DS6208 02

RT6208
High Efficiency, 36V 100mA Synchronous Step-Down Converter
General Description
Features
The RT6208 is a high-efficiency, monolithic synchronous

step-down DC/DC converter that can deliver up to
Achieves Very High Efficiency in Low Load
Conditions
100mA output current from a 4.75V to 36V input supply.

1% High Accuracy Feedback Voltage
It requires only 25A typical supply current at no load

4.75V to 36V Input Voltage Range
while maintaining output voltage regulation. The RT6208

100mA Output Current
achieves Boundary Conduction Mode (BCM) operation,

Integrated High-Side and Low-Side Switches
low quiescent current and programmable high-side peak

No Compensation Required
current limit, providing high efficiency over a wide range

Low Quiescent Current
of load currents. It also provides soft-start protection to

Adjustable Peak Current Limit
eliminate input current surge during start-up. The low

Cycle-by-Cycle Over Current Protection
current
output

Input Under Voltage Lockout
disconnect, enabling easy power management in

Internal Soft-Start
battery-powered systems. The RT6208 is available in a

Thermal Shutdown Protection
(3A)
shutdown
mode
provides
SOT-23-6 and SOT-23-8 packages.
Ordering Information
RT6208
Package Type
E : SOT-23-6
V8 : SOT-23-8
Lead Plating System
G : Green (Halogen Free and Pb Free)
Note :
Richtek products are :
 RoHS compliant and compatible with the current
requirements of IPC/JEDEC J-STD-020.
 Suitable for use in SnPb or Pb-free soldering processes
Applications

Wireless Charger

Industrial and Commercial Low Power Systems

Green Electronics/Appliances

Point of Load Regulation for High-Performance DSPs

MCU Supply in Wireless LED Lighting
Marking Information
RT6208GE
30=DNN
30= : Product Code
DNN : Date Code
RT6208GV8
0E=DNN
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DS6208-02
May 2016
0E= : Product Code
DNN : Date Code
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RT6208
Pin Configurations
AGND
3
8
7
6
5
2
3
4
SW
2
PGOOD
4
VIN
5
FB
6
GND
SW VIN ISET
EN
(TOP VIEW)
ISET
FB GND EN
SOT-23-6
SOT-23-8
Functional Pin Description
Pin No
Pin Name
Pin Function
SOT-23-6
SOT-23-8
1
7
FB
Feedback Voltage Input. This pin receives the feedback voltage from
a resistive divider connected across the output.
2
2
GND
Power Ground.
EN
Enable Control Input. A voltage on this pin above 1.25V enables the
converter into normal mode; forcing this pin below 0.3V shuts down
the IC, reducing quiescent current to 3A.
An internal 2A current pulls up enable pin for automatic startup.
3
8
4
1
ISET
High-Side Peak Current Set Pin. A resistor from this pin to GND sets
the high-side peak current limit. Leave floating for the maximum
peak current, 225mA. Short this pin to GND for the minimum peak
current, 50mA. A 1A current is sourced out of this pin.
5
3
VIN
Input Supply Voltage. Must bypass with a suitably large ceramic
capacitor.
6
4
SW
Switch Node. Connect The Switching Node To External Inductor.
--
6
PGOOD
Power Good Open Drain Output. Asserts low if output voltage is low
due to OTP, UVP, UVLO, EN shutdown or during soft-start.
--
5
AGND
Analog Ground.
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RT6208
Function Block Diagram
VIN
VCC
ISET
2V
UVLO
1μA
HS Switch
Current
Comparator
2μA
-
EN
5k
6V
FB
1.21 +
Shutdown
Comparator
1ms Ramp
SW
FB
Comparator
LS Switch
Current
Comparator
AGND
PGOOD
Current
Sense
Logic &
Deadtime
Control
+
+
0.8V
Internal
Regulator
PGOOD
Generator
Current
Sense
GND
Operation
The RT6208 is a step-down DC/DC converter with
comparators are disabled, reducing the VIN pin supply
internal power switches that uses Hysteresis Mode
current to only 25A. As the load current discharges
control, combining low quiescent current, which results
the output capacitor, the voltage on the VFB pin
in high efficiency across a wide range of load currents.
decreases. When this voltage falls 5mV below the
Hysteresis
using
800mV reference, the feedback comparator trips and
Boundary Conduction Mode (BCM) to ramp the
enables BCM. At the beginning of the BCM, the internal
inductor current through the internal power switches,
high-side power switch (P-channel MOSFET) is turned
followed by a sleep cycle where the power switches are
on and the inductor current begins to ramp up. The
off and the load current is supplied by the output
inductor current increases until either the current
capacitor. During the sleep cycle, the RT6208 draws
exceeds the peak current comparator threshold, or the
only 25A of supply current. At light loads, the BCM
ON time of the high-side MOSFET exceeds 5μs during
cycles are a small percentage of the total cycle time
the time VFB is higher than 800mV, at which the
which minimizes the average supply current, greatly
high-side power switch is turned off, and the Low-side
improving efficiency.
power switch is turned on. The inductor current ramps
Mode
operation
functions
by
Scheme of Hysteresis Mode
The feedback comparator monitors the voltage on the
VFB pin and compares it to an internal 800mV
reference, as shown in Figure 1. If this voltage is
greater than the reference, the comparator activates a
sleep mode in which the power switches and current
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DS6208-02
May 2016
down until the reverse current is close to zero. If the
voltage on the VFB pin is still less than the 800mV
reference, the high-side power switch is turned on
again and another cycle commences which keep the
inductor current operated in a boundary conduction
mode. The average current during the BCM will
normally be greater than the average load current. For
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RT6208
this architecture, the maximum average output current
to ground, the inductor current will decay very slowly
is equal to half of the peak current. The hysteresis
during a single switching cycle. Since the high-side
nature of this control architecture results in a switching
switch turns on only when the inductor current is near
frequency that is a function of the input voltage, output
zero, the RT6208 inherently switches at a lower
voltage and inductor value. This behavior provides
frequency during short-circuit condition.
inherent short‑circuit protection. If the output is shorted
VREF
VFB
VREF - VHys
High-Side Peak Current (PC)
Inductor Current
Low-Side Zero Current (ZC)
Sleep
Mode
Stop Switch
Boundary Conduction
Mode
Sleep
Mode
Switch between High-Side PC and
Low-Side ZC
Figure 1. Hysteresis Mode
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DS6208-02
May 2016
RT6208
Absolute Maximum Ratings
(Note 1)

