IDT23S09E 3.3V ZERO DELAY CLOCK BUFFER COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES IDT23S09E 3.3V ZERO DELAY CLOCK BUFFER, SPREAD SPECTRUM COMPATIBLE FEATURES: DESCRIPTION: • Phase-Lock Loop Clock Distribution • 10MHz to 200MHz operating frequency • Distributes one clock input to one bank of five and one bank of four outputs • Separate output enable for each output bank • Output Skew < 250ps • Low jitter <200 ps cycle-to-cycle • IDT23S09E-1 for Standard Drive • IDT23S09E-1H for High Drive • No external RC network required • Operates at 3.3V VDD • Spread spectrum compatible • Available in SOIC and TSSOP packages The IDT23S09E is a high-speed phase-lock loop (PLL) clock buffer, designed to address high-speed clock distribution applications. The zero delay is achieved by aligning the phase between the incoming clock and the output clock, operable within the range of 10 to 200MHz. The IDT23S09E is a 16-pin version of the IDT23S05E. The IDT23S09E accepts one reference input, and drives two banks of four low skew clocks. The -1H version of this device operates up to 200MHz frequency and has higher drive than the -1 device. All parts have on-chip PLLs which lock to an input clock on the REF pin. The PLL feedback is on-chip and is obtained from the CLKOUT pad. In the absence of an input clock, the IDT23S09E enters power down. In this mode, the device will draw less than 12µA for Commercial Temperature range and less than 25µA for Industrial temperature range, and the outputs are tri-stated. The IDT23S09E is characterized for both Industrial and Commercial operation. FUNCTIONAL BLOCK DIAGRAM 16 1 2 PLL CLKOUT CLKA1 REF 3 CLKA2 14 CLKA3 15 S2 S1 CLKA4 8 9 Control Logic 6 7 10 11 CLKB1 CLKB2 CLKB3 CLKB4 The IDT logo is a registered trademark of Integrated Device Technology, Inc. COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES MAY 2010 1 c 2006 Integrated Device Technology, Inc. DSC - 6399/11 IDT23S09E 3.3V ZERO DELAY CLOCK BUFFER COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES ABSOLUTE MAXIMUM RATINGS(1) PIN CONFIGURATION Symbol REF 1 16 CLKOUT CLKA1 2 15 CLKA4 CLKA2 3 14 CLKA3 VDD 4 13 VDD GND 5 12 GND CLKB1 6 Unit Supply Voltage Range Rating –0.5 to +4.6 V VI (2) Input Voltage Range (REF) –0.5 to +5.5 V VI Input Voltage Range –0.5 to V (except REF) Input Clamp Current –50 mA IO (VO = 0 to VDD) Continuous Output Current ±50 mA VDD or GND Continuous Current ±100 mA TA = 55°C Maximum Power Dissipation 0.7 W –65 to +150 °C 0 to +70 °C -40 to +85 °C CLKB4 CLKB3 TSTG Storage Temperature Range S1 Operating Commercial Temperature CLKB2 7 10 S2 8 9 (in still air) (3) Temperature Range Operating Industrial Temperature Temperature Range NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 3. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils. APPLICATIONS: SDRAM Telecom Datacom PC Motherboards/Workstations Critical Path Delay Designs PIN DESCRIPTION Pin Name REF (1) CLKA1(2) CLKA2 Pin Number Type Functional Description 1 IN Input reference clock, 5 Volt tolerant input 2 Out Output clock for bank A Output clock for bank A 3 Out VDD 4, 13 PWR GND (2) 3.3V Supply 5, 12 GND CLKB1(2) 6 Out Output clock for bank B CLKB2(2) 7 Out Output clock for bank B S2(3) 8 IN Select input Bit 2 S1 Ground 9 IN Select input Bit 1 CLKB3(2) 10 Out Output clock for bank B CLKB4(2) 11 Out Output clock for bank B CLKA3(2) 14 Out Output clock for bank A CLKA4 15 Out Output clock for bank A 16 Out Output clock, internal feedback on this pin (3) (2) CLKOUT(2) VDD+0.5 IIK (VI < 0) 11 SOIC/ TSSOP TOP VIEW • • • • • Max. VDD NOTES: 1. Weak pull down. 2. Weak pull down on all outputs. 