V I S H AY I N T E R T E C H N O L O G Y, I N C . SMD Power Inductors IHHP Series Low-Profile, High-Current Inductors KEY BENEFITS • • • • • Compact 3 mm by 3 mm footprint with height profiles of 0.8 mm and 1.0 mm Magnetic alloy power choke coil Magnetic shielded Low acoustic noise and high efficiency Inductance values up to 10 µH APPLICATIONS • DC/DC conversion in portable electronics RESOURCES • Datasheets: IHHP-1212AZ-01 - www.vishay.com/doc?34404, IHHP-1212ZH-01 - www.vishay.com/doc?34405 • For technical questions contact [email protected] • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 A WORLD OF SOLUTIONS Product Sheet 1/2 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VMN-PT0486-1603 www.vishay.com Vishay Dale Low Profile, High Current Inductors V I S H AYLow I N T Profile, E R T E C HHigh N O L OCurrent G Y, I N C .Induc FEATURES FEATURES • • • • • Magnetic alloy powe SMD Power Inductors • Magnetic shielded Magnetic alloy power choke coil Magnetic shielded Low acoustic noise and high efficiency Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 • Low acoustic noise a IHHP Series • Material categorizati for definitions of www.vishay.com/do APPLICATIONS Low-Profile, High-Current Inductors • PDA / notebook / desktop / server applications IHHP-1212AZ-01 APPLICATIONS • IHHP-1212ZH-01 High current POL converters • Low profile, high current power supplies STANDARD ELECTRICAL SPECIFICATIONS • Battery powered devices L0 HEAT systems • DC/DC converters in distributed power INDUCTANCE DCR DCR RATING SATURATION Vishay Dale • DC/DC converter for Field Programmable Gate Array AT 1 MHz, CURRENT TYP. MAX. CURRENT Vishay Dale Vishay Dale (FPGA) 0.10 V, 0 A DC TYP. 25 °C 25 °C DC STANDARD ELECTRICAL SPECIFICATIONS IHHP-1212ZH-01 IHHP-1212AZ-01 IHHP-1212ZH-01 IHHP-1212AZ-01 IHHP-1212ZH-01 IHHP-1212ZH-01 DC TYP. 25 °C 25 °C DC www.vishay.com (μH) Inductors (A) (mΩ) (mΩ) (A) (A) High Current (mΩ) (mΩ) (A) Profile, High Current Inductors Low DIMENSIONS in inches [millimeters]Vishay Dale Low5.2Profile, Profile, High Current Inductors Low Profile, 0.33 ± 30Inductors % 21 23 6.0 6.5 0.47 ± 30 % 27 30 5.0 High Current FEATURES FEATURES 0.118 ± 0.008 IHHP-1212AZ-01 FEATURES [3.0 ± 0.2] Low Profile, Inductors 0.47 ± 30 % 25 28 5.3 5.3 1.0 ± 20 % 59 66 3.2 4.2 High Current FEATURES Magnetic alloy alloy power power choke choke coil coil • Magnetic alloy power choke coil •• Magnetic L0 INDUCTANCE AT 1 MHz, 0.10 V, 0 A (μH) IHHP-1212AZ-01 HEAT www.vishay.com DCR DCR RATING SATURATION Vishay Dale www.vishay.com www.vishay.com TYP. MAX. CURRENT CURRENT (3) (3) (4) • Magnetic Magnetic alloy alloy power power choke choke coil coil • 1.0 ± 20shielded % 70 78 2.9 3.4 shielded •FEATURES Magnetic • Magnetic shielded • Magnetic shielded Low acoustic noise and high efficiency 0.118 ± 0.008 0.079 ± 0.008 •• Low and high efficiency 4.7acoustic ± 20alloy % noise 281 312 1.4 1.7 Magnetic power Low acoustic noise efficiency [3.0and ± choke 0.2]high coil [2.0 ± 0.2] •• Material Low acoustic noise and high efficiency Material categorization: • categorization: •Notes Magnetic shielded Material categorization: please see see for definitions definitions of compliance compliance please ••(1) for Material categorization: of All test data is noise referenced to 25 efficiency °C ambient. • for Low acoustic high please 0.024 see± 0.008 definitions of and compliance www.vishay.com/doc?99912 please see for definitions of