STW8A12D

Product Data Sheet
STW8A12D – Mid-Power LED
Mid-Power LED - 3528 Series
STW8A12D – 0.5W (Cool, Neutral, Warm)
RoHS
Product Brief
Description
Features and Benefits
•
This White Colored surface-mount LED
comes in standard package dimension.
Package Size: 3.5x2.8x0.7mm
•
•
•
•
It has a substrate made up of a molded
plastic reflector sitting on top of a lead
frame.
•
The die is attached within the reflector
cavity and the cavity is encapsulated by
silicone.
•
Market Standard 3528 Package Size
High Color Quality, CRI Min. 80
RoHS compliant
Key Applications
•
•
•
•
The package design coupled with
careful selection of component
materials allow these products to
perform with high reliability.
Interior lighting
General lighting
Indoor and outdoor displays
Architectural / Decorative lighting
Table 1. Product Selection Table
CCT
Part Number
Color
Min.
Typ.
Max.
STW8A12D
Cool White
4700K
5600K
7000K
STW8A12D
Neutral White
3700K
4200K
4700K
STW8A12D
Warm White
2600K
3000K
3700K
Rev1.6, Jun 22, 2016
1
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Product Data Sheet
STW8A12D – Mid-Power LED
Table of Contents
Index
•
Product Brief
1
•
Table of Contents
2
•
Performance Characteristics
3
•
Characteristics Graph
5
•
Color Bin Structure
11
•
Mechanical Dimensions
16
•
Recommended Solder Pad
17
•
Reflow Soldering Characteristics
18
•
Emitter Tape & Reel Packaging
19
•
Product Nomenclature
21
•
Handling of Silicone Resin for LEDs
22
•
Precaution For Use
23
•
Company Information
26
Rev1.6, Jun 22, 2016
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Product Data Sheet
STW8A12D – Mid-Power LED
Performance Characteristics
Table 2. Product Selection Guide, IF = 150mA, Tj = 25ºC, RH30%
Luminous Intensity [2]
Luminous Flux [3]
CRI
IV (cd)
ФV (lm)
Ra
CCT (K) [1]
Part Number
RANK
Typ.
6500
5600
Min
Max
Min
Max
Min.
J16
16.0
18.0
49.6
55.8
80
J18
18.0
20.0
55.8
62.0
80
K20
20.0
22.0
62.0
68.2
80
J16
16.0
18.0
49.6
55.8
80
J18
18.0
20.0
55.8
62.0
80
K20
20.0
22.0
62.0
68.2
80
J18
18.0
20.0
55.8
62.0
80
K20
20.0
22.0
62.0
68.2
80
J18
18.0
20.0
54.0
60.0
80
K20
20.0
22.0
62.0
68.2
80
J18
18.0
20.0
54.0
60.0
80
K20
20.0
22.0
62.0
68.2
80
J16
16.0
18.0
48.0
54.0
80
J18
18.0
20.0
54.0
60.0
80
J16
16.0
18.0
48.0
54.0
80
J18
18.0
20.0
54.0
60.0
80
J16
16.0
18.0
48.0
54.0
80
J18
18.0
20.0
54.0
60.0
80
5000
STW8A12D
4500
4000
3500
3000
2700
Notes :
(1) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
(2) Seoul Semiconductor maintains a tolerance of 7% on Intensity and power measurements.
The luminous intensity IV was measured at the peak of the spatial pattern which may not be
aligned with the mechanical axis of the LED package.
(3) The lumen table is only for reference.
Rev1.6, Jun 22, 2016
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Product Data Sheet
STW8A12D – Mid-Power LED
Performance Characteristics
Table 3. Characteristics, IF=150mA, Tj= 25ºC, RH30%
Value
Parameter
Symbol
Unit
Min.
Typ.
Max.
Forward Current
IF
-
150
180
mA
Forward Voltage
VF
-
3.2
3.5
V
Luminous Intensity[1] (2,700K)[2]
Iv
-
18.2
-
cd
CRI [3]
Ra
80
83
90
Viewing Angle
2Θ1/2
-
120
-
Deg.
Storage Temperature
Tstg
- 40
-
+ 85
ºC
Thermal resistance (J to S) [4]
RθJ-S
-
35
-
℃/W
ESD Sensitivity(HBM)
-
Class 2 JESD22-A114-E
Parameter
Symbol
Value
Unit
Forward Current
IF
180
mA
Power Dissipation
PD
0.63
W
Junction Temperature
Tj
125
ºC
Operating Temperature
Topr
-40 ~ + 85
ºC
Storage Temperature
Tstg
-40 ~ + 100
ºC
Table 4. Absolute Maximum Ratings
Notes :
(1) Seoul Semiconductor maintains a tolerance of 7% on Intensity and power measurements.
