IDT IDT71V124

IDT71V124
3.3V CMOS Static RAM
1 Meg (128K x 8-Bit)
Revolutionary Pinout
Features
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Description
128K x 8 advanced high-speed CMOS static RAM
JEDEC revolutionary pinout (center power/GND) for
reduced noise
Commercial (0°C to +70°C) and Industrial (–40°C to
+85°C) temperature options
Equal access and cycle times
— Industrial and Commercial: 15/20ns
One Chip Select plus one Output Enable pin
Bidirectional inputs and outputs directly
LVTTL-compatible
Low power consumption via chip deselect
Available in 32-pin 400 mil Plastic SOJ.
The IDT71V124 is a 1,048,576-bit high-speed static RAM organized as 128K x 8. It is fabricated using IDT’s high-performance, highreliability CMOS technology. This state-of-the-art technology, combined with innovative circuit design techniques, provides a costeffective solution for high-speed memory needs. The JEDEC center
power/GND pinout reduces noise generation and improves system
performance.
The IDT71V124 has an output enable pin which operates as fast as
7ns, with address access times as fast as 15ns available. All bidirectional inputs and outputs of the IDT71V124 are LVTTL-compatible and
operation is from a single 3.3V supply. Fully static asynchronous
circuitry is used; no clocks or refreshes are required for operation.
The IDT71V124 is packaged in 32-pin 400 mil Plastic SOJ.
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Functional Block Diagram
A0
•
•
•
•
•
•
ADDRESS
1,048,576-BIT
MEMORY ARRAY
DECODER
A16
O
I/O0 - I/O7
O R
O
F
8
I/O CONTROL
8
8
WE
OE
CS
CONTROL
LOGIC
3484 drw 01
AUGUST 2000
1
©2000 Integrated Device Technology, Inc.
DSC-3484/05
IDT71V124, 3.3V CMOS Static RAM
1 Meg (128K x 8-Bit), Revolutionary Pinout
Commercial and Industrial Temperature Ranges
Absolute Maximum Ratings(1)
Pin Configuration
A0
A1
A2
A3
CS
I/O0
I/O1
VDD
GND
I/O2
I/O3
WE
A4
A5
A6
A7
3484 drw 02
WE
L
L
H
DATAOUT
Read Data
L
X
L
DATAIN
Write Data
L
H
H
High-Z
Output Disabled
X
X
High-Z
Deselected – Standby (I SB)
X
X
High-Z
Deselected – Standby (ISB1 )
VHC
I/O
NOTES:
1. H = VIH, L = VIL, x = Don't care.
2. VLC = 0.2V, VHC = VDD –0.2V.
3. Other inputs ≥VHC or ≤VLC.
Capacitance
O
Function
Parameter(1)
CIN
Input Capacitance
CI/O
I/O Capacitance
TA
Operating Temperature
–0.5 to +4.1
V
0 to +70
o
C
C
C
TBIAS
Temperature Under Bias
–55 to +125
o
TSTG
Storage Temperature
–55 to +125
o
PT
Power Dissipation
IOUT
DC Output Current
0.5
E
W
50
mA
3484 tbl 02
Grade
Temperature
GND
VDD
Commercial
0°C to +70°C
0V
See Below
Industrial
–40°C to +85°C
0V
See Below
3484 tb l 02a
3484 tbl 01
Recommended DC Operating
Conditions
(TA = +25°C, f = 1.0MHz, SOJ package)
Symbol
Terminal Voltage with
Respect to GND
Unit
(2)
Recommended Operating
Temperature and Supply Voltage
OE
(3)
VTERM
Value
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliabilty.
2. VTERM must not exceed VDD + 0.5V.
CS
H
Rating
(2)
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SOJ
Top View
Truth Table(1,2)
Symbol
A16
A15
A14
A13
OE
I/O7
I/O6
GND
VDD
I/O5
I/O4
A12
A11
A10
A9
A8
1
32
2
31
3
30
4
29
28
5
6 SO32-3 27
26
7
25
8
9
24
10
23
11
22
12
21
13
20
14
19
15
18
16
17
Symbol
O R
O
F
Conditions
Max.
Unit
VIN = 3dV
8
pF
VOUT = 3dV
8
pF
3484 tbl 03
NOTE:
1. This parameter is guaranteed by device characterization, but is not production
tested.
Parameter
Min.
Typ.
Max.
