V ishay I ntertechnolog y, I nc . AND TEC I INNOVAT O L OGY Using Thin Film Substrates N HN DIODE SUBMOUNT CAPABILITIES O 19 62-2012 Resistors - Vishay Electro-Films LED Submounts INTRODUCTION Vishay Electro-Films, with its complete in-house capability, offers a wide variety of solutions for matching the best substrate materials and metal schemes to achieve optimum thermal and mechanical performance. Vishay Electro-Films, an RoHS-compliant facility and ISO 9001/2000-registered company, provides thermal management submount solutions for all optoelectronics applications. Resources • For technical questions contact [email protected] • General Product Tech Notes: –– HDI Design Guidelines: http://www.vishay.com/doc?49387 –– Integrated Microelectronic Interconnect Circuitry: http://www.vishay.com/doc?61082 –– Layout Guidelines: http:/www.vishay.com/doc?61081 –– Standard Metal Thickness: http://www.vishay.com/doc?49387 –– Application and Design of Plated and Filled Via Circuits: http://www.vishay.com/doc?61084 • Sales Contacts: http://www.vishay.com/doc?99914 One of the World’s Largest Manufacturers of Discrete Semiconductors and Passive Components Capabilities 1/6 VMN-PL0400-1204 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V ishay I ntertechnolog y, I nc . AND TEC I INNOVAT O L OGY Using Thin Film Substrates N HN DIODE SUBMOUNT CAPABILITIES O 19 62-2012 Typical Applications Using Vishay Electro-Films Substrate Submounts Applications • Laser diode submounts • Fiber optic pump lasers Resistors - Vishay Electro-Films • Optical transmitters 25 Gbit/s to 40 Gbit/s TOSA and ROSA transceiver / receiver optical sub submount Semiconductor laser diode submount Tunable laser submount Single-emitter semiconductor laser CATV submount • Optical receivers • Optical transceivers • Optical TOSA/ROSA packages High Power Laser Bar Machined Shapes Vishay EFI’s in-house CO2 laser machining of ceramics provides the ability to offer custom-shaped substrates, cut outs, and holes for special applications. CO2 machining can be applied to Al2O3, AlN and BeO substrates. Cut out Tosa Rosa Capabilities 10 G Submount Custom Round with Filled Vias 2/6 Custom Submounts VMN-PL0400-1204 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V ishay I ntertechnolog y, I nc . AND TEC I INNOVAT O L OGY Using Thin Film Substrates N HN DIODE SUBMOUNT CAPABILITIES O 19 62-2012 High-Power Conductor Lines Resistors - Vishay Electro-Films Special process capabilities allow Vishay EFI to provide power lines with up to 0.006 in thick copper. A copper conductor to 0.002 in (0.05 mm) thickness can be integrated on one substrate in relatively close proximity to the fine-line patterns without degradation of the patterning capability. The copper lines are isolated with nickel barrier layers to prevent copper oxidation and intermetalic diffusion during high-temperature processing and operation. Copper/gold Thick copper Thick copper / Nickel / Gold See datasheet 61053 at http://www.vishay.com/doc?61053 General Product Tech Notes: HDI Design Guidelines: http://www.vishay.com/doc?49387 Integrated Microelectronic Interconnect Circuitry: http://www.vishay.com/doc?61082 If your design is complete and you would like us to use