Demoboard BTF3050TE V1.1 Smart Low Side Power Switch Demoboard Description V 1.1, 2015-04-14 Automotive Power 1 V 1.1, 2015-04-14 Demoboard BTF3050TE How to use the Demoboard Demoboard BTF3050TE 1 Demoboard BTF3050TE Note: The following information is given as a hint for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the device. Basic Features of this Demoboard • RoHS compliant • Driving one12 V DC resistive, capacitive or inductive load • Supporting PWM < 20 kHz (via external signal generator) • Additional equipment needed: 1x 12 V power supply, 1x signal generator Description of how to use the Demoboard This description is intended to give a fast introduction to the BTF3050TE demoboard. The demoboard gives the user a quick start for lab evaluation of the capabilities of the BTF3050TE. Stand-alone operation is possible. The BTF3050TE demoboard (PCB size: 85 x 70 mm2) has 2 layers (70 µm copper). It is equipped with one sample of the product BTF3050TE (IC3). Figure 1 gives an overview of the demoboard. Table 1 provides a description of major parts of the demoboard. The schematic and an example for external connection is given in Figure 2. BTF3050TE IN OUT/LOAD JP2 SRP SV1 VREG JP1 GND VS/VBAT LED1 Figure 1 Board Overview Table 1 Part Description LED2 Name Description IN Input signal; TTL logic level (5V recommended) SRP SRP output; digital fault feedback output. Slew Rate selection via SV1 VS Supply voltage; Can be connected to battery supply line or an external power supply < 20 V. An integrated voltage regulator maintains VS at 5 V, supplying the BTF3050TE VDD pin Demoboard Description 2 V 1.1, 2015-04-14 Demoboard BTF3050TE How to use the Demoboard Demoboard BTF3050TE Table 1 Part Description (cont’d) Name Description OUT Output/Load; refers to the OUT pin of the device. Load (4.7 Ω for nominal current) to battery supply line (13.5 V recommended). For inductive loads check energy capabilities GND Ground; connect all grounds to this pin VREG Voltage regulator; TLE4295 provides a stable output voltage of 5 V JP1 Jumper 1; connects the FAULT signaling LED1 JP2 Jumper 2; connects the Voltage regulator output to the device’s VDD JP2 can be removed to implement an external power supply for VDD SV1 SRP resistor selector; Controls the Slew Rate to the desired switching speed 1-2 connects 0 Ω between device’s SRP pin and GND 3-4 connects 5.8 Ω between device’s SRP pin and GND 5-6 connects 58 Ω between device’s SRP pin and GND LED1 FAULT indicator; If LED1 (red) is on, the fault feedback is active LED2 VDD indicator; If LED2 (green) is on, the regulated 5 V supply is active BTF3050 TE Demoboard V .1.1 5V VDD LOAD VBAT C4 100nF VDD_2 VS/ VBAT OUT VDD Signal Generator IN OUT OUT_TAB OUT IN IN DC Power Supply IN_1 SRP IC3 SRP SRP SRP_4 R1= 100R 5 3 1 6 4 2 V CC_5 GND NC fast slow 5V VDD LED1_red FAULT/ FAILURE VS/ V BAT VS/ V BAT PF_1 R3= 1k5 74AHC1G04DBV GND OUT_4 IC2 GND_3 IN _1 R4= 58k R2= 5.8k 5V VDD FAULT reset GND_5 OUT_3 JP1 FAULT IC1 GND SV1 VDD/ VCC Voltage Regulator OUT_4 IC1 GND_5 Figure 2 GND_2 C1 220 nF TLE4295 _GV50 VOUT=5V R5= 1k5 IN_3 C2 2.2uF C3 100nF JP2 VDD/VCC LED 2_green VDD/ OK Demoboard Schematic Note: The Figure above shows the demoboard schematics and a very simplified application example. The function in real applications must be verified to not exceed the limits of the device nor the demoboard and its components. Demoboard Description 3 V 1.1, 2015-04-14 Demoboard BTF3050TE How to use the Demoboard Demoboard BTF3050TE Table 2 Revision History Revision Date Subjects (major changes since last revision) Rev. 1.1 14.04.2015 Demoboard Description released Demoboard Description 4 V 1.1, 2015-04-14 Trademarks of Infineon Technologies AG AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolGaN™, CoolMOS™, CoolSET™, CoolSiC™, CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, DrBLADE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, IsoPACK™, iWafer™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OPTIGA™, OptiMOS™, ORIGA™, POWERCODE™, PRIMARION™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, ReverSave™, SatRIC™, SIEGET™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, SPOC™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. ANSI™ of American National Standards Institute. AUTOSAR™ of AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. HYPERTERMINAL™ of Hilgraeve Incorporated. MCS™ of Intel Corp. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ of Openwave Systems Inc. RED HAT™ of Red Hat, Inc. RFMD™ of RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Trademarks Update 2014-07-17 www.infineon.com Edition 2015-04-14 Published by Infineon Technologies AG 81726 Munich, Germany © 2014 Infineon Technologies AG. All Rights Reserved. Do you have a question about any aspect of this document? Email: [email protected] Document reference Doc_Number Legal Disclaimer THE INFORMATION GIVEN IN THIS APPLICATION NOTE (INCLUDING BUT NOT LIMITED TO CONTENTS OF REFERENCED WEBSITES) IS GIVEN AS A HINT FOR THE IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND (INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN IN THIS APPLICATION NOTE. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.