AOS Semiconductor Product Reliability Report AO6415, rev C Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com This AOS product reliability report summarizes the qualification result for AO6415. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AO6415 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Reliability Stress Test Summary and Result Reliability Evaluation I. Product Description: The AO6415 uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 2.5V. This device is suitable for use as a load switch or in PWM applications. -RoHS Compliant - Halogen Free Detailed information refers to datasheet. II. Die / Package Information: AO6415 Standard sub-micron Low voltage P channel Package Type TSOP6 Lead Frame Cu Die Attach Ag epoxy Bonding Wire Cu wire Mold Material Epoxy resin with silica filler MSL (moisture sensitive level) Level 1 based on J-STD-020 Process III. Result of Reliability Stress for AO6415 Test Item Test Condition Time Point Lot Attribution Total Sample size MSL Preconditio n 168hr 85°c /85%RH +3 cycle reflow@260°c HTGB Number of Failures Standard - 12 lots 2618pcs 0 JESD22A113 Temp = 150 c, Vgs=100% of Vgsmax 168hrs 500 hrs 1000 hrs 3 lots 4 lots 3 lots 770pcs 0 JESD22A108 HTRB Temp = 150 c, Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs (Note A*) 3 lots 4 lots 3 lots 77pcs / lot 770pcs 0 JESD22A108 HAST 96 hrs (Note A*) 11 lots 77pcs / lot 847pcs 0 JESD22A110 Pressure Pot 130 +/- 2c, 85%RH, 33.3 psi, Vgs = 100% of Vgsmax 121c, 29.7psi, RH=100% 96 hrs (Note A*) 11 lots 77pcs / lot 847pcs 0 JESD22A102 Temperatur e Cycle -65c to 150c, air to air 250 / 500 cycles (Note A*) 12 lots 77pcs / lot 924pcs 0 JESD22A104 (Note A*) 77pcs / lot Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 4.16 MTTF = 27446 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AO6415). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.83 x 10 / [2x (6x77x168 + 8x77x500 +6x77x1000) x259] = 4.16 9 8 MTTF = 10 / FIT = 2.40 x 10 hrs = 27446 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 259 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u = The use junction temperature in degree (Kelvin), K = C+273.16 -5 K = Boltzmann’s constant, 8.617164 X 10 eV / K