your files, or if you would like us to help finalize your application design, please contact: Vishay Electro-Films, Inc., 111 Gilbane Street, Warwick, RI 02886, USA, Ph: +1-401-738-9150, Fax: +1-401-738-4389, Email: [email protected] Design Guidelines – Materials Vishay offers a variety of material choices for submounts with a wide range of thicknesses to help designers meet their specific application requirements. Material Surface finish µ" CLA (micro inch) Standard thickness mils (mm) Available thickness mils (mm) Dielectric constant ε at 1 MHz Thermal conductivity (W/m°C) 25 °C/100 °C Coefficient thermal expansion (ppm) Tanδ 1 MHz 10 GHz Quartz 60/40 optical 10, 20 (0.25, 0.5) 10 to 40 (0.25 to 1.0) 3.82 5/2 0.55 0.00002 0.0001 Al2O3 < 1 polished < 3 as-fired 10, 15, 25 (0.25, 0.38, 0.63) 5 to 90 (0.12 to 2.3) 9.9 35 / 27 7.4 0.0001 0.0003 AlN < 2 polished < 24 as-fired 20, 25, 51 (0.5, 0.63, 1.3) 10 to 90 0.25 to 2.3) 8.6 170 / 130 200 / 230 4.6 0.001 0.002 BeO < 4 polished < 15 as-fired 15, 25 (0.38, 0.63) 10 to 60 (0.25 to 1.5) 6.5 300 / 240 9 0.0004 Zirconia < 4 polished Special order 10 to 25 (0.25 to 0.63) 20 to 33 2 to 3 10 to 11 ~ Capabilities 3/6 VMN-PL0400-1204 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V ishay I ntertechnolog y, I nc . AND TEC I INNOVAT O L OGY Using Thin Film Substrates N HN DIODE SUBMOUNT CAPABILITIES O 19 62-2012 Metalization Guidelines Resistors - Vishay Electro-Films For applications incorporating resistors, or for conductors only, Vishay provides designers with a wide range of metal combinations to meet their needs. Metal stack resistor Vishay EFI STD Wire bondable Ta2N/TiW/Au Yes Ta2N/TiW/Au/Ni/Au Ta2N/TiW/Pd/Au Solderable Vishay EFI STD Gold Solder Yes ~ ~ TiW (500 to 1 kA) Yes Yes Yes Yes TiW (500 to 1 kA) Yes Yes Yes Yes TiW (500 to 1 kA) Ta2N/TiW/Au/Cu/Au Yes ~ ~ TiW (500 to 1 kA) Ta2N/TiW/Au/Cu/Ni/Au Yes Yes Yes TiW (500 to 1 kA) Yes ~ ~ TiW (500 to 1 kA) Yes Yes Yes Yes ~ ~ TiW (500 to 1 kA) Yes Yes Yes TiW (500 to 1 kA) Yes Yes Yes TiW (500 to 1 kA) Yes Yes Yes Ti (500 to 1 kA) NiCr/TiW/Au Yes NiCr/Au/Ni/Au Conductor Only TiW/Au Yes TiW/Au/Ni/Au TiW/Pd/Au Yes Ti/Pd/Au Conductor Only - High Power TiW/Cu/Ni/Au Yes NiCr/Cu/Ni/Au AuSn 80/20 Yes Yes Yes TiW (500 to 1 kA) Yes Yes Yes NiCr (500 to 1 kA) Yes Yes 4, 6, 8 micron Yes Refer to technical note for recommended standard metal thickness http://www.vishay.com/doc?49387 Capabilities 4/6 VMN-PL0400-1204 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V ishay I ntertechnolog y, I nc . AND TEC I INNOVAT O L OGY Using Thin Film Substrates N HN DIODE SUBMOUNT CAPABILITIES O 19 62-2012 Thermal Management – Solid Filled Vias Vishay EFI Products Feature Unique Capabilities for Improved Thermal Performance • Solid-filled vias — Gold or copper vias are available in AlN, BeO, Al2O3, and quartz. • Key benefits: –– High-reliability, low-resistance paths to ground (less than 10 mΩ) Resistors - Vishay Electro-Films –– Enhanced thermal conductivity –– Low thermal paths to rear of the substrate Design Parameters Material Thickness Min Via Diameter (max = 2x min) 0.010 in (0.245 mm) 0.006 in (0.152 mm) 0.015 in (0.381 mm) 0.008 in (0.203 mm) 0.020 in (0.51 mm) 0.010 in (0.254 mm) 