AOS Semiconductor Product Reliability Report AOD4189, rev C Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOD4189. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOD4189 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AOD4189 uses advanced trench technology and design to provide excellent RDS(ON) with low gate charge. With the excellent thermal resistance of the DPAK package, this device is well suited for high current load applications. -RoHS Compliant -Halogen-Free Details refer to the datasheet. II. Die / Package Information: Process Package Type Lead Frame Die Attach Bonding Mold Material Moisture Level AOD4189 Standard sub-micron P-Channel MOSFET TO252 Bare Cu Soft solder Al & Au wire Epoxy resin with silica filler Up to Level 1 2 III. Result of Reliability Stress for AOD4189 Test Item Test Condition Time Point MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c Temp = 150°c , Vgs=100% of Vgsmax - HTGB HTRB Temp = 150°c , Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs 168hrs 500 hrs 1000 hrs Lot Attribution Total Sample size 3003pcs 0 JESD22A113 3 lots 3 lots 5 lots (Note A*) 924pcs 0 JESD22A108 3 lots 3 lots 5 lots (Note A*) 847pcs 0 JESD22A108 847pcs 0 JESD22A110 0 JESD22A102 0 JESD22A104 77 pcs / lot 77 pcs / lot 130 °c , 85%RH, 33.3 psi, Vgs = 100% of Vgs max 96 hrs 12 lots Pressure Pot 121°c , 29.7psi, RH=100% 96 hrs (Note A*) 12lots 77 pcs / lot 924pcs (Note A*) 77 pcs / lot -65°c to 150°c , air to air, 250 / 500 cycles Reference Standard 15 lots HAST Temperature Cycle Number of Failures 15 lots (Note A*) 1155pcs 77 pcs / lot Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 3.27 MTTF = 34926 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOD4189). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.83 x 10 / [2x (6x77x168 +6x77x500 +10x77x1000) x259] = 3.27 9 8 MTTF = 10 / FIT = 3.27 x 10 hrs = 34926 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 259 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K 3