3. Weak pull ups on these inputs. 2 IDT23S09E 3.3V ZERO DELAY CLOCK BUFFER COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES FUNCTION TABLE(1) S2 S1 CLKA CLKB CLKOUT (2) Output Source PLL Shut Down L L Tri-State Tri-State Driven PLL N L H Driven Tri-State Driven PLL N H L Driven Driven Driven REF Y H H Driven Driven Driven PLL N NOTES: 1. H = HIGH Voltage Level. L = LOW Voltage Level 2. This output is driven and has an internal feedback for the PLL. The load on this ouput can be adjusted to change the skew between the REF and the output. DC ELECTRICAL CHARACTERISTICS - COMMERCIAL Symbol Parameter Conditions VIL Input LOW Voltage Level VIH Input HIGH Voltage Level IIL Input LOW Current VIN = 0V IIH Input HIGH Current VIN = VDD VOL Output LOW Voltage VOH IDD_PD IDD Output HIGH Voltage Standard Drive IOL = 8mA High Drive IOL = 12mA (-1H) Standard Drive IOH = -8mA High Drive IOH = -12mA (-1H) Min. Max. Unit — 0.8 V 2 — V — 50 µA — 100 µA — 0.4 V 2.4 — V Power Down Current REF = 0MHz (S2 = S1 = H) — 12 µA Supply Current Unloaded Outputs at 66.66MHz, SEL inputs at VDD or GND — 32 mA OPERATING CONDITIONS - COMMERCIAL Symbol Min. Max. Unit VDD Supply Voltage 3 3.6 V TA Operating Temperature (Ambient Temperature) 0 70 °C CL Load Capacitance < 100MHz — 30 pF Load Capacitance 100MHz - 200MHz — 10 Input Capacitance — 7 CIN Parameter pF SWITCHING CHARACTERISTICS (23S09E-1) - COMMERCIAL(1,2) Symbol t1 Parameter Conditions Output Frequency Min. Typ. Max. Unit 10pF Load 10 — 200 MHz 30pF Load 10 — 100 Duty Cycle = t2 ÷ t1 Measured at 1.4V, FOUT = 66.66MHz 40 50 60 % t3 Rise Time Measured between 0.8V and 2V — — 2.5 ns t4 Fall Time Measured between 0.8V and 2V — — 2.5 ns t5 Output to Output Skew All outputs equally loaded — — 250 ps t6A Delay, REF Rising Edge to CLKOUT Rising Edge Measured at VDD/2 — 0 ±350 ps t6B Delay, REF Rising Edge to CLKOUT Rising Edge(2) Measured at VDD/2 in PLL bypass mode (IDT23S09E only) 1 5 8.7 ns t7 Device-to-Device Skew Measured at VDD/2 on the CLKOUT pins of devices — 0 700 ps tJ Cycle-to-Cycle Jitter Measured at 66.66MHz, loaded outputs — — 200 ps PLL Lock Time Stable power supply, valid clock presented on REF pin — — 1 ms tLOCK (2) NOTES: 1. REF Input has a threshold voltage of VDD/2. 2. All parameters specified with loaded outputs. 3 IDT23S09E 3.3V ZERO DELAY CLOCK BUFFER COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES SWITCHING CHARACTERISTICS (23S09E-1H) - COMMERCIAL(1,2) Symbol Min. Typ. Max. Unit Output Frequency 10pF Load 30pF Load 10 10 — — 200 100 MHz Duty Cycle = t2 ÷ t1 Measured at 1.4V, FOUT = 66.66MHz 40 50 60 % Duty Cycle = t2 ÷ t1 Measured at 1.4V, FOUT <50MHz 45 50 55 % t3 Rise Time Measured between 0.8V and 2V — — 1.5 ns t4 Fall Time Measured between 0.8V and 2V — — 1.5 ns t5 Output to Output