16-BIT 2:1 MUX/DEMUX SWITCH IDT74FST163233 ADVANCE INFORMATION Integrated Device Technology, Inc. their own while providing a low resistance path for an external driver. These devices connect input and output ports through an n-channel FET. When the gate-to-source junction of this FET is adequately forward-biased the device conducts and the resistance between input and output ports is small. Without adequate bias on the gate-to-source junction of the FET, the FET is turned off, therefore with no VCC applied, the device has hot insertion capability. The low on-resistance and simplicity of the connection between input and output ports reduces the delay in this path to close to zero. The FST163233 provides three 16-bit TTL-compatible ports that support 2:1 multiplexing. The SEL0,1 and TEST0,1 pins provide switch enable and mux select control as shown below. The A port can be connected to port 1B or port 2B or both ports 1B and 2B. FEATURES: • Bus switches provide zero delay paths • Extended commercial range of –40°C to +85°C • Low switch on-resistance: FST163xxx – 7Ω • TTL-compatible input and output levels • ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C = 200pF, R = 0) • Available in SSOP, TSSOP and TVSOP DESCRIPTION: The FST163233 belongs to IDT's family of Bus switches. Bus switch devices perform the function of connecting or isolating two ports without providing any inherent current sink or source capability. Thus they generate little or no noise of FUNCTIONAL BLOCK DIAGRAM SEL1 TEST1 SEL0 TEST0 One of Eight Channels One of Eight Channels 0A1-8 1A9 -16 2B1 -8 2B9-16 1B9-16 1B1 -8 3512 drw 01 PIN DESCRIPTION Pin Names A, 1B, 2B I/O I/O SEL0-1, TEST0-1 I Description Buses A, 1B, 2B Control Pins for Mux and Switch Enable Functions 3512 tbl 01 The IDT logo is a registered trademark of Integrated Device Technology, Inc. COMMERCIAL TEMPERATURE RANGE AUGUST 1996 1996 Integrated Device Technology, Inc. DSC-3512/1 1 IDT74FST163233 16-BIT 2:1 MUX/DEMUX SWITCH COMMERCIAL TEMPERATURE RANGE ABSOLUTE MAXIMUM RATINGS(1) PIN CONFIGURATION 0A1 1 56 1B1 1B2 2 55 2B1 2B2 3 54 0A2 0A3 4 53 1B3 1B4 5 52 2B3 2B4 6 51 0A4 0A5 7 50 1B5 1B6 8 49 2B5 2B6 9 48 0A6 0A7 10 47 1B7 1B8 11 46 2B7 2B8 12 45 0A8 GND 13 44 GND VCC 14 43 VCC 1A9 15 42 1B9 1B10 16 41 2B9 2B10 17 40 1A10 1A11 18 39 1B11 1B12 19 38 2B11 2B12 20 37 1A12 1A13 21 36 1B13 1B14 22 35 2B14 23 1A15 SO56-1 SO56-2 SO56-3 Symbol Description VTERM(2) Terminal Voltage with Respect to GND TSTG Storage Temperature I OUT Max. –0.5 to +7.0 Unit V –65 to +150 °C 128 mA Maximum Continuous Channel Current 3512 tbl 02 NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating condiitions for extended periods may affect reliability. 2. VCC, Control and Switch terminals. CAPACITANCE(1) Symbol Conditions(2) Typ. Unit Parameter CIN Control Input Capacitance CI/O Switch Input/Output Capacitance 4 pF Switch Off NOTES: 1. Capacitance is characterized but not tested 2. TA = 25°C, f = 1MHz, VIN = 0V, VOUT = 0V pF 3512 tbl 03 FUNCTION TABLE SEL0 L TEST0 L Function 0A to 1B H L 0A to 2B X H 0A to 1B and 0A to 2B 2B13 SEL1 L TEST1 L Function 1A to 1B 34 1A14 H L 1A to 2B X H 24 33 1B15 1A to 1B and 1A to 2B 1B16 25 32 2B15 2B16 26 31 1A16 TEST0 27 30 SEL0 TEST1 28 29 SEL1 3512 tbl 04 SSOP/ TSSOP/TVSOP TOP VIEW 3512 drw 02 2 IDT74FST163233 16-BIT MUX/DEMUX SWITCH COMMERCIAL TEMPERATURE RANGE DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE Following Conditions Apply Unless Otherwise Specified: Commercial: TA = –40°C to +85°C, VCC = 5.0V ±10% Parameter Input HIGH Voltage Test Conditions(1) Guaranteed Logic HIGH for Control Inputs Min. 2.0 Typ.