Datasheet

AOZ8807
Ultra-Low Capacitance TVS Diode
General Description
Features
The AOZ8807 is a transient voltage suppressor array
designed to protect high speed data lines such as HDMI,
USB 3.0, MDDI, SATA, and Gigabit Ethernet from
damaging ESD events.
 ESD protection for high-speed data lines:
This device incorporates twelve surge rated, low
capacitance steering diodes and a TVS in a single
package. During transient conditions, the steering diodes
direct the transient to either the positive side of the power
supply line or to ground.
The AOZ8807 provides a typical line-to-line capacitance
of 0.25 pF and low insertion loss up to 6 GHz providing
greater signal integrity making it ideally suited for
HDMI 1.3, Thunderbolt, or USB 3.0 applications, such as
Digital TVs,
DVD players, computing, set-top boxes and MDDI
applications in mobile computing devices.
The AOZ8807 comes in a RoHS compliant and
Halogen free 3.3 mm x 1.3 mm x 0.55 mm 8-lead DFN
package and is rated for -40 °C to +125 °C junction
temperature range.
– IEC 61000-4-2, level 4 (ESD) immunity test
– Air discharge: ±15 kV; contact discharge: ±15 kV
– IEC61000-4-4 (EFT) 40 A (5/50 nS)
– IEC61000-4-5 (Lightning) 4 A (8/20 µS)
– Human Body Model (HBM) ±24 kV
 Array of surge rated diodes with internal TVS diode
 Small package saves board space
 Protects six I/O lines
 Low capacitance between I/O lines: 0.25 pF
 Low clamping voltage
 Low operating voltage: 3.3 V, 5.0 V
Applications
 HDMI, USB 3.0, MDDI, SATA, Thunderbolt ports
 Monitors and flat panel displays
 Set-top box
 Video graphics cards
 Digital Video Interface (DVI)
 Notebook computers
Typical Applications
AOZ8807
TX0+
TX0-
D+
DUSB 3.0
Transceiver
RX0+
D+
D-
RX0TX1+
USB 3.0
Connector
TX1-
Thunderbolt
SSRX+
SSRX-
SSRX+
SSRX-
SSTX+
SSTX-
SSTX+
SSTX-
RX1+
RX1HPD
DPP
LSR
CF2
Connector
AOZ8807
AOZ8807
Figure 1. USB 3.0 Ports
Rev. 3.0 December 2015
Figure 2. Thunderbolt Ports
www.aosmd.com
Page 1 of 8
AOZ8807
Ordering Information
Part Number
Ambient Temperature Range
Package
Environmental
-40 °C to +85 °C
DFN 3.3 mm x 1.3 mm 8-lead
Green Product
AOZ8807DI-03
AOZ8807DI-05
AOS Green Products use reduced levels of Halogens, and are also RoHS compliant.
Please visit www.aosmd.com/media/AOSGreenPolicy.pdf for additional information.
Pin Configuration
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
8
GND
7
GND
DFN 3.3x1.3mm
(Top View)
Absolute Maximum Ratings
Exceeding the Absolute Maximum ratings may damage the device.
Parameter
AOZ8807DI-03
Storage Temperature (TS)
-65 °C to +150 °C
ESD Rating per IEC61000-4-2, contact
ESD Rating per IEC61000-4-2, air
AOZ8807DI-05
(1)
±15 kV
(1)
ESD Rating per Human Body Model
±15 kV
(2)
±24 kV
Notes:
1. IEC 61000-4-2 discharge with CDischarge = 150pF, RDischarge = 330 Ω.
2. Human Body Discharge per MIL-STD-883, Method 3015 CDischarge = 100 pF, RDischarge = 1.5 kΩ.
Maximum Operating Ratings
Parameter
Rating
Junction Temperature (TJ)
Rev. 3.0 December 2015
-40 °C to +125 °C
www.aosmd.com
Page 2 of 8
AOZ8807
Electrical Characteristics
TA = 25°C unless otherwise specified.
