AOS Semiconductor Product Reliability Report AOD403 / AOI403, rev C Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOD403 /AOI403. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOD403 /AOI403 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AOD403/AOI403 uses advanced trench technology to provide excellent RDS(ON), low gate charge and low gate resistance. With the excellent thermal resistance of the DPAK/IPAK package, this device is well suited for high current load applications. -RoHS Compliant -Halogen-Free Details refer to the datasheet. II. Die / Package Information: AOD403 / AOI403 Standard sub-micron 30V P-Channel MOSFET Package Type TO252 / TO251A Lead Frame Bare Cu Die Attach Soft solder Bonding Al & Au wire Mold Material Epoxy resin with silica filler Moisture Level Up to Level 1 * Note * based on info provided by assembler and mold compound supplier Process 2 III. Result of Reliability Stress for AOD403 / AOI403 Test Item Test Condition Time Point MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c Temp = 150°c , Vgs=100% of Vgsmax - HTGB HTRB Temp = 150°c , Vds=80% of Vdsmax Lot Attribution 15 lots 168hrs 500 hrs 1000 hrs 168hrs 500 hrs 1000 hrs 6 lot 5 lot (Note A*) Total Sample size 0 JESD22A113 462pcs 0 JESD22A108 0 JESD22A108 660pcs 0 JESD22A110 0 JESD22A102 0 JESD22A104 77 pcs / lot 462pcs 6 lot 5 lot (Note A*) 77 pcs / lot 130 °c , 85%RH, 33.3 psi, Vgs = 100% of Vgs max 100 hrs 12 lots Pressure Pot 121°c , 29.7psi, RH=100% 96 hrs (Note A*) 12lots 55 pcs / lot 924pcs (Note A*) 77 pcs / lot -65°c to 150°c , air to air, 250 / 500 cycles 15 lots (Note A*) Reference Standard 2739pcs HAST Temperature Cycle Number of Failures 1155pcs 77 pcs / lot Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 3 MTTF = 39656 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOD403/AOI403). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.83 x 10 / [2x (12x77x500+10x77x1000) x258] = 3 9 8 MTTF = 10 / FIT = 3.47 x 10 hrs = 39656 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K 3