TNPW e3 Vishay High Stability Thin Film Flat Chip Resistors FEATURES • Low temperature coefficient and tight tolerances (± 0.1 %; ± 10 ppm/K) • Superior moisture resistivity 0.25 % (85 °C; 56 days; 85 % RH) • Excellent overall stability at different environmental conditions 0.05 % (1000 h rated power at 70 °C) • AEC-Q200 qualified (sizes 0402 to 1206) • Waste gas resistant • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 TNPW e3 precision thin film flat chip resistors are the perfect choice for most fields of modern electronics where highest reliability and stability is of major concern. Typical applications include test and measuring equipment, medical equipment, industrial, and automotive. APPLICATIONS • • • • Test and measuring equipment Medical equipment Industrial equipment Automotive STANDARD ELECTRICAL SPECIFICATIONS DESCRIPTION Metric size TNPW0402 e3 TNPW0603 e3 TNPW0805 e3 TNPW1206 e3 TNPW1210 e3 (1) TNPW2010 e3 TNPW2512 e3 (1) RR 1005M Resistance range RR 1608M RR 2012M RR 3216M 10 to 100 k 10 to 332 k 10 to 1 M Resistance tolerance RR 3225M RR 5025M RR 6332M 10 to 2 M 10 to 3.01 M 10 to 4.99 M 10 to 8.87 M ± 1 %; ± 0.5 %; ± 0.1 % Temperature coefficent ± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K ± 50 ppm/K; ± 25 ppm/K Rated dissipation, P70 (2) 0.063 W 0.1 W 0.125 W 0.25 W 0.33 W 0.4 W 0.5 W Operating voltage, Umax. AC/DC 50 V 75 V 150 V 200 V 200 V 300 V 300 V 140 K/W 110 K/W Permissible film temperature, F max. 155 °C Operating temperature range Thermal resistance (3) Max. resistance change at P70; R/R: - 55 °C to 125 °C (155 °C) 870 K/W 550 K/W 440 K/W 10 to 100 k 10 to 332 k 10 to 1 M 220 K/W 170 K/W 10 to 2 M 10 to 3.01 M 10 to 4.99 M 10 to 8.87 M 1000 h 0.05 % 0.05 % 0.05 % 0.05 % 0.05 % 0.05 % 0.05 % 8000 h 0.10 % 0.10 % 0.10 % 0.10 % 0.10 % 0.10 % 0.10 % 225 000 h 0.30 % 0.30 % 0.30 % 0.30 % 0.30 % 0.30 % 0.30 % Uins 1 min 75 V 100 V 200 V 300 V 300 V 300 V 300 V Continuous 75 V 75 V 75 V 75 V 75 V 75 V 75 V 0.1 x 10-9/h 0.1 x 10-9/h 0.1 x 10-9/h 0.1 x 10-9/h 0.1 x 10-9/h 0.1 x 10-9/h 0.1 x 10-9/h Insulation voltage: Failure rate: FITobserved Notes • TNPW 0402 without marking. (1) Size not specified in EN 140401-801. (2) Rated voltage P x R . The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). Using advanced temperature level may require special considerations towards the choice of circuit board and solder material. The rated dissipation applies only if the permitted film temperature is not exceeded. (3) Measuring conditions in accordance with EN 140401-801. Document Number: 28758 www.vishay.com For technical questions, contact: [email protected] 336 Revision: 27-Jun-12 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPW e3 High Stability Thin Film Flat Chip Resistors DIMENSIONS Vishay DIMENSIONS AND MASS TYPE TNPW0402 e3 TNPW0603 e3 TNPW0805 e3 TNPW1206 e3 TNPW1210 e3 TNPW2010 e3 TNPW2512 e3 L (mm) 1.0 ± 0.05 1.6 ± 0.10 2.0 ± 0.15 3.2 ± 0.15 3.2 ± 0.15 5.0 ± 0.15 6.3 ± 0.20 W (mm) 0.5 ± 0.05 0.85 ± 0.10 1.25 ± 0.15 1.6 ± 0.15 2.45 ± 0.15 2.5 ± 0.15 3.1 ± 0.15 H (mm) 0.35 ± 0.05 0.45 ± 0.10 0.45 ± 0.10 0.55 ± 0.10 0.60 ± 0.15 0.60 ± 0.15 0.60 ± 0.15 T1/T2 MASS (mm) (mg) 0.2 ± 0.10 0.65 0.3 ± 0.20 2 0.4 ± 0.20 5.5 0.5 ± 0.25 10 0.5 ± 0.25 16 0.6 ± 0.25 28 0.6 ± 0.25 39 SOLDER PAD DIMENSIONS TYPE TNPW0402 e3 TNPW0603 e3 TNPW0805 e3 TNPW1206 e3 TNPW1210 e3 TNPW2010 e3 TNPW2512 e3 REFLOW SOLDERING a b l (mm) (mm) (mm) 0.4 0.6 0.5 0.5 0.9 1.0 0.7 1.3 1.2 0.9 1.7 2.0 0.9 2.5 2.0 1.0 2.5 3.9 1.0 3.2 5.2 WAVE SOLDERING a b l (mm) (mm) (mm) 0.9 0.9 1.0 0.9 1.3 1.3 1.1 1.7 2.3 1.1 2.5 2.3 1.2 2.5 3.9 1.2 3.2 5.2 TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE TCR ± 50 ppm/K TNPW0402 e3 ± 25 ppm/K ± 15 ppm/K ± 10 ppm/K ± 50 ppm/K TNPW0603 e3 ± 25 ppm/K ± 15 ppm/K ± 10 ppm/K ± 50 ppm/K TNPW0805 e3 ± 25 ppm/K ± 15 ppm/K ± 10 ppm/K ± 50 ppm/K TNPW1206 e3 ± 25 ppm/K ± 15 ppm/K ± 10 ppm/K TOLERANCE ±1% ± 0.5 % ± 0.1 % ±1% ± 0.5 % ± 0.1 % ± 0.1 % ± 0.1 % ±1% ± 0.5 % ± 0.1 % ±1% ± 0.5 % ± 0.1 % ± 0.1 % ± 0.1 % ±1% ± 0.5 % ± 0.1 % ±1% ± 0.5 % ± 0.1 % ± 0.1 % ± 0.1 % ±1% ± 0.5 % ± 0.1 % ±1% ± 0.5 % ± 0.1 % ± 0.1 % ± 0.1 % RESISTANCE 10R to 100K 10R to 100K 47R to 100K 10R to 100K 10R to 100K 47R to 100K E-SERIES 24; 96 24; 192 24; 96 24; 192 10R to 332K 24; 96 10R to 332K 24; 192 10R to 332K 24; 96 10R to 332K 24; 192 47R to 332K 10R to 1M0 24; 96 10R to 1M0 24; 192 10R to 1M0 24; 96 10R to 1M0 24; 192 47R to 1M0 10R to 2M0 24; 96 10R to 2M0 24; 192 10R to 2M0 24; 96 10R to 2M0 24; 192 47R to 2M0 www.vishay.com Document Number: 28758 For technical questions, contact: [email protected] Revision: 27-Jun-12 337 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPW e3 High Stability Thin Film Flat Chip Resistors Vishay TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE TCR TOLERANCE ±1% ± 0.5 % ± 0.1 % ±1% ± 0.5 % ± 0.1 % ± 0.1 % ± 0.1 % ±1% ± 0.5 % ± 0.1 % ±1% ± 0.5 % ± 0.1 % ±1% ± 0.5 % ± 0.1 % ±1% ± 0.5 % ± 0.1 % ± 50 ppm/K TNPW1210 e3 ± 25 ppm/K ± 15 ppm/K ± 10 ppm/K ± 50 ppm/K TNPW2010 e3 ± 25 ppm/K ± 50 ppm/K TNPW2512 e3 ± 25 ppm/K RESISTANCE 10R to 3M01 10R to 3M01 47R to 2M13 10R to 3M01 10R to 3M01 E-SERIES 24; 96 24; 192 24; 96 24; 192 47R to 2M13 10R to 4M99 10R to 4M99 47R to 1M0 10R to 4M99 10R to 4M99 47R to 1M0 10R to 8M87 10R to 8M87 47R to 1M0 10R to 8M87 10R to 8M87 47R to 1M0 24; 96 24; 192 24; 96 24; 192 24; 96 24; 192 24; 96 24; 192 PART NUMBER AND PRODUCT DESCRIPTION Part Number: TNPW12061K32DEEA T N P W 1 2 0 6 1 K 3 2 D E E A TYPE/SIZE RESISTANCE TOLERANCE TCR PACKAGING SPECIAL TNPW0402 TNPW0603 TNPW0805 TNPW1206 TNPW1210 TNPW2010 TNPW2512 R = Decimal K = Thousand M = Million (4 digits) B = ± 0.1 % D = ± 0.5 % F = ± 1.0 % H = ± 50 ppm/K E = ± 25 ppm/K X = ± 15 ppm/K Y = ± 10 ppm/K EA EC ED EG EN EY Up to 2 digits Blank = Standard Product Description: TNPW1206 1K32 0.5 % T-9 ET1 e3 TNPW1206 1K32 0.5 % T-9 ET1 e3 TYPE/SIZE RESISTANCE TOLERANCE TCR PACKAGING LEAD (Pb)-FREE TNPW0402 TNPW0603 TNPW0805 