± 0.020)
2.00 ± 0.20
(0.079 ± 0.008)
2.20
(0.087)
0.75 ± 0.35
(0.030 ± 0.014)
1000 1500 2000 2500
4.60 ± 0.50
(0.181 ± 0.020)
3.20 ± 0.30
(0.126 ± 0.012)
2.80
(0.110)
0.75 ± 0.35
(0.030 ± 0.014)
1000 1500 2000 2500
(L) Length
mm
(in.)
mm
(in.)
mm
(in.)
min
max
(W) Width
(T) Thickness
(t) Terminal
Voltage (V)
600
3.30 ± 0.30
(0.130 ± 0.012)
1.60 +0.30/-0.10
(0.063 +0.012/-0.004)
1.80
(0.071)
0.60 ± 0.20
(0.024 ± 0.008)
630 1000 1500 2000
600
630
600
630
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
E
E
E
E
E
F
E
E
E
E
E
E
E
E
F
E
E
E
F
F
E
E
E
E
E
F
E
E
E
E
E
E
E
E
F
E
E
E
E
F
F
E
E
E
E
E
F
E
E
E
E
E
E
E
E
F
E
E
E
E
E
F
F
E
E
E
E
E
F
F
C
E
E
E
E
E
E
E
C
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
E
E
E
E
E
F
F
E
E
E
E
E
E
F
F
E
E
E
E
E
G
G
C
C
E
E
E
E
E
E
C
C
E
E
E
E
E
E
E
E
E
E
E
E
E
F
F
F
E
E
E
E
F
F
F
X
C
C
E
E
E
E
X
C
C
E
E
E
E
F
E
E
E
E
F
E
F
E
E
E
E
F
X
X
C
C
E
E
E
E
G
E
E
E
472
X
X
C
C
E
E
E
E
G
E
E
5600
562
X
X
C
C
E
E
E
E
G
E
6800
682
X
X
C
8200
822
X
X
C
C
E
E
E
E
C
E
E
E
E
0.010
103
C
C
C
C
E
E
E
E
0.015
153
C
0.018
183
C
C
E
E
E
E
E
E
F
F
F
E
C
E
E
E
E
E
F
F
F
E
0.022
223
C
0.027
273
C
E
E
E
E
E
F
F
E
E
G
E
E
E
E
F
F
E
E
0.033
333
G
E
E
E
E
F
F
E
E
0.039
G
393
E
E
F
F
E
E
G
0.047
473
E
E
F
F
E
E
G
0.056
563
F
F
F
F
F
F
0.068
683
F
F
F
F
0.082
823
F
F
0.100
104
F
F
F
F
0.150
154
G
G
0.220
224
G
G
0.270
274
0.330
334
0.390
394
0.470
474
0.560
564
0.680
684
0.820
824
1.000
105
600
630
Cap (pF)
Cap (μF)
2.10 ± 0.20
(0.083 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
1.35
(0.053)
0.50 ± 0.20
(0.020 ± 0.008)
600
630 1000
600
2000
100
101
X
X
C
C
C
E
E
E
E
E
E
E
E
120
121
X
X
C
C
C
E
E
E
E
E
E
E
E
150
151
X
X
C
C
C
E
E
E
E
E
E
E
E
180
181
X
X
C
C
C
E
E
E
E
E
E
E
E
220
221
X
X
C
C
C
E
E
E
E
E
E
E
E
270
271
X
X
C
C
C
E
E
E
E
E
E
E
E
330
331
X
X
C
C
C
E
E
E
E
E
E
E
390
391
X
X
C
C
C
E
E
E
E
E
E
470
471
X
X
C
C
C
E
E
E
E
E
560
561
X
X
C
C
C
E
E
E
E
680
681
X
X
C
C
C
E
E
E
750
751
X
X
C
C
C
E
E
820
821
X
X
C
C
C
E
1000
102
X
X
C
C
C
1200
122
X
X
C
C
1500
152
X
X
C
C
1800
182
X
X
2200
222
X
X
2700
272
X
3300
332
X
3900
392
4700
Voltage (V)
Case Size
011916
600
630
0805
1000
600
630
1000
1206
1500
2000
600
630
1000
1210
1500
2000
3000
4000
3000
E
E
E
E
E
G
G
E
E
E
E
E
G
G
F
E
E
E
E
E
G
G
F
E
E
E
F
F
G
G
F
E
E
E
F
F
G
G
E
F
E
E
E
F
F
G
G
E
E
F
E
E
E
G
G
E
E
E
F
E
E
E
G
G
E
E
E
E
E
E
G
G
E
E
E
E
E
F
G
G
E
F
G
E
G
2500
3000
600
630
1000
1500
2000
1808
2500
3000
4000
F
F
F
F
1000
1500
2000
4000
4000
1812
103
High Voltage MLC Chips FLEXITERM®
For 600V to 5000V Applications
X7R CAPACITANCE RANGE
PREFERRED SIZES ARE SHADED
Case Size
1825
2220
2225
Soldering
Reflow Only
Reflow Only
Reflow Only
(L) Length
mm
(in.)
(W) Width
mm
(in.)
(T) Thickness mm
(in.)
(t) Terminal
min
max
Voltage (V)
Cap (pF)
600
4.60 ± 0.50
(0.181 ± 0.020)
6.30 ± 0.40
(0.248 ± 0.016)
3.40
(0.134)
0.75 ± 0.35
(0.030 ± 0.014)
630 1000 1500 2000 2500 3000 4000 600
5.70 ± 0.50
(0.224 ± 0.020)
5.00 ± 0.40
(0.197 ± 0.016)
3.40
(0.134)
0.85 ± 0.35
(0.033 ± 0.014)
630 1000 1500 2000 2500 3000 4000 5000 600
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
2.54
(0.100)
0.85 ± 0.35
630 1000 1500 2000 2500 3000 4000 5000
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
750 751
820 821
1000 102
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
1200 122
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
1500 152
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
1800 182
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
2200 222
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
2700 272
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
3300 332
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
3900 392
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
4700 472
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
5600 562
F
F
F
F
F
F
F
F
F
F
F
F
F
G
F
F
F
F
F
F
F
6800 682
F
F
F
G
G
G
G
F
F
F
F
F
G
G
F
F
F
F
F
G
G
8200 822
F
F
F
G
G
G
G
F
F
F
G
G
G
G
F
F
F
F
F
G
G
Cap (μF) 0.010 103
F
F
F
G
G
G
G
F
F
F
G
G
G
G
F
F
F
F
F
G
G
0.015 153
F
F
F
G
G
G
F
F
F
G
G
G
F
F
F
G
G
G
G
0.018 183
F
F
F
G
G
F
F
F
G
G
G
F
F
F
G
G
G
0.022 223
F
F
F
G
G
F
F
F
G
G
F
F
F
G
G
G
0.027 273
F
F
F
G
F
F
F
G
G
F
F
F
G
G
0.033 333
F
F
F
G
F
F
F
G
F
F
F
G
G
0.039 393
F
F
F
G
F
F
F
G
F
F
F
G
0.047 473
F
F
F
P
F
F
F
G
F
F
F
G
0.056 563
F
F
F
G
F
F
F
G
F
F
F
G
0.068 683
F
F
G
F
F
G
F
F
F
G
0.082 823
F
F
G
F
F
G
F
F
G
0.100 104
F
F
G
F
F
G
F
F
G
0.150 154
F
F
F
F
G
F
F
G
0.220 224
F
F
F
F
G
F
F
0.270 274
F
F
F
F
F
F
0.330 334
F
F
F
F
F
F
0.390 394
F
F
F
F
F
F
0.470 474
F
F
F
F
F
F
0.560 564
G
G
G
G
F
F
G
G
G
G
G
G
0.680 684
0.820 824
1.000 105
Voltage (V)
600
630 1000 1500 2000 2500 3000 4000 600
Case Size
Letter
Max.
Thickness
104
630 1000 1500 2000 2500 3000 4000 5000 600
1825
A
0.813
(0.032)
C
1.448
(0.057)
2220
E
1.8034
(0.071)
F
2.2098
(0.087)
G
2.794
(0.110)
P
3.048
(0.120)
630 1000 1500 2000 2500 3000 4000 5000
2225
X
0.940
(0.037)
NOTE: Contact factory for non-specified capacitance values
011916
High Voltage MLC Chip Capacitors
For 600V to 3000V Automotive Applications – AEC-Q200
Modern automotive electronics could require components capable to work with high
voltage (e.g. xenon lamp circuits or power converters in hybrid cars). AVX offer high
voltage ceramic capacitors qualified according to AEC-Q200 standard.
High value, low leakage and small size are difficult parameters to obtain in capacitors
for high voltage systems. AVX special high voltage MLC chip capacitors meet these
performance characteristics and are designed for applications such as snubbers in
high frequency power converters, resonators in SMPS, and high voltage coupling / dc
blocking. These high voltage chip designs exhibit low ESRs at high frequencies.
Due to high voltage nature, larger physical dimensions are necessary. These larger
sizes require special precautions to be taken in applying of MLC chips. The
temperature gradient during heating or cooling cycles should not exceed 4ºC per
second. The preheat temperature must be within 50ºC of the peak temperature
reached by the ceramic bodies through the soldering process. Chip sizes 1210 and
larger should be reflow soldered only. Capacitors may require protective surface
coating to prevent external arcing.
To improve mechanical and thermal resistance, AVX recommend to use flexible
terminations system - FLEXITERM®.
HOW TO ORDER
1210
C
C
223
K
4
T
1
A
AVX
Style
1206
1210
1808
1812
2220
Voltage
C = 630V
A = 1000V
S = 1500V
G = 2000V
W = 2500V
H = 3000V
Dielectric
C = X7R
Capacitance Code
(2 significant digits
+ no. of zeros)
e.g. 103 = 10nF
(223 = 22nF)
Capacitance
Tolerance
J = ±5%
K = ±10%
M = ±20%
Failure Rate
4 = Automotive
Termination
T = Plated Ni/Sn
Z = FLEXITERM®
Packaging
2 = 7" Reel
4 = 13" Reel
Special
Code
A = Standard
*AVX offers nonstandard case sizes. Contact factory for details.
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal.
Please contact AVX for recommendations.
CHIP DIMENSIONS DESCRIPTION (See capacitance range chart on page 106)
L
L = Length
W = Width
T = Thickness
t = Terminal
W
T
t
t
X7R DIELECTRIC PERFORMANCE CHARACTERISTICS
Parameter/Test
Specification Limits
Measuring Conditions
Operating Temperature Range
-55°C to +125°C
Temperature Cycle Chamber
Capacitance
Dissipation Factor
Capacitance Tolerance
within specified tolerance
2.5% max.
±5% (J), ±10% (K), ±20% (M)
Freq.: 1kHz ±10%
Voltage: 1.0Vrm s ±0.2Vrms
T = +25°C, V = 0Vdc
Temperature Characteristics
X7R = ±15%
Vdc = 0V, T = (-55°C to +125°C)
Insulation Resistance
100GΩ min. or 1000MΩ • μF min. (whichever is less)
10GΩ min. or 100MΩ • μF min. (whichever is less)
T = +25°C, V = 500Vdc
T = +125°C, V = 500Vdc
(t ≥ 120 sec, I ≤ 50mA)
Dielectric Strength
No breakdown or visual defect
120% of rated voltage
t ≤ 5 sec, I ≤ 50mA
REV 01
105
High Voltage MLC Chip Capacitors
For 600V to 3000V Automotive Applications – AEC-Q200
X7R CAPACITANCE RANGE
PREFERRED SIZES ARE SHADED
Case Size
1206
1210
1808
1812
2220
Soldering
Reflow/Wave
Reflow Only
Reflow Only
Reflow Only
Reflow Only
(L) Length
(W) Width
(T) Thickness
(t) Terminal
mm
(in.)
mm
(in.)
mm
(in.)
min
max
Voltage (V)
Cap (pF)
Cap (μF)
100
101
120
121
150
151
180
181
220
221
270
271
330
331
390
391
470
471
560
561
680
681
820
821
1000
102
1200
122
1500
152
1800
182
2200
222
2700
272
3300
332
3900
392
4700
472
5600
562
6800
682
8200
822
0.01
103
0.012
123
0.015
153
0.018
183
0.022
223
0.027
273
0.033
333
0.039
393
0.047
473
0.056
563
0.068
683
0.082
823
0.100
104
0.120
124
0.150
154
Voltage (V)
Case Size
630
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
1.52
(0.060)
0.25 (0.010)
0.75 (0.030)
1000 1500 2000 2500
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
1.70
(0.067)
0.25 (0.010)
0.75 (0.030)
630 1000 1500 2000
630
1000 1500 2000 2500
630
1206
1000 1500 2000
1210
630
4.57 ± 0.25
(0.180 ± 0.010)
2.03 ± 0.25
(0.080 ± 0.010)
2.03
(0.080)
0.25 (0.010)
1.02 (0.040)
1000 1500 2000 2500 3000
630
1000 1500 2000 2500 3000
1808
630
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
2.54
(0.100)
0.25 (0.010)
1.02 (0.040)
1000 1500 2000 2500 3000
5.70 ± 0.40
(0.224 ± 0.016)
5.00 ± 0.40
(0.197 ± 0.016)
3.30
(0.130)
0.25 (0.010)
1.02 (0.040)
630 1000 1500 2000
630
1000 1500 2000 2500 3000
630
1812
1000 1500 2000
2220
NOTE: Contact factory for non-specified capacitance values
106
REV 01
MIL-PRF-55681/Chips
Part Number Example
CDR01 thru CDR06
MILITARY DESIGNATION PER MIL-PRF-55681
Part Number Example
CDR01
L
W
D
t
BP
101
B
K
S
M
MIL Style
Voltage-temperature
Limits
Capacitance
T
Rated Voltage
Capacitance Tolerance
Termination Finish
Failure Rate
NOTE: Contact factory for availability of Termination and Tolerance Options for
Specific Part Numbers.