Supply Voltage, VIN --------------------------------------------------------------------------------------------------- 0.3V to 40V

Switch Voltage, SW ---------------------------------------------------------------------------------------------------- 0.3V to (VIN + 0.3V)
<10ns ----------------------------------------------------------------------------------------------------------------------- 5V to 46.3V

All Other Pins ------------------------------------------------------------------------------------------------------------ 0.3V to 6V

Power Dissipation, PD @ TA = 25C
SOT-23-6 ------------------------------------------------------------------------------------------------------------------ 0.48W
SOT-23-8 ------------------------------------------------------------------------------------------------------------------ 0.53W

Package Thermal Resistance
(Note 2)
SOT-23-6, JA ----------------------------------------------------------------------------------------------------------- 208.2C/W
SOT-23-6, JC ----------------------------------------------------------------------------------------------------------- 32C/W
SOT-23-8, JA ----------------------------------------------------------------------------------------------------------- 186.2C/W
SOT-23-8, JC ----------------------------------------------------------------------------------------------------------- 47.4C/W

Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------- 260C

Junction Temperature ------------------------------------------------------------------------------------------------- 150C

Storage Temperature Range --------------------------------------------------------------------------------------- 65C to 150C

ESD Susceptibility
(Note 3)
HBM (Human Body Model) ----------------------------------------------------------------------------------------- 2kV
MM (Machine Model) ------------------------------------------------------------------------------------------------- 200V
Recommended Operating Conditions
(Note 4)

Input Voltage Range -------------------------------------------------------------------------------------------------- 4.75V to 36V

Ambient Temperature Range -------------------------------------------------------------------------------------- 40C to 85C

Junction Temperature Range -------------------------------------------------------------------------------------- 40C to 125C
Electrical Characteristics
(VIN = 12V, TA = 25C, unless otherwise specified)
Parameter
Supply Current
Symbol
Min
Typ
Max
Unit
Active Mode
--
160
190
A
Sleep Mode
--
25
40
A
VEN = 0V
--
3
6
A
VFB Rising
0.792
0.8
0.808
V
3
5
7
mV
100
0
100
nA
Shutdown Mode
Test Conditions
Feedback Comparator Trip Voltage
VFB
Feedback Comparator Hysteresis
VFBHYS
Feedback Pin Current
IFB
High-Side Switch On-Resistance
RDS(ON)_H
--
3
--

