AOS Semiconductor Product Reliability Report AOD409, rev D Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOD409. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOD409 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be routine monitored for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Reliability Stress Test Summary and Results Reliability Evaluation I. Product Description: The AOD409 uses advanced trench technology to provide excellent RDS(ON), low gate charge and low gate resistance. With the excellent thermal resistance of the DPAK package, this device is well suited for high current load applications. Details refer to the datasheet. II. Die / Package Information: Process Package Type Lead Frame Die Attach Bond Mold Material Moisture Level AOD409 Standard sub-micron P-Channel MOSFET TO252 Bare Cu Soft solder Al wire Epoxy resin with silica filler Up to Level 1 2 III. Reliability Stress Test Summary and Results Test Item Test Condition Time Point Total Sample Size* Number of Failures Reference Standard MSL Precondition 168hr 85°C / 85%RH + 3 cycle reflow@260°C (MSL 1) - 3234pcs 0 JESD22-A113 HTGB Temp = 150°C , Vgs=100% of Vgsmax 168 / 500 / 1000 hrs 924pcs Temp = 150°C , Vds=80% of Vdsmax 130°C , 85%RH, 33.3 psi, Vds = 80% of Vdsmax up to 42V 168 / 500 / 1000 hrs 924pcs 96 hrs 693 pcs 0 JESD22-A110 HTRB HAST 0 JESD22-A108 0 JESD22-A108 H3TRB 85°C , 85%RH, Vds = 80% of Vdsmax 1000 hrs 462 pcs 0 JESD22-A101 Autoclave 121°C , 29.7psi, RH=100% 96 hrs 924 pcs 0 JESD22-A102 Temperature Cycle -65°C to 150°C , air to air, 250 / 500 / 1000 cycles 462 pcs 0 JESD22-A104 Power 15000 693 pcs 0 AEC Q101 Tj = 100°C cycles Cycling *Note: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 3.27 MTTF = 34926 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size. Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 3.27 9 MTTF = 10 / FIT = 34926 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from burn-in tests H = Duration of burn-in testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C Af 259 87 32 13 5.64 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K 130 deg C 150 deg C 2.59 1 3