Webinar ECT Best Practice: How to handle a PCB project with embedded components? www.we-online.com/embedding Embedded Component Technology – ECT ECT Best Practice How to handle a PCB project with embedded components? Basic Motivation Brief overview of technologies to embed discrete components Possible components Conceptual phase and layer constructions Design & layout Jürgen Wolf Summary www.we-online.com/embedding Embedded Component Technology – ECT Würth Elektronik GmbH & Co. KG Product Manager Embedded Component Technology Webinar V2015/1 05.05.2015 Page 2 Embedded Component Technology – ECT ECT Best Practice How to handle a PCB project with embedded components? Basic Motivation Brief overview of technologies to embed discrete components Possible components Conceptual phase and layer constructions Design & layout Summary www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 05.05.2015 Page 3 Embedded Component Technology – ECT Advantages of „buried“ components? Miniaturization Performance/ Function Reliability www.we-online.com/embedding Embedded Component Technology – ECT • Package replacement • Space savings of assembly area on the outer layers • Integrated shielding • Short signal paths • Protection against plagiarism • Protected against influences • Secure fixing • Thermal management Webinar V2015/1 05.05.2015 Page 4 Embedded Component Technology – ECT ECT Best Practice How to handle a PCB project with embedded components? Basic Motivation Brief overview of technologies to embed discrete components Possible components Conceptual phase and layer constructions Design & layout Summary www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 05.05.2015 Page 5 Embedded Component Technology – ECT ECT–µVia: Embedded active and passive devices ECT–µVia Manufacturing Assembly (Gluing/Sintering/ Soldering) Multilayer pressing Drilling of vias and microvias www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 05.05.2015 Page 6 Embedded Component Technology – ECT ECT–µVia: Embedded active and passive devices Non-plated microvia on embedded capacitor with Cu termination length: 58,97 µm length: 21,96 µm www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 05.05.2015 Page 7 Embedded Component Technology – ECT ECT–µVia: Embedded active and passive devices ECT–µVia Manufacturing Assembly (Gluing/Sintering/ Soldering) Multilayer pressing Drilling of vias and microvias Plating and structuring www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 05.05.2015 Page 8 Embedded Component Technology – ECT ECT–µVia: Embedded active and passive devices Plated Microvia on embedded capacitor with Cu termination www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 05.05.2015 Page 9 Embedded Component Technology – ECT ECT–Flip Chip: Embedded active devices ECT-Flip Chip Production Core with footprint for Flip Chip Assembly (Flip Chip – ACA) Multilayer pressing Remaining PCB processes www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 05.05.2015 Page 10 Embedded Component Technology – ECT ECT Best Practice How to handle a PCB project with embedded components? Basic Motivation Brief overview of technologies to embed discrete components Possible components Conceptual phase and layer constructions Design & layout Summary www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 05.05.2015 Page 11 Embedded Component Technology – ECT Availability of components Passive Components with Cu-Termination Resistors mounting form 0402 Capacitors 150 µm Thicknesses from 150 µm to 300 µm 150 µm Bare Die Silicon ICs with process compatible pads ECT–µVia Pads • Cu • NiPd www.we-online.com/embedding Generally a customer provision Embedded Component Technology – ECT ECT–Flip Chip Pads • Wirebond Au Stud-Bumps • Wafer-level Au-Bumps Webinar V2015/1 05.05.2015 Page 12 Embedded Component Technology – ECT ECT Best Practice How to handle a PCB project with embedded components? Basic Motivation Brief overview of technologies to embed discrete components Possible components Conceptual phase and layer constructions Design & layout Summary www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 05.05.2015 Page 13 Embedded Component Technology – ECT Collaboration in the development Very close collaboration is needed at a very early stage in the concept and design phase to be successful Products using ECT product idea design concept www.we-online.com/embedding development draft Embedded Component Technology – ECT optimisation prototypes Webinar V2015/1 Serial production 05.05.2015 Page 14 Embedded Component Technology – ECT Analysis of existing boards with regard to usability of embedded components BOM – Analysis of an existing predecessor-layout (if available) Designator nHIB, RST ANT PROG R1, R2, R3, R4, R6, R8, R9, R10, R11, R13, R14 R12, R15, R16, R18, R19 R17, R20 R5, R7 T1, T2 U2 L1, L3 L2 AUX J1, J2, J3 FL1 U1 C1, C6, C7, C9, C10, C15, C16, C21, C22, C23, C27 C12 C13, C14 C18, C19, C20 C2, C3 C24, C25 C4, C5, C26 C8, C11, C17 XT2 XT1 www.we-online.com/embedding Value Quantity Manufacturer 100k N.C. 100 10k N.C. 2.2uH 1uH N.C. 100nF 1uF 22uF 4.7uF 6.2pF 100uF 10pF 10uF 2 C&K Components 1 Cinch Connectivity Solutions Johnson 1 SAMTEC 11 Yageo 5 2 Panasonic Electronic Components 2 Yageo 2 1 Micron Technology Inc 2 Murata Electronics North America 1 