DS2875AB 04

®
RT2875A/B
3A, 36V, Synchronous Step-Down Converter
General Description
Features
The RT2875A/B is a high efficiency, current-mode
synchronous DC/DC step-down converter that can deliver
up to 3A output current over a wide input voltage range
from 4.5V to 36V. The device integrates 95mΩ high-side
and 70mΩ low-side MOSFETs to achieve high conversion
efficiency. The current-mode control architecture
supports fast transient response and simple external
compensation. A cycle-by-cycle current limit function
provides protection

3A Output Current

Internal N-MOSFETs
Current Mode Control
Adjustable Switching Frequency : 300kHz to 2.1MHz
Adjustable Current Limit : 1.5A to 6A
Synchronous to External Clock : 300kHz to 2.1MHz
Adjustable Output Voltage from 0.6V to 24V
High Efficiency Up to 95%
Stable with Low ESR Ceramic Output Capacitors
Cycle-by-Cycle Current Limit
Input Under-Voltage Lockout
Output Under-Voltage Protection
Thermal Shutdown
AEC-Q100 Grade 2 Certification
RoHS Compliant and Halogen Free








against shorted output and an external soft-start eliminates
input current surge during start-up. The RT2875A/B
provides complete protection functions such as input
under-voltage lockout, output under-voltage protection,
over-current protection and thermal shutdown.





The RT2875A/B is available in the thermal enhanced
TSSOP-14 (Exposed Pad) package.
Applications

Pin Configurations

(TOP VIEW)
SW
SW
PGND
RT/SYNC
AGND
RLIM
FB

BOOT
VIN
VIN
PGOOD
EN
SS
COMP
14
2
13
3
4
12
PGND
5
11
10
6
15
7
9
8

Point of Load Regulator in Distributed Power Systems
Digital Set Top Boxes
Broadband Communications
Vehicle Electronics
TSSOP-14 (Exposed Pad)
Simplified Application Circuit
VIN
VIN
CIN
BOOT
CBOOT L
RT2875A/B
VOUT
SW
Enable
PGOOD
EN
PGOOD
RLIM
RT/SYNC
RLIM
ROSC
R1
COUT
FB
RCOMP CCOMP
COMP
R2
SS
CSS
AGND
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DS2875A/B-04 August 2015
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RT2875A/B
Ordering Information
Marking Information
RT2875A/B
RT2875AQGCP
Package Type
CP: TSSOP-14 (Exposed Pad)
Lead Plating System
G : Green (Halogen Free and Pb Free)
AQ : Latched UVP
BQ : Hiccup Mode UVP
Note :
RT2875AQGCP : Product Number
RT2875AQ
GCPYMDNN
YMDNN : Date Code
RT2875BQGCP
RT2875BQGCP : Product Number
RT2875BQ
GCPYMDNN
YMDNN : Date Code
Richtek products are :

RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.