Unit
3.0
3.3
3.6
V
0
0
0
V
VDD
Supply Voltage
GND
Ground
VIH
Input High Voltage
2.0
____
VDD +0.3
V
VIL
Input Low Voltage
–0.3(1)
____
0.8
V
3484 tbl 04
NOTE:
1. VIL (min.) = –1V for pulse width less than 5ns, once per cycle.
DC Electrical Characteristics
(VDD = 3.3V ± 10%, Commercial and Industrial Temperature Ranges)
IDT71V124
Symbol
|ILI|
|ILO|
VOL
VOH
Parameter
Test Condition
Min.
Max.
Unit
Input Leakage Current
VDD = Max., VIN = GND to VDD
___
5
µA
Output Leakage Current
VDD = Max., CS = VIH, VOUT = GND to VDD
___
5
µA
IOL = 8mA, VDD = Min.
___
0.4
V
2.4
___
V
Output Low Voltage
Output High Voltage
IOH = –8mA, VDD = Min.
3484 tbl 05
6.42
2
IDT71V124, 3.3V CMOS Static RAM
1 Meg (128K x 8-Bit), Revolutionary Pinout
Commercial and Industrial Temperature Ranges
DC Electrical Characteristics(1)
(VDD = 3.3V ± 10%, VLC = 0.2V, VHC = VDD – 0.2V)
71V124S15
Symbol
Parameter
71V124S20
Com'l.
Ind.
Com'l.
Ind.
Unit
ICC
Dynamic Operating Current
CS < VIL, Outputs Open, VDD = Max., f = f MAX(2)
100
120
95
115
mA
ISB
Standby Power Supply Current (TTL Level)
CS > VIH, Outputs Open, VDD = Max., f = f MAX(2)
35
40
30
35
mA
ISB1
Full Standby Power Supply Current (CMOS Level)
CS > VHC, Outputs Open, VDD = Max., f = 0(2)
VIN < VLC or VIN > VHC
5
7
5
7
mA
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NOTES:
1. All values are maximum guaranteed values.
2. fMAX = 1/tRC (all address inputs are cycling at fMAX); f = 0 means no address input lines are changing.
3484 tbl 06
AC Test Conditions
Input Pulse Levels
GND to 3.0V
Input Rise/Fall Times
3ns
Input Timing Reference Levels
Output Reference Levels
1.5V
1.5V
AC Test Load
See Figure 1 and 2
3484 tbl 07
3.3V
DATA OUT
30pF
O
3.3V
O R
O
F
298Ω
298Ω
DATAOUT
5pF*
216Ω
216Ω
3484 drw 04
3484 drw 03
*Including jig and scope capacitance.
Figure 1. AC Test Load
Figure 2. AC Test Load
(for tCLZ, tOLZ, tCHZ, tOHZ, tOW, and tWHZ)
6.42
3
IDT71V124, 3.3V CMOS Static RAM
1 Meg (128K x 8-Bit), Revolutionary Pinout
Commercial and Industrial Temperature Ranges
AC Electrical Characteristics
(VDD = 3.3V ± 10%, Commercial and Industrial Ranges)
71V124S15
Symbol
Parameter
71V124S20
Min.
Max.
Min.
Max.
Unit
READ CYCLE
tRC
Read Cycle Time
15
____
20
____
ns
tAA
Address Access Time
____
15
____
20
ns
tACS
Chip Select Access Time
____
15
____
20
ns
tCLZ(1)
Chip Select to Output in Low-Z
3
____
3
____
ns
tCHZ(1)
Chip Deselect to Output in High-Z
0
0
8
ns
tOE
Output Enable to Output Valid
____
8
ns
tOLZ(1)
Output Enable to Output in Low-Z
0
____
0
____
ns
tOHZ(1)
Output Disable to Output in High-Z
0
5
0
7
ns
tOH
Output Hold from Address Change
4
____
4
____
ns
tPU(1)
Chip Select to Power-Up Time
0
____
0
____
ns
tPD(1)
Chip Deselect to Power-Down Time
____
15
____
20
ns
tWC
Write Cycle Time
15
____
20
____
ns
tAW
Address Valid to End of Write
12
____
15
____
ns
15
____
ns
WRITE CYCLE
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____
7
tCW
Chip Select to End of Write
12
____
tAS
Address Set-up Time
0
____
0
____
ns
tWP
Write Pulse Width
12
____
15
____
ns
0
____
0
____
ns
8
____
9
____
ns
0
____
0
____
ns
tWR
Write Recovery Time
tDW
Data Valid to End of Write
tDH
Data Hold Time
tOW(1)
Output Active from End of Write
3
____
4
____
ns
tWHZ(1)
Write Enable to Output in High-Z
0
5
0
8
ns
O
O R
O
F
NOTE:
1. This parameter guaranteed with the AC load (Figure 2) by device characterization, but is not production tested.
6.42
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3484 tbl 08
IDT71V124, 3.3V CMOS Static RAM
1 Meg (128K x 8-Bit), Revolutionary Pinout
Commercial and Industrial Temperature Ranges
Timing Waveform of Read Cycle No. 1
(1)
tRC
ADDRESS
tAA
OE
tOE
tOLZ
CS
tCLZ
(5)
(5)
tACS
(3)
C
HIGH IMPEDANCE
DATAOUT
(5)
tOHZ (5)
DATAOUT VALID
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tPD
tPU
VCC SUPPLY ICC
CURRENT ISB
E
tCHZ
3484 drw 05
Timing Waveform of Read Cycle No. 2(1,2,4)
tRC
ADDRESS
tAA
tOH
DATAOUT
tOH
PREVIOUS DATAOUT VALID
DATAOUT VALID
NOTES:
1. WE is HIGH for Read Cycle.
2. Device is continuously selected, CS is LOW.
3. Address must be valid prior to or coincident with the later of CS transition LOW; otherwise tAA is the limiting parameter.
4. OE is LOW.
5. Transition is measured ±200mV from steady state.
O
O R
O
F
6.42
5
3484 drw 06
IDT71V124, 3.3V CMOS Static RAM
1 Meg (128K x 8-Bit), Revolutionary Pinout
Commercial and Industrial Temperature Ranges
Timing Waveform of Write Cycle No.1 (WE Controlled Timing)(1,2,4)
tWC
ADDRESS
tAW
CS
tWR
tAS
WE
tWP
(2)
(5)
HIGH IMPEDANCE
tDW
DATAIN
C
tOW
(3)
DATAOUT
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tWHZ
(5)
tCHZ (5)
(3)
tDH
DATAIN VALID
3484 drw 07
Timing Waveform of Write Cycle No. 2 (CS Controlled Timing)(1,4)
tWC
ADDRESS
tAW
CS
WE
DATAIN
O
tAS
(3)
tCW
O R
O
F
tWR
tDW
tDH
DATAIN VALID
3484 drw 08
NOTES:
1. A write occurs during the overlap of a LOW CS and a LOW WE.
2. OE is continuously HIGH. During a WE controlled write cycle with OE LOW, tWP must be greater than or equal to tWHZ + tDW to allow the I/O drivers to turn off and data to be
placed on the bus for the required tDW. If OE is HIGH during a WE controlled write cycle, this requirement does not apply and the minimum write pulse is the specified tWP.
3. During this period, I/O pins are in the output state, and input signals must not be applied.
4. If the CS LOW transition occurs simultaneously with or after the WE LOW transition, the outputs remain in a high impedance state. CS must be active during the tCW write
period.
5. Transition is measured ±200mV from steady state.
6.42
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IDT71V124, 3.3V CMOS Static RAM
1 Meg (128K x 8-Bit), Revolutionary Pinout
Commercial and Industrial Temperature Ranges
Ordering Information
IDT 71V124
Device
Type
S
XX
X
X
Power
Speed
Package
Process/
Temperature
Range
Blank
I
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
Y
400-mil SOJ (SO32-3)
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15
20
Speed in nanoseconds
3484 drw 09
O
O R
O
F
6.42
7
IDT71V124, 3.3V CMOS Static RAM
1 Meg (128K x 8-Bit), Revolutionary Pinout
Commercial and Industrial Temperature Ranges
Datasheet Document History
11/1/99
Updated to new format
Expressed commercial and industrial temperature ranges on DC Electrical table
Added Recommended Operating Temperature and Supply Voltage table
Expressed commercial and industrial ranges on AC Electrical table
Revised footnotes and notes on AC Electrical table
Revised footnotes on Write Cycle No. 1 diagram
Added datasheet document history
Part in obsolescence; order part 71V124SA. See PDN# S-0004
Pg. 2
Pg. 2
Pg. 4
Pg. 4
Pg. 6
Pg. 8
08/30/00
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8
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