0.025 in (0.635 mm) 0.012 in (0.305 mm) 0.050 in (1.27 mm) 0.020 in (0.51 mm) Min Via Centers Min Via Center to Die Edge 2x via diameter Al2O3 3x via diameter AlN 1.5x via diameter See technical note 61084, “Application and Design of Plated & Filled Via Circuits”at http:/www.vishay.com/doc?61084 Cu filled 8 mil (0.2 mm) diameter vias on a 15 mil thick (0.38 mm) aluminum nitride substrate Capabilities Custom gold filled 10 mil (0.25 mm) diameter vias on a 20 mil (0.51 mm) thick alumina substrate 5/6 VMN-PL0400-1204 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V ishay I ntertechnolog y, I nc . AND TEC I INNOVAT O L OGY Using Thin Film Substrates N HN DIODE SUBMOUNT CAPABILITIES O 19 62-2012 Thermal Management – AuSn • Gold/tin pre-deposited pads — Vishay Electro-Films offers a robust selective-patterned 80/20 gold/tin for solder applications. • Key benefits: –– 2 µm to 8 µm thickness available at ± 1 µm tolerance –– Eliminates need for soldering preforms — AuSn is pre-deposited onto submount Resistors - Vishay Electro-Films –– Available on simple to complex designs –– AuSn pad placement accuracy to 0.0005 in. (0.0127 mm) –– Allows accurate laser alignment to ± 0.005 in. (0.127 mm) –– Pad tolerance to ± 0.0002 in (0.005 mm) –– Freeze time: 120 s at 320 °C –– Excellent reflow stability — does not migrate outside borders of defined area AuSn pad custom designs AuSn pad with no vias AuSn pad with vias Layout Guidelines MAXIMUM SUBSTRATE SIZE 4.1" [104] x 4.1" [104] CONDUCTORS & RESISTORS - VALUES & TOLERANCES VALUE TO ± 5 % WIDTH: 0.002" [0.05] MIN. LAYER TO LAYER REGISTRATION ± 0.0005" [0.01] METAL PULLBACK 0.003" [0.08] PREFERRED LENGTH: 0.002" [0.05] MIN. 0.005" [0.13] MIN. HALF VIA. EDGE WRAP AIR BRIDGE MIN. DIA. 0.010" [0.254] OR SUBSTRATE THICKNESS SLOTTED EDGEWRAP 0.007" [0.18] ± 0.005" [0.13] INTRUSION 0.006" [0.15] TYP RADIUS 0.020" [0.51] TYP WIDTH LENGTH: 0.005" [0.13] MIN. 0.003" [0.08] MIN. LATERIAL RESISTOR SPACING (FOR LASER ENTRY) LINE SPACING 0.0005" [0.013] MIN. TOL. ± 0.0001" [0.003] MULTILAYER CONDUCTORS (UP TO 5 LAYERS) VIA PAD 0.005" [0.13] TYP. LINE WIDTH 0.0005" [0.013] MIN. TOL. ± 0.0001" [0.003] 0.001" [0.025] SQ. MIN CONTACT AIR BRIDGES OR SUPPORTED DIELECTRIC VIAS 0.002" [0.08] DIA. BACK PATTERN AIR BRIDGE HOLES AND MACHINED FEATURES REGISTRATION VIA TO CIRCUIT ± 0.002" [0.05] FRONT TO BACK PATTERN REGISTRATION ± 0.002" [0.05] THIN FILM CAPACITORS VALUE: L x W x 0.15 pF/SQ. MIL (Si 3N4) VALUE: L x W x 0.055 pF/SQ. MIL (POLY) CONDUCTOR OVERLAP AREA ANNULUS 0.005" [0.13] FOR PLATED THRU HOLES 0.0025" [0.064] FOR FILLED VIAS 0.004" [0.01] FOR VENTED FILLED VIAS Capabilities VALUE TO ± 0.1 % WIDTH 0.002" [0.05] MIN. CIRCUIT FEATURE LOCATION TOLERANCE ± 0.002" [0.05] RELATIVE TO CIRCUIT DATUM RADIUS ± 0.006" [0.15] MIN. CUTOUT DIELECTRIC AREA 6/6 HOLE LOCATION ± 0.002" [0.5] NON-CUMMULATIVE TOLERANCE TO ± 0.003" [0.08] VMN-PL0400-1204 DIAMOND SAWN TO ± 0.001" [0.025] ± 0.003" [0.08] STD. This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO CUTOUT SPACING [0.51] MIN. ± 0.015" [0.38] MIN. SPECIFIC DISCLAIMERS, SET0.020" FORTH AT www.vishay.com/doc?91000 LASER CUT GREATER OF 0.020" [0.51] OR HOLE DIAMETER HOLE DIAMETER FEATURES ± 0.003" [0.08]