TNPW1206 TNPW1210 TNPW2010 TNPW2512 Examples: 54R1 = 54.1 1K32 = 1320 ± 0.1 % ± 0.5 % ± 1.0 % T-2 = ± 50 ppm/K T-9 = ± 25 ppm/K T-10 = ± 15 ppm/K T-13 = ± 10 ppm/K ET1 ET6 ET7 E67 E52 E75 e3 = Pure tin termination finish Note • The product can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION. Document Number: 28758 www.vishay.com For technical questions, contact: [email protected] 338 Revision: 27-Jun-12 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPW e3 High Stability Thin Film Flat Chip Resistors Vishay PACKAGING TYPE TNPW0402 e3 TNPW0603 e3 TNPW0805 e3 TNPW1206 e3 TNPW1210 e3 TNPW2010 e3 CODE QUANTITY ET7 = ED 10 000 E52 = EN 1000 (1) ET1 = EA 5000 ET6 = EC 20 000 E75 = EY 1000 E75 = EY 1000 E67 = EG 2000 TNPW2512 e3 CARRIER TAPE Paper tape acc. IEC 60286-3 Type I Blister tape acc. IEC 60286-3 Type II WIDTH 8 mm 12 mm PITCH REEL DIAMETER 2 mm 180 mm / 7" 4 mm 180 mm / 7" 4 mm 330 mm / 13" 4 mm 180 mm / 7" Note (1) 1000 pieces packaging is available only for precision resistors with tolerance ± 0.1 % and temperature coefficient ± 25 ppm/K. DESCRIPTION Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A homogeneous film of metal alloy is deposited on a high grade AI2O3 ceramic substrate and conditioned to achieve the desired temperature coefficient. Specially designed inner contacts are deposited on both sides. A special laser is used to achieve the target value by smoothly fine trimming the resistive layer without damaging the ceramics. A further conditioning is applied in order to stabilize the trimming result. The resistor elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure tin on nickel plating. The result of the determined production is verified by an extensive testing procedure on 100 % of the individual chip resistors. This includes pulse load screening for the elimination of products with a potential risk of early life failures according to EN 140401-801, 2.1.2.2. Only accepted products are laid directly into the tape in accordance with EN 60286-3. ASSEMBLY The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow or vapour phase as shown in IEC 61760-1. The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system. The resistors are RoHS compliant, the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. The immunity of the plating against tin whisker growth has been proven under extensive testing. All products comply with the GADSL (2) and the CEFIC-EECA-EICTA (3) list of legal restrictions on hazardous substances. This includes full compliance with the following directives: • 2000/53/EC End of Vehicle life Directive (ELV) and Annex II (ELV II) • 2011/65/EU Restriction of the use of Hazardous Substances Directive (RoHS) • 2002/96/EC Waste Electrical and Electronic Equipment Directive (WEEE) The resistors are Halogen-free according to JEDEC JS709A definition. Solderability is specified for 2 years after production or re-qualification. The permitted storage time is 20 years. RELATED PRODUCTS The TNPW