Suitable for use in SnPb or Pb-free soldering processes.
Functional Pin Description
Pin No.
1, 2
Pin Name
SW
3,
PGND
15 (Exposed Pad)
Pin Function
Switch Node. Connect to external L-C filter.
Power Ground. The exposed pad must be soldered to a large PCB and
connected to PGND for maximum power dissipation.
4
RT/SYNC
Oscillator Resistor and External Frequency Synchronization Input. Must connect
a resistor from this pin to GND to set the switching frequency. If SYNC clock is
requested, connect an external clock to change the switching frequency.
5
AGND
Analog Ground.
6
RLIM
Current Limit Setting. Connect a resistor from this pin to GND to set the current
limit value.
7
FB
Feedback Voltage Input. The pin is used to set the output voltage of the
converter to regulate to the desired via a resistive divider. Feedback reference =
0.6V.
8
COMP
Compensation Node. COMP is used to compensate the regulation control loop.
Connect a series RC network from COMP to GND. In some cases, an additional
capacitor from COMP to GND is required.
9
SS
Soft-Start Time Setting. Connect a capacitor from SS to GND to set the
soft-start period.
10
EN
Enable Control Input. High = Enable.
11
PGOOD
Power Good Indicator Output.
VIN
Power Input. Support 4.5V to 36V input voltage. Must bypass with a suitable
large ceramic capacitor at this pin.
BOOT
Bootstrap Supply for High-Side Gate Driver. Connect a 0.1F ceramic capacitor
between the BOOT and SW pins.
12, 13
14
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DS2875A/B-04 August 2015
RT2875A/B
Function Block Diagram
PGOOD
6k
-
EN
VIN
Internal
Regulator
UVLO
+
Shutdown
Comparator
1.5V
3.8V
Current
Sense
BOOT
UVLO
+
0.55V
PGOOD
Logic &
Comparator Protection
Control
0.3V
+
BOOT
Power
Stage &
Deadtime
Control
UV
Comparator
FB
0.6V
HS Switch
Current
Comparator
+EA
+
AGND
6µA
SS
Oscillator
SW
LS Switch
Current
Comparator
Current
Sense
PGND
Slop
Compensation
COMP RT/SYNC
RLIM
Operation
The RT2875A/B is current-mode synchronous step-down
converter. In normal operation, the high-side N-MOSFET
is turned on when the S-R latch is set by the oscillator
and is turned off when the current comparator resets the
S-R latch. While the high-side N-MOSFET is turned off,
the low-side N-MOSFET is turned on to conduct the
inductor current until next cycle begins.
Error Amplifier
The error amplifier adjusts its output voltage by comparing
the feedback signal (VFB) with the internal 0.6V reference.
When the load current increases, it causes a drop in the
feedback voltage relative to the reference, and then the
error amplifier's output voltage rises to allow higher inductor
current to match the load current.
Internal Regulator
The regulator provides low voltage power to supply the
internal control circuits and the bootstrap power for highside gate driver.
Enable
The converter is turned on when the EN pin is higher than
1.6V. When the EN pin is lower than 0.4V, the converter
will enter shutdown mode and reduce the supply current
lower than 10μA.
Soft-Start (SS)
In order to prevent the converter output voltage from
overshooting during the startup period, the soft-start
function is necessary. The soft-start time is adjustable
by an external capacitor.
Switching Frequency
The switching frequency can be set by using extra resister
RT or external clock. Switching frequency range is from
300kHz to 2.1MHz.
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RT2875A/B
UV Comparator
If the feedback voltage is lower than 0.3V, the UV
Comparator will go high to turn off the high-side MOSFET.
The output under voltage protection is designed to operate
in Hiccup mode. When the UV condition is removed, the
converter will resume switching.
Current Setting
The current limit of high side MOSFET is adjustable by
an external resistor connected to the RLIM pin. The current
limit range is from 1.5A to 6A.
Thermal Shutdown
The over-temperature protection function will shut down
the switching operation when the junction temperature
exceeds 180°C. Once the junction temperature cools
down by approximately 15°C, the converter will
automatically resume switching.
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DS2875A/B-04 August 2015
RT2875A/B
Absolute Maximum Ratings











(Note 1)
Supply Voltage, VIN -----------------------------------------------------------------------------------------------Switch Voltage, SW -----------------------------------------------------------------------------------------------BOOT to SW --------------------------------------------------------------------------------------------------------Power Good Voltage, PGOOD -----------------------------------------------------------------------------------Other Pins ------------------------------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C
TSSOP-14 (Exposed Pad) ---------------------------------------------------------------------------------------Package Thermal Resistance (Note 2)
TSSOP-14 (Exposed Pad), θJA ---------------------------------------------------------------------------------TSSOP-14 (Exposed Pad), θJC ---------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------Junction Temperature ----------------------------------------------------------------------------------------------Storage Temperature Range -------------------------------------------------------------------------------------ESD Susceptibility (Note 3)
HBM (Human Body Model) ----------------------------------------------------------------------------------------
Recommended Operating Conditions