compliance (2) www.vishay.com/doc?99912 [0.6 ± 0.2] Operating temperature range -55 °C to +125 °C . www.vishay.com/doc?99912 •(3) Material <categorization: < 0.012 0.024 ± 0.008 0.012 www.vishay.com/doc?99912 DC current[0.3] (A) that will cause an±approximate of 40 °C. [0.3] [0.6 0.2] please ΔTsee for definitions of compliance (4) DC current (A) that will cause L to drop approximately 30 %. APPLICATIONS 0 APPLICATIONS (5) www.vishay.com/doc?99912 APPLICATIONS The part temperature (ambient + temp. rise) should not exceed PDA notebook desktop server applications •• PDA // 0.039 notebook // desktop // server applications PDA notebook desktop serverconditions. applications 125 °C under worst case operating Circuit design, [1.0] •• High PDA //current notebook // desktop // server applications High current POL converters • POL converters APPLICATIONS component PWB trace size and thickness, airflow Max. placement, • High High current POL converters converters • current POL Low profile, high current power supplies and profile, other cooling all affect the part temperature. Part •• Low high current power supplies 0.037 PDA / notebook /provisions desktop / server applications Low profile, high current power supplies temperature should be verified in the end application. [0.95] •• Battery Low profile, high current power supplies Battery powered devices • powered • High current POLdevices converters • Battery powered devices • Battery powered devices power systems systems DC/DC converters in distributed distributed power •• DC/DC converters in Low profile, high current power supplies power systems systems • DC/DC DC/DC converters in distributed distributed power • converters in converterdevices for Field Field Programmable Programmable Gate Array Array •• DC/DC converter for Gate Battery powered 0.079 DC/DC converter for for Field Field Programmable Programmable Gate Gate Array Array (FPGA) [2.0] •• (FPGA) DC/DC converter • (FPGA) DC/DC converters in distributed power systems (FPGA) • DIMENSIONS DC/DC converterin for Field[millimeters] Programmable Gate Array inches DIMENSIONS in inches inches [millimeters] [millimeters] (FPGA) DIMENSIONS in 0.063 0.118 ± ± 0.008 0.008 0.118 [1.6] IHHP-1212ZH-01 IHHP-1212AZ-01 0.118 ± 0.2] 0.008 [3.0 ± 0.2] [3.0 IHHP-1212ZH-01 0.118 DIMENSIONS in inches [millimeters] IHHP-1212AZ-01 [3.0 ± ± 0.008 0.2] IHHP-1212ZH-01 2.2 ± 20shielded % 130 144 2.4 3.0 • Magnetic • Low and high efficiency 4.7acoustic ± 20 % noise 227 252 1.6 1.8 • Material categorization: 6.8 ± 20 % 261 290 1.3 1.6 for definitions of compliance please see www.vishay.com/doc?99912 10 ± 20 % 369 410 1.1 1.3 HEAT ATING SATURATION RRENT CURRENT DC TYP. DC (A) (4) A) (3) 5.2 5.0 3.2 4.2 2.4 3.0 1.6 1.8 1.3 1.6 1.1 1.3 ient. +125 °C . ximate ΔT of 40 °C. p approximately 30 %. rise) should not exceed nditions. Circuit design, e and thickness, airflow he part temperature. Part nd application. 0.063 [1.6] DESCRIPTION DESCRIPTION DESCRIPTION IHHP-1212ZH-01 ER 2 ± 20 % IHHP-1212AZ-01 IHHP-1212ZH-01 IHHP-1212AZ-01 DESCRIPTION MODEL CODE INDUCTANCE TOLERANCE IHHP-1212ZH-01 PACKAGE MODEL MODEL MODEL IHHP-1212ZH-01 1 2 SIZE A Z Revision 10-Nov-15 UE PDA / notebook / de High current POL co Low profile, high cur Battery powered dev DC/DC converters in DC/DC converter fo (FPGA) DIMENSIONS in i 0.118 ± 0.008 [3.0 ± 0.2] 0.11 [3 < 0.012 < 0.012 Notes [0.3] [0.3] All test data is referenced to 25 °C ambient. •(2) PDA / notebook / desktop / server applications Operating temperature range -55 °C to +125 °C . 