RF & Microwave Surface Mount Ceramic Solutions Products RF & MICROWAVE Ultra HiQ-CBR Squared Series Offering Case Size Typical ESR (10 pF at 1 GHz) Dielectric 0505 < 0.068 C0G Operating Frequency Operating Range Temperature Range 1 MHz – 50 GHz –55ºC to +125ºC Temp Coef. (TCC) Capacitance Range Max Voltage 0 ±30 ppm/ºC 0.4pF - 100pF 250 Capacitance Range Max Voltage 0.1pF - 33pF 50 0.1pF - 100pF 200 0.3pF - 100pF 250 0.3pF - 100pF 500 HiQ-CBR Series Offering (EIA Case Sizes) Case Size Typical ESR Ohms (10pF @ 1 GHz) 0201 - 0402 Dielectric Operating Frequency Operating Range Temperature Range 0 ±30 ppm/ºC < 0.095 C0G 0603 < 0.100 0805 < 0.085 Temp Coef. (TCC) 1 MHz – 50 GHz –55ºC to +125ºC (0 ±60 ppm/ºC for 0201 case size ≥ 22 pF) Capacitor Properties Ceramic Dielectric Plated Tin Finish Plated Nickel Barrier Layer Copper External Electrode Copper Internal Electrode Base Metal, Copper Electrodes PME vs. BME •BME = low-loss properties + lower cost Element Electrical Resistance (Ω-cm) Cost Silver (Ag, PME) Palladium (Pd, PME) 1.6 10.8 Medium High Nickel (Ni, BME) Copper (Cu, BME) 6.8 1.7 Low Low PME = Precious metal electrode technology BME = Base metal electrode technology PME vs. BME •Low loss is important in terms of Power Dissipation. •Copper BME C0G vs. Nickel BME: • Frequency (MHz) Power Dissipation (mW) Copper BME Power Dissipation (mW) Nickel BME 150 4.9 15.9 300 5.8 20.5 600 6.4 26.2 1200 7.8 37.0 Copper BME = Lower ESR = Better power dissipation = Ideal for High Frequency applications PME = Precious metal electrode technology BME = Base metal electrode technology Applications RF & MICROWAVE RF Circuits & Applications High RF Power Circuits • • • • Typical Applications • • • • • Coupling DC Blocking Impedance Matching Bypass DC BLOCKING MATCHING Base Stations Satellite Communication Wireless Power Amplifiers Cellular Handsets BYPASS Bypass Functions Frequency (GHz) 100 Applications / Frequency Bands 10 1 GPS WLAN and UWB Bluetooth and Zigbee WiMAX WiGig and Wireless HD Frequency Range: 1 – 60 GHz Microwave/RF Amplifiers Mixers Oscillators Low Noise Amplifiers Filter Networks Diplexers Antenna Matching Timing Circuits Delay Lines RF Performance Power Dissipation vs. Frequency 15 Pd-PME 12 9 6 Power Dissipation mW Electrical Resistance Ω-cm Electrical Resistance Ni-BME Cu-BME 3 Ag-PME 40 35 30 25 20 15 10 5 0 150 300 600 1200 Frequency 0 Ni BME Electrode Material Cu BME Copper BME = Lower ESR = Better power dissipation = Ideal for High Frequency applications Application Power and Frequency Capabilities Base Station / Power Amp C0603 - C2225 < 10W Power < 100 MHz Frequency CBR06, CBR08 > 10W Power > 1 GHz Frequency Mobile Phone C0201, C0402 < 1W Power < 100 MHz Frequency CBR02, CBR04 > 10W Power > 1 GHz Frequency COMMERCIAL RF & MICROWAVE Support RF & MICROWAVE Support Tools • Product bulletin/datasheet • Parts stocked at authorized distributors • Sample kits available • S-Parameter • Qualification data • Frequently asked questions • Capacitor Edge (kemet.com) • Microsite (www.kemet.com/rf) For additional support please contact your local KEMET representative CBR Series Ordering Information CBR 02 C F 9 G A C Rated Packaging/ Capacitance Dielectri Failure Rate/ Termination Voltage Grade Tolerance c Design Finish (VDC) (C-Spec)1 02 = 0201 C = Standard 2 significant digits + number of zeros A = ± 0.05pF 9 = 6.3V G = C0G A = N/A C = 100% Matte Sn Blank = 7" Reel, 04 = 0402 B = ±0.1pF 8 = 10V Unmarked 06 = 0603 C = ±0.25pF 3 = 25V 08 = 0805 D = ±0.5pF 5 = 50V Use 9 for 1.0 - 9.9pF F = ±1% 1 = 100V 05 = 0505 Use 8 for 0.5 - .99pF G = ±2% 2 = 200V ex. 2.2pF = 229 J = ±5% A = 250V ex. 0.5pF = 508 Case Size Specification Ceramic (L" x W") / Series CBR 330 Capacitance Code (pF) C = 500V 1 When ordering CBR series devices, a "suffix" or "C-spec" is not required to indicate a 7" reel packaging option. CBR devices are only available and shipped on 7" reels (paper tape). Bulk bag and cassette packaging options are not available. Please contact KEMET if you have a specific, non-standard packaging requirement. Reel Quantity 7" Paper 13" Paper Chip Size In. (mm) Chip Thickness (mm) 0201 (0603) 0.30 ± 0.03 15,000 0402 (1005) 0.50 ± 0.05 10,000 0603 (1608) 0.80 ± 0.07 4,000 0805 (2012) 0.85 ± 0.10 4,000 0505 (1414) 1.15 ± 0.15 3,000 Contact KEMET for availability. RF & Microwave Microsite www.kemet.com/rf Thanks for Choosing KEMET