−0.3V to 40V
−0.3V to (VIN + 0.3V)
−0.3V to 6V
−0.3V to 40V
−0.3V to 6V
4.464W
28°C/W
4.3°C/W
260°C
150°C
−65°C to 150°C
2kV
(Note 4)
Supply Input Voltage, VIN ----------------------------------------------------------------------------------------- 4.5V to 36V
Junction Temperature Range -------------------------------------------------------------------------------------- −40°C to 150°C
Ambient Temperature Range -------------------------------------------------------------------------------------- −40°C to 105°C
Electrical Characteristics
(VIN = 12V, TA = −40°C to 105°C, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Shutdown Supply Current
VEN = 0V
--
‐‐ 10
A Switching quiescent current with
no load at DCDC output
VEN = 2V, VFB = 0.64V,
RLIM = 91k, ROSC = 169k
--
--
1.3
mA
0.588
0.6
0.612
V
--
950
--
A/V
Feedback Voltage
VFB
Error Amplifier Trans-conductance G EA
4.5V  VIN  36V
IC = ±10A
High-Side
R DS(ON)1
--
95
--
Low-Side
High-Side Switch Leakage
Current
Current Limit Setting Rage
R DS(ON)2
--
70
--
--
1
--
A
(Note 5)
1.5
--
6
A
High-Side Switch Current Limit 1
H OC1
RLIM = 100k
1.79
2.1
2.41
A
High-Side Switch Current Limit 2
H OC2
RLIM = 47k
3.52
4
4.48
A
High-Side Switch Current Limit 3
H OC3
RLIM = 33k
4.84
5.5
6.16
A
--
2
--
A
--
5.2
--
A/V
300
--
2100
kHz
Switch OnResistance
VEN = 0V, VSW = 0V
Low-Side Switch Current Limit
COMP to Current Sense
Transconductance
Switching Frequency Range
From Drain to Source
G CS
Include Sync mode and RT mode
set point
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RT2875A/B
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Switching Frequency1
fOSC1
Rt = 169k
275
305
335
kHz
Switching Frequency2
fOSC2
Rt = 51k
0.83
0.98
1.13
MHz
Switching Frequency3
fOSC3
Rt = 23k
1.89
2.1
2.31
MHz
--
31.25
--
kHz
--
20
--
ns
High-Level
--
--
2
Low- Level
0.8
--
--
tON
--
100
--
VIH
1.4
1.5
1.6
EN hysteresis voltage
--
0.2
--
VUVLO
VIN Rising
--
4.1
--
V
VUVLO
Hysteresis
--
300
--
mV
Rising
--
90
--
Falling
--
85
--
Power Good Output High
Leakage Current
VFB = VREF, VPGOOD = 5.5V
--
30
--
nA
Power Good Output Low
IPGOOD = 0.4mA
--
--
0.3
V
--
6
--
A
--
80
--