Low-Side Switch On-Resistance
RDS(ON)_L
--
1.5
--

1
1.2
1.4
V
--
100
--
mV
3.9
4.2
4.75
V
Enable Threshold Voltage
Enable Rising
Enable Hysteresis
Input Under Voltage Lockout Threshold VUVLO
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VIN Rising
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RT6208
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Input Under Voltage Lockout
Hysteresis
ΔVUVLO
--
300
--
mV
Soft-Start Period
tSS
--
1
--
ms
200
225
250
500k from ISET to GND
--
135
--
ISET short to GND
--
50
--
Peak Current Comparator Propagation
Delay Time
ISET floating
I/t = 250mA/s
--
100
--
ns
Power Good Threshold - Rising
VFB Rising
--
87.5
--
%
Power Good Threshold - Falling
VFB Falling
--
82.5
--
%
--
150
--
C
ISET Floating
High-Side Peak Current Limit
Thermal Shutdown
TSD
mA
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect
device reliability.
Note 2. JA is measured at TA = 25C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. JC is
measured at the lead of the package.
Note 3. Devices are ESD sensitive. Handling precaution recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
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May 2016
RT6208
Typical Application Circuit
L
RT6208
VIN
4.75V to 36V
SW
VIN
CIN
VOUT
R1
*CFF
COUT
FB
EN
(Open = automatic start)
R2
ISET
PGOOD
GND
AGND
*See Application Information for detail.
(Recommended Component Selections for a 100mA Loading application of Popular output Voltage)
VOUT (V)
CIN (F)
COUT (F)
L (H)
R2 (k)
R1 (k)
CFF (pF)
ISET
1.8
2.2
10
150
24
30
68
Floating
3.3
2.2
10
150
24
75
120
Floating
5
2.2
10
150
24
126
150
Floating
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RT6208
Typical Operating Characteristics
Efficiency vs. Load Current
90
80
80
70
Efficiency (%)
Efficiency (%)
Efficiency vs. Load Current
90
VIN = 12V
VIN = 24V
60
VIN = 36V
50
VIN = 12V
70
VIN = 24V
VIN = 36V
60
50
VOUT = 3.3V
VOUT = 1.8V
40
40
0.1
1
10
100
0.1
1
Load Current (mA)
Efficiency vs. Load Current
90
157
Ground Current (μA)
160
Efficiency (%)
85
80
VIN = 12V
75
VIN = 24V
VIN = 36V
65
60
154
151
148
145
142
139
136
133
VOUT = 5V
55
BCM
130
0.1
1
10
100
4
8
12
Load Current (mA)
190
27
180
24
Ground Current (μA)
30
170
160
VIN = 36V
VIN = 24V
140
130
120
110
20
24
28
32
36
Ground Current vs. Input Voltage
200
150
16
Input Voltage (V)
Ground Current vs. Temperature
Ground Current (μA)
100
Ground Current vs. Input Voltage
95
70
10
Load Current (mA)
Sleep Mode
21
18
15
12
9
6
Shutdown Mode
3
BCM
0
100
-50
-25
0
25
50
75
100
Temperature (°C)
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125
4
8
12
16
20
24
28
32
36
Input Voltage (V)
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RT6208
Ground Current vs. Temperature
UVLO vs. Temperature
50
4.6
VIN = 36V
40
High
4.4
Sleep Mode
35
UVLO (V)
Ground Current (μA)
45
30
25
20
4.2
4.0
Low
15
Shutdown Mode
10
3.8
5
0
3.6
-50
-25
0
25
50
75
100
125
-50
-25
0
Temperature (°C)
FB Voltage vs. Temperature
50
75
9
0.804
8
0.802
0.800
0.798
0.796
125
7
6
5
4
3
VIN = 24V, L = 100μH, C OUT = 10μF, Load = 30mA
VIN = 24V
2
0.794
-50
-25
0
25
50
75
100
-50
125
-25
HS Peak Current Limit vs. Input Voltage
25
50
75
100
125
HS Peak Current Limit vs. Temperature
250
250
HS Peak Current Limit (mA)
225
ISET = Floating
200
175
150
125
ISET = 500kΩ
100
75
50
ISET = GND
25
0
225
ISET = Floating
200
175
150
125
ISET = 500kΩ
100
75
50
ISET = GND
25
VIN = 24V
0
4
8
12
16
20
24
28
32
Input Voltage (V)
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Temperature (°C)
Temperature (°C)
HS Peak Current Limit (mA)
100
FB Voltage Hysteresis vs. Temperature
0.806
FB Voltage (mV)
FB Voltage (V)
25
Temperature (°C)
May 2016
36
-40
-10
20
50
80
110
140
Temperature (°C)
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RT6208
Switch On-Resistance vs. Temperature
5.0
4.5
4.5
Switch On-Resistance (Ω)
Switch On-Resistance (Ω)1
Switch On-Resistance vs. Input Voltage
5.0
4.0
3.5
3.0
High-Side
2.5
2.0
1.5
1.0
Low-Side
4.0
3.5
3.0
High-Side
2.5
2.0
1.5
Low-Side
1.0
0.5
0.5
0.0
0.0
4
8
12
16
20
24
28
32
-50
36
-25
Switch Leakage Current vs. Temperature
25
50
75
100
125
EN Threshold Voltage vs. Temperature
0.1
1.4
0.09
EN Threshold Voltage (V)
Switch Leakage Current (μA)1
0
Temperature (°C)
Input Voltage (V)
0.08
0.07
0.06
0.05
0.04
0.03
0.02
1.3
Rising
1.2
1.1
Falling
1.0
0.9
0.01
VIN = 24V
0
0.8
-50
-25
0
25
50
75
100
125
-40
-10
20
50
80
Temperature (°C)
Temperature (°C)
Switching
Soft-Start
110
140
VOUT_ac
(20mV/Div)
SW
(20V/Div)
Inductor
Current
(100mA/Div)
VOUT
(1V/Div)
VIN = 24V, VOUT = 5V, ILOAD = 100mA
Time (5s/Div)
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VIN = 24V, VOUT = 5V
Time (500s/Div)
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DS6208-02
May 2016
RT6208
Short Circuit Response
Load Transient Respone
VIN = 36V, VOUT = 5V, ILOAD = 100mA
VIN = 24V, VOUT = 5V, ILOAD = 0 to 100mA
VOUT_ac
(50mV/Div)
VOUT
(2V/Div)
Inductor
Current
(100mA/Div)
Load Current
(50mA/Div)
Time (1ms/Div)
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May 2016
Time (250s/Div)
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RT6208
Application Information
The typical RT6208 application circuit is shown on
page 7 of this data sheet. External component
R
VOUT = VREF  1 + 1 
R2 