(2) — Max. — Unit V VIL Input LOW Voltage Guaranteed Logic LOW for Control Inputs — — 0.8 V II H Input HIGH Current VCC = Max. — — ±1 µA II L Input LOW Voltage IOZH High Impedance Output Current IOZL (3-State Output pins) Symbol VIH VI = VCC VCC = Max. GND(3) VI = GND — — ±1 VO = VCC — — ±1 VO = GND — — ±1 µA IOS Short Circuit Current VCC = Max., VO = — 300 — mA VIK Clamp Diode Voltage VCC = Min., IIN = –18mA — –0.7 –1.2 V VCC = Min., VIN = 0.0V — 5 7 Ω — 10 15 Ω µA RON Switch On Resistance(4) ION = 12mA VCC = Min., VIN = 2.4V ION = 8mA IOFF Input/Output Power Off Leakage VCC = 0V, VIN or VO ≤ 4.5V — — ±1 ICC Quiescent Power Supply Current VCC = Max., VIN = GND or VCC — 0.1 3 NOTES: 1. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type. 2. Typical values are at VCC = 5.0V, +25°C ambient. 3. Not more than one output should be tested at one time. Duration of the test should not exceed one second. 4. Measured by voltage drop between ports at indicated current through the switch. 3 µA 3512 tbl 05 IDT74FST163233 16-BIT 2:1 MUX/DEMUX SWITCH COMMERCIAL TEMPERATURE RANGE POWER SUPPLY CHARACTERISTICS Symbol ∆ICC ICCD IC Parameter Quiescent Power Supply Current TTL Inputs HIGH Dynamic Power Supply Current(4) Total Power Supply Current (6) Test Conditions(1) VCC = Max. VIN = 3.4V(3) VCC = Max. Outputs Open Enable Pin Toggling 50% Duty Cycle VCC = Max. Outputs Open 2 Select Pins Toggling (16 Switches Toggling) fi = 10MHz 50% Duty Cycle Min. — Typ.(2) 0.5 Max. 1.5 Unit mA VIN = VCC VIN = GND — 30 40 µA/ MHz/ Switch VIN = VCC VIN = GND — 4.8 6.4 mA VIN = 3.4 VIN = GND — 5.3 7.9 NOTES: 1. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type. 2. Typical values are at VCC = 5.0V, +25°C ambient. 3. Per TTL driven input (VIN = 3.4V). All other inputs at VCC or GND. 4. This parameter is not directly testable, but is derived for use in Total Power Supply Calculations. 5. Values for these conditions are examples of the ICC formula. These limits are guaranteed but not tested. 6. IC = IQUIESCENT + IINPUTS + IDYNAMIC IC = ICC + ∆ICC DHNT + ICCD (fiN) ICC = Quiescent Current ∆ICC = Power Supply Current for a TTL High Input (VIN = 3.4V) DH = Duty Cycle for TTL Inputs High NT = Number of TTL Inputs at DH ICCD = Dynamic Current Caused by an Input Transition Pair (HLH or LHL) fi = Input Frequency N = Number of Switches Toggling at fi All currents are in milliamps and all frequencies are in megahertz. 3512 tbl 06 SWITCHING CHARACTERISTICS OVER OPERATING RANGE Following Conditions Apply Unless Otherwise Specified: Commercial: TA = –40°C to +85°C, VCC = 5.0V ±10% Symbol tPLH tPHL tBX tPZH tPZL tPHZ tPLZ |QCI| Description Data Propagation Delay A to B, B to A(3,4) Switch Multiplex Delay SEL to A Switch Turn on Delay SEL, TEST to B Switch Turn off Delay SEL, TEST to B Charge Injection, Typical(5,7) |QDCI| Charge Injection, Typical(6,7) Condition(1) CL = 50pF RL = 500Ω Min.