MIL Style: CDR01, CDR02, CDR03, CDR04, CDR05,
CDR06
Rated Voltage: A = 50V, B = 100V
Termination Finish:
M = Palladium silver
N = Silver-nickel-gold
S = Solder coated final with a minimum of 4 percent lead
T = Silver
U = Base metallization-barrier metal-solder coated
(tin/lead alloy, with a minimum of 4 percent lead)
W = Base metallization-barrier metal-tinned
(tin or tin/lead alloy)
Y = Base metallization-barrier metal-tin (100 percent)
Z = Base metallization-barrier metal-tinned
(tin/lead alloy, with a minimum of 4 percent lead)
Capacitance Tolerance: J ± 5%, K ± 10%, M ± 20%
*See MIL-PRF-55681 Specification for more details
Voltage Temperature Limits:
BP = 0 ± 30 ppm/°C without voltage; 0 ± 30 ppm/°C with
rated voltage from -55°C to +125°C
BX = ±15% without voltage; +15 –25% with rated voltage
from -55°C to +125°C
Capacitance: Two digit figures followed by multiplier
(number of zeros to be added) e.g., 101 = 100 pF
Failure Rate Level: M = 1.0%, P = .1%, R = .01%,
S = .001%
Packaging: Bulk is standard packaging. Tape and reel
per RS481 is available upon request.
Not RoHS Compliant
CROSS REFERENCE: AVX/MIL-PRF-55681/CDR01 THRU CDR06*
Per
MIL-PRF-55681
AVX
Style
CDR01
CDR02
CDR03
CDR04
0805
1805
1808
1812
CDR05
1825
CDR06
2225
Length (L)
Width (W)
.080 ± .015
.180 ± .015
.180 ± .015
.180 ± .015
.180 +.020
-.015
.225 ± .020
.050 ± .015
.050 ± .015
.080 ± .018
.125 ± .015
.250 +.020
-.015
.250 ± .020
Thickness (T)
Min.
Max.
Min.
D
Max.
Termination Band (t)
Min.
Max.
.022
.022
.022
.022
.055
.055
.080
.080
.030
—
—
—
—
—
—
—
.010
.010
.010
.010
—
.030
.030
.030
.020
.080
—
—
.010
.030
.020
.080
—
—
.010
.030
*For CDR11, 12, 13, and 14 see AVX Microwave Chip Capacitor Catalog
107
MIL-PRF-55681/Chips
Military Part Number Identification
CDR01 thru CDR06
CDR01 thru CDR06 to MIL-PRF-55681
Military
Type
Designation
Capacitance
in pF
Rated temperature WVDC
Capacitance
and voltagetolerance temperature limits
AVX Style 0805/CDR01
Military
Type
Designation
Capacitance
in pF
Rated temperature WVDC
Capacitance
and voltagetolerance temperature limits
AVX Style 1808/CDR03
CDR01BP100B--CDR01BP120B--CDR01BP150B--CDR01BP180B--CDR01BP220B---
10
12
15
18
22
J,K
J
J,K
J
J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR03BP331B--CDR03BP391B--CDR03BP471B--CDR03BP561B--CDR03BP681B---
330
390
470
560
680
J,K
J
J,K
J
J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR01BP270B--CDR01BP330B--CDR01BP390B--CDR01BP470B--CDR01BP560B---
27
33
39
47
56
J
J,K
J
J,K
J
BP
BP
BP
BP
BP
100
100
100
100
100
CDR03BP821B-CDR03BP102B--CDR03BX123B-CDR03BX153B--CDR03BX183B---
820
1000
12,000
15,000
18,000
J
J,K
K
K,M
K
BP
BP
BX
BX
BX
100
100
100
100
100
CDR01BP680B--CDR01BP820B--CDR01BP101B--CDR01B--121B--CDR01B--151B---
68
82
100
120
150
J,K
J
J,K
J,K
J,K
BP
BP
BP
BP,BX
BP,BX
100
100
100
100
100
CDR03BX223B--CDR03BX273B--CDR03BX333B--CDR03BX393A--CDR03BX473A---
22,000
27,000
33,000
39,000
47,000
K,M
K
K,M
K
K,M
BX
BX
BX
BX
BX
100
100
100
50
50
CDR01B--181B--CDR01BX221B--CDR01BX271B--CDR01BX331B--CDR01BX391B---
180
220
270
330
390
J,K
K,M
K
K,M
K
BP,BX
BX
BX
BX
BX
100
100
100
100
100
CDR03BX563A--CDR03BX683A---
56,000
68,000
K
K,M
BX
BX
50
50
CDR01BX471B--CDR01BX561B--CDR01BX681B--CDR01BX821B--CDR01BX102B---
470
560
680
820
1000
K,M
K
K,M
K
K,M
BX
BX
BX
BX
BX
100
100
100
100
100
CDR04BP122B--CDR04BP152B--CDR04BP182B--CDR04BP222B--CDR04BP272B---
1200
1500
1800
2200
2700
J
J,K
J
J,K
J
BP
BP
BP
BP
BP
100
100
100
100
100
CDR01BX122B--CDR01BX152B--CDR01BX182B--CDR01BX222B--CDR01BX272B---
1200
1500
1800
2200
2700
K
K,M
K
K,M
K
BX
BX
BX
BX
BX
100
100
100
100
100
CDR04BP332B--CDR04BX393B--CDR04BX473B--CDR04BX563B--CDR04BX823A---
3300
39,000
47,000
56,000
82,000
J,K
K
K,M
K
K
BP
BX
BX
BX
BX
100
100
100
100
50
CDR01BX332B--CDR01BX392A--CDR01BX472A---
3300
3900
4700
K,M
K
K,M
BX
BX
BX
100
50
50
CDR04BX104A--CDR04BX124A--CDR04BX154A--CDR04BX184A---
100,000
120,000
150,000
180,000
K,M
K
K,M
K
BX
BX
BX
BX
50
50
50
50
AVX Style 1812/CDR04
AVX Style 1805/CDR02
CDR02BP221B--CDR02BP271B--CDR02BX392B--CDR02BX472B--CDR02BX562B---
220
270
3900
4700
5600
J,K
J
K
K,M
K
BP
BP
BX
BX
BX
100
100
100
100
100
CDR02BX682B--CDR02BX822B--CDR02BX103B--CDR02BX123A--CDR02BX153A---
6800
8200
10,000
12,000
15,000
K,M
K
K,M
K
K,M
BX
BX
BX
BX
BX
100
100
100
50
50
CDR02BX183A--CDR02BX223A---
18,000
22,000
K
K,M
BX
BX
50
50
AVX Style 1825/CDR05
CDR05BP392B--CDR05BP472B--CDR05BP562B--CDR05BX683B--CDR05BX823B---
3900
4700
5600
68,000
82,000
J,K
J,K
J,K
K,M
K
BP
BP
BP
BX
BX
100
100
100
100
100
CDR05BX104B--CDR05BX124B--CDR05BX154B--CDR05BX224A--CDR05BX274A---
100,000
120,000
150,000
220,000
270,000
K,M
K
K,M
K,M
K
BX
BX
BX
BX
BX
100
100
100
50
50
CDR05BX334A---
330,000
K,M
BX
50
J,K
J,K
J,K
K
K,M
BP
BP
BP
BX
BX
100
100
100
50
50
Add appropriate failure rate
AVX Style 2225/CDR06
Add appropriate termination finish
CDR06BP682B--CDR06BP822B--CDR06BP103B--CDR06BX394A--CDR06BX474A---
Capacitance Tolerance
6800
8200
10,000
390,000
470,000
Add appropriate failure rate
Add appropriate termination finish
Capacitance Tolerance
108
MIL-PRF-55681/Chips
Part Number Example
CDR31 thru CDR35
MILITARY DESIGNATION PER MIL-PRF-55681
Part Number Example
(example)
L
W
t
D
CDR31
BP
101
B
K
S
M
MIL Style
Voltage-temperature
Limits
Capacitance
T
Rated Voltage
Capacitance Tolerance
Termination Finish
Failure Rate
NOTE: Contact factory for availability of Termination and Tolerance Options for
Specific Part Numbers.
MIL Style: CDR31, CDR32, CDR33, CDR34, CDR35
Voltage Temperature Limits:
BP = 0 ± 30 ppm/°C without voltage; 0 ± 30 ppm/°C with
rated voltage from -55°C to +125°C
BX = ±15% without voltage; +15 –25% with rated voltage
from -55°C to +125°C
Capacitance: Two digit figures followed by multiplier
(number of zeros to be added) e.g., 101 = 100 pF
Rated Voltage: A = 50V, B = 100V
Capacitance Tolerance: B ± .10 pF, C ± .25 pF, D ± .5
pF, F ± 1%, J ± 5%, K ± 10%,
M ± 20%
Termination Finish:
Termination Finish:
M = Palladium silver
N = Silver-nickel-gold
S = Solder coated final with a minimum of 4 percent lead
T = Silver
U = Base metallization-barrier metal-solder coated
(tin/lead alloy, with a minimum of 4 percent lead)
W = Base metallization-barrier metal-tinned
(tin or tin/lead alloy)
Y = Base metallization-barrier metal-tin (100 percent)
Z = Base metallization-barrier metal-tinned
(tin/lead alloy, with a minimum of 4 percent lead)
*See MIL-PRF-55681 Specification for more details
Failure Rate Level: M = 1.0%, P = .1%, R = .01%,
S = .001%
Packaging: Bulk is standard packaging. Tape and reel
per RS481 is available upon request.
