Capabilities Brochure

V ishay I ntertechnolog y, I nc .
AND TEC
I
INNOVAT
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Using Thin Film Substrates
N
HN
DIODE SUBMOUNT CAPABILITIES
O
19
62-2012
Resistors - Vishay Electro-Films
LED Submounts
INTRODUCTION
Vishay Electro-Films, with its complete in-house capability, offers a wide variety of solutions for
matching the best substrate materials and metal schemes to achieve optimum thermal and
mechanical performance.
Vishay Electro-Films, an RoHS-compliant facility and ISO 9001/2000-registered company,
provides thermal management submount solutions for all optoelectronics applications.
Resources
• For technical questions contact [email protected]
• General Product Tech Notes:
–– HDI Design Guidelines: http://www.vishay.com/doc?49387
–– Integrated Microelectronic Interconnect Circuitry: http://www.vishay.com/doc?61082
–– Layout Guidelines: http:/www.vishay.com/doc?61081
–– Standard Metal Thickness: http://www.vishay.com/doc?49387
–– Application and Design of Plated and Filled Via Circuits:
http://www.vishay.com/doc?61084
• Sales Contacts: http://www.vishay.com/doc?99914
One of the World’s Largest Manufacturers of
Discrete Semiconductors and Passive Components
Capabilities
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VMN-PL0400-1204
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V ishay I ntertechnolog y, I nc .
AND TEC
I
INNOVAT
O L OGY
Using Thin Film Substrates
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DIODE SUBMOUNT CAPABILITIES
O
19
62-2012
Typical Applications Using Vishay Electro-Films
Substrate Submounts
Applications
• Laser diode submounts
• Fiber optic pump lasers
Resistors - Vishay Electro-Films
• Optical transmitters
25 Gbit/s to 40 Gbit/s TOSA
and ROSA transceiver /
receiver optical sub submount
Semiconductor laser
diode submount
Tunable laser submount
Single-emitter
semiconductor laser
CATV submount
• Optical receivers
• Optical transceivers
• Optical TOSA/ROSA
packages
High Power Laser Bar
Machined Shapes
Vishay EFI’s in-house CO2 laser machining of ceramics provides the ability to offer custom-shaped substrates, cut outs,
and holes for special applications. CO2 machining can be applied to Al2O3, AlN and BeO substrates.
Cut out Tosa Rosa
Capabilities
10 G Submount
Custom Round with Filled Vias
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Custom Submounts
VMN-PL0400-1204
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V ishay I ntertechnolog y, I nc .
AND TEC
I
INNOVAT
O L OGY
Using Thin Film Substrates
N
HN
DIODE SUBMOUNT CAPABILITIES
O
19
62-2012
High-Power Conductor Lines
Resistors - Vishay Electro-Films
Special process capabilities allow Vishay EFI to provide power lines with up to 0.006 in thick copper. A copper conductor
to 0.002 in (0.05 mm) thickness can be integrated on one substrate in relatively close proximity to the fine-line patterns
without degradation of the patterning capability. The copper lines are isolated with nickel barrier layers to prevent copper
oxidation and intermetalic diffusion during high-temperature processing and operation.
Copper/gold
Thick copper
Thick copper / Nickel / Gold
See datasheet 61053 at http://www.vishay.com/doc?61053
General Product Tech Notes:
HDI Design Guidelines: http://www.vishay.com/doc?49387
Integrated Microelectronic Interconnect Circuitry: http://www.vishay.com/doc?61082
If your design is complete and you would like us to use your files, or if you would like us to help finalize your application
design, please contact: Vishay Electro-Films, Inc., 111 Gilbane Street, Warwick, RI 02886, USA, Ph: +1-401-738-9150,
Fax: +1-401-738-4389, Email: [email protected]
Design Guidelines – Materials
Vishay offers a variety of material choices for submounts with a wide range of thicknesses to help designers meet their
specific application requirements.