with SnPb termination plating is designed for those applications, where lead bearing terminations are mandatory. For ordering TNPW with SnPb terminations please refer to latest edition of data sheet TNPW, document number 31006. TNPS .... ESCC high-reliability thin film chip resistors are the premium choice for design and manufacture of equipment, where matured technology and proven reliability are of utmost importance. They are regularly used in communication and research satellites and fit equally well into aircraft and military electronic systems. Approval of the TNPS .... ESCC products is granted by the European Space Components Coordination and registered in the ESCC Qualified Parts List, REP005, document number 28789. Notes (2) Global Automotive Declarable Substance List, see www.gadsl.org. (3) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade organisation representing the information and communications technology and consumer electronics), see www.eicta.org issue environment policy chemicals chemicals for electronics. www.vishay.com Document Number: 28758 For technical questions, contact: [email protected] Revision: 27-Jun-12 339 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPW e3 High Stability Thin Film Flat Chip Resistors Vishay Current Noise in µV/V Non-Linearity A3 in dB FUNCTIONAL PERFORMANCE 120 TNPW1206 e3 TNPW0805 e3 TNPW0603 e3 110 100 TNPW0402 e3 90 80 3 2 1 0.5 TNPW0402 e3 TNPW0603 e3 0.3 TNPW0805 e3 0.1 TNPW1206 e3 0.05 0.03 70 60 10 100 10K 100K Resistance Value in Ω Non-Linearity 0.01 100 TNPW0603 e3 40 20 10 Ω 0 100K 1M Resistance Value in Ω TNPW0603 e3 40 20 10 Ω 0 100 Ω 1 kΩ 100 Ω 1 kΩ - 20 - 40 - 40 4.75 kΩ - 60 1 5 10 HF Performance (1) 10 k Ω 50 100 500 1000 Frequency f in MHz 4.75 k Ω - 60 10 k Ω - 80 1 5 10 50 100 HF Performance (1) 500 1000 Frequency f in MHz 60 TNPW0805 e3 40 20 10 Ω 0 100 Ω - 20 [Z]-RO in % RO 60 Phase Angle in ϑ° 10K 60 60 - 80 1K Current Noise [Z]-RO in % RO Phase Angle in ϑ° 1K TNPW0805 e3 40 20 10 Ω 100 Ω 1 kΩ 0 - 20 1 kΩ - 40 - 40 - 60 - 60 - 80 10 k Ω 1 5 10 HF Performance (1) 50 100 500 1000 Frequency f in MHz 10 k Ω - 80 1 5 10 HF Performance (1) 50 100 500 1000 Frequency f in MHz Note (1) Typical figures. HF-characteristic also depends on termination and circuit design. Document Number: 28758 www.vishay.com For technical questions, contact: [email protected] 340 Revision: 27-Jun-12 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPW e3 90 80 0402 0603 0805 1206 1210 2010 2512 70 60 50 Rated Power in % Temperature Rise in K High Stability Thin Film Flat Chip Resistors Vishay 120 100 80 60 40 30 40 20 20 10 EN 0 0.1 0.2 0.3 0.4 0.5 Temperature Rise Test Voltage in V 0.6 0.7 Power in W 3K TNPW0805 e3 1K TNPW0603 e3 100 10 0 25 50 70 75 100 125 150 175 Ambient Temperature in °C 3K TNPW0805 e3 1K TNPW0603 e3 100 10R 100R 1K Single-Pulse High Voltage Overload Test 1.2/50 µs EN140000 4.27 10K 100K Resistance Value in Ω 10 10R 100R 1K Single-Pulse High Voltage Overload