Not RoHS Compliant
CROSS REFERENCE: AVX/MIL-PRF-55681/CDR31 THRU CDR35
Per MIL-PRF-55681
(Metric Sizes)
AVX
Style
Length (L)
(mm)
Width (W)
(mm)
CDR31
CDR32
CDR33
CDR34
CDR35
0805
1206
1210
1812
1825
2.00
3.20
3.20
4.50
4.50
1.25
1.60
2.50
3.20
6.40
Thickness (T)
D
Max. (mm)
1.3
1.3
1.5
1.5
1.5
Min. (mm)
.50
—
—
—
—
Termination Band (t)
Max. (mm)
.70
.70
.70
.70
.70
Min. (mm)
.30
.30
.30
.30
.30
109
MIL-PRF-55681/Chips
Military Part Number Identification CDR31
CDR31 to MIL-PRF-55681/7
Military
Type
Designation 1/
Capacitance
in pF
Rated temperature WVDC
Capacitance
and voltagetolerance temperature limits
AVX Style 0805/CDR31 (BP)
Military
Type
Designation 1/
Capacitance
in pF
Rated temperature WVDC
Capacitance
and voltagetolerance temperature limits
AVX Style 0805/CDR31 (BP) cont’d
CDR31BP1R0B--CDR31BP1R1B--CDR31BP1R2B--CDR31BP1R3B--CDR31BP1R5B---
1.0
1.1
1.2
1.3
1.5
B,C
B,C
B,C
B,C
B,C
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP101B--CDR31BP111B--CDR31BP121B--CDR31BP131B--CDR31BP151B---
100
110
120
130
150
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP1R6B--CDR31BP1R8B--CDR31BP2R0B--CDR31BP2R2B--CDR31BP2R4B---
1.6
1.8
2.0
2.2
2.4
B,C
B,C
B,C
B,C
B,C
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP161B--CDR31BP181B--CDR31BP201B--CDR31BP221B--CDR31BP241B---
160
180
200
220
240
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP2R7B--CDR31BP3R0B--CDR31BP3R3B--CDR31BP3R6B--CDR31BP3R9B---
2.7
3.0
3.3
3.6
3.9
B,C,D
B,C,D
B,C,D
B,C,D
B,C,D
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP271B--CDR31BP301B--CDR31BP331B--CDR31BP361B--CDR31BP391B---
270
300
330
360
390
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP4R3B--CDR31BP4R7B--CDR31BP5R1B--CDR31BP5R6B--CDR31BP6R2B---
4.3
4.7
5.1
5.6
6.2
B,C,D
B,C,D
B,C,D
B,C,D
B,C,D
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP431B--CDR31BP471B--CDR31BP511A--CDR31BP561A--CDR31BP621A---
430
470
510
560
620
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
50
50
50
CDR31BP6R8B--CDR31BP7R5B--CDR31BP8R2B--CDR31BP9R1B--CDR31BP100B---
6.8
7.5
8.2
9.1
10
B,C,D
B,C,D
B,C,D
B,C,D
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP681A---
680
F,J,K
BP
50
CDR31BP110B--CDR31BP120B--CDR31BP130B--CDR31BP150B--CDR31BP160B---
11
12
13
15
16
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP180B--CDR31BP200B--CDR31BP220B--CDR31BP240B--CDR31BP270B---
18
20
22
24
27
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP300B--CDR31BP330B--CDR31BP360B--CDR31BP390B--CDR31BP430B---
30
33
36
39
43
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP470B--CDR31BP510B--CDR31BP560B--CDR31BP620B--CDR31BP680B---
47
51
56
62
68
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR31BP750B--CDR31BP820B--CDR31BP910B---
75
82
91
F,J,K
F,J,K
F,J,K
BP
BP
BP
100
100
100
Add appropriate failure rate
Add appropriate termination finish
Capacitance Tolerance
110
AVX Style 0805/CDR31 (BX)
CDR31BX471B--CDR31BX561B--CDR31BX681B--CDR31BX821B--CDR31BX102B---
470
560
680
820
1,000
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
100
100
100
100
100
CDR31BX122B--CDR31BX152B--CDR31BX182B--CDR31BX222B--CDR31BX272B---
1,200
1,500
1,800
2,200
2,700
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
100
100
100
100
100
CDR31BX332B--CDR31BX392B--CDR31BX472B--CDR31BX562A--CDR31BX682A---
3,300
3,900
4,700
5,600
6,800
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
100
100
100
50
50
CDR31BX822A--CDR31BX103A--CDR31BX123A--CDR31BX153A--CDR31BX183A---
8,200
10,000
12,000
15,000
18,000
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
50
50
50
50
50
Add appropriate failure rate
Add appropriate termination finish
Capacitance Tolerance
1/ The complete part number will include additional symbols to indicate capacitance
tolerance, termination and failure rate level.
MIL-PRF-55681/Chips
Military Part Number Identification CDR32
CDR32 to MIL-PRF-55681/8
Military
Type
Designation 1/
Capacitance
in pF
Rated temperature WVDC
Capacitance
and voltagetolerance temperature limits
AVX Style 1206/CDR32 (BP)
Military
Type
Designation 1/
Capacitance
in pF
Rated temperature WVDC
Capacitance
and voltagetolerance temperature limits
AVX Style 1206/CDR32 (BP) cont’d
CDR32BP1R0B--CDR32BP1R1B--CDR32BP1R2B--CDR32BP1R3B--CDR32BP1R5B---
1.0
1.1
1.2
1.3
1.5
B,C
B,C
B,C
B,C
B,C
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP101B--CDR32BP111B--CDR32BP121B--CDR32BP131B--CDR32BP151B---
100
110
120
130
150
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP1R6B--CDR32BP1R8B--CDR32BP2R0B--CDR32BP2R2B--CDR32BP2R4B---
1.6
1.8
2.0
2.2
2.4
B,C
B,C
B,C
B,C
B,C
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP161B--CDR32BP181B--CDR32BP201B--CDR32BP221B--CDR32BP241B---
160
180
200
220
240
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP2R7B--CDR32BP3R0B--CDR32BP3R3B--CDR32BP3R6B--CDR32BP3R9B---
2.7
3.0
3.3
3.6
3.9
B,C,D
B,C,D
B,C,D
B,C,D
B,C,D
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP271B--CDR32BP301B--CDR32BP331B--CDR32BP361B--CDR32BP391B---
270
300
330
360
390
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP4R3B--CDR32BP4R7B--CDR32BP5R1B--CDR32BP5R6B--CDR32BP6R2B---
4.3
4.7
5.1
5.6
6.2
B,C,D
B,C,D
B,C,D
B,C,D
B,C,D
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP431B--CDR32BP471B--CDR32BP511B--CDR32BP561B--CDR32BP621B---
430
470
510
560
620
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP6R8B--CDR32BP7R5B--CDR32BP8R2B--CDR32BP9R1B--CDR32BP100B---
6.8
7.5
8.2
9.1
10
B,C,D
B,C,D
B,C,D
B,C,D
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP681B--CDR32BP751B--CDR32BP821B--CDR32BP911B--CDR32BP102B---
680
750
820
910
1,000
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP110B--CDR32BP120B--CDR32BP130B--CDR32BP150B--CDR32BP160B---
11
12
13
15
16
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP112A--CDR32BP122A--CDR32BP132A--CDR32BP152A--CDR32BP162A---
1,100
1,200
1,300
1,500
1,600
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
50
50
50
50
50
CDR32BP180B--CDR32BP200B--CDR32BP220B--CDR32BP240B--CDR32BP270B---
18
20
22
24
27
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP182A--CDR32BP202A--CDR32BP222A---
1,800
2,000
2,200
F,J,K
F,J,K
F,J,K
BP
BP
BP
50
50
50
CDR32BP300B--CDR32BP330B--CDR32BP360B--CDR32BP390B--CDR32BP430B---
30
33
36
39
43
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP470B--CDR32BP510B--CDR32BP560B--CDR32BP620B--CDR32BP680B---
47
51
56
62
68
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR32BP750B--CDR32BP820B--CDR32BP910B---
75
82
91
F,J,K
F,J,K
F,J,K
BP
BP
BP
100
100
100
AVX Style 1206/CDR32 (BX)
CDR32BX472B--CDR32BX562B--CDR32BX682B--CDR32BX822B--CDR32BX103B---
4,700
5,600
6,800
8,200
10,000
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
100
100
100
100
100
CDR32BX123B--CDR32BX153B--CDR32BX183A--CDR32BX223A--CDR32BX273A---
12,000
15,000
18,000
22,000
27,000
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
100
100
50
50
50
CDR32BX333A--CDR32BX393A---
33,000
39,000
K,M
K,M
BX
BX
50
50
Add appropriate failure rate
Add appropriate failure rate
Add appropriate termination finish
Add appropriate termination finish
Capacitance Tolerance
Capacitance Tolerance
1/ The complete part number will include additional symbols to indicate capacitance
tolerance, termination and failure rate level.
111
MIL-PRF-55681/Chips
Military Part Number Identification CDR33/34/35
CDR33/34/35 to MIL-PRF-55681/9/10/11
Military
Type
Designation 1/
Capacitance
in pF
Rated temperature WVDC
Capacitance
and voltagetolerance temperature limits
AVX Style 1210/CDR33 (BP)
Military
Type
Designation 1/
Capacitance
in pF
Rated temperature WVDC
Capacitance
and voltagetolerance temperature limits
AVX Style 1812/CDR34 (BX)
CDR33BP102B--CDR33BP112B--CDR33BP122B--CDR33BP132B--CDR33BP152B---
1,000
1,100
1,200
1,300
1,500
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR34BX273B--CDR34BX333B--CDR34BX393B--CDR34BX473B--CDR34BX563B---
27,000
33,000
39,000
47,000
56,000
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
100
100
100
100
100
CDR33BP162B--CDR33BP182B--CDR33BP202B--CDR33BP222B--CDR33BP242A---
1,600
1,800
2,000
2,200
2,400
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
50
CDR34BX104A--CDR34BX124A--CDR34BX154A--CDR34BX184A---
100,000
120,000
150,000
180,000
K,M
K,M
K,M
K,M
BX
BX
BX
BX
50
50
50
50
CDR33BP272A--CDR33BP302A--CDR33BP332A---
2,700
3,000
3,300
F,J,K
F,J,K
F,J,K
BP
BP
BP
50
50
50
AVX Style 1825/CDR35 (BP)
AVX Style 1210/CDR33 (BX)
CDR33BX153B--CDR33BX183B--CDR33BX223B--CDR33BX273B--CDR33BX393A---
15,000
18,000
22,000
27,000
39,000
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
100
100
100
100
50
CDR33BX473A--CDR33BX563A--CDR33BX683A--CDR33BX823A--CDR33BX104A---
47,000
56,000
68,000
82,000
100,000
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
50
50
50
50
50
AVX Style 1812/CDR34 (BP)
CDR34BP222B--CDR34BP242B--CDR34BP272B--CDR34BP302B--CDR34BP332B---
2,200
2,400
2,700
3,000
3,300
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR34BP362B--CDR34BP392B--CDR34BP432B--CDR34BP472B--CDR34BP512A---
3,600
3,900
4,300
4,700
5,100
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
50
CDR34BP562A--CDR34BP622A--CDR34BP682A--CDR34BP752A--CDR34BP822A---
5,600
6,200
6,800
7,500
8,200
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
50
50
50
50
50
CDR34BP912A--CDR34BP103A---
9,100
10,000
F,J,K
F,J,K
BP
BP
50
50
CDR35BP472B--CDR35BP512B--CDR35BP562B--CDR35BP622B--CDR35BP682B---
4,700
5,100
5,600
6,200
6,800
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
100
CDR35BP752B--CDR35BP822B--CDR35BP912B--CDR35BP103B--CDR35BP113A---
7,500
8,200
9,100
10,000
11,000
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
100
100
100
100
50
CDR35BP123A--CDR35BP133A--CDR35BP153A--CDR35BP163A--CDR35BP183A---
12,000
13,000
15,000
16,000
18,000
F,J,K
F,J,K
F,J,K
F,J,K
F,J,K
BP
BP
BP
BP
BP
50
50
50
50
50
CDR35BP203A--CDR35BP223A---
20,000
22,000
F,J,K
F,J,K
BP
BP
50
50
AVX Style 1825/CDR35 (BX)
CDR35BX563B--CDR35BX683B--CDR35BX823B--CDR35BX104B--CDR35BX124B---
56,000
68,000
82,000
100,000
120,000
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
100
100
100
100
100
CDR35BX154B--CDR35BX184A--CDR35BX224A--CDR35BX274A--CDR35BX334A---
150,000
180,000
220,000
270,000
330,000
K,M
K,M
K,M
K,M
K,M
BX
BX
BX
BX
BX
100
50
50
50
50
CDR35BX394A--CDR35BX474A---
390,000
470,000
K,M
K,M
BX
BX
50
50
Add appropriate failure rate
Add appropriate failure rate
Add appropriate termination finish
Add appropriate termination finish
Capacitance Tolerance
Capacitance Tolerance
1/ The complete part number will include additional symbols to indicate capacitance
tolerance, termination and failure rate level.
112
MQ Series – Medical Grade MLCC
General Specifications
GENERAL DESCRIPTION
AVX offers a wide variety of medically qualified passive components.
Medical devices require the utmost reliability with respect to the
components incorporated into the designs. Advanced design
qualification requirements, in-process controls and requirements and
lot acceptance testing are implemented to ensure these components
will meet the superior reliability levels of a life supporting application.