(2) Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
Color coordinate : 0.005, CCT 5% tolerance.
(3) Tolerance is 2.0 on CRI measurements.
(4) Thermal resistance is junction to Solder.
(5) IFP conditions with pulse width ≤10ms and duty cycle ≤10%
(6) The products are sensitive to static electricity and must be carefully taken when handling products
•
Calculated performance values are for reference only.
•
All measurements were made under the standardized environment of Seoul Semiconductor.
Rev1.6, Jun 22, 2016
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Product Data Sheet
STW8A12D – Mid-Power LED
Characteristics Graph
Fig 1. Color Spectrum, Tj = 25ºC, IF=150mA
2600~3700K
3700~4700K
4700~7000K
Relative Emission Intensity
1.0
0.5
0.0
300
400
500
600
700
800
Wavelength [nm]
Fig 2. Radiant Pattern, Tj = 25ºC, IF=150mA
Relative Intensity (%)
100
80
60
40
20
0
-100
-75
-50
-25
0
25
50
75
100
Angle [Degree]
Rev1.6, Jun 22, 2016
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Product Data Sheet
STW8A12D – Mid-Power LED
Characteristics Graph
Fig 3. Forward Voltage vs. Forward Current, Tj = 25ºC
IF[A]
0.15
0.10
0.05
0.00
2.0
2.2
2.4
2.6
2.8
3.0
VF[V]
Fig 4. Forward Current vs. Relative Luminous Intensity, Tj = 25ºC
1.2
Relative Luminous Intensity
1.0
0.8
0.6
0.4
0.2
0.0
0
20
40
60
80
100
120
140
160
180
Forward Current IF [mA]
Rev1.6, Jun 22, 2016
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Product Data Sheet
STW8A12D – Mid-Power LED
Characteristics Graph
Fig 5. Forward Current vs. CIE X,Y Shift, Tj = 25ºC
(2600~4200K)
0.4220
0.4215
60mA
y
120mA
150mA
0.4210
180mA
0.4205
0.4200
0.470
0.471
0.472
0.473
0.474
x
(4200~7000K)
0.332
0.330
y
60mA
120mA
0.328
150mA
180mA
0.326
0.324
0.325
0.326
0.327
0.328
0.329
0.330
x
Rev1.6, Jun 22, 2016
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Product Data Sheet
STW8A12D – Mid-Power LED
Characteristics Graph
Fig 6. Junction Temperature vs. Relative Luminous Intensity, IF=150mA
1.0
Relative Luminous Intensity
0.8
0.6
0.4
0.2
0.0
30
45
60
75
90
105
120
O
Junction temperature Tj( C)
Fig 7. Junction Temperature vs. Relative Forward Voltage, IF=150mA
1.0
Relative Forward Voltage
0.8
0.6
0.4
0.2
0.0
30
45
60
75
90
105
120
O
Junction temperature Tj( C)
Rev1.6, Jun 22, 2016
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Product Data Sheet
STW8A12D – Mid-Power LED
Characteristics Graph
Fig 8. Chromaticity Coordinate vs. Junction Temperature, IF=150mA
(2600~4200K)
0.426
0.424
25
y
0.422
0.420
80
0.418
120
100
0.416
0.414
0.468
0.470
0.472
0.474
0.476
0.478
0.480
x
(4200~7000K)
0.364
0.362
0.360
25
y
0.358
0.356
0.354
80
0.352
0.350
100
120
0.348
0.346
0.3300.3320.3340.3360.3380.3400.3420.3440.3460.3480.3500.3520.3540.3560.3580.360
x
Rev1.6, Jun 22, 2016
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Product Data Sheet
STW8A12D – Mid-Power LED
Characteristics Graph
Fig 9. Ambient Temperature vs. Maximum Forward Current, Tj_max = 125℃
Forward Current IF [mA]
200
150
100
50
0
-40
-20
0
20
40
60
80
100
O
Ambient Temperature TA [ C]
Rev1.6, Jun 22, 2016
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Product Data Sheet
STW8A12D – Mid-Power LED
Color Bin Structure
Table 5. Bin Code description, Tj=25℃, IF=150mA
Luminous Intensity (cd)
Part Number
Bin
Code
Min.
Max.
J16
16.0
J18
K20
Color
Chromaticity
Coordinate
Typical Forward Voltage (V)
Bin
Code
Min.
Max.