selection is determined by the maximum load current
Where VREF is the reference voltage (0.8V typ.).
requirement and begins with the selection of the peak
The resistive divider attenuates the ripple signal on FB
current programming resistor, RISET. The inductor
pin as well. A small feed forward capacitor CFF can be
value L can then be determined, followed by capacitors
added in parallel with the upper feedback resistor R1. It
CIN and COUT.
helps to reduce switch-noise coupling on the FB pin
Peak Current Resistor Selection
The peak current comparator has a maximum current
limit of 225mA nominally, which results in a maximum
average current of 112mA. For applications that
demand less current, the peak current threshold can be
reduced to as little as 50mA. The threshold can be
and increases the FB pin ripple voltage to improve
switching stability and avoid double pulses. The CFF
value
is
dependent
on
the
feedback
network
impedance and the peak-peak ripple voltage on the
output. Recommended CFF values range from 47pF to
470pF.
easily programmed with an appropriately chosen
Inductor Selection
resistor (RISET) between the ISET pin and ground.
The inductor, input voltage, output voltage and peak
The value of resistor for a particular peak current can
current determine the switching frequency of the
be computed by following equation
RT6208. For a given input voltage, output voltage and
RISET = IPEAK  0.05   5.88  106
peak current, the inductor value sets the maximum
where 50mA < IPEAK < 225mA.
1/2 of the peak current. A good first choice for the
The peak current is internally limited to be within the
inductor value can be determined by the following
range of 50mA to 225mA. Shorting the ISET pin to
equation :
ground programs the current limit to 50mA, and leaving
it floating sets the current limit to the maximum value of
VOUT
   1  VOUT 
L = 