AVX medical MLCC reliability documents provide an advanced level
of designing, manufacturing, testing and qualification that places AVX
as the top supplier and industry leader of medically qualified MLCCs.
AVX MQ series of medically qualified ceramic capacitors are available
in EIA case sizes ranging from 0402 to 2225, at typical voltage
ratings between 4 – 200 Vdc with various termination options
including Sn, SnPb solder, and Au.
APPLICATIONS
FEATURES
• Implantable cardioverter-defibrillator (ICD)
• Pacemakers
• Neuromodulation
• 0402 to 2225 case sizes
• Voltage range from 4v to 100v
• Capacitance up to 100μF
• Class I & II dielectric materials
• Tight tolerances on Class I dielectric materials
• Various terminations
• Customer specific requirements, screening, & testing
HOW TO ORDER
MQ02
Z
A
100
J
G
T
3
A
Size
MQ02 = 0402
MQ03 = 0603
MQ05 = 0805
MQ06 = 1206
MQ10 = 1210
MQ12 = 1812
MQ13 = 1825
MQ14 = 2225
Rated
Voltage
4 = 4V
6 = 6.3V
Z = 10V
Y = 16v
3 = 25V
5 = 50V
1 = 100V
Dielectric
Code
A = NP0 (C0G)
C = X7R
Z = X7S
D = X5R
Capacitance
Code (In pF)
(2 significant
digits + number
of zeros)
for values <10pF:
letter R denotes
decimal point.
Example:
68pF = 680
8.2pF = 8R2
Capacitance
Tolerance
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1% (≥10pF)
G = ±2% (≥10pF)
J = ±5%
K = ±10%
M = ±20%
N = ±30%
Medical
Grade
Termination
Finish
T = Plated Ni & Sn
J = 60/40 Sn/Pb
B = 5% min Pb
Plated Solder
7 = Gold Plated
Packaging
1 = 7" Reel
2 = 7" Reel
(0402 only)
3 = 13" Reel
4 = 13" Reel
(0402 only)
6 = Waffle
Special
Code
A = Standard
042216
Contact AVX
for others
113
MQ Series – Medical Grade MLCC
NP0 (C0G) – Capacitance & Voltage Range
PREFERRED SIZES ARE SHADED
0603
0805
1206
1210
1812
1825
2225
Reflow/Wave
All Embossed
Reflow/Wave
All Embossed
Reflow/Wave
All Embossed
Reflow Only
All Embossed
Reflow Only
All Embossed
Reflow Only
All Embossed
Reflow Only
All Embossed
mm
(in.)
(W) Width mm
(in.)
(t) Terminal mm
(in.)
Maximum
mm
Thickness
(in.)
WVDC
Cap
0.5
(pF)
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
5600
6800
8200
10000
WVDC
1.00 ± 0.10
((0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
0.56
(0.022)
16
25
50
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.037)
0.94
(0.014 ± 0.006)
16
25
50
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
1.52
(0.060)
25
50
100
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
1.78
(0.070)
25
50
100
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
1.78
(0.070)
25
50
100
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
0.61 ± 0.36
(0.024 ± 0.014)
2.79
(0.110)
25
50
100
4.50 ± 0.30
(0.177 ± 0.012)
6.40 ± 0.40
(0.252 ± 0.016)
0.61 ± 0.36
(0.024 ± 0.014)
2.79
(0.110)
50
100
5.72 ± 0.25
(0.225 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
0.64 ± 0.39
(0.025 ± 0.015)
2.79
(0.110)
25
50
100
SIZE
0402
16
16
䉲
100
L
䉲
W
T
䉲
䉲
䉲
114
6.3
䉲
(L) Length
䉲
0402
Reflow Only
All Paper
䉲
SIZE
Soldering
Packaging
16
25
50
6.3
16
25
0603
50
100
16
25
50
0805
100
16
25
50
1206
100
25
50
1210
100
25
50
1812
100
50
t
100
1825
25
50
100
2225
042216
MQ Series – Medical Grade MLCC
NP0 (C0G) – General Specifications
TYPICAL ELECTRICAL CHARACTERISTICS
⌬ Capacitance vs. Frequency
+2
Typical Capacitance Change
Envelope: 0 ± 30 ppm/°C
% ⌬ Capacitance
% ⌬ Capacitance
Temperature Coefficient
+0.5
0
-0.5
-55 -35 -15 +5 +25 +45 +65 +85 +105 +125
+1
0
-1
-2
1KHz
10 KHz
1 MHz
10 MHz
Variation of Impedance with Cap Value
Impedance vs. Frequency
0805 - C0G (NP0)
10 pF
p vs. 100 pF vs.
p 1000 pF
p
Insulation Resistance vs. Temperature
Insulation
Resistance vs Temperature
10,000
100,000
10,000
Impedance, ⍀
Insulation Resistance (Ohm-Farads)
100 KHz
Frequency
Temperature °C
1,000
100
1,000
100
10 pF
10.0
1.0
100 pF
1000 pF
0.1
0
0
1
20
40
60
80
100
100
10
1000
Frequency, MHz
Temperature °C
Variation of Impedance with Chip Size
Impedance vs. Frequency
1000 pF - C0G (NP0)
10.00
1.0
100
Frequency, MHz
042216
X7R
NPO
1206
0805
1812
1210
Impedance, ⍀
Impedance, ⍀
10
0.1
10
Variation of Impedance with Ceramic Formulation
Impedance vs. Frequency
1000 pF - C0G (NP0) vs. X7R
0805
1000
1.00
0.10
0.01
10
100
1000
Frequency, MHz
115
MQ Series – Medical Grade MLCC
NP0 (C0G) – Specifications & Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
Insulation Resistance
NP0 Specification Limits
-55ºC to +125ºC
Within specified tolerance
<30 pF: Q≥ 400+20 x Cap Value
≥30 pF: Q≥ 1000
100,000MΩ or 1000MΩ - μF,
whichever is less
Dielectric Strength
No breakdown or visual defects
Q
Resistance to
Flexure
Stresses
Appearance
Capacitance
Variation
±5% or ±.5 pF, whichever is greater
Q
Meets Initial Values (As Above)
Insulation
Resistance
≥ Initial Value x 0.3
Solderability
Resistance to
Solder Heat
Appearance
Capacitance
Variation
Q
Insulation
Resistance
Appearance
Capacitance
Variation
Thermal
Shock
Load Life
Q
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Q
Insulation
Resistance
Dielectric
Strength
Appearance
Load
Humidity
116
Insulation
Resistance
No defects
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 MHz ± 10% for cap ≤ 1000 pF
1.0 kHz ± 10% for cap > 1000 pF
Voltage: 1.0Vrms ± .2V
Charge device with rated voltage for
120 ± 5 secs @ room temp/humidity
Charge device with 250% of rated voltage for
1-5 seconds, with charge and discharge
current limited to 50 mA (max)
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
≥ 85% of each terminal should be covered
with fresh solder
No defects, <25% leaching of either end terminal
90 mm
Dip device in eutectic solder at 245 ± 5ºC
for 5.0 ± 0.5 seconds
≤ ±2.5% or ±.25 pF, whichever is greater
Meets Initial Values (As Above)
MIL-STD-202 / Method 210 / Condition J
(Reflow Mounting plus 1 Reflow Cycle
@ 235°C ± 5°C)
Meets Initial Values (As Above)
No visual defects
Step 1: -55ºC ± 2º
30 ± 3 minutes
≤ ±3.0% or ±.0.3 pF, whichever is greater
Step 2: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Step 3: +125ºC ± 2º
30 ± 3 minutes
Meets Initial Values (As Above)
Step 4: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Repeat for 5 cycles and measure after
24 hours at room temperature
No visual defects
≤ ±3.0% or ± 0.3 pF, whichever is greater
≥ 30 pF:
≥10 pF, <30 pF:
<10 pF:
Q≥ 350
Q≥ 275 +5C/2
Q≥ 200 +10C
≥ Initial Value x 0.3 (See Above)
Load in test chamber set at 125°C ± 2°C
for 1000 hours (+48, -0)
with twice rated voltage applied.
Remove from test chamber and stabilize at room
temperature before measuring.
Meets Initial Values (As Above)
No visual defects
≥ Initial Value x 0.3 (See Above)
Load in a test chamber set at 85°C ± 2°C/85% ± 5%
relative humidity for 1000 hours (+48, -0) with rated
voltage applied.
Remove from chamber and stabilize at room
temperature before measuring.
042216
MQ Series – Medical Grade MLCC
X7R/X7S – General Specifications
PREFERRED SIZES ARE SHADED
SIZE
0402
0603
0805
1206
1210
Soldering
Packaging
Reflow Only
All Paper
Reflow/Wave
All Embossed
Reflow/Wave
All Embossed
Reflow/Wave
All Embossed
Reflow Only
All Embossed
(L) Length mm
(in.)
(W) Width mm
(in.)
(t) Terminal mm
(in.)
Maximum mm
Thickness (in.)
WVDC
Cap
100
(pF)
150
220
330
470
680
1000
1500
2200
3300
4700
6800
Cap 0.010
(μF)
0.015
0.022
0.033
0.047
0.068
0.10
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
WVDC
1.00 ± 0.10
((0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
0.56
(0.022)
10 16
25
50
6.3
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.037)
0.94
(0.014 ± 0.006)
10
16
25
50
100
6.3
10
100
10
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
1.78
(0.070)
16
25
50
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
0.61 ± 0.36
(0.024 ± 0.014)
2.79
(0.110)
100 50 100
10
6.3
10
100
6.3
10
100
10
16
100
SIZE
0402
16
25
50
16
25
0603
50
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
1.52
(0.060)
16
25 50
16
25
0805
50
100
6.3
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
1.78
(0.070)
10
16
25
50
100
6.3
10
16
25
1206
50
25
1210
1812
50
1825
2225
Reflow Only Reflow Only
All Embossed All Embossed
50
100
1812
Reflow Only
All Embossed
4.50 ± 0.30
5.72 ± 0.25
(0.177 ± 0.012)
(0.225 ± 0.010)
6.40 ± 0.40
6.35 ± 0.25
(0.252 ± 0.016)
(0.250 ± 0.010)
0.61 ± 0.36
0.64 ± 0.39
(0.024 ± 0.014)
(0.025 ± 0.015)
2.79
2.79
(0.110)
(0.110)
50 100 16
25 50
100
50
100
1825
16
25
50
100
2225
䉲
䉲
W
䉲
䉲
L
䉲
These values are produced with X7S temperature coefficient code
T
䉲
䉲
䉲
042216
t
117
MQ Series – Medical Grade MLCC
X7R/X7S – General Specifications
TYPICAL ELECTRICAL CHARACTERISTICS
X7R Dielectric
Typical Temperature Coefficient
⌬ Capacitance vs. Frequency
10
+30
+20
% ⌬ Capacitance
% Cap Change
5
0
-5
-10
-15
-20
-25
-60 -40 -20
0
20
40
60
+10
0
-10
-20
-30
1KHz
80 100 120 140
Temperature °C
100 KHz
1 MHz
10 MHz
Frequency
Variation of Impedance with Cap Value
Impedance vs. Frequency
1,000 pF vs. 10,000 pF - X7R
0805
Insulation Resistance vs. Temperature
Insulation Resistance vs Tempera
10,000
10.00
1,000 pF
10,000 pF
Impedance, ⍀
Insulation Resistance (Ohm-Farads)
10 KHz
1,000
100
0
0
20
40
60
80
100
1.00
0.10
0.01
10
120
Temperature °C
10
10
1206
0805
1210
Impedance, ⍀
Impedance, ⍀
1000
Variation of Impedance with Chip Size
Impedance vs. Frequency
100,000
pF
,
p - X7R
Variation of Impedance with Chip Size
Impedance vs. Frequency
10,000 pF -X7R
1.0
0.1
.01
1
10
100
Frequency, MHz
118
100
Frequency, MHz
1,000
1206
0805
1210
1.0
0.1
.01
1
10
100
1,000
Frequency, MHz
042216
MQ Series – Medical Grade MLCC
X7R/X7S – Specifications & Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
Insulation Resistance
NP0 Specification Limits
-55ºC to +125ºC
Within specified tolerance
≤ 2.5% for ≥ 50V DC rating
≤ 3.0% for 25V & 35V DC rating
≤ 12.5% for 16V DC rating and lower
Contact factory for DF by PN
100,000MΩ or 1000MΩ - μF,
whichever is less
Dielectric Strength
No breakdown or visual defects
Dissipation Factor
Resistance to
Flexure
Stresses
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Solderability
Resistance to
Solder Heat
Thermal
Shock
Load Life
Load
Humidity
042216
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
No defects
≤ ±12%
Measuring Conditions
Temperature Cycle Chamber
Frequency: 1.0kHz ± 10%
Voltage: 1.0Vrms ± 0.2V
Charge device with rated voltage for
120 ± 5 secs @ room temp/humidity
Charge device with 250% of rated voltage for
1-5 seconds, with charge and discharge
current limited to 50 mA (max)
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
Meets Initial Values (As Above)
≥ Initial Value x 0.3
90 mm
≥ 85% of each terminal should be covered
with fresh solder
No defects, <25% leaching of either end terminal
Dip device in eutectic solder at 245 ± 5ºC
for 5.0 ± 0.5 seconds
≤ ±7.5%
Meets Initial Values (As Above)
MIL-STD-202 / Method 210 / Condition J
(Reflow Mounting plus 1 Reflow Cycle
@ 235°C ± 5°C)
Meets Initial Values (As Above)
No visual defects
Step 1: -55ºC ± 2º
30 ± 3 minutes
≤ ±7.5%
Step 2: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Step 3: +125ºC ± 2º
30 ± 3 minutes
Meets Initial Values (As Above)
Step 4: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Repeat for 5 cycles and measure after
24 hours at room temperature
No visual defects
≤ ±12.5%
≤ initial value x 2.0 (see above)
≥ Initial Value x 0.3 (See Above)
Load in test chamber set at 125°C ± 2°C
for 1000 hours (+48, -0)
with twice rated voltage applied.