Murata Electronics North America 1 3 Hirose Electric Co Ltd 1 TDK Corporation 1 TEXAS INSTRUMENTS 11 Taiyo Yuden 1 Murata Electronics North America 2 Taiyo Yuden 3 Samsung Electro-Mechanics America, Inc 2 Murata Electronics North America 2 TDK Corporation 3 AVX Corporation 3 Murata Electronics North America 1 Abracon Corporation 1 AVX Corp/Kyocera Corp Manufacturer Part Number Supplier 1 Supplier Device Package Supplier Part Number 1 Supplier Unit Price 1 Comment Footprint KMR231G ULC LFS 128-0711-201 FTS-104-03-F-DV-TR RC'0402JR-07100KL Digi-Key Digi-Key Farnell Digi-Key 0.71 0.99 '0402 311-100KJRCT-ND 0.10 ERJ-2GEJ101X RC'0402JR-0710KL Digi-Key Digi-Key '0402 '0402 P100JCT-ND 311-10KJRCT-ND 0.10 0.10 M25PX80-VMN6TP LQM2HPN2R2MG0L LQM2HPN1R0MJ0L Digi-Key Digi-Key Digi-Key 8-SO 1008 (2520 Metric) 1008 (2520 Metric) M25PX80-VMN6TPCT-ND 0.90 490-5114-1-ND 0.36 490-6699-1-ND 0.42 DF40C-20DP-0.4V(51) DEA202450BT-1294C1-H CC3100R11MRGC LMK105BJ104KV-F GRM155R61A105ME15D AMK107BBJ226MAHT CL05A475MQ5NRNC GRM1555C1H6R2BA01D C3216X5R0J107M160AB '04025U100CAT2A GRM188R60J106ME47D ABS07-32.768KHZ-T CX3225GB40000D0HEQCC Digi-Key Digi-Key Farnell Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Taster_Miniatur U.FL-R-SMT SAMTEC_FTS_104 '0402 '0402 '0402 '0402 Testpin_0.8 MICT-MN-8_N 1008_inductor 1008_inductor PIN2 _1.27 DF40C-20DP-0.4V DEA202450BT-1294C1-H PVQFN-64 '0402 '0402 J1-0603 '0402 '0402 C1206 '0402 J1-0603 ABS07 CMAC-XTAL_2.5x3.2 Embedded Component Technology – ECT CKN10245CT-ND J983CT-ND 1928283 Webinar V2015/1 H11618CT-ND 445-172335-1-ND 0.83 0.54 2445381 587-1227-1-ND 490-5409-1-ND 587-3262-1-ND 1276-1056-1-ND 490-8224-1-ND 445-6008-1-ND 478-5991-1-ND 490-3896-2-ND 535-9542-1-ND 1253-1222-1-ND 0.034 0.66 0.22 0.10 0.14 0.75 05.05.2015 Value U.FL-R-SMT Stecker_8Pin Res3 Res3 Res3 Res3 N.C. M25PX80-VMN6TP LQM2HPN2R2MG0L LQM2HPN1R0MJ0L Header 2 DF40C-20DP-0.4V DEA202450BT-1294C1-H Dez 21 CC3100 Cap Semi Cap Semi Cap Semi Cap Semi Cap Semi Jan 32 Cap Semi Cap Semi Cap Semi Jan 24 ABS07-32.768KHZ-T 40MHz Page 15 Embedded Component Technology – ECT Analysis of existing boards with regard to usability of embedded components BOM – Analysis of an existing predecessor-layout (if available) Embeddable Components identified in BOM www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 05.05.2015 Page 16 Embedded Component Technology – ECT Collaboration in the concept phase Embedding of active and passive components: Initial meeting www.we-online.com/embedding Final implementation Embedded Component Technology – ECT Webinar V2015/1 05.05.2015 Page 17 Embedded Component Technology – ECT ECT Best Practice How to handle a PCB project with embedded components? Basic Motivation Brief overview of technologies to embed discrete components Possible components Conceptual phase and layer constructions Design & layout Summary www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 05.05.2015 Page 18 Embedded Component Technology – ECT Design and layout? EDA-Tools for ECT: The latest versions of these tools: with limitations Allegro® PCB Designer Miniaturization Option Further tools possible, but with limitations www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 05.05.2015 Page 19 Embedded Component Technology – ECT Design and layout? EDA-Tools for ECT: Main differences between these tools ECT capable tools: ECT incapable tools: Central part libraries, footprints may be moved to any Layer of the layout Application specific part library, same layer stack for library and application board with footprint on dedicated layer 3D Design Rule Check Only 2D Design Rule Check, including mechanical checks no Z-axis-check www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 05.05.2015 Page 20 Embedded Component Technology – ECT Design Rules ECT–µVia and ECT–Flip Chip pad 175 µm distance pad / pad ≥ 75 µm distance next component ≥ 300 µm distance chip / sidewall ≥ 500 µm ≈ end 70 µm dielectric thickness 20 – 25 µm component height ≥ 150 µm (<150 µm upon request) dielectric thickness ≥ 50 µm dielectric thickness ≥ 50 µm adhesive pad ≥ 125 µm pitch ≥ 250 µm pad metallization ≥ 6 µm Cu or ≥ 5 µm Ni + flash Pd pitch ≥ 100 µm embedded component ≤ 5 mm x 5 mm backside contact (microvia or ICA) available upon request pad distance ≥ 50 µm pad / pad ≥ 50 µm embedded flip chip ≤ 5 mm x 5 mm component height ≥ 150 µm adhesive ACA / NCA / ESC (Encapsulated Solder Connection) prepreg core www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 05.05.2015 Page 21 Embedded Component Technology – ECT ECT Best Practice How to handle a PCB project with embedded components? Basic Motivation Brief overview of technologies to embed discrete components Possible components Conceptual phase and layer constructions Design & layout Summary www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 05.05.2015 Page 22 Embedded Component Technology – ECT ECT Best Practice How to handle a PCB project with embedded components? Summary Different technologies possible Components must meet certain conditions Würth Elektronik already provides support during conceptual phase for layer constructions, design and layout Jürgen Wolf Würth Elektronik GmbH & Co. KG Product Manager Embedded Component Technology www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2015/1 05.05.2015 Page 23