160
180
200
C
--
15
--
C
Short Circuit Oscillation
Frequency
VFB = 0V, ROSC = 100k,
VIN = 12V
Minimum SYNC Pulse width
SYNC Input Voltage
Minimum On-Time
EN Input Voltage
Logic-High
Hysteresis
Input Under-Voltage Lockout
Threshold
Power Good Threshold
Soft-Start Charge Current
ISS
SW Discharge Resistance
Thermal Shutdown
TSD
Thermal Shutdown Hysteresis
TSD
V
ns
V
%
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25 °C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Guarantee by design.
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RT2875A/B
Typical Application Circuit
12, 13
BOOT
VIN
CIN
RT2875A/B
10µF x 2
SW
10
EN
11
PGOOD
FB
6
RLIM
4
RT/SYNC COMP
VIN
Enable
PGOOD
RLIM
ROSC
SS
14
1, 2
CBOOT L
VOUT
R1
COUT
22µF x 2
7
8
RCOMP
CCOMP
R2
9
CSS
AGND
5
PGND
3, 15 (Exposed Pad)
For 500kHz Only
VOUT
R1 (k)
R2 (k)
ROSC (k)
RCOMP (k)
CCOMP (nF)
L (H)
12
102
5.36
100
32
3.9
10
8
102
8.25
100
20
3.3
8.2
5
110
15
100
15
3.3
6.8
3.3
115
25.5
100
10
3.3
4.7
2.5
25.5
8.06
100
7.5
3.3
3.6
1.2
10
10
100
4.3
3.9
2.2
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS2875A/B-04 August 2015
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RT2875A/B
Typical Operating Characteristics
Efficiency vs. Load Current
Output Voltage vs. Load Current
100
3.37
90
3.36
Output Voltage (V)
Efficiency (%)
80
VIN = 5V
VIN = 12V
VIN = 23V
VIN = 30V
VIN = 36V
70
60
50
40
30
3.35
3.34
VIN = 12V
VIN = 5V
VIN = 24V
VIN = 30V
VIN = 36V
3.33
3.32
20
3.31
10
VOUT = 3.3V
VOUT = 3.3V
0
3.30
0
0.5
1
1.5
2
2.5
3
0
0.5
1
Load Current (A)
Referecnec Voltage vs. Input Voltage
2.5
3
Reference Voltage vs. Temperature
0.65
0.64
Reference Voltage (V)
0.608
Referecnec Voltage (V)
2
Load Current (A)
0.610
0.605
0.603
0.600
0.598
0.595
0.593
0.63
0.62
0.61
0.60
0.59
0.58
0.57
0.56
VIN = 4.5V to 36V, VOUT = 3.3V, IOUT = 0A
0.590
VIN = 12V, VOUT = 1.2V, IOUT = 0A
0.55
2
9.6
17.2
24.8
32.4
-50
40
-25
0
Switching Frequency vs. RT
50
75
100
125
Switching Frequency vs. Input Voltage
600
1800
590
Switching Frequency (kHz)1
2000
1600
1400
1200
1000
800
600
400
200
25
Temperature (°C)
Input Voltage (V)
Switching Frequency (kHz)1
1.5
VIN = 12V, VOUT = 3.3V, IOUT = 0A
0
580
570
560
550
540
530
520
510
VIN = 12V, VOUT = 3.3V, IOUT = 0A, RT = 100kΩ
500
20
40
60
80
100
120
140
160
180
RT(k Ω)
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8
200
4
8
12
16
20
24
28
32
36
Input Voltage (V)
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RT2875A/B
Current Limit vs. RLIM
Switching Frequency vs. Temperature
7
580
6
560
VIN = 4.5V
VIN = 12V
VIN = 24V
VIN = 36V
540
520
Current Limit (A)
Switching Frequency (kHz)1
600
500
480
460
5
4
3
2
440
1
420
VOUT = 3.3V, IOUT = 0A
0
400
-50
-25
0
25
50
75
100
20
125
30
40
50
60
70
80
90
100
RLIM (kΩ)
Ambient Temperature (°C)
Current Limit vs. Temperature
Enable Voltage vs. Temperature
8
2.0
1.8
6
5
4
1.4
1.2
Enable_Falling
1.0
0.8
0.6
0.4
3
VIN = 12V, VOUT = 3.3V, RLIM = 39kΩ
2
0.2
VIN = 12V, VOUT = 3.3V
0.0
-50
Input Voltage (V)
Enable_Rising
1.6
Enable Voltage (V)
Current limit (A)
7
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
Temperature (°C)
Temperature (°C)
UVLO vs. Temperature
Load Transient Response
4.7
4.6
4.5
4.4
4.3
4.2
4.1
4.0
3.9
3.8
3.7
3.6
3.5
3.4
3.3
3.2
3.1
3.0
125
VOUT
(200mV/Div)
Turn On
Turn Off
VIN = 12V, VOUT = 3.3V
-50
-25
0
25
50
75
100
125
IOUT
(2A/Div)
VIN = 12V, VOUT = 3.3V, IOUT = 0A to 3A
Time (250μs/Div)
Temperature (°C)
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RT2875A/B
Load Transient Response
Switching
VOUT
(5mV/Div)
VOUT
(200mV/Div)
VSW
(10V/Div)
IOUT
(2A/Div)
VIN = 12V, VOUT = 1.2V, IOUT = 0A to 2.5A
IOUT
(1A/Div)
Time (250μs/Div)
Time (1μs/Div)
Switching
Power On from EN
VOUT
(5mV/Div)
VEN