Remove from test chamber and stabilize at room
temperature before measuring.
Meets Initial Values (As Above)
Appearance
No visual defects
Insulation
Resistance
≥ Initial Value x 0.3 (See Above)
Load in a test chamber set at 85°C ± 2°C/85% ± 5%
relative humidity for 1000 hours (+48, -0) with rated
voltage applied.
Remove from chamber and stabilize at room
temperature before measuring.
119
MQ Series – Medical Grade MLCC
X5R – Capacitance & Voltage Range
PREFERRED SIZES ARE SHADED
SIZE
0402
0603
0805
1206
1210
1812
Soldering
Packaging
Reflow Only
All Paper
Reflow/Wave
All Embossed
Reflow/Wave
All Embossed
Reflow/Wave
All Embossed
Reflow Only
All Embossed
Reflow Only
All Embossed
(L) Length mm
(in.)
(W) Width mm
(in.)
(t) Terminal mm
(in.)
Maximum mm
Thickness (in.)
WVDC
Cap
0.01
(μF)
0.015
0.022
0.033
0.047
0.068
0.1
0.15
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
4.7
10
22
47
100
WVDC
4
1.00 ± 0.10
(0.040 ± 0.004)
0.50 ± 0.10
(0.020 ± 0.004)
0.25 ± 0.15
(0.010 ± 0.006)
0.56
(0.022)
6.3
10
16
25
50
4
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.35 ± 0.15
(0.037)
0.94
(0.014 ± 0.006)
6.3
10
16
25
50
6.3
2.01 ± 0.20
(0.079 ± 0.008)
1.25 ± 0.20
(0.049 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
1.52
(0.060)
10
16
25
50
6.3
3.20 ± 0.20
(0.126 ± 0.008)
1.60 ± 0.20
(0.063 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
1.78
(0.070)
10
16
25
50
4
3.20 ± 0.20
(0.126 ± 0.008)
2.50 ± 0.20
(0.098 ± 0.008)
0.50 ± 0.25
(0.020 ± 0.010)
1.78
(0.070)
6.3
10
16
25
50
4.50 ± 0.30
(0.177 ± 0.012)
3.20 ± 0.20
(0.126 ± 0.008)
0.61 ± 0.36
(0.024 ± 0.014)
2.79
(0.110)
6.3
10
25
50
4
6.3
50
4
6.3
50
6.3
10
50
6.3
10
50
4
6.3
50
6.3
10
16
25
0402
䉲
䉲
W
䉲
䉲
L
10
16
25
0603
16
25
0805
16
25
1206
10
16
25
10
1210
25
50
1812
䉲
SIZE
T
䉲
䉲
䉲
t
TYPICAL ELECTRICAL CHARACTERISTICS
20
% ⌬ Capacitance
15
10
5
0
-5
-10
-15
-20
-60
-40
-20
0
+20
+40
Temperature °C
120
+60
+80
Insulation Resistance (Ohm-Farads)
Temperature Coefficient
Insulation Resistance vs. Temperature
Insulation Resistance vs Temperature
10,000
1,000
100
0
0
20
40
60
80
100
120
Temperature °C
042216
MQ Series – Medical Grade MLCC
X5R – Specifications & Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
Insulation Resistance
X5R Specification Limits
-55ºC to +85ºC
Within specified tolerance
≤ 2.5% for ≥ 50V DC rating
≤ 3.0% for 25V, 35V DC rating
≤ 12.5% Max. for 16V DC rating and lower
Contact Factory for DF by PN
10,000MΩ or 500MΩ - μF,
whichever is less
Dielectric Strength
No breakdown or visual defects
Dissipation Factor
Resistance to
Flexure
Stresses
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Solderability
Resistance to
Solder Heat
Thermal
Shock
Load Life
Load
Humidity
042216
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Insulation
Resistance
No defects
≤ ±12%
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 kHz ± 10%
Voltage: 1.0Vrms ± .2V
For Cap > 10 μF, 0.5Vrms @ 120Hz
Charge device with rated voltage for
120 ± 5 secs @ room temp/humidity
Charge device with 150% of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
Meets Initial Values (As Above)
≥ Initial Value x 0.3
90 mm
≥ 85% of each terminal should be covered
with fresh solder
No defects, <25% leaching of either end terminal
Dip device in eutectic solder at 245 ± 5ºC
for 5.0 ± 0.5 seconds
≤ ±7.5%
Meets Initial Values (As Above)
MIL-STD-202 / Method 210 / Condition J
(Reflow Mounting plus 1 Reflow Cycle
@ 235°C ± 5°C)
Meets Initial Values (As Above)
No visual defects
Step 1: -55ºC ± 2º
30 ± 3 minutes
≤ ±7.5%
Step 2: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Step 3: +85ºC ± 2º
30 ± 3 minutes
Meets Initial Values (As Above)
Step 4: Room Temp
≤ 3 minutes
Meets Initial Values (As Above)
Repeat for 5 cycles and measure after
24 ± 2 hours at room temperature
No visual defects
≤ ±12.5%
≤ Initial Value x 2.0 (See Above)
≥ Initial Value x 0.3 (See Above)
Load in test chamber set at 85°C ± 2°C
for 1000 hours (+48, -0)
with twice rated voltage applied.
Remove from test chamber and stabilize at room
temperature before measuring.
Meets Initial Values (As Above)
No visual defects
≥ Initial Value x 0.3 (See Above)
Load in a test chamber set at 85°C ± 2°C/85% ± 5%
relative humidity for 1000 hours (+48, -0) with rated
voltage applied.
Remove from chamber and stabilize at room
temperature before measuring.
121
Packaging of Chip Components
Automatic Insertion Packaging
TAPE & REEL QUANTITIES
All tape and reel specifications are in compliance with RS481.
4mm
8mm
Paper or Embossed Carrier
Embossed Only
12mm
0612, 0508, 0805, 1206,
1210
0101
1808
Paper Only
1812, 1825
2220, 2225
0101, 0201, 0306, 0402, 0603
Qty. per Reel/7" Reel
4,000
1,000, 2,000, 3,000 or 4,000, 10,000, 15,000, 20,000
3,000
Contact factory for exact quantity
Qty. per Reel/13" Reel
500, 1,000
Contact factory for exact quantity
5,000, 10,000, 50,000
10,000
4,000
Contact factory for exact quantity
REEL DIMENSIONS
Tape
Size
(1)
4mm
A
Max.
1.80
(7.087)
B*
Min.
1.5
(0.059)
C
13.0±0.5
(0.522±0.020)
D*
Min.
20.2
(0.795)
N
Min.
60.0
(2.362)
8mm
330
(12.992)
1.5
(0.059)
13.0 +0.50
-0.20
(0.512 +0.020
-0.008 )
20.2
(0.795)
Metric dimensions will govern.
English measurements rounded and for reference only.
(1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision.
122
8.40 +1.5
-0.0
(0.331 +0.059
-0.0
)
14.4
(0.567)
7.90 Min.
(0.311)
10.9 Max.
(0.429)
12.4 +2.0
-0.0
-0.0
(0.488 +0.079
)
18.4
(0.724)
11.9 Min.
(0.469)
15.4 Max.
(0.607)
50.0
(1.969)
12mm
REV 01
4.35±0.3
(0.171±0.011)
W2
Max.
7.95
(0.312)
W1
W3
Embossed Carrier Configuration
4, 8 & 12mm Tape Only
10 PITCHES CUMULATIVE
TOLERANCE ON TAPE
±0.2mm (±0.008)
EMBOSSMENT
P0
T2
T
D0
P2
DEFORMATION
BETWEEN
EMBOSSMENTS
Chip Orientation
E1
A0
F
TOP COVER
TAPE
B1
T1
W
B0
K0
S1
E2
P1
MAX. CAVITY
SIZE - SEE NOTE 1
CENTER LINES
OF CAVITY
B1 IS FOR TAPE READER REFERENCE ONLY
INCLUDING DRAFT CONCENTRIC AROUND B0
D1 FOR COMPONENTS
2.00 mm x 1.20 mm AND
LARGER (0.079 x 0.047)
User Direction of Feed
4, 8 & 12mm Embossed Tape
Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size
4mm
8mm
& 12mm
D0
E1
P0
P2
0.80±0.04
0.90±0.05
2.0±0.04
1.00±0.02
(0.031±0.001) (0.035±0.001) (0.078±0.001) (0.039±0.0007)
1.75 ± 0.10
4.0 ± 0.10
2.0 ± 0.05
1.50 +0.10
-0.0
(0.059 +0.004
-0.0
) (0.069 ± 0.004) (0.157 ± 0.004) (0.079 ± 0.002)
S1 Min.
1.075
(0.042)
0.60
(0.024)
T Max.
0.26
(0.010)
0.60
(0.024)
T1 Max.
0.06
(0.002)
0.10
(0.004)
VARIABLE DIMENSIONS
Tape Size
B1
Max.
D1
Min.
E2
Min.
F
P1
T2
W
Max.
A 0 B0 K0
See Note 5
R
Min.
See Note 2
8mm
4.35
(0.171)
1.00
(0.039)
6.25
(0.246)
3.50 ± 0.05
(0.138 ± 0.002)
4.00 ± 0.10
(0.157 ± 0.004)
25.0
(0.984)
2.50 Max.
(0.098)
8.30
(0.327)
See Note 1
12mm
8.20
(0.323)
1.50
(0.059)
10.25
(0.404)
5.50 ± 0.05
(0.217 ± 0.002)
4.00 ± 0.10
(0.157 ± 0.004)
30.0
(1.181)
6.50 Max.
(0.256)
12.3
(0.484)
See Note 1
8mm
1/2 Pitch
4.35
(0.171)
1.00
(0.039)
6.25
(0.246)
3.50 ± 0.05
(0.138 ± 0.002)
2.00 ± 0.10
(0.079 ± 0.004)
25.0
(0.984)
2.50 Max.
(0.098)
8.30
(0.327)
See Note 1
12mm
Double
Pitch
8.20
(0.323)
1.50
(0.059)
10.25
(0.404)
5.50 ± 0.05
(0.217 ± 0.002)
8.00 ± 0.10
(0.315 ± 0.004)
30.0
(1.181)
6.50 Max.
(0.256)
12.3
(0.484)
See Note 1
NOTES:
1. The cavity defined by A0, B0, and K0 shall be configured to provide the following:
Surround the component with sufficient clearance such that:
a) the component does not protrude beyond the sealing plane of the cover tape.
b) the component can be removed from the cavity in a vertical direction without mechanical
restriction, after the cover tape has been removed.
c) rotation of the component is limited to 20º maximum (see Sketches D & E).
d) lateral movement of the component is restricted to 0.5mm maximum (see Sketch F).