Symbol
Parameter
Diagram
I
IPP
Maximum Reverse Peak Pulse Current
VCL
Clamping Voltage @ IPP (IEC61000-4-5 8/20 μs pulse)
VRWM
IR
VBR
IF
Working Peak Reverse Voltage
Maximum Reverse Leakage Current
Breakdown Voltage
VCL VBR VRWM
V
IR VF
IT
IT
Test Current
VF
Forward Voltage @ IF
Ppk
Peak Power Dissipation (IEC61000-4-5 8/20 μs pulse)
CJ
Max. Capacitance @ VR = 0 and f = 1 MHz
VRWM (V)
Max.
VBR (V)
Min.
IT = 100 μA
IR (µA)
Max.
IPP
VF (V)
Typ.
VCL Max.(3)
Device
Device
Marking
AOZ8807DI-03
AG
3.3
3.5
1.0
0.85
8.0
AOZ8807DI-05
AF
5.0
6.0
1.0
0.85
9.0
IPP = 4 A
CJ (pF)
Ppk(3)
Typ.
Max.
32
0.45
0.6
36
0.45
0.6
Notes:
3. These specifications are guaranteed by design and characterization.
Rev. 3.0 December 2015
www.aosmd.com
Page 3 of 8
AOZ8807
Typical Performance Characteristics
Forward Voltage vs. Forward Peak Pulse Current
AOZ8807DI-3
12
(tperiod = 100ns, tr = 1ns)
10
Clamping Voltage, VCL (V)
14
Forward Voltage (V)
Clamping Voltage vs. Peak Pulse Current
(tperiod = 100ns, tr = 1ns)
AOZ8807DI-5
10
8
6
4
2
0
9
AOZ8807DI-3
AOZ8807DI-5
8
7
6
5
4
3
2
0
2
4
6
8
10
Forward Current, IPP (A)
12
0
14
2
14
875m
AOZ8807DI-3
-5
AOZ8807DI-5
-10
Voltage (V)
S21 (dB)
12
HDMI 1.4 Eye Pattern with AOZ8807
I/O - GND Insertion Loss (S21) vs. Frequency
0
4
6
8
10
Peak Pulse Current, IPP (A)
-15
-20
-25
-875m
-30
10
100
1000
Frequency (MHz)
0.0
400m
Voltage (V)
Differential Signal (V)
Rev. 3.0 December 2015
898p
USB 3.1 Eye Diagram with AOZ8807 (10Gbps)
USB 3.0 Eye Diagram with AOZ8807 (5Gbps)
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-0.2 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
Unit Intervals
Time (s)
-400m
www.aosmd.com
-100
Time (s)
100p
Page 4 of 8
AOZ8807
High Speed PCB Layout Guidelines
Printed circuit board layout is the key to achieving the
highest level of surge immunity on power and data lines.
The location of the protection devices on the PCB is the
simplest and most important design rule to follow. The
AOZ8807DI devices should be located as close as
possible to the noise source. The AOZ8807DI device
should be placed on all data and power lines that enter or
exit the PCB at the I/O connector. In most systems, surge
pulses occur on data and power lines that enter the PCB
through the I/O connector. Placing the AOZ8807DI
devices as close as possible to the noise source ensures
that a surge voltage will be clamped before the pulse can
be coupled into adjacent PCB traces. In addition, the
PCB should use the shortest possible traces. A short
trace length equates to low impedance, which ensures
that the surge energy will be dissipated by the
AOZ8807DI device. Long signal traces will act as
antennas to receive energy from fields that are produced
by the ESD pulse. By keeping line lengths as short as
possible, the efficiency of the line to act as an antenna for
ESD related fields is reduced. Minimize interconnecting
line lengths by placing devices with the most interconnect
as close together as possible. The protection circuits
should shunt the surge voltage to either the reference or
chassis ground. Shunting the surge voltage directly to the
IC’s signal ground can cause ground bounce.
The clamping performance of TVS diodes on a single
ground PCB can be improved by minimizing the
impedance with relatively short and wide ground traces.
The PCB layout and IC package parasitic inductances
can cause significant overshoot to the TVS’s clamping
voltage. The inductance of the PCB can be reduced by
using short trace lengths and multiple layers with
separate ground and power planes. One effective
method to minimize loop problems is to incorporate a
ground plane in the PCB design.
The AOZ8807DI ultra-low capacitance TVS is designed
to protect six high speed data transmission lines from
transient over-voltages by clamping them to a fixed
reference. The low inductance and construction
minimizes voltage overshoot during high current surges.