Skew All outputs equally loaded — — 250 ps t6A Delay, REF Rising Edge to CLKOUT Rising Edge Measured at VDD/2 — 0 ±350 ps t6B Delay, REF Rising Edge to CLKOUT Rising Edge Measured at VDD/2 in PLL bypass mode (IDT23S09E only) 1 5 8.7 ns t7 Device-to-Device Skew Measured at VDD/2 on the CLKOUT pins of devices — 0 700 ps t8 Output Slew Rate Measured between 0.8V and 2V using Test Circuit 2 1 — — V/ns tJ Cycle-to-Cycle Jitter Measured at 66.66MHz, loaded outputs — — 200 ps PLL Lock Time Stable power supply, valid clock presented on REF pin — — 1 ms t1 tLOCK Parameter Conditions NOTES: 1. REF Input has a threshold voltage of VDD/2. 2. All parameters specified with loaded outputs. DC ELECTRICAL CHARACTERISTICS - INDUSTRIAL Symbol Parameter Conditions Min. Max. Unit VIL Input LOW Voltage Level — 0.8 V VIH Input HIGH Voltage Level 2 — V IIL Input LOW Current VIN = 0V — 50 µA IIH Input HIGH Current VIN = VDD VOL Output LOW Voltage Standard Drive VOH Output HIGH Voltage IDD_PD IDD IOL = 8mA High Drive IOL = 12mA (-1H) Standard Drive IOH = -8mA High Drive IOH = -12mA (-1H) — 100 µA — 0.4 V 2.4 — V Power Down Current REF = 0MHz (S2 = S1 = H) — 25 µA Supply Current Unloaded Outputs at 66.66MHz, SEL inputs at VDD or GND — 35 mA OPERATING CONDITIONS - INDUSTRIAL Symbol Parameter Min. Max. Unit 3 3.6 V VDD Supply Voltage TA Operating Temperature (Ambient Temperature) -40 +85 °C CL Load Capacitance < 100MHz — 30 pF Load Capacitance 100MHz - 200MHz — 10 Input Capacitance — 7 CIN 4 pF IDT23S09E 3.3V ZERO DELAY CLOCK BUFFER COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES SWITCHING CHARACTERISTICS (23S09E-1) - INDUSTRIAL(1,2) Symbol t1 Parameter Output Frequency Conditions Min. Typ. Max. Unit 10pF Load 10 — 200 MHz 30pF Load 10 — 100 Duty Cycle = t2 ÷ t1 Measured at 1.4V, FOUT = 66.66MHz 40 50 60 % t3 Rise Time Measured between 0.8V and 2V — — 2.5 ns t4 Fall Time Measured between 0.8V and 2V — — 2.5 ns t5 Output to Output Skew All outputs equally loaded — — 250 ps t6A Delay, REF Rising Edge to CLKOUT Rising Edge Measured at VDD/2 — 0 ±350 ps t6B Delay, REF Rising Edge to CLKOUT Rising Edge Measured at VDD/2 in PLL bypass mode (IDT23S09E only) 1 5 8.7 ns t7 Device-to-Device Skew Measured at VDD/2 on the CLKOUT pins of devices — 0 700 ps tJ Cycle-to-Cycle Jitter Measured at 66.66MHz, loaded outputs — — 200 ps PLL Lock Time Stable power supply, valid clock presented on REF pin — — 1 ms tLOCK NOTES: 1. REF Input has a threshold voltage of VDD/2. 2. All parameters specified with loaded outputs. SWITCHING CHARACTERISTICS (23S09E-1H) - INDUSTRIAL(1,2) Symbol t1 Min. Typ. Max. Unit Output Frequency Parameter 10pF Load 30pF Load Conditions 10 10 — — 200 100 MHz Duty Cycle = t2 ÷ t1 Measured at 1.4V, FOUT = 66.66MHz 40 50 60 % Duty Cycle = t2 ÷ t1 Measured at 1.4V, FOUT <50MHz 45 50 55 % t3 Rise Time Measured between 0.8V and 2V — — 1.5 ns t4 Fall Time Measured between 0.8V and 2V — — 1.5 ns t5 Output to Output Skew All outputs equally loaded — — 250 ps t6A Delay, REF Rising Edge to CLKOUT Rising Edge Measured at VDD/2 — 0 ±350 ps t6B Delay, REF Rising Edge to CLKOUT Rising Edge Measured at VDD/2 in PLL bypass mode (IDT23S09E only) 1 5 8.7 ns t7 Device-to-Device Skew Measured at VDD/2 on the CLKOUT pins of devices — 0 700 ps t8 Output Slew Rate Measured between 0.8V and 2V using Test Circuit 2 1 — — V/ns tJ Cycle-to-Cycle Jitter Measured at 66.66MHz, loaded outputs — — 200 ps PLL Lock Time Stable power supply, valid clock presented on REF pin — — 1 ms tLOCK NOTES: 1. REF Input has a threshold voltage of VDD/2. 