2. Tape with or without components shall pass around radius “R” without damage.
3. Bar code labeling (if required) shall be on the side of the reel opposite the round sprocket holes.
Refer to EIA-556.
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. If P1 = 2.0mm, the tape may not properly index in all tape feeders.
Top View, Sketch "F"
Component Lateral Movements
0.50mm (0.020)
Maximum
0.50mm (0.020)
Maximum
123
REV 01
Paper Carrier Configuration
8 & 12mm Tape Only
10 PITCHES CUMULATIVE
TOLERANCE ON TAPE
±0.20mm (±0.008)
P0
D0
T
P2
E1
BOTTOM
COVER
TAPE
TOP
COVER
TAPE
F
W
E2
B0
G
T1
T1
A0
CENTER LINES
OF CAVITY
CAVITY SIZE
SEE NOTE 1
P1
User Direction of Feed
8 & 12mm Paper Tape
Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size
D0
8mm
and
12mm
1.50
(0.059
+0.10
-0.0
+0.004
-0.0
E
)
P0
P2
1.75 ± 0.10
4.00 ± 0.10
2.00 ± 0.05
(0.069 ± 0.004) (0.157 ± 0.004) (0.079 ± 0.002)
T1
G. Min.
R Min.
0.10
(0.004)
Max.
0.75
(0.030)
Min.
25.0 (0.984)
See Note 2
Min.
VARIABLE DIMENSIONS
P1
See Note 4
E2 Min.
F
W
A0 B0
4.00 ± 0.10
(0.157 ± 0.004)
6.25
(0.246)
3.50 ± 0.05
(0.138 ± 0.002)
8.00 +0.30
-0.10
(0.315 +0.012
-0.004 )
See Note 1
12mm
4.00 ± 0.10
(0.157 ± 0.004)
10.25
(0.404)
5.50 ± 0.05
(0.217 ± 0.002)
12.0 ± 0.30
(0.472 ± 0.012)
8mm
1/2 Pitch
2.00 ± 0.05
(0.079 ± 0.002)
6.25
(0.246)
3.50 ± 0.05
(0.138 ± 0.002)
-0.10
8.00 +0.30
(0.315 +0.012
-0.004 )
12mm
Double
Pitch
8.00 ± 0.10
(0.315 ± 0.004)
10.25
(0.404)
5.50 ± 0.05
(0.217 ± 0.002)
12.0 ± 0.30
(0.472 ± 0.012)
Tape Size
8mm
NOTES:
1. The cavity defined by A0, B0, and T shall be configured to provide sufficient clearance
surrounding the component so that:
a) the component does not protrude beyond either surface of the carrier tape;
b) the component can be removed from the cavity in a vertical direction without
mechanical restriction after the top cover tape has been removed;
c) rotation of the component is limited to 20º maximum (see Sketches A & B);
d) lateral movement of the component is restricted to 0.5mm maximum
(see Sketch C).
1.60mm
(0.063) Max.
for Non-Paper
Base Compositions
3. Bar code labeling (if required) shall be on the side of the reel opposite the sprocket
holes. Refer to EIA-556.
4. If P1 = 2.0mm, the tape may not properly index in all tape feeders.
0.50mm (0.020)
Maximum
0.50mm (0.020)
Maximum
Bar Code Labeling Standard
AVX bar code labeling is available and follows latest version of EIA-556
124
1.10mm
(0.043) Max.
for Paper Base
Tape and
2. Tape with or without components shall pass around radius “R” without damage.
Top View, Sketch "C"
Component Lateral
REV 01
T
Basic Capacitor Formulas
I. Capacitance (farads)
English: C = .224 K A
TD
Metric: C = .0884 K A
TD
XI. Equivalent Series Resistance (ohms)
E.S.R. = (D.F.) (Xc) = (D.F.) / (2 π fC)
XII. Power Loss (watts)
Power Loss = (2 π fCV2) (D.F.)
XIII. KVA (Kilowatts)
KVA = 2 π fCV2 x 10 -3
II. Energy stored in capacitors (Joules, watt - sec)
E = 1⁄2 CV2
XIV. Temperature Characteristic (ppm/°C)
T.C. = Ct – C25 x 106
C25 (Tt – 25)
III. Linear charge of a capacitor (Amperes)
dV
I=C
dt
XV. Cap Drift (%)
C1 – C2
C.D. =
x 100
C1
IV. Total Impedance of a capacitor (ohms)
Z = 冑 R2S + (XC - XL )2
V. Capacitive Reactance (ohms)
1
xc =
2 π fC
XVI. Reliability of Ceramic Capacitors
Vt
L0
X
Tt
Y
=
Lt
Vo
To
( ) ( )
VI. Inductive Reactance (ohms)
xL = 2 π fL
XVII. Capacitors in Series (current the same)
VII. Phase Angles:
Ideal Capacitors: Current leads voltage 90°
Ideal Inductors: Current lags voltage 90°
Ideal Resistors: Current in phase with voltage
Any Number:
C1 C2
VIII. Dissipation Factor (%)
Two: CT =
D.F.= tan ␦ (loss angle) = E.S.R. = (2 πfC) (E.S.R.)
Xc
XIX. Aging Rate
D C/decade of time
A.R. = %
XX. Decibels
X. Quality Factor (dimensionless)
Q = Cotan ␦ (loss angle) = 1
db = 20 log V1
V2
D.F.
Pico
Nano
Micro
Milli
Deci
Deca
Kilo
Mega
Giga
Tera
X 10-12
X 10-9
X 10-6
X 10-3
X 10-1
X 10+1
X 10+3
X 10+6
X 10+9
X 10+12
C 1 + C2
XVIII. Capacitors in Parallel (voltage the same)
CT = C1 + C2 --- + CN
IX. Power Factor (%)
P.F. = Sine ␦ (loss angle) = Cos (phase angle)
f
P.F. = (when less than 10%) = DF
METRIC PREFIXES
1 = 1 + 1 --- 1
CT
C1
C2
CN
SYMBOLS
K
= Dielectric Constant
f
= frequency
Lt
= Test life
A
= Area
L
= Inductance
Vt
= Test voltage
TD
= Dielectric thickness
␦
= Loss angle
Vo
= Operating voltage
V
= Voltage
f
= Phase angle
Tt
= Test temperature
t
= time
X&Y
= exponent effect of voltage and temp.
To
= Operating temperature
Rs
= Series Resistance
Lo
= Operating life
125
General Description
Basic Construction – A multilayer ceramic (MLC)
capacitor is a monolithic block of ceramic containing two
sets of offset, interleaved planar electrodes that extend to
two opposite surfaces of the ceramic dielectric. This simple
Ceramic Layer
structure requires a considerable amount of sophistication,
both in material and manufacture, to produce it in the quality
and quantities needed in today’s electronic equipment.
Electrode
End Terminations
Terminated
Edge
Terminated
Edge
Margin
Electrodes
Multilayer Ceramic Capacitor
Figure 1
Formulations – Multilayer ceramic capacitors are available
in both Class 1 and Class 2 formulations. Temperature
compensating formulation are Class 1 and temperature
stable and general application formulations are classified
as Class 2.
Class 1 – Class 1 capacitors or temperature compensating
capacitors are usually made from mixtures of titanates
where barium titanate is normally not a major part of the
mix. They have predictable temperature coefficients and
in general, do not have an aging characteristic. Thus they
are the most stable capacitor available. The most popular
Class 1 multilayer ceramic capacitors are C0G (NP0)
temperature compensating capacitors (negative-positive
0 ppm/°C).
126
Class 2 – EIA Class 2 capacitors typically are based on the
chemistry of barium titanate and provide a wide range of
capacitance values and temperature stability. The most
commonly used Class 2 dielectrics are X7R and Y5V. The
X7R provides intermediate capacitance values which vary
only ±15% over the temperature range of -55°C to 125°C. It
finds applications where stability over a wide temperature
range is required.
The Y5V provides the highest capacitance values and is
used in applications where limited temperature changes are
expected. The capacitance value for Y5V can vary from
22% to -82% over the -30°C to 85°C temperature range.
All Class 2 capacitors vary in capacitance value under the
influence of temperature, operating voltage (both AC and
DC), and frequency. For additional information on
performance changes with operating conditions, consult
AVX’s software, SpiCap.
General Description
EIA CODE
Percent Capacity Change Over Temperature Range
RS198
Temperature Range
X7
X6
X5
Y5
Z5
-55°C to +125°C
-55°C to +105°C
-55°C to +85°C
-30°C to +85°C
+10°C to +85°C
Code
Percent Capacity Change
D
E
F
P
R
S
T
U
V
±3.3%
±4.7%
±7.5%
±10%
±15%
±22%
+22%, -33%
+22%, - 56%
+22%, -82%
Effects of Voltage – Variations in voltage have little effect
on Class 1 dielectric but does affect the capacitance and
dissipation factor of Class 2 dielectrics. The application of DC
voltage reduces both the capacitance and dissipation factor
while the application of an AC voltage within a reasonable
range tends to increase both capacitance and dissipation
|factor readings. If a high enough AC voltage is applied,
eventually it will reduce capacitance just as a DC voltage will.
Figure 2 shows the effects of AC voltage.
Cap. Change vs. A.C. Volts
X7R
Capacitance Change Percent
Table 1: EIA and MIL Temperature Stable and General
Application Codes
50
40
30
20
10
0
12.5
EXAMPLE – A capacitor is desired with the capacitance value at 25°C to
increase no more than 7.5% or decrease no more than 7.5% from
-30°C to +85°C. EIA Code will be Y5F.
Symbol
Temperature Range
A
B
C
-55°C to +85°C
-55°C to +125°C
-55°C to +150°C
Symbol
R
S
W
X
Y
Z
Cap. Change
Zero Volts
Cap. Change
Rated Volts
+15%, -15%
+22%, -22%
+22%, -56%
+15%, -15%
+30%, -70%
+20%, -20%
+15%, -40%
+22%, -56%
+22%, -66%
+15%, -25%
+30%, -80%
+20%, -30%
Temperature characteristic is specified by combining range and change
symbols, for example BR or AW. Specification slash sheets indicate the
characteristic applicable to a given style of capacitor.
50
Figure 2
Capacitor specifications specify the AC voltage at which to
measure (normally 0.5 or 1 VAC) and application of the wrong
voltage can cause spurious readings. Figure 3 gives the voltage coefficient of dissipation factor for various AC voltages at
1 kilohertz. Applications of different frequencies will affect the
percentage changes versus voltages.
D.F. vs. A.C. Measurement Volts
X7R
10.0
Dissipation Factor Percent
MIL CODE
25
37.5
Volts AC at 1.0 KHz
Curve 1 - 100 VDC Rated Capacitor
8.0 Curve 2 - 50 VDC Rated Capacitor
Curve 3 - 25 VDC Rated Capacitor
6.0
Curve 3
Curve 2
4.0
Curve 1
2.0
0
.5
In specifying capacitance change with temperature for Class
2 materials, EIA expresses the capacitance change over an
operating temperature range by a 3 symbol code. The first
symbol represents the cold temperature end of the temperature range, the second represents the upper limit of the
operating temperature range and the third symbol represents
the capacitance change allowed over the operating temperature range. Table 1 provides a detailed explanation of the EIA
system.
1.0
1.5
2.0
2.5
AC Measurement Volts at 1.0 KHz
Figure 3
Typical effect of the application of DC voltage is shown in
Figure 4. The voltage coefficient is more pronounced for
higher K dielectrics. These figures are shown for room temperature conditions. The combination characteristic known as
voltage temperature limits which shows the effects of rated
voltage over the operating temperature range is shown in
Figure 5 for the military BX characteristic.
127
General Description
capacitors and is why re-reading of capacitance after 12 or
24 hours is allowed in military specifications after dielectric
strength tests have been performed.
5
Typical Curve of Aging Rate
X7R
0
+1.5
-5
-10
0
-15
-20
25%
50%
75%
Percent Rated Volts
100%
Figure 4
Capacitance Change Percent
Typical Cap. Change vs. Temperature
X7R
-1.5
-3.0
-4.5
-6.0
-7.5
+20
1
10
100
+10
0VDC
0
-10
-30
-55 -35
Characteristic
C0G (NP0)
X7R, X5R
Y5V
1000 10,000 100,000
Hours
Max. Aging Rate %/Decade
None
2
7
Figure 6
-20
-15
+5
+25 +45 +65 +85 +105 +125
Temperature Degrees Centigrade
Figure 5
Effects of Time – Class 2 ceramic capacitors change
capacitance and dissipation factor with time as well as
temperature, voltage and frequency. This change with time is
known as aging. Aging is caused by a gradual re-alignment
of the crystalline structure of the ceramic and produces an
exponential loss in capacitance and decrease in dissipation
factor versus time. A typical curve of aging rate for
semistable ceramics is shown in Figure 6.