(2V/Div)
VSW
(10V/Div)
VOUT
(2V/Div)
IOUT
(2A/Div)
IOUT
(2A/Div)
VIN = 12V, VOUT = 3.3V, IOUT = 3A
Time (5ms/Div)
Power Off from EN
Power On from VIN
VIN
(5V/Div)
VOUT
(2V/Div)
VOUT
(2V/Div)
VIN = 12V, VOUT = 3.3V, IOUT = 3A
Time (50μs/Div)
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VIN = 12V, VOUT = 3.3V, IOUT = 3A
Time (1μs/Div)
VEN
(2V/Div)
IOUT
(2A/Div)
VIN = 12V, VOUT = 3.3V, IOUT = 1.5A
IOUT
(2A/Div)
VIN = 12V, VOUT = 3.3V, IOUT = 3A
Time (10ms/Div)
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RT2875A/B
Power Off from VIN
VIN
(5V/Div)
VOUT
(2V/Div)
IOUT
(2A/Div)
VIN = 12V, VOUT = 3.3V, sIOUT =
Time (5ms/Div)
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RT2875A/B
Application Information
Output Voltage Setting
Chip Enable Operation
The resistive divider allows the FB pin to sense the output
voltage as shown in Figure 1.
The EN pin is the chip enable input. Pulling the EN pin
low (<0.4V) will shutdown the device. During shutdown
mode, the RT2875A/B quiescent current drops to lower
than 10μA. Driving the EN pin high (>1.6V) will turn on the
device again. For external timing control, the EN pin can
also be externally pulled high by adding a REN resistor
and CEN capacitor from the VIN pin (see Figure 3).
VOUT
R1
FB
RT2875A/B
R2
GND
EN
Figure 1. Output Voltage Setting
VIN
REN
EN
RT2875A/B
CEN
The output voltage is set by an external resistive voltage
divider according to the following equation :
VOUT = VREF  1 R1 
 R2 
Where VREF is the reference voltage (0.6V typ.).
External Bootstrap Diode
Connect a 0.1μF low ESR ceramic capacitor between the
BOOT and SW pins. This capacitor provides the gate driver
voltage for the high side MOSFET.
It is recommended to add an external bootstrap diode
between an external 5V and BOOT pin for efficiency
improvement when input voltage is lower than 5.5V or duty
ratio is higher than 65% .The bootstrap diode can be a
low cost one such as IN4148 or BAT54. The external 5V
can be a 5V fixed input from system or a 5V output of the
RT2875A/B. Note that the external boot voltage must be
lower than 5.5V
BOOT
100nF
SW
Figure 2. External Bootstrap Diode
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Figure 3. Enable Timing Control
An external MOSFET can be added to implement digital
control on the EN pin when no system voltage above 2.5V
is available, as shown in Figure 4. In this case, a 100kΩ
pull-up resistor, REN, is connected between VIN and the
EN pin. MOSFET Q1 will be under logic control to pull
down the EN pin.
VIN
EN
REN
100k
EN
Q1
RT2875A/B
GND
Figure 4. Digital Enable Control Circuit
Under Voltage Protection
Hiccup Mode
5V
RT2875A/B
GND
The RT2875B provides Hiccup Mode Under Voltage
Protection (UVP). When the VFB voltage drops below
0.3V, the UVP function will be triggered to shut down
switching operation. If the UVP condition remains for a
period, the RT2875B will retry automatically. When the
UVP condition is removed, the converter will resume
operation. The UVP is disabled during soft-start period.
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DS2875A/B-04 August 2015
RT2875A/B
Latch Mode
For the RT2875A it provides Latch-Off Mode Under
Voltage Protection (UVP). When the VFB voltage drops
below 0.3V, UVP will be triggered and the RT2875A will
shut down in Latch-Off Mode. In shutdown condition, the
RT2875A can be reset by EN pin or power input VIN.
For the ripple current selection, the value of ΔIL = 0.24(IMAX)
will be a reasonable starting point. The largest ripple
current occurs at the highest VIN. To guarantee that the
ripple current stays below the specified maximum, the
inductor value should be chosen according to the following
equation :
 VOUT  
VOUT 
L =
 1 