(2) — Typ. — Max. 0.25 Unit ns 1.5 — 6.5 ns 1.5 — 6.5 ns 1.5 — 7 ns — 1.5 — pC — 0.5 — 3512 tbl 07 NOTES: 1. See test circuit and waveforms. 2. Minimum limits guaranteed but not tested. 3. This parameter is guaranteed by design but not tested. 4. The bus switch contributes no propagation delay other than the RC delay of the on resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 2.5ns for 50pF load. Since this time is constant and much smaller than the rise/fall times of typical driving signals, it adds very little propagation delay to the system. Propagation delay on the bus switch when used in a system is determined by the driving circuit on the driving side of the switch and its interaction with the load on the driven side. 5. Measured at switch turn off, load = 50 pF in parallel with 10 MΩ scope probe, VIN = 0.0 volts. 6. Measured at switch turn off through bus multiplexer, (e.g.- A to 1B = >A to 2B), load = 50 pF in parallel with 10 MΩ scope probe, VIN at A = 0.0 volts. Charge injection is reduced because the injection from the turn off of the A to 1B switch is compensated by the turn on of the A to 2B switch. 7. Characterized parameter. Not 100% tested. 4 IDT74FST163233 16-BIT MUX/DEMUX SWITCH COMMERCIAL TEMPERATURE RANGE TEST CIRCUITS AND WAVEFORMS TEST CIRCUITS FOR ALL OUTPUTS V CC SWITCH POSITION 500Ω Pulse Generator Switch Open Drain Disable Low Closed Enable Low V OUT VIN Test 7.0V Open All Other Tests D.U.T. 50pF RT 3512 lnk 08 DEFINITIONS: CL= Load capacitance: includes jig and probe capacitance. RT = Termination resistance: should be equal to ZOUT of the Pulse Generator. 500Ω CL 3512 lnk 03 PULSE WIDTH SET-UP, HOLD AND RELEASE TIMES DATA INPUT TIMING INPUT ASYNCHRONOUS CONTROL PRESET CLEAR ETC. SYNCHRONOUS CONTROL PRESET CLEAR CLOCK ENABLE ETC. tH tSU tREM tSU 3V 1.5V 0V 3V 1.5V 0V LOW-HIGH-LOW PULSE 1.5V tW 3V 1.5V 0V HIGH-LOW-HIGH PULSE 1.5V 3V 1.5V 0V tH 3512 lnk 05 3512 lnk 04 PROPAGATION DELAY ENABLE AND DISABLE TIMES ENABLE SAME PHASE INPUT TRANSITION tPLH tPHL OUTPUT tPLH OPPOSITE PHASE INPUT TRANSITION tPHL 3V 1.5V 0V VOH 1.5V VOL DISABLE 3V CONTROL INPUT tPLZ tPZL OUTPUT NORMALLY LOW 3V 1.5V 0V SWITCH CLOSED 3512 lnk 06 SWITCH OPEN 3.5V 3.5V 1.5V tPZH OUTPUT NORMALLY HIGH 1.5V 0V 0.3V VOL tPHZ 0.3V VOH 1.5V 0V 0V 3512 lnk 07 NOTES: 1. Diagram shown for input Control Enable-LOW and input Control DisableHIGH 2. Pulse Generator for All Pulses: Rate ≤ 1.0MHz; tF ≤ 2.5ns; tR ≤ 2.5ns 5 IDT74FST163233 16-BIT 2:1 MUX/DEMUX SWITCH COMMERCIAL TEMPERATURE RANGE ORDERING INFORMATION IDT XX FST 16 XX Temp. Range Device Type X Package PV PA PF Shrink Small Outline Package (SO56-1) Thin Shrink Small Outline Package (SO56-2) Thin Very Small Outline Package (SO56-3) 163233 16-Bit 2:1 Mux/Demux Switch 74 –40°C to +85°C 3512 drw 08 Integrated Device Technology, Inc. reserves the right to make changes to the specifications in this data sheet in order to improve design or performance and to supply the best possible product. Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA 95054-3090 Telephone: (408) 727-6116 6 FAX 408-492-8674