If a Class 2 ceramic capacitor that has been sitting on the
shelf for a period of time, is heated above its curie point,
(125°C for 4 hours or 150°C for 1⁄2 hour will suffice) the part will
de-age and return to its initial capacitance and dissi-pation
factor readings. Because the capacitance changes
rapidly, immediately after de-aging, the basic capacitance
measurements are normally referred to a time period
sometime after the de-aging process. Various manufacturers
use different time bases but the most popular one is one day
or twenty-four hours after “last heat.” Change in the aging
curve can be caused by the application of voltage and
other stresses. The possible changes in capacitance due to
de-aging by heating the unit explain why capacitance changes
are allowed after test, such as temperature cycling, moisture
resistance, etc., in MIL specs. The application of high voltages
such as dielectric withstanding voltages also tends to de-age
128
Capacitance Change Percent
Capacitance Change Percent
Typical Cap. Change vs. D.C. Volts
X7R
Effects of Frequency – Frequency affects capacitance
and impedance characteristics of capacitors. This effect is
much more pronounced in high dielectric constant ceramic
formulation than in low K formulations. AVX’s SpiCap
software generates impedance, ESR, series inductance,
series resonant frequency and capacitance all as functions
of frequency, temperature and DC bias for standard chip
sizes and styles. It is available free from AVX and can be
downloaded for free from AVX website: www.avx.com.
General Description
Effects of Mechanical Stress – High “K” dielectric ceramic
capacitors exhibit some low level piezoelectric reactions
under mechanical stress. As a general statement, the piezoelectric output is higher, the higher the dielectric constant of
the ceramic. It is desirable to investigate this effect before
using high “K” dielectrics as coupling capacitors in extremely
low level applications.
Reliability – Historically ceramic capacitors have been one
of the most reliable types of capacitors in use today.
The approximate formula for the reliability of a ceramic
capacitor is:
Lo
=
Lt
共共共共
Vt
Vo
where
Lo = operating life
Lt = test life
Vt = test voltage
Vo = operating voltage
X
Tt
To
Y
Tt = test temperature and
To = operating temperature
in °C
X,Y = see text
Historically for ceramic capacitors exponent X has been
considered as 3. The exponent Y for temperature effects
typically tends to run about 8.
A capacitor is a component which is capable of storing
electrical energy. It consists of two conductive plates (electrodes) separated by insulating material which is called the
dielectric. A typical formula for determining capacitance is:
Energy Stored – The energy which can be stored in a
capacitor is given by the formula:
E = 1⁄2CV2
E = energy in joules (watts-sec)
V = applied voltage
C = capacitance in farads
Potential Change – A capacitor is a reactive component
which reacts against a change in potential across it. This is
shown by the equation for the linear charge of a capacitor:
I ideal = C dV
dt
where
I = Current
C = Capacitance
dV/dt = Slope of voltage transition across capacitor
Thus an infinite current would be required to instantly change
the potential across a capacitor. The amount of current a
capacitor can “sink” is determined by the above equation.
Equivalent Circuit – A capacitor, as a practical device,
exhibits not only capacitance but also resistance and
inductance. A simplified schematic for the equivalent circuit
is:
C = Capacitance
L = Inductance
C = .224 KA
t
C = capacitance (picofarads)
K = dielectric constant (Vacuum = 1)
A = area in square inches
t = separation between the plates in inches
(thickness of dielectric)
.224 = conversion constant
(.0884 for metric system in cm)
Capacitance – The standard unit of capacitance is the
farad. A capacitor has a capacitance of 1 farad when 1
coulomb charges it to 1 volt. One farad is a very large unit
and most capacitors have values in the micro (10-6), nano
(10-9) or pico (10-12) farad level.
Dielectric Constant – In the formula for capacitance given
above the dielectric constant of a vacuum is arbitrarily chosen
as the number 1. Dielectric constants of other materials are
then compared to the dielectric constant of a vacuum.
Dielectric Thickness – Capacitance is indirectly proportional
to the separation between electrodes. Lower voltage requirements mean thinner dielectrics and greater capacitance per
volume.
Area – Capacitance is directly proportional to the area of the
electrodes. Since the other variables in the equation are
usually set by the performance desired, area is the easiest
parameter to modify to obtain a specific capacitance within
a material group.
RP
L
RS
C
Rp = Parallel Resistance
Rs = Series Resistance
Reactance – Since the insulation resistance (Rp) is normally very high, the total impedance of a capacitor is:
Z=
冑
RS2 + (XC - XL )2
where
Z = Total Impedance
Rs = Series Resistance
XC = Capacitive Reactance =
XL = Inductive Reactance
1
2 π fC
= 2 π fL
The variation of a capacitor’s impedance with frequency
determines its effectiveness in many applications.
Phase Angle – Power Factor and Dissipation Factor are
often confused since they are both measures of the loss in
a capacitor under AC application and are often almost
identical in value. In a “perfect” capacitor the current in the
capacitor will lead the voltage by 90°.
129
General Description
di
I (Ideal)
I (Actual)
Loss
Angle
Phase
Angle
␦
f
V
IR s
In practice the current leads the voltage by some other phase
angle due to the series resistance RS. The complement of this
angle is called the loss angle and:
Power Factor (P.F.) = Cos f or Sine ␦
Dissipation Factor (D.F.) = tan ␦
for small values of ␦ the tan and sine are essentially equal
which has led to the common interchangeability of the two
terms in the industry.
Equivalent Series Resistance – The term E.S.R. or
Equivalent Series Resistance combines all losses both
series and parallel in a capacitor at a given frequency so
that the equivalent circuit is reduced to a simple R-C series
connection.
E.S.R.
C
Dissipation Factor – The DF/PF of a capacitor tells what
percent of the apparent power input will turn to heat in the
capacitor.
Dissipation Factor = E.S.R. = (2 π fC) (E.S.R.)
XC
The watts loss are:
Watts loss = (2 π fCV2 ) (D.F.)
Very low values of dissipation factor are expressed as their
reciprocal for convenience. These are called the “Q” or
Quality factor of capacitors.
Parasitic Inductance – The parasitic inductance of
capacitors is becoming more and more important in the
decoupling of today’s high speed digital systems. The
relationship between the inductance and the ripple voltage
induced on the DC voltage line can be seen from the simple
inductance equation:
V = L di
dt
130
The dt seen in current microprocessors can be as high as
0.3 A/ns, and up to 10A/ns. At 0.3 A/ns, 100pH of parasitic
inductance can cause a voltage spike of 30mV. While this
does not sound very drastic, with the Vcc for
microprocessors decreasing at the current rate, this can be
a fairly large percentage.
Another important, often overlooked, reason for knowing
the parasitic inductance is the calculation of the resonant
frequency. This can be important for high frequency, bypass capacitors, as the resonant point will give the most
signal attenuation. The resonant frequency is calculated
from the simple equation:
1
fres =
2␲冑 LC
Insulation Resistance – Insulation Resistance is the
resistance measured across the terminals of a capacitor
and consists principally of the parallel resistance R P shown
in the equivalent circuit. As capacitance values and hence
the area of dielectric increases, the I.R. decreases and
hence the product (C x IR or RC) is often specified in ohm
farads or more commonly megohm-microfarads. Leakage
current is determined by dividing the rated voltage by IR
(Ohm’s Law).
Dielectric Strength – Dielectric Strength is an expression
of the ability of a material to withstand an electrical stress.
Although dielectric strength is ordinarily expressed in volts, it
is actually dependent on the thickness of the dielectric and
thus is also more generically a function of volts/mil.
Dielectric Absorption – A capacitor does not discharge
instantaneously upon application of a short circuit, but
drains gradually after the capacitance proper has been
discharged. It is common practice to measure the dielectric
absorption by determining the “reappearing voltage” which
appears across a capacitor at some point in time after it has
been fully discharged under short circuit conditions.
Corona – Corona is the ionization of air or other vapors
which causes them to conduct current. It is especially
prevalent in high voltage units but can occur with low voltages
as well where high voltage gradients occur. The energy
discharged degrades the performance of the capacitor and
can in time cause catastrophic failures.
Surface Mounting Guide
MLC Chip Capacitors
REFLOW SOLDERING
D2
D1
D3
D4
D5
Dimensions in millimeters (inches)
Case Size
0201
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
D1
D2
D3
D4
D5
0.85 (0.033)
1.70 (0.067)
2.30 (0.091)
3.00 (0.118)
4.00 (0.157)
4.00 (0.157)
5.60 (0.220)
5.60 (0.220)
5.60 (0.220)
6.60 (0.260)
6.60 (0.260)
0.30 (0.012)
0.60 (0.024)
0.80 (0.031)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
0.25 (0.010)
0.50 (0.020)
0.70 (0.028)
1.00 (0.039)
2.00 (0.079)
2.00 (0.079)
3.60 (0.142)
3.60 (0.142)
3.60 (0.142)
4.60 (0.181)
4.60 (0.181)
0.30 (0.012)
0.60 (0.024)
0.80 (0.031)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
0.35 (0.014)
0.50 (0.020)
0.75 (0.030)
1.25 (0.049)
1.60 (0.063)
2.50 (0.098)
2.00 (0.079)
3.00 (0.118)
6.35 (0.250)
5.00 (0.197)
6.35 (0.250)
Component Pad Design
Component pads should be designed to achieve good
solder filets and minimize component movement during
reflow soldering. Pad designs are given below for the most
common sizes of multilayer ceramic capacitors for both
wave and reflow soldering. The basis of these designs is:
• Pad width equal to component width. It is permissible to
decrease this to as low as 85% of component width but it
is not advisable to go below this.
• Pad overlap 0.5mm beneath component.
• Pad extension 0.5mm beyond components for reflow and
1.0mm for wave soldering.
WAVE SOLDERING
D2
D1
Case Size
0603
0805
1206
D3
D4
D1
D2
D3
D4
D5
3.10 (0.12)
4.00 (0.15)
5.00 (0.19)
1.20 (0.05)
1.50 (0.06)
1.50 (0.06)
0.70 (0.03)
1.00 (0.04)
2.00 (0.09)
1.20 (0.05)
1.50 (0.06)
1.50 (0.06)
0.75 (0.03)
1.25 (0.05)
1.60 (0.06)
Dimensions in millimeters (inches)
D5
Component Spacing
Preheat & Soldering
For wave soldering components, must be spaced sufficiently
far apart to avoid bridging or shadowing (inability of solder
to penetrate properly into small spaces). This is less
important for reflow soldering but sufficient space must be
allowed to enable rework should it be required.
The rate of preheat should not exceed 4°C/second to
prevent thermal shock. A better maximum figure is about
2°C/second.
For capacitors size 1206 and below, with a maximum
thickness of 1.25mm, it is generally permissible to allow a
temperature differential from preheat to soldering of 150°C.
In all other cases this differential should not exceed 100°C.
For further specific application or process advice, please
consult AVX.
Cleaning
≥1.5mm (0.06)
≥1mm (0.04)
≥1mm (0.04)
Care should be taken to ensure that the capacitors are
thoroughly cleaned of flux residues especially the space
beneath the capacitor. Such residues may otherwise
become conductive and effectively offer a low resistance
bypass to the capacitor.
Ultrasonic cleaning is permissible, the recommended
conditions being 8 Watts/litre at 20-45 kHz, with a process
cycle of 2 minutes vapor rinse, 2 minutes immersion in the
ultrasonic solvent bath and finally 2 minutes vapor rinse.
131
Surface Mounting Guide
Recommended Soldering Profiles
REFLOW SOLDER PROFILES
Recommended Reflow Profiles
AVX RoHS compliant products utilize termination
finishes (e.g.Sn or SnAg) that are compatible
with all Pb-Free soldering systems and are fully
reverse compatible with SnPb soldering systems.