2. All parameters specified with loaded outputs. 5 IDT23S09E 3.3V ZERO DELAY CLOCK BUFFER COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES ZERO DELAY AND SKEW CONTROL All outputs should be uniformly loaded in order to achieve Zero I/O Delay. Since the CLKOUT pin is the internal feedback for the PLL, its relative loading can affect and adjust the input/output delay. For designs utilizing zero I/O Delay, all outputs including CLKOUT must be equally loaded. Even if the output is not used, it must have a capacitive load equal to that on the other outputs in order to obtain true zero I/O Delay. For zero output-to-output skew, all outputs must be loaded equally. SPREAD SPECTRUM COMPATIBLE Many systems being designed now use a technology called Spread Spectrum Frequency Timing Generation. This product is designed not to filter off the Spread Spectrum feature of the reference input, assuming it exists. When a zero delay buffer is not designed to pass the Spread Spectrum feature through, the result is a significant amount of tracking skew, which may cause problems in systems requiring synchronization. 6 IDT23S09E 3.3V ZERO DELAY CLOCK BUFFER COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES TEST CIRCUITS VDD VDD 0.1 F CLKOUT OUTPUTS 0.1 F 1K CLOAD 1K VDD VDD 0.1 F 0.1 F GND GND GND GND Test Circuit 2 (t8, Output Slew Rate On -1H Devices) Test Circuit 1 (all Parameters Except t8) SWITCHING WAVEFORMS t1 1.4V Output t2 1.4V 1.4V 1.4V 1.4V Output t5 Output to Output Skew Duty Cycle Timing Output CLKOUT OUTPUTS 0.8V t3 2V 2V 0.8V 3.3V VDD/2 REF 0V t4 VDD/2 Output t6 Input to Output Propagation Delay All Outputs Rise/Fall Time CLKOUT Device 1 CLKOUT Device 2 VDD/2 t7 VDD/2 Device to Device Skew 7 10pF IDT23S09E 3.3V ZERO DELAY CLOCK BUFFER COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES ORDERING INFORMATION IDT XXXXX XX Device Type Package X Process Blank I Commercial (0oC to +70oC) Industrial (-40oC to +85oC) DC DCG PG PGG Small Outline SOIC - Green Thin Shrink Small Outline Package TSSOP - Green Standard Drivewith High Drive, Zero with Delay Clock Buffer 23S09E-1 ZDB with High Drive Spread Spectrum Compatible 23S09E-1H ZDB Spread Spectrum Compatible Part / Order Number Shipping Packaging Package 23S09E-1DCG 23S09E-1DCG8 23S09E-1DCGI 23S09E-1DCGI8 23S09E-1HDCG 23S09E-1HDCG8 23S09E-1HDCGI 23S09E-1HDCGI8 23S09E-1HPGG 23S09E-1HPGG8 23S09E-1HPGGI 23S09E-1HPGGI8 Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin TSSOP 16-pin TSSOP 16-pin TSSOP 16-pin TSSOP CORPORATE HEADQUARTERS 6024 Silver Creek Valley Road San Jose, CA 95138 for SALES: 800-345-7015 or 408-284-8200 fax: 408-284-2775 www.idt.com 8 Temperature 0° to +70° C 0° to +70° C -40° to +85°C -40° to +85°C 0° to +70° C 0° to +70° C -40° to +85°C -40° to +85°C 0° to +70° C 0° to +70° C -40° to +85°C -40° to +85°C for Tech Support: www.idt.com/go/clockhelp