18.0
Y3
2.9
3.0
18.0
20.0
Z1
3.0
3.1
20.0
22.0
Z2
3.1
3.2
Z3
3.2
3.3
A1
3.3
3.4
A2
3.4
3.5
Refer to
Page. 12
STW8A12D
Available ranks
Table 6. Intensity rank distribution
CCT
CIE
IV Rank
6,000 ~ 7,000K
A
J16
J18
K20
5,300 – 6,000K
B
J16
J18
K20
4,700 ~ 5,300K
C
J16
J18
K20
4,200 ~ 4,700K
D
J16
J18
K20
3,700 ~ 4,200K
E
J16
J18
K20
3,200 ~ 3,700K
F
J16
J18
K20
2,900 ~ 3,200K
G
J16
J18
K20
2,600 ~ 2,900K
H
J16
J18
K20
*Notes :
(1) Calculated performance values are for reference only.
•
All measurements were made under the standardized environment of Seoul Semiconductor.
In order to ensure availability, single color rank will not be orderable.
Rev1.6, Jun 22, 2016
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Product Data Sheet
STW8A12D – Mid-Power LED
Color Bin Structure
CIE Chromaticity Diagram Tj=25℃, IF=150mA
CG
CH
CF
CE
CD
CC
CB
CA
*Notes :
• Energy Star binning applied to all 2600~7000K.
• Measurement Uncertainty of the Color Coordinates : ± 0.005
Rev1.6, Jun 22, 2016
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Product Data Sheet
STW8A12D – Mid-Power LED
Color Bin Structure
CIE Chromaticity Diagram Tj=25℃, IF=150mA
4700k
5000k
CC22
5300k
CC21
5600k
CC10
CB22
6000k
CC24
CB21
6500k
CB10
CA22
CC23
CB24
CC11
7000k
CA21
CA10
CA23
CA10
CA24
CB23
CB11
CA11
CA11
CA21
CA22
CA23
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3087
0.3292
0.3080
0.3299
0.3028
0.3304
0.3115
0.3393
0.3048
0.3209
0.3162
0.3365
0.3166
0.3384
0.3115
0.3393
0.3205
0.3481
0.3131
0.3290
0.3171
0.3285
0.3178
0.3277
0.3131
0.3290
0.3213
0.3371
0.3146
0.3187
0.3101
0.3216
0.3098
0.3200
0.3048
0.3209
0.3131
0.3290
0.3068
0.3113
CA24
CB10
CB11
CB21
CB22
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3131
0.3290
0.3257
0.3435
0.3252
0.3444
0.3207
0.3462
0.3292
0.3539
0.3213
0.3371
0.3328
0.3498
0.3333
0.3518
0.3292
0.3539
0.3376
0.3616
0.3221
0.3261
0.3326
0.3406
0.3331
0.3398
0.3293
0.3423
0.3371
0.3493
0.3146
0.3187
0.3260
0.3347
0.3256
0.3331
0.3215
0.3353
0.3293
0.3423
CB23
CB24
CC10
CC11
CC21
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3215
0.3353
0.3293
0.3423
0.3420
0.3579
0.3415
0.3588
0.3376
0.3616
0.3293
0.3423
0.3371
0.3493
0.3492
0.3637
0.3499
0.3657
0.3463
0.3687
0.3294
0.3306
0.3366
0.3369
0.3481
0.3536
0.3484
0.3524
0.3452
0.3557
0.3222
0.3243
0.3294
0.3306
0.3414
0.3483
0.3407
0.3461
0.3371
CC22
CC23
CC24
B24
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3463
0.3687
0.3371
0.3492
0.3451
0.3557
0.3551
0.3760
0.3451
0.3557
0.3532
0.3623
0.3532
0.3623
0.3440
0.3427
0.3514
0.3487
0.3451
0.3557
0.3366
0.3369
0.3440
0.3428
Rev1.6, Jun 22, 2016
13
0.3493
B24
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Product Data Sheet
STW8A12D – Mid-Power LED
Color Bin Structure
CIE Chromaticity Diagram Tj=25℃, IF=150mA
3700k
4000k
CE22
4200k
CE21
4500k
CE10
CD22
4700k
CE24
CD21
CE23
CD10
CD24
CE11
CD23
CD11
CD10
CD11
CD21
CD22
CD23
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3589
0.3685
0.3560
0.3557
0.3528
0.3599
0.3641
0.3805
0.3530
0.3601
0.3665
0.3742
0.3580
0.3697
0.3548
0.3736
0.3736
0.3874
0.3616
0.3663
0.3637
0.3622
0.3681
0.3771
0.3641
0.3805
0.3703
0.3726
0.3590
0.3521
0.3573
0.3579
0.3645
0.3618
0.3616
0.3663
0.3616
0.3663
0.3511
0.3465
CD24
CE10
CE11
CE21
CE22
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.3616
0.3663
0.3764
0.3713
0.3746