Test 10/700 µs EN140000 4.27 10K 100K Resistance Value in Ω 100 W 100 W TNPW1206 e3 Permissible pulse power Pi, max. Permissible pulse power Pi, max. - 25 Derating Test Voltage in V 0 0 - 55 TNPW0805 e3 TNPW0603 e3 10 W 1W Conditions: P 0, n ≤ 1000 and Ui ≤ Ui, max. 0.1 W 10 µs 100 µs 1 ms 10 ms Maximum pulse load Pi, max. for single pulses 100 ms 1s 10 s Pulse Duration t i TNPW1206 e3 TNPW0805 e3 10 W TNPW0603 e3 1W Conditions: Pmax. ≤ Pmax. (including derating) and Ui ≤ Ui, max. 0.1 W 10 µs 100 µs 1 ms 10 ms Maximum pulse load Pi, max. for continuous pulses 100 ms 1s 10 s Pulse Duration t i www.vishay.com Document Number: 28758 For technical questions, contact: [email protected] Revision: 27-Jun-12 341 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPW e3 High Stability Thin Film Flat Chip Resistors Vishay Permissible pulse voltage Ui, max. 10 000 V 1000 V TNPW1206 e3 TNPW0805 e3 TNPW0603 e3 100 V Conditions: Pi ≤ Pi, max. 10 V 10 µs 100 µs 1 ms 10 ms 100 ms Maximum pulse voltage U i, max. 1s 10 s Pulse Duration t i TEST AND REQUIREMENTS All tests are carried out in accordance with the following specifications: IEC 60115-1, generic specification (includes tests) EN 140400, sectional specification (includes schedule for qualification approval) EN 140401-801, detail specification (includes schedule for conformance inspection) The testing also covers most of the requirements specified by EIA/IS-703 and JIS-C-5202. The tests are carried out under standard atmospheric conditions in accordance with IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated temperature range: Lower category temperature, upper category temperature; damp heat, long term, 56 days) is valid. Unless otherwise specified the following values apply: Temperature: 15 °C to 35 °C Relative humidity: 45 % to 75 % Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). The components are mounted for testing on boards in accordance with EN 60115-1, 4.31 unless otherwise specified. The parameters stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of EN 140401-801. TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE Stability for product types: TNPW0402 e3 TNPW0603 e3 TNPW0805 e3 TNPW1206 e3 TNPW1210 e3 TNPW2010 e3 TNPW2512 e3 4.5 - Resistance 4.8.4.2 - Temperature coefficient 4.25.1 4.25.3 - - Endurance at 70 C Endurance at upper category temperature ± 1 %; ± 0.5 %; ± 0.1 % At (20/- 55/20) C and (20/125/20) °C ± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K U = P 70 x R or U = Umax.; whichever is the less severe; 1.5 h on; 0.5 h off; 70 °C; 1000 h ± (0.05 % R + 0.01 ) 70 C; 8000 h ± (0.1 % R + 0.02 ) 125 °C; 1000 h 155 °C; 1000 h ± (0.05 % R + 0.01 ) ± (0.1 % R + 0.02 ) Document Number: 28758 www.vishay.com For technical questions, contact: [email protected] 342 Revision: 27-Jun-12 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPW e3 High Stability Thin Film Flat Chip Resistors Vishay TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE