Demoboard BTF3050TE Description

Demoboard BTF3050TE V1.1
Smart Low Side Power Switch
Demoboard Description
V 1.1, 2015-04-14
Automotive Power
1
V 1.1, 2015-04-14
Demoboard BTF3050TE
How to use the Demoboard
Demoboard BTF3050TE
1
Demoboard BTF3050TE
Note: The following information is given as a hint for the implementation of the device only and shall not be
regarded as a description or warranty of a certain functionality, condition or quality of the device.
Basic Features of this Demoboard
•
RoHS compliant
•
Driving one12 V DC resistive, capacitive or inductive load
•
Supporting PWM < 20 kHz (via external signal generator)
•
Additional equipment needed: 1x 12 V power supply, 1x signal generator
Description of how to use the Demoboard
This description is intended to give a fast introduction to the BTF3050TE demoboard. The demoboard gives
the user a quick start for lab evaluation of the capabilities of the BTF3050TE. Stand-alone operation is
possible.
The BTF3050TE demoboard (PCB size: 85 x 70 mm2) has 2 layers (70 µm copper). It is equipped with one
sample of the product BTF3050TE (IC3). Figure 1 gives an overview of the demoboard. Table 1 provides a
description of major parts of the demoboard. The schematic and an example for external connection is given
in Figure 2.
BTF3050TE
IN
OUT/LOAD
JP2
SRP
SV1
VREG JP1
GND
VS/VBAT
LED1
Figure 1
Board Overview
Table 1
Part Description
LED2
Name Description
IN
Input signal; TTL logic level (5V recommended)
SRP
SRP output; digital fault feedback output. Slew Rate selection via SV1
VS
Supply voltage; Can be connected to battery supply line or an external power supply < 20 V. An
integrated voltage regulator maintains VS at 5 V, supplying the BTF3050TE VDD pin
Demoboard Description
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Demoboard BTF3050TE
How to use the Demoboard
Demoboard BTF3050TE
Table 1
Part Description (cont’d)
Name Description
OUT
Output/Load; refers to the OUT pin of the device. Load (4.7 Ω for nominal current) to battery supply
line (13.5 V recommended). For inductive loads check energy capabilities
GND
Ground; connect all grounds to this pin
VREG Voltage regulator; TLE4295 provides a stable output voltage of 5 V
JP1
Jumper 1; connects the FAULT signaling LED1
JP2
Jumper 2; connects the Voltage regulator output to the device’s VDD JP2 can be removed to
implement an external power supply for VDD
SV1
SRP resistor selector; Controls the Slew Rate to the desired switching speed
1-2 connects 0 Ω between device’s SRP pin and GND
3-4 connects 5.8 Ω between device’s SRP pin and GND
5-6 connects 58 Ω between device’s SRP pin and GND
LED1
FAULT indicator; If LED1 (red) is on, the fault feedback is active
LED2
VDD indicator; If LED2 (green) is on, the regulated 5 V supply is active
BTF3050 TE Demoboard V .1.1
5V
VDD
LOAD
VBAT
C4
100nF
VDD_2
VS/
VBAT
OUT
VDD
Signal
Generator
IN
OUT OUT_TAB
OUT
IN
IN
DC
Power
Supply
IN_1
SRP
IC3
SRP
SRP
SRP_4
R1= 100R
5
3
1
6
4
2
V CC_5
GND
NC
fast
slow
5V
VDD
LED1_red
FAULT/
FAILURE
VS/
V BAT
VS/
V BAT
PF_1
R3= 1k5
74AHC1G04DBV
GND
OUT_4
IC2
GND_3
IN _1
R4= 58k
R2= 5.8k
5V
VDD
FAULT
reset
GND_5
OUT_3
JP1
FAULT
IC1
GND
SV1
VDD/
VCC
Voltage Regulator
OUT_4
IC1
GND_5
Figure 2
GND_2
C1
220 nF
TLE4295 _GV50
VOUT=5V
R5= 1k5
IN_3
C2
2.2uF
C3
100nF
JP2
VDD/VCC
LED 2_green
VDD/
OK
Demoboard Schematic
Note: The Figure above shows the demoboard schematics and a very simplified application example. The
function in real applications must be verified to not exceed the limits of the device nor the demoboard
and its components.
Demoboard Description
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Demoboard BTF3050TE
How to use the Demoboard
Demoboard BTF3050TE
Table 2
Revision History
Revision
Date
Subjects (major changes since last revision)
Rev. 1.1
14.04.2015
Demoboard Description released
Demoboard Description
4
V 1.1, 2015-04-14
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolGaN™, CoolMOS™, CoolSET™, CoolSiC™, CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, DrBLADE™,
EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, IsoPACK™, iWafer™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OPTIGA™, OptiMOS™, ORIGA™, POWERCODE™, PRIMARION™, PrimePACK™,
PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, ReverSave™, SatRIC™, SIEGET™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, SPOC™, TEMPFET™,
thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited,
UK. ANSI™ of American National Standards Institute. AUTOSAR™ of AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT
Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft
Corporation. HYPERTERMINAL™ of Hilgraeve Incorporated. MCS™ of Intel Corp. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated
Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of
MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ of
Openwave Systems Inc. RED HAT™ of Red Hat, Inc. RFMD™ of RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems,
Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of
Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc.
VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.
Trademarks Update 2014-07-17
www.infineon.com
Edition 2015-04-14
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2014 Infineon Technologies AG.
All Rights Reserved.
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