f
I
V


L(MAX)  
IN(MAX) 

Hiccup Mode
The inductor's current rating (caused a 40°C temperature
rising from 25°C ambient) should be greater than the
maximum load current and its saturation current should
be greater than the short circuit peak current limit. Please
see Table 2 for the inductor selection reference.
VOUT
(2V/Div)
Table 2. Suggested Inductors for Typical
Application Circuit
ILX
(2A/Div)
IOUT = Short
Time (50ms/Div)
Figure 5. Hiccup Mode Under Voltage Protection
Component
Supplier
Series
Dimensions
(mm)
TDK
VLF10045
10 x 9.7 x 4.5
TDK
TAIYO
YUDEN
SLF12565
12.5 x 12.5 x 6.5
NR8040
8x8x4
Over Temperature Protection
The RT2875A/B features an Over Temperature Protection
(OTP) circuitry to prevent from overheating due to
excessive power dissipation. The OTP will shut down
switching operation when junction temperature exceeds
180°C. Once the junction temperature cools down by
approximately 15°C, the converter will resume operation.
To maintain continuous operation, the maximum junction
temperature should be lower than 150°C.
Inductor Selection
The inductor value and operating frequency determine
the ripple current according to a specific input and output
voltage. The ripple current ΔIL increases with higher VIN
and decreases with higher inductance.
V
V
IL =  OUT   1 OUT 
f

L
VIN 

 
Having a lower ripple current reduces not only the ESR
losses in the output capacitors but also the output voltage
ripple. High frequency with small ripple current can achieve
the highest efficiency operation. However, it requires a
large inductor to achieve this goal.
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS2875A/B-04 August 2015
CIN and COUT Selection
The input capacitance, C IN, is needed to filter the
trapezoidal current at the Source of the high side MOSFET.
To prevent large ripple current, a low ESR input capacitor
sized for the maximum RMS current should be used. The
approximate RMS current equation is given :
V
IRMS = IOUT(MAX) OUT
VIN
VIN
1
VOUT
This formula has a maximum at VIN = 2VOUT, where
IRMS = IOUT / 2. This simple worst case condition is
commonly used for design because even significant
deviations do not offer much relief.
Choose a capacitor rated at a higher temperature than
required. Several capacitors may also be paralleled to
meet size or height requirements in the design.
For the input capacitor, two 10μF low ESR ceramic
capacitors are suggested. For the suggested capacitor,
please refer to Table 3 for more details.
The selection of COUT is determined by the required ESR
to minimize voltage ripple.
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RT2875A/B
Moreover, the amount of bulk capacitance is also a key
for COUT selection to ensure that the control loop is stable.
Loop stability can be checked by viewing the load transient
response as described in a later section.
The output ripple, ΔVOUT , is determined by :
1