Material
Surface
finish
µ" CLA
(micro inch)
Standard
thickness
mils (mm)
Available
thickness
mils (mm)
Dielectric
constant
ε at 1 MHz
Thermal
conductivity
(W/m°C)
25 °C/100 °C
Coefficient
thermal
expansion
(ppm)
Tanδ
1 MHz
10 GHz
Quartz
60/40 optical
10, 20
(0.25, 0.5)
10 to 40
(0.25 to 1.0)
3.82
5/2
0.55
0.00002
0.0001
Al2O3
< 1 polished
< 3 as-fired
10, 15, 25
(0.25, 0.38, 0.63)
5 to 90
(0.12 to 2.3)
9.9
35 / 27
7.4
0.0001
0.0003
AlN
< 2 polished
< 24 as-fired
20, 25, 51
(0.5, 0.63, 1.3)
10 to 90
0.25 to 2.3)
8.6
170 / 130
200 / 230
4.6
0.001
0.002
BeO
< 4 polished
< 15 as-fired
15, 25
(0.38, 0.63)
10 to 60
(0.25 to 1.5)
6.5
300 / 240
9
0.0004
Zirconia
< 4 polished
Special
order
10 to 25
(0.25 to 0.63)
20 to 33
2 to 3
10 to 11
~
Capabilities
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VMN-PL0400-1204
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V ishay I ntertechnolog y, I nc .
AND TEC
I
INNOVAT
O L OGY
Using Thin Film Substrates
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HN
DIODE SUBMOUNT CAPABILITIES
O
19
62-2012
Metalization Guidelines
Resistors - Vishay Electro-Films
For applications incorporating resistors, or for conductors only, Vishay provides designers with a wide range of metal
combinations to meet their needs.
Metal stack resistor
Vishay EFI STD
Wire bondable
Ta2N/TiW/Au
Yes
Ta2N/TiW/Au/Ni/Au
Ta2N/TiW/Pd/Au
Solderable
Vishay EFI STD
Gold
Solder
Yes
~
~
TiW (500 to 1 kA)
Yes
Yes
Yes
Yes
TiW (500 to 1 kA)
Yes
Yes
Yes
Yes
TiW (500 to 1 kA)
Ta2N/TiW/Au/Cu/Au
Yes
~
~
TiW (500 to 1 kA)
Ta2N/TiW/Au/Cu/Ni/Au
Yes
Yes
Yes
TiW (500 to 1 kA)
Yes
~
~
TiW (500 to 1 kA)
Yes
Yes
Yes
Yes
~
~
TiW (500 to 1 kA)
Yes
Yes
Yes
TiW (500 to 1 kA)
Yes
Yes
Yes
TiW (500 to 1 kA)
Yes
Yes
Yes
Ti (500 to 1 kA)
NiCr/TiW/Au
Yes
NiCr/Au/Ni/Au
Conductor Only
TiW/Au
Yes
TiW/Au/Ni/Au
TiW/Pd/Au
Yes
Ti/Pd/Au
Conductor Only - High Power
TiW/Cu/Ni/Au
Yes
NiCr/Cu/Ni/Au
AuSn 80/20
Yes
Yes
Yes
TiW (500 to 1 kA)
Yes
Yes
Yes
NiCr (500 to 1 kA)
Yes
Yes
4, 6, 8 micron
Yes
Refer to technical note for recommended standard metal thickness http://www.vishay.com/doc?49387
Capabilities
4/6
VMN-PL0400-1204
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V ishay I ntertechnolog y, I nc .
AND TEC
I
INNOVAT
O L OGY
Using Thin Film Substrates
N
HN
DIODE SUBMOUNT CAPABILITIES
O
19
62-2012
Thermal Management – Solid Filled Vias
Vishay EFI Products Feature Unique Capabilities for Improved Thermal Performance
• Solid-filled vias — Gold or copper vias are available in AlN, BeO, Al2O3, and quartz.
• Key benefits:
–– High-reliability, low-resistance paths to ground (less than 10 mΩ)
Resistors - Vishay Electro-Films
–– Enhanced thermal conductivity
–– Low thermal paths to rear of the substrate
Design Parameters
Material Thickness
Min Via Diameter
(max = 2x min)
0.010 in (0.245 mm)
0.006 in (0.152 mm)
0.015 in (0.381 mm)
0.008 in (0.203 mm)
0.020 in (0.51 mm)
0.010 in (0.254 mm)
0.025 in (0.635 mm)
0.012 in (0.305 mm)
0.050 in (1.27 mm)
0.020 in (0.51 mm)
Min Via Centers
Min Via Center to Die Edge
2x via diameter Al2O3
3x via diameter AlN
1.5x via diameter
See technical note 61084, “Application and Design of Plated & Filled Via Circuits”at http:/www.vishay.com/doc?61084
Cu filled 8 mil (0.2 mm) diameter
vias on a 15 mil thick (0.38 mm)
aluminum nitride substrate
Capabilities
Custom gold filled 10 mil (0.25 mm)
diameter vias on a 20 mil (0.51 mm)
thick alumina substrate
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VMN-PL0400-1204
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO
SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V ishay I ntertechnolog y, I nc .