0.3689
0.3703
0.3726
0.3828
0.3803
0.3703
0.3726
0.3793
0.3828
0.3784
0.3841
0.3736
0.3874
0.3871
0.3959
0.3670
0.3578
0.3890
0.3887
0.3914
0.3922
0.3871
0.3959
0.4006
0.4044
0.3590
0.3521
0.3854
0.3768
0.3865
0.3762
0.3828
0.3803
0.3952
0.3880
CE23
CE24
CIE X
CIE Y
CIE X
CIE Y
0.3670
0.3578
0.3784
0.3647
0.3703
0.3726
0.3828
0.3803
0.3828
0.3803
0.3952
0.3880
0.3784
0.3647
0.3898
0.3716
Rev1.6, Jun 22, 2016
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Product Data Sheet
STW8A12D – Mid-Power LED
Color Bin Structure
CIE Chromaticity Diagram Tj=25℃, IF=150mA
2600k
2700k
2900k
3000k
3200k
CH21
CH22
CG22
CG21
3500k
CH10
CF22
3700k
CG10
CF21
CH24
CH23
CG24
CF10
CG23
CH11
CF24
CG11
CF23
CF11
CF10
CF11
CF21
CF22
CF23
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4006
0.3829
0.3981
0.3800
0.3996
0.4015
0.4146
0.4089
0.3943
0.3853
0.4051
0.3954
0.4040
0.3966
0.4146
0.4089
0.4299
0.4165
0.4082
0.3920
0.4159
0.4007
0.4186
0.4037
0.4082
0.3920
0.4223
0.3990
0.4017
0.3751
0.4108
0.3878
0.4116
0.3865
0.3943
0.3853
0.4082
0.3920
0.3889
0.3690
CF24
CG10
CG11
CG21
CG22
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4082
0.3920
0.4267
0.3946
0.4243
0.3922
0.4299
0.4165
0.4430
0.4212
0.4223
0.3990
0.4328
0.4079
0.4324
0.4100
0.4430
0.4212
0.4562
0.4260
0.4147
0.3814
0.4422
0.4113
0.4451
0.4145
0.4345
0.4033
0.4468
0.4077
0.4017
0.3751
0.4355
0.3977
0.4361
0.3964
0.4223
0.3990
0.4345
0.4033
CG23
CG24
CH10
CH11
CH21
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4223
0.3990
0.4345
0.4033
0.4502
0.4020
0.4477
0.3998
0.4562
0.4260
0.4345
0.4033
0.4468
0.4077
0.4576
0.4158
0.4575
0.4182
0.4687
0.4289
0.4259
0.3853
0.4373
0.3893
0.4667
0.4180
0.4697
0.4211
0.4585
0.4104
0.4147
0.3814
0.4259
0.3853
0.4588
0.4041
0.4591
0.4025
0.4468
CH22
CH23
CH24
B24
CIE X
CIE Y
CIE X
CIE Y
CIE X
CIE Y
0.4687
0.4289
0.4468
0.4077
0.4585
0.4104
0.4813
0.4319
0.4585
0.4104
0.4703
0.4132
0.4703
0.4132
0.4483
0.3919
0.4593
0.3944
0.4585
0.4104
0.4373
0.3893
0.4483
0.3919
Rev1.6, Jun 22, 2016
15
0.4077
B24
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Product Data Sheet
STW8A12D – Mid-Power LED
Mechanical Dimensions
Bottom View
Top View
Cathode
Cathode Mark
Side View
Circuit
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none
(3) Undefined tolerance is ±0.2mm
Rev1.6, Jun 22, 2016
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Product Data Sheet
STW8A12D – Mid-Power LED
Recommended Solder Pad
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none
(3) This drawing without tolerances are for reference only
(4) Undefined tolerance is ±0.1mm
(5) The appearance and specifications of the product may be changed for improvement without notice.
Rev1.6, Jun 22, 2016
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Product Data Sheet
STW8A12D – Mid-Power LED
Reflow Soldering Characteristics
IPC/JEDEC J-STD-020
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Ts_max to Tp)
3° C/second max.
3° C/second max.
Preheat
- Temperature Min (Ts_min)
- Temperature Max (Ts_max)
- Time (Ts_min to Ts_max) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215℃
260℃
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
Caution :
(1) Reflow soldering is recommended not to be done more than two times
In the case of more than 24 hours passed soldering after first, LEDs will be damaged.