When the voltage on the protected line exceeds the
reference voltage the internal steering diodes are forward
biased, conducting the transient current away from the
sensitive circuitry. The AOZ8807DI is designed for ease
of PCB layout by allowing the traces to run underneath
the device. The pinout of the AOZ8807DI is designed to
simply drop onto the IO lines of a High Definition
Multimedia Interface (HDMI) or USB 3.0 design without
having to divert the signal lines that may add more
parasitic inductance.
I/O
I/O
GND
I/O
I/O
I/O
GND
I/O
AOZ8807
Figure 3. Layout Example
.
Rev. 3.0 December 2015
www.aosmd.com
Page 5 of 8
AOZ8807
Package Dimensions, DFN 3.3 mm x 1.3 mm x 0.55 mm, 8L
D
e1
L1
E
L
b
Pin #1 Dot
By Marking
Top View
e
Bottom View
c
A
A1
Side View
RECOMMENDED LAND PATTERN
Dimensions in millimeters
1.25
0.625
0.25
0.92
1.85
.05
0.68
0.50
Symbols
A
A1
b
C
D
E
e
e1
L
L1
Min.
0.50
0.00
0.20
3.25
1.25
0.30
0.54
Nom. Max.
0.55
0.60
0.02
0.05
0.25
0.30
0.152 REF
3.30
3.38
1.30
1.38
0.50 BSC
1.25 BSC
0.38
0.43
0.62
0.67
Dimensions in inches
Symbols
A
A1
b
C
D
E
e
e1
L
L1
Min.
0.025
0.000
0.008
Nom. Max.
0.022 0.024
0.001 0.002
0.010 0.012
0.006 REF
0.128 0.130 0.133
0.049 0.051 0.054
0.020 BSC
0.049 BSC
0.012 0.015 0.017
0.021 0.024 0.026
0.30
0.25
UNIT: mm
NOTE:
1. Controlling dimension is millimeters. Converted inches dimensions are not necessarily exact.
Rev. 3.0 December 2015
www.aosmd.com
Page 6 of 8
AOZ8807
Tape and Reel Dimensions, DFN 3.3 mm x 1.3 mm x 0.55 mm, 8L
Carrier Tape
A - A’
Section
P0
D0
T
P2
A
E1
E2
E
B0
D1
K0
A
P1
A0
Feeding Direction
UNIT: mm
Package
3.3x1.3x0.55
A0
1.60
±0.10
B0
3.55
±0.05
K0
D0
D1
0.60 1.55
1.5
±0.05 Max. ±0.1/-0.0
E
12.0
±0.30
E1
1.75
±0.10
E2
5.50
±0.10
P0
4.0
±0.10
P1
4.0
±0.10
P2
2.0
±0.10
T
0.25
±0.05
Reel
UNIT: mm
Tape Size
12
Reel Size
Ø330
M
Ø330
±0.3/-4.0
N
55.0
±0.40
W1
12.4
±0.20
H
13.0
±0.20
S
2.2
±0.20
K
10.6
±0.20
R
----
Leader/Trailer and Orientation
Trailer Tape
300mm Min.
Rev. 3.0 December 2015
Components Tape
Orientation in Pocket
www.aosmd.com
Leader Tape
Page 7 of 8
AOZ8807
Part Marking
AOZ8807DI-03
AOZ8807DI-05
(3.3 x 1.3 x 0.55 DFN)
WLT
Assembly Lot Code
Part Number Code
Week and Year Code
LEGAL DISCLAIMER
Alpha and Omega Semiconductor makes no representations or warranties with respect to the accuracy or
completeness of the information provided herein and takes no liabilities for the consequences of use of such
information or any product described herein. Alpha and Omega Semiconductor reserves the right to make changes
to such information at any time without further notice. This document does not constitute the grant of any intellectual
property rights or representation of non-infringement of any third party’s intellectual property rights.
LIFE SUPPORT POLICY
ALPHA AND OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body or (b) support or sustain life, and (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of
the user.
Rev. 3.0 December 2015
2. A critical component in any component of a life
support, device, or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
www.aosmd.com
Page 8 of 8