VOUT  IL ESR 
8fC
OUT 

The output ripple will be the highest at the maximum input
voltage since ΔIL increases with input voltage. Multiple
capacitors placed in parallel may be needed to meet the
ESR and RMS current handling requirement. Higher values,
lower cost ceramic capacitors are now becoming available
in smaller case sizes. Their high ripple current, high voltage
rating and low ESR make them ideal for switching regulator
applications. However, care must be taken when these
capacitors are used at input and output. When a ceramic
capacitor is used at the input and the power is supplied
by a wall adapter through long wires, a load step at the
output can induce ringing at the input, VIN. At best, this
ringing can couple to the output and be mistaken as loop
instability. At worst, a sudden inrush of current through
the long wires can potentially cause a voltage spike at
VIN large enough to damage the part.
Switching Frequency Setting
The switching frequency can be set by using extra resister
RT or external clock. Switching frequency range is from
300kHz to 2.1MHz. Through extra resister RT connect to
RT/SYNC pin to setting the switching frequency FS, below
offer approximate formula equation :
Current Setting
The current limit of high side MOSFET is adjustable by
an external resistor connected to the RLIM pin. The current
limit range is from 1.5A to 6A. When the inductor current
reaches the current limit threshold, the COMP voltage
will be clamped to limit the inductor current. Inductor
current ripple current also should be considered into
current limit setting. Current limit minimum value should
be set as below :
Current limit minimum = (IO(max) + 1 / 2 inductor current
ripple) x 1.2
Through extra resister RLIM connect to RLIM pin to setting
the current limit value below offer approximate formula
equation :
ISET = current limit value (A)
y = (ISET − 0.4206) / 167.79
RLIM (kΩ) = (1 / y)
Soft-Start
The RT2875A/B provides soft-start function. The soft-start
function is used to prevent large inrush current while
converter is being powered-up. The soft-start timing can
be programmed by the external capacitor CSS between
SS and GND. An internal current source ISS (6μA) charges
an external capacitor to build a soft-start ramp voltage.
The VFB voltage will track the internal ramp voltage during
softstart interval. The typical soft start time is calculated
as follows :
Soft-Start time tSS = CSS x 0.6 / 6μA
Setting Frequency = FS (kHz)
x = [FS − 31.379] / 47691
ROSC (kΩ) = (1 / x)
The RT2875A/B can be synchronized with an external clock
ranging from 300kHz to 2.1MHz applied to the RT/SYNC
pin. The external clock duty cycle must be from 10% to
90%. The RT/SYNC pin is at logic-high level (>2V). If the
EN pin is pulled to low-level for 10μs above, the IC will
shut down.
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14
is a registered trademark of Richtek Technology Corporation.
DS2875A/B-04 August 2015
RT2875A/B
Thermal Considerations
PD(MAX) = (TJ(MAX) − TA) / θJA
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and θJA is the junction to ambient
thermal resistance.
For recommended operating condition specifications, the
maximum junction temperature is 150°C. The junction to
ambient thermal resistance, θJA, is layout dependent. For
TSSOP-14 (Exposed Pad) package, the thermal
resistance, θJA, is 28°C/W on a standard JEDEC 51-7
Maximum Power Dissipation (W)1
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
5.0
Four-Layer PCB
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
25
50
75
100
125
150
Ambient Temperature (°C)
Figure 6. Derating Curve of Maximum Power Dissipation
four-layer thermal test board. The maximum power
dissipation at TA = 25°C can be calculated by the following
formula :
PD(MAX) = (150°C − 25°C) / (28°C/W) = 4.464W for
TSSOP-14 (Exposed Pad) package
The maximum power dissipation depends on the operating
ambient temperature for fixed T J(MAX) and thermal
resistance, θJA. The derating curve in Figure 6 allows the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS2875A/B-04 August 2015
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
15
RT2875A/B
Outline Dimension
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
1.000
1.200
0.039
0.047
A1
0.000
0.150
0.000
0.006
A2
0.800
1.050
0.031
0.041
b
0.190
0.300
0.007
0.012
D
4.900
5.100
0.193
0.201
e
0.650
0.026
E
6.300
6.500
0.248
0.256
E1
4.300
4.500
0.169
0.177
L
0.450
0.750
0.018
0.030
U
1.900
2.900
0.075
0.114
V
1.600
2.600
0.063
0.102
14-Lead TSSOP (Exposed Pad) Plastic Package
Richtek Technology Corporation
14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
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DS2875A/B-04 August 2015