A recommended SnPb profile is shown for
comparison; for Pb-Free soldering, IPC/JEDECJSTD-020C may be referenced. The upper line in
the chart shows the maximum envelope to which
products are qualified (typically 3x reflow cycles
at 260ºC max). The center line gives the
recommended profile for optimum wettability and
soldering in Pb-Free Systems.
Component Temperature / ºC
275
Pb Free Recommended
250
Pb Free Max with care
Reflow CoolCool
Down
Reflow
Down
Preheat
Preheat
Sn Pb Recommended
225
200
175
150
125
100
75
50
25
0
20
40
60
80
100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 420
Time / secs
Preheat:
Wetting Force at 2nd Sec. (higher is better)
0.40
0.30
0.20
F [mN]
The pre-heat stabilizes the part and reduces the
temperature differential prior to reflow. The initial ramp to
125ºC may be rapid, but from that point (2-3)ºC/sec is
recommended to allow ceramic parts to heat uniformly and
plastic encapsulated parts to stabilize through the glass
transition temperature of the body (~ 180ºC).
SnPb - Sn60Pb40
0.10
Sn - Sn60Pb40
0.00
Sn-Sn3.5Ag0.7Cu
-0.10
Sn-Sn2.5Ag1Bi0.5Cu
Reflow:
-0.20
Sn-Sn0.7Cu
In the reflow phase, the maximum recommended time
> 230ºC is 40secs. Time at peak reflow is 10secs max.;
optimum reflow is achieved at 250ºC, (see wetting balance
chart opposite) but products are qualified to 260ºC max.
Please reference individual product datasheets for
maximum limits
-0.30
Cool Down:
Cool down should not be forced and 6ºC/sec is
recommended. A slow cool down will result in a finer grain
structure of the reflow solder in the solder fillet.
-0.40
200
210
220
230
240
250
260
270
Temperature of Solder [C]
IMPORTANT NOTE: Typical Pb-Free reflow solders have a
more dull and grainy appearance compared to traditional
SnPb. Elevating the reflow temperature will not change this,
but extending the cool down can help improve the visual
appearance of the joint.
WAVE SOLDER PROFILES
Preheat:
This is more important for wave solder; a higher
temperature preheat will reduce the thermal shock to SMD
parts that are immersed (please consult individual product
data sheets for SMD parts that are suited to wave solder).
SMD parts should ideally be heated from the bottom-Side
prior to wave. PTH (Pin through hole) parts on the topside
should not be separately heated.
Recommended Soldering Profiles
275
Component Temperature / ºC
For wave solder, there is no change in the recommended
wave profile; all standard Pb-Free (SnCu/SnCuAg) systems
operate at the same 260ºC max recommended for SnPb
systems.
225
Wave
175
Preheat
125
Wave
75
Preheat
Wave:
250ºC – 260ºC recommended for optimum solderability.
Cool Down:
As with reflow solder, cool down should not be forced and
6ºC/sec is recommended. Any air knives at the end of the
2nd wave should be heated.
132
Cool Down
Cool Down
25
0
50
100
150
200
250
Time / seconds
300
350
400
Surface Mounting Guide
MLC Chip Capacitors
APPLICATION NOTES
Storage
The components should be stored in their “as received
packaging” where possible. If the components are removed
from their original packaging then they should be stored in
an airtight container (e.g. a heat sealed plastic bag) with
desiccant (e.g. silica gel). Storage area temperature should
be kept between +5 degrees C and +30 degrees C with
humidity < 70% RH. Storage atmosphere must be free of
gas containing sulfur and chlorine. Avoid exposing the
product to saline moisture or to temperature changes that
might result in the formation of condensation. To assure
good solderability performance we recommend that the
product be used within 6 months from our shipping date,
but can be used for up to 12 months. Chip capacitors may
crack if exposed to hydrogen (H2) gas while sealed or if
coated with silicon, which generates hydrogen gas.
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds.
Leaching
Terminations will resist leaching for at least the immersion
times and conditions shown below.
Nickel Barrier
Preheat
It is important to avoid the possibility of thermal shock during
soldering and carefully controlled preheat is therefore
required. The rate of preheat should not exceed 4°C/second
and a target figure 2°C/second is recommended. Although
an 80°C to 120°C temperature differential is preferred,
recent developments allow a temperature differential
between the component surface and the soldering temperature of 150°C (Maximum) for capacitors of 1210 size and
below with a maximum thickness of 1.25mm. The user is
cautioned that the risk of thermal shock increases as chip
size or temperature differential increases.
Soldering
Solderability
Termination Type
handling should ensure that abrasion and mechanical shock
are minimized. Taped and reeled components provides the
ideal medium for direct presentation to the placement
machine. Any mechanical shock should be minimized during
handling chip multilayer ceramic capacitors.
Solder
Solder
Tin/Lead/Silver Temp. °C
60/40/0
260 ± 5
Immersion Time
Seconds
30 ± 1
Lead-Free Wave Soldering
The recommended peak temperature for lead-free wave
soldering is 250°C-260°C for 3-5 seconds. The other
parameters of the profile remains the same as above.
The following should be noted by customers changing from
lead based systems to the new lead free pastes.
a) The visual standards used for evaluation of solder joints
will need to be modified as lead free joints are not as
bright as with tin-lead pastes and the fillet may not be as
large.
b) Lead-free solder pastes do not allow the same self
alignment as lead containing systems. Standard
mounting pads are acceptable, but machine set up may
need to be modified.
General
Surface mounting chip multilayer ceramic capacitors
are designed for soldering to printed circuit boards or other
substrates. The construction of the components is such that
they will withstand the time/temperature profiles used in both
wave and reflow soldering methods.
Handling
Chip multilayer ceramic capacitors should be handled with
care to avoid damage or contamination from perspiration
and skin oils. The use of tweezers or vacuum pick ups
is strongly recommended for individual components. Bulk
Mildly activated rosin fluxes are preferred. The minimum
amount of solder to give a good joint should be used.
Excessive solder can lead to damage from the stresses
caused by the difference in coefficients of expansion
between solder, chip and substrate. AVX terminations are
suitable for all wave and reflow soldering systems. If hand
soldering cannot be avoided, the preferred technique is the
utilization of hot air soldering tools.
Cooling
Natural cooling in air is preferred, as this minimizes stresses
within the soldered joint. When forced air cooling is used,
cooling rate should not exceed 4°C/second. Quenching
is not recommended but if used, maximum temperature
differentials should be observed according to the preheat
conditions above.
Cleaning
Flux residues may be hygroscopic or acidic and must be
removed. AVX MLC capacitors are acceptable for use with
all of the solvents described in the specifications MIL-STD202 and EIA-RS-198. Alcohol based solvents are acceptable
and properly controlled water cleaning systems are also
acceptable. Many other solvents have been proven successful,
and most solvents that are acceptable to other components
on circuit assemblies are equally acceptable for use with
ceramic capacitors.
Prevention of Metallic Migration
Note that when components with Sn plating on the end
terminations are to be used in applications that are likely to
experience conditions of high humidity under bias voltage,
we strongly recommend that the circuit boards be
conformally coated to protect the Sn from moisture that
might lead to migration and eventual current leakage.
When using Capacitor Arrays we recommend that there is
no differential in applied voltage between adjacent elements.
133
Surface Mounting Guide
MLC Chip Capacitors
POST SOLDER HANDLING
Once SMP components are soldered to the board, any
bending or flexure of the PCB applies stresses to the
soldered joints of the components. For leaded devices, the
stresses are absorbed by the compliancy of the metal leads
and generally don’t result in problems unless the stress is
large enough to fracture the soldered connection.
Ceramic capacitors are more susceptible to such stress
because they don’t have compliant leads and are brittle in
nature. The most frequent failure mode is low DC resistance
or short circuit. The second failure mode is significant loss
of capacitance due to severing of contact between sets of
the internal electrodes.
Cracks caused by mechanical flexure are very easily
identified and generally take one of the following two
general forms:
Mechanical cracks are often hidden underneath the
termination and are difficult to see externally. However, if
one end termination falls off during the removal process
from PCB, this is one indication that the cause of failure was
excessive mechanical stress due to board warping.
134
Type A:
Angled crack between bottom of device to top of solder joint.
Type B:
Fracture from top of device to bottom of device.
Surface Mounting Guide
MLC Chip Capacitors
COMMON CAUSES OF
MECHANICAL CRACKING
REWORKING OF MLCS
The most common source for mechanical stress is board
depanelization equipment, such as manual breakapart, vcutters and shear presses. Improperly aligned or dull cutters
may cause torqueing of the PCB resulting in flex stresses
being transmitted to components near the board edge.
Another common source of flexural stress is contact during
parametric testing when test points are probed. If the PCB
is allowed to flex during the test cycle, nearby ceramic
capacitors may be broken.
A third common source is board to board connections at
vertical connectors where cables or other PCBs are
connected to the PCB. If the board is not supported during
the plug/unplug cycle, it may flex and cause damage to
nearby components.
Special care should also be taken when handling large (>6"
on a side) PCBs since they more easily flex or warp than
smaller boards.
Solder Tip
Preferred Method - No Direct Part Contact
Thermal shock is common in MLCs that are manually
attached or reworked with a soldering iron. AVX strongly
recommends that any reworking of MLCs be done with hot
air reflow rather than soldering irons. It is practically
impossible to cause any thermal shock in ceramic
capacitors when using hot air reflow.
However direct contact by the soldering iron tip often
causes thermal cracks that may fail at a later date. If rework
by soldering iron is absolutely necessary, it is recommended
that the wattage of the iron be less than 30 watts and the
tip temperature be <300ºC. Rework should be performed
by applying the solder iron tip to the pad and not directly
contacting any part of the ceramic capacitor.
Solder Tip
Poor Method - Direct Contact with Part
PCB BOARD DESIGN
To avoid many of the handling problems, AVX recommends that MLCs be located at least .2" away from nearest edge of board.
However when this is not possible, AVX recommends that the panel be routed along the cut line, adjacent to where the MLC is
located.
No Stress Relief for MLCs
Routed Cut Line Relieves Stress on MLC
135
AMERICAS
EUROPE
ASIA-PACIFIC
ASIA-KED
(KYOCERA Electronic Devices)
AVX Greenville, SC
AVX Limited, England
Tel: 864-967-2150
Tel: +44-1276-697000
AVX/Kyocera (S) Pte Ltd.,
Singapore
KED Hong Kong Ltd.
Tel: +852-2305-1080/1223
Tel: +65-6286-7555
AVX S.A.S., France
Tel: +33-1-69-18-46-00
AVX/Kyocera, Asia, Ltd.,
Hong Kong
AVX GmbH, Germany
Tel: +852-2363-3303
Tel: +49-0811-95949-0
AVX SRL, Italy
AVX/Kyocera Yuhan Hoesa,
South Korea
Tel: +39-02-614-571
Tel: +82-2785-6504
AVX Czech Republic
AVX/Kyocera HK Ltd.,
Taiwan
Tel: +420-57-57-57-521
KED Hong Kong Ltd.
Shenzen
Tel: +86-755-3398-9600
KED Company Ltd.
Shanghai
Tel: +86-21-3255-1833
KED Hong Kong Ltd.
Beijing
Tel: +86-10-5869-4655
Tel: +886-2-2656-0258
AVX/ELCO UK
KED Taiwan Ltd.
Tel: +44-1638-675000
AVX/Kyocera (M) Sdn Bhd,
Malaysia
ELCO Europe GmbH
Tel: +60-4228-1190
Tel: +49-2741-299-0
AVX S.A., Spain
AVX/Kyocera International
Trading Co. Ltd.,
Shanghai
Tel: +34-91-63-97-197
Tel: +86-21-3255 1933
AVX Benelux
AVX/Kyocera Asia Ltd.,
Shenzen
Tel: +65-6509-0328
Tel: +86-755-3336-0615
Kyocera Corporation
Japan
AVX/Kyocera International
Trading Co. Ltd.,
Beijing
Tel: +81-75-604-3449
Tel: +31-187-489-337
Tel: +886-2-2950-0268
KED Korea Yuhan Hoesa,
South Korea
Tel: +82-2-783-3604/6126
KED (S) Pte Ltd.
Singapore
Tel: +86-10-6588-3528
AVX/Kyocera India
Liaison Office
Tel: +91-80-6450-0715
Contact:
A KYOCERA GROUP COMPANY
http://www.avx.com
S-MLCC0116-C