Stability for product types: TNPW0402 e3 TNPW0603 e3 TNPW0805 e3 TNPW1206 e3 TNPW1210 e3 TNPW2010 e3 TNPW2512 e3 4.24 78 (Cab) 4.23.3 (40±2) °C; 56 days; (93 ± 3) % RH ± (0.1 % R + 0.01 ) Climatic sequence: 4.23 4.23.2 Damp heat, steady state 2 (Bb) 30 (Db) Dry heat UCT; 16 h Damp 55 °C; 24 h; > 90 % RH; 1 cycle 4.23.4 1 (Ab) Cold LCT; 2 h 4.23.5 13 (M) Low air 8.5 kPa; 2 h; 25 ± 10 °C 4.23.6 30 (Db) Damp heat, cyclic 55 °C; 5 days; > 95 to 100 % RH; 5 cycles 4.23.7 - DC load 1 (Ab) Cold - 55 °C; 2 h ±(0.05 % R + 0.01 ) ±(0.1 % R + 0.01 ) U= - ±(0.1 % R + 0.02 ) P 70 x R Umax.; 1 min LCT = - 55 °C UCT = 125 °C 4.19 14 (Na) Rapid change of temperature 30 min at LCT and 30 min at UCT; LCT = - 55 °C; UCT = 125 °C; 1000 cycles 4.13 - Short time overload U = 2.5 x P 70 x R or U = 2 x Umax.; whichever is the less severe; 5 s ±(0.05 % R + 0.01 ) - Single pulse high voltage overload Severity no. 4: U = 10 x P 70 x R or U = 2 x Umax.; whichever is the less severe; 10 pulses 10 µs/700 µs ±(0.5 % R + 0.05 ) no visible damage - Periodic electric overload 15 x P 70 x R or U = 2 x Umax.; whichever is the less severe; 0.1 s on; 2.5 s off; 1000 cycles ±(0.5 % R + 0.05 ) no visible damage Vibration Endurance by sweeping; 10 Hz to 2000 Hz; no resonance; amplitude 1.5 mm or 200 m/s2; 7.5 h ±(0.05 % R + 0.01 ) no visible damage 4.27 U= 4.37 4.22 6 (Fc) www.vishay.com Document Number: 28758 For technical questions, contact: [email protected] Revision: 27-Jun-12 343 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPW e3 High Stability Thin Film Flat Chip Resistors Vishay TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE Stability for product types: TNPW0402 e3 TNPW0603 e3 TNPW0805 e3 TNPW1206 e3 TNPW1210 e3 TNPW2010 e3 TNPW2512 e3 Solder bath method; SnPb40; non-activated flux (215 ± 3) °C; (3 ± 0.3) s Good tinning ( 95 % covered); no visible damage 4.17.2 58 (Td) Solderability Solder bath method; SnAg3Cu0.5 or SnAg3.5; non-activated flux (235 ± 3) °C; (2 ± 0.2) s 4.18.2 58 (Td) Resistance to soldering heat Solder bath method; (260 ± 5) °C; (10 ± 1) s ±(0.02 % R + 0.01) 4.29 45 (XA) Component solvent resistance Isopropyl alcohol + 50 °C; method 2 No visible damage 4.32 21 (Ue3) Shear (adhesion) 4.33 21 (Ue1) Substrate bending Depth 2 mm, 3 times ±(0.05 % R + 0.01) no visible damage, no open circuit in bent position 4.7 - Voltage proof URMS = Uins; 60 ± 5 s No flashover or breakdown 4.35 - Flammability IEC 60695-11-5, needle flame test; 10 s No burning after 30 s - Damp heat (85 ±5) °C; 56 days (85 ±5) % RH ± (0.25 R + 0.05 ) - RR 1005M and RR 1608M; 9N RR 2012M and RR 3216M: 45 N No visible damage Document Number: 28758 www.vishay.com For technical questions, contact: [email protected] 344 Revision: 27-Jun-12 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Material Category Policy Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant. Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU. Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000