VIN 
 fMAX  IPEAK 

225mA. When selecting this resistor value, be aware
The variation in switching frequency would be
that the maximum average output current for this
calculated with inductor, load current, input and output
architecture is limited to half of the peak current.
voltage. Large output capacitors will result in multiple
Therefore, be sure to select a value that sets the peak
switching cycles in BCM. The discharge time and
current with enough margin to provide adequate load
charge time of operation frequency can follow below
current under all foreseeable operating conditions.
equation :
Output Voltage Setting and Feedback Network
Discharge time (Sleep Mode) : T1 = C OUT 
The resistive divider allows the FB pin to sense the
output voltage. The output voltage is set by an external
resistive voltage divider according to the following
switching frequency when the load current is close to
VHys.
ILOAD
Charge time (Boundary Conduction Mode) :
T2 = COUT 
 0.5
VHys.
 IPEAK  ILOAD 
equation :
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May 2016
RT6208
Operation Frequency f =
1
T1 + T2
Input Under Voltage Lockout
The RT6208 implements a protection feature which
disables switching when the input voltage is too low. If
VIN falls below 3.9V typical, an under voltage detector
disables switching. Switching is enabled when the input
voltage exceeds 4.2V typical (4.75V maximum).
deviations do not offer much relief. Choose a capacitor
rated at a higher temperature than required. Several
capacitors may also be paralleled to meet size or
height requirements in the design.
The output capacitor, COUT, filters the inductor’s ripple
current and stores energy to satisfy the load current
when the RT6208 is in sleep mode. The value of the
output capacitor must be large enough to accept the
energy stored in the inductor without a large change in
Enable Operation
output
The EN pin can be used to shutdown or activate the
peak-peak ripple less than 1% of the output voltage,
chip. Pulling the EN pin low (<1V) will shutdown the
the output capacitor must be :
device. During shutdown mode, the RT6208 quiescent
I
COUT  50  L   PEAK 
 VOUT 
current drops to lower than 3A. Driving the EN pin
high (>1.4V) will turn on the device again. Leaving the
EN pin floating will pull the EN pin up to 2V internally
and enable RT6208.
voltage.
To
achieve
an
output
voltage
2
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
Soft-Start
dissipation depends on the thermal resistance of the IC
The RT6208 provides an internal soft-start function to
package, PCB layout, rate of surrounding airflow, and
prevent large inrush current and output voltage
difference between junction and ambient temperature.
overshoot when the converter starts up. The soft-start
The maximum power dissipation can be calculated by
automatically begins once the chip is enabled. During
the following formula :
soft-start, it clamps the ramp of internal reference
PD(MAX) = (TJ(MAX)  TA) / JA
voltage which is compared with FB signal. The typical
where TJ(MAX) is the maximum junction temperature,
soft-start duration is 1ms.
TA is the ambient temperature, and JA is the junction to
ambient thermal resistance.
CIN and COUT Selection
For recommended operating condition specifications,
The input capacitance, CIN, is needed to filter the
triangular current at the Source of the high-side
MOSFET. To prevent large ripple current, a low ESR
input capacitor sized for the maximum RMS current
should be used. The approximate RMS current
equation is given :
IRMS = IOUT(MAX)
VOUT
VIN
IRMS = IOUT / 2. This simple worst case condition is
commonly used for design because even significant
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May 2016
junction to ambient thermal resistance, JA, is layout
dependent. For SOT-23-6 package, the thermal
resistance, JA, is 208.2C/W on a standard JEDEC
51-7 four-layer thermal test board. For SOT-23-8
package, the thermal resistance, JA, is 186.2C/W on
VIN
1
VOUT
This formula has a maximum at VIN = 2VOUT, where
DS6208-02
the maximum junction temperature is 125C. The
a standard JEDEC 51-7 four-layer thermal test board.
The maximum power dissipation at TA = 25C can be
calculated by the following formula :
PD(MAX) = (125C  25C) / (208.2C/W) = 0.48W for
SOT-23-6 package
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
13
RT6208
PD(MAX) = (125C  25C) / (186.2C/W) = 0.53W for
SOT-23-8 package
The maximum power dissipation depends on the
operating ambient temperature for fixed TJ(MAX) and
thermal resistance, JA. The derating curve in Figure 2
allows the designer to see the effect of rising ambient
temperature on the maximum power dissipation.
Maximum Power Dissipation (W)1
1.0
Four-Layer PCB
0.9
0.8
0.7
SOT-23-8
0.6
0.5
0.4
SOT-23-6
0.3
0.2
0.1
0.0
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 2. Derating Curve of Maximum Power
Dissipation
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
14
is a registered trademark of Richtek Technology Corporation.
DS6208-02
May 2016
RT6208
Outline Dimension
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
0.889
1.295
0.031
0.051
A1
0.000
0.152
0.000
0.006
B
1.397
1.803
0.055
0.071
b
0.250
0.560
0.010
0.022
C
2.591
2.997
0.102
0.118
D
2.692
3.099
0.106
0.122
e
0.838
1.041
0.033
0.041
H
0.080
0.254
0.003
0.010
L
0.300
0.610
0.012
0.024
SOT-23-6 Surface Mount Package
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS6208-02
May 2016
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
15
RT6208
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
1.000
1.450
0.039
0.057
A1
0.000
0.150
0.000
0.006
B
1.500
1.700
0.059
0.067
b
0.220
0.500
0.009
0.020
C
2.600
3.000
0.102
0.118
D
2.800
3.000
0.110
0.118
e
0.585
0.715
0.023
0.028
H
0.100
0.220
0.004
0.009
L
0.300
0.600
0.012
0.024
SOT-23-8 Surface Mount Package
Richtek Technology Corporation
14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume
responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be accurate and
reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
www.richtek.com
16
is a registered trademark of Richtek Technology Corporation.
DS6208-02
May 2016