(2) Repairs should not be done after the LEDs have been soldered
When repair is unavoidable, suitable tools must be used.
(3) Die slug is to be soldered.
(4) When soldering, do not put stress on the LEDs during heating.
(5) After soldering, do not warp the circuit board.
Rev1.6, Jun 22, 2016
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Product Data Sheet
STW8A12D – Mid-Power LED
Emitter Tape & Reel Packaging
Notes :
(1) Quantity : Max 4,000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape
Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape
at the angle of 10˚ to the carrier tape.
(4) Package : P/N, Manufacturing data Code No. and Quantity to be indicated on a damp proof Package.
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Product Data Sheet
STW8A12D – Mid-Power LED
Emitter Tape & Reel Packaging
Reel
Aluminum Bag
Outer Box
Rev1.6, Jun 22, 2016
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Product Data Sheet
STW8A12D – Mid-Power LED
Product Nomenclature
Table 7. Part Numbering System : X1X2X3X4X5X6X7X8
Part Number Code
Description
Part Number
Value
X1
Company
S
X2
Top View LED series
T
X3
Color Specification
W8
CRI 80
X4
Package series
A
A series
X5X6
Characteristic code
12
X7
Version
D
Table 8. Lot Numbering System :Y1Y2Y3Y4Y5Y6Y7Y8Y9Y10–Y11Y12Y13Y14Y15Y16Y17
Lot Number Code
Description
Y1Y2
Year
Y3
Month
Y4Y5
Day
Y6
Top View LED series
Y7Y8Y9Y10
Mass order
Y11Y12Y13Y14Y15Y16Y17
Internal Number
Rev1.6, Jun 22, 2016
Lot Number
21
Value
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Product Data Sheet
STW8A12D – Mid-Power LED
Handling of Silicone Resin for LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form
of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be
prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These
conditions must be considered during the handling of such devices. Compared to standard
encapsulants, silicone is generally softer, and the surface is more likely to attract dust.
As mentioned previously, the increased sensitivity to dust requires special care during processing.
In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning
solution must be applied to the surface after the soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be
assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this.
product with acid or sulfur material in sealed space.
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Product Data Sheet
STW8A12D – Mid-Power LED
Precaution for Use
(1) Storage
To avoid the moisture penetration, we recommend store in a dry box with a desiccant.
The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of
RH50%.
(2) Use Precaution after Opening the Packaging
Use proper SMT techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency.
Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing
- Temperature : 5 ~ 30℃ Humidity : less than RH60%
b. If the package has been opened more than 4 week(MSL_2a) or the color of the desiccant
changes, components should be dried for 10-24hr at 65±5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication.
These products are dangerous if they are burned or shredded in the process of disposal.
It is also dangerous to drink the liquid or inhale the gas generated by such products when
chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LEDs are in operation the maximum current should be decided after measuring
the package temperature.
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Product Data Sheet
STW8A12D – Mid-Power LED
Precaution for Use
(10) The appearance and specifications of the product may be modified for improvement without
notice.
(11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
(12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures
can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic
energy. The result can be a significant loss of light output from the fixture. Knowledge of the
properties of the materials selected to be used in the construction of fixtures can help prevent
these issues.
(13) Attaching LEDs, do not use adhesives that outgas organic vapor.
(14) The driving circuit must be designed to allow forward voltage only when it is ON or OFF.
If the reverse voltage is applied to LED, migration can be generated resulting in LED damage.
(15) Similar to most Solid state devices;
LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS).
Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects.
a. ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact. While most ESD events are considered harmless, it can be an expensive problem in
many industrial environments during production and storage. The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as:
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event.
One or more recommended work area suggestions:
- Ionizing fan setup
- ESD table/shelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options:
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls:
- Humidity control (ESD gets worse in a dry environment)
Rev1.6, Jun 22, 2016
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Product Data Sheet
STW8A12D – Mid-Power LED
Precaution for Use
b. EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device.
The effects from an EOS event can be noticed through product performance like:
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation.)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary, but there are some
common signs that will indicate an EOS event has occurred:
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires.
- This damage usually appears due to the thermal stress produced during the EOS event.
c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing:
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
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Product Data Sheet
STW8A12D – Mid-Power LED
Company Information
Published by
Seoul Semiconductor © 2013 All Rights Reserved.
Company Information
Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage
and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than
10,000 patents globally, while offering a wide range of LED technology and production capacity in
areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs.
The company’s broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type
LEDs as well as custom modules, displays, and sensors.
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products. With
respect to any examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party. The appearance and specifications of the product can be changed
to improve the quality and/or performance without notice.
Rev1.6, Jun 22, 2016
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