AND TEC
I
INNOVAT
O L OGY
Using Thin Film Substrates
N
HN
DIODE SUBMOUNT CAPABILITIES
O
19
62-2012
Thermal Management – AuSn
• Gold/tin pre-deposited pads — Vishay Electro-Films offers a robust selective-patterned 80/20 gold/tin for solder
applications.
• Key benefits:
–– 2 µm to 8 µm thickness available at ± 1 µm tolerance
–– Eliminates need for soldering preforms — AuSn is pre-deposited onto submount
Resistors - Vishay Electro-Films
–– Available on simple to complex designs
–– AuSn pad placement accuracy to 0.0005 in. (0.0127 mm)
–– Allows accurate laser alignment to ± 0.005 in. (0.127 mm)
–– Pad tolerance to ± 0.0002 in (0.005 mm)
–– Freeze time: 120 s at 320 °C
–– Excellent reflow stability — does not migrate outside borders of defined area
AuSn pad custom designs
AuSn pad with no vias
AuSn pad with vias
Layout Guidelines
MAXIMUM SUBSTRATE SIZE 4.1" [104] x 4.1" [104]
CONDUCTORS & RESISTORS - VALUES & TOLERANCES
VALUE TO ± 5 %
WIDTH: 0.002" [0.05] MIN.
LAYER TO LAYER
REGISTRATION
± 0.0005" [0.01]
METAL PULLBACK
0.003" [0.08] PREFERRED
LENGTH: 0.002"
[0.05] MIN.
0.005" [0.13] MIN.
HALF VIA.
EDGE WRAP
AIR
BRIDGE
MIN. DIA. 0.010" [0.254]
OR SUBSTRATE
THICKNESS
SLOTTED EDGEWRAP
0.007" [0.18] ± 0.005" [0.13]
INTRUSION
0.006" [0.15] TYP RADIUS
0.020" [0.51] TYP WIDTH
LENGTH: 0.005"
[0.13] MIN.
0.003" [0.08] MIN. LATERIAL
RESISTOR SPACING
(FOR LASER ENTRY)
LINE SPACING
0.0005" [0.013] MIN.
TOL. ± 0.0001" [0.003]
MULTILAYER CONDUCTORS
(UP TO 5 LAYERS) VIA PAD
0.005" [0.13] TYP.
LINE WIDTH
0.0005" [0.013] MIN.
TOL. ± 0.0001" [0.003]
0.001" [0.025] SQ.
MIN CONTACT
AIR BRIDGES
OR SUPPORTED
DIELECTRIC VIAS
0.002" [0.08] DIA.
BACK PATTERN
AIR BRIDGE
HOLES AND MACHINED FEATURES
REGISTRATION
VIA TO CIRCUIT
± 0.002" [0.05]
FRONT TO BACK PATTERN
REGISTRATION ± 0.002" [0.05]
THIN FILM CAPACITORS
VALUE: L x W x 0.15 pF/SQ. MIL (Si 3N4)
VALUE: L x W x 0.055 pF/SQ. MIL (POLY)
CONDUCTOR OVERLAP AREA
ANNULUS
0.005" [0.13] FOR PLATED THRU HOLES
0.0025" [0.064] FOR FILLED VIAS
0.004" [0.01] FOR VENTED FILLED VIAS
Capabilities
VALUE TO ± 0.1 %
WIDTH 0.002"
[0.05] MIN.
CIRCUIT FEATURE LOCATION
TOLERANCE ± 0.002" [0.05]
RELATIVE TO CIRCUIT DATUM
RADIUS
± 0.006" [0.15] MIN.
CUTOUT
DIELECTRIC AREA
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HOLE LOCATION ± 0.002" [0.5]
NON-CUMMULATIVE
TOLERANCE TO ± 0.003" [0.08]
VMN-PL0400-1204
DIAMOND SAWN
TO ± 0.001" [0.025]
± 0.003" [0.08] STD.
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN
AND THIS DOCUMENT ARE SUBJECT TO
CUTOUT
SPACING
[0.51] MIN.
± 0.015" [0.38] MIN.
SPECIFIC DISCLAIMERS, SET0.020"
FORTH
AT www.vishay.com/doc?91000
LASER
CUT
GREATER OF 0.020" [0.51]
OR HOLE DIAMETER
HOLE DIAMETER
FEATURES
± 0.003" [0.08]