0.031 [0.8] DC current (A)POL that converters will cause an approximate ΔT of 40 °C. •(3) High current Max. (4) DC current (A) that will cause L to drop approximately 30 %. 0 •(5) Low profile, high current power supplies 0.037 The part temperature (ambient + temp. rise) should not exceed STANDARD ELECTRICAL SPECIFICATIONS [0.95] • Battery devices STANDARD ELECTRICAL SPECIFICATIONS 125 °C powered under worst case operating conditions. Circuit design, STANDARD ELECTRICAL SPECIFICATIONS L00 placement, PWB trace sizeHEAT HEAT L component and thickness, airflow power systems • DC/DC converters in distributed L HEAT INDUCTANCE SATURATION DCR allDCR DCR RATING and other affect the part temperature. Part L00cooling provisions HEAT INDUCTANCE SATURATION DCR RATING STANDARD ELECTRICAL SPECIFICATIONS INDUCTANCE SATURATION DCR DCR RATING • DC/DC for FieldMAX. Gate Array AT 1 1converter MHz, CURRENT TYP. CURRENT temperature should be verified inProgrammable the CURRENT end application. 0.079 INDUCTANCE SATURATION DCR DCR RATING AT MHz, CURRENT TYP. MAX. AT 1 MHz, CURRENT TYP. MAX. CURRENT [2.0] (FPGA) 0.101LV, V, 0A A DC TYP. TYP. 25 °C MAX. 25 °C °C CURRENT DC HEAT AT MHz, CURRENT TYP. 0 0 0.10 DC 25 °C 25 DC 0.10 V, 0 A DC TYP. 25 °C 25 °C DC (3) (4) (4) (μH) (A)TYP. (mΩ) (mΩ) (A) INDUCTANCE SATURATION DCR DCR 0.10(μH) V, 0 A DC 25 °C 25 °C RATING DC(3) (A) (mΩ) (mΩ) (A) (μH) (A) (4) (mΩ) (mΩ) (A) (3) DIMENSIONS in inches [millimeters] AT (μH) 1 MHz, CURRENT TYP. MAX. CURRENT (A) (4) (mΩ) (mΩ) (A) (3) 0.33 ±V,30 30 % 21°C 2530 23°C 6.0 6.5 0.47 ± % 27 5.2 5.0 0 0.10 0 A DC TYP. 25 DC 0.33±±0.008 30 % 21 23 6.0 6.5 0.118 [ (3) 0.47 ± 30 % 27 30 5.2 5.0(4) IHHP-1212AZ-01 0.33(μH) 21 23 6.0 6.5 (A) (mΩ) (mΩ) (A) [3.0 0.47 30% % 25 28 5.3 5.3 1.0 ±±±0.2] 20 59 66 3.2 4.2 0.47 ± 30 % 25 28 5.3 5.3 [3.0 ± 0.2] 1.0 ±± 59 66 3.2 4.2 0.47 ±20 30% % 25 28 5.3 5.3 0.33 30 % 21 23 6.0 6.5 1.0 ± ± 20 20 % 70 78 2.9 3.4 2.2 % 130 144 2.4 3.0 0.118 ± 0.008 1.0 ± 20 % 70 78 2.9 3.4 IHHP-1212ZH-01 DESCRIPTION DESCRIPTION 2.2 ± 20 % 130 144 2.4 3.0 1.0 70 78 2.9 3.4 [3.0 ± 0.2] 0.47 30 % % 0.118281 25 28 5.3 0.118 ± ± 0.008 0.008 0.079 ± ± 0.008 0.008 ± 0.008 312 0.079 ±5.3 0.008 0.118 0.079 4.7 ± ±±20 20 1.4 1.7 4.7 % 1.6 0.118 ± 0.2] 0.008 [3.0 ± 0.2] 0.079 ± 0.2] 0.008 [2.0 ± 0.2] [3.0227 ± 0.2] 252 [2.0 ±1.8 0.2] [3.0 [2.0 4.7 ± 20 % 281 312 1.4 1.7 0.118 ± 0.008 0.079 IHHP-1212ZH-01 1.0 μH 20 % ER IHHP-1212AZ-01 1.0 μH ± 20 % ER e3 [3.0 ± 0.2] [2.0 ± ±±0.008 0.2] 4.7 ± 20 % 227 252 1.6 1.8 281 312 1.4 1.7 1.0 ± 20 % 70 78 2.9 3.4 [3.0 ± 0.2] [2.0 ± 0.2] Notes6.8 ± 20 % 261 290 1.3 1.6 ® LEAD Notes MODEL INDUCTANCE VALUE INDUCTANCE TOLERANCE PACKAGE CODE (Pb)-FREE STANDARD INDUCTANCE VALUE INDUCTANCE TOLERANCE PACKAGE CODE JEDEC (1) AllMODEL test± data to 25 °C ambient. 0.118 ± 0.008 0.079 ± 0.008 6.8 20 261 290 1.3 1.6 Notes 0.024 ± 0.008 0.008 0.024 ± 20 % %is referenced 281 to 312 1.4 0.024 ± 0.008 1.7 (1) All4.7 test±± data 25 °C°C ambient. [3.0 ± 0.2] (2) Operating [2.0 ± 0.2] 10 20 temperature %is referenced 369 410 1.1 °C [0.6 1.3 0.024 ± 0.2] 0.008 [0.6 0.2] (1) [0.6 ± range -55 to +125 . ± 0.2] All test data is referenced to 25 °C ambient. 0.024 ± 0.008 (2) [0.6 ± 0.2] < 0.012 0.012 0.024 ± ± 0.008 0.008 < 0.012 0.012 < 0.012 0.024 0.008 < 0.012 Operating temperature range -55 °C to +125 ± 20 % 369 410 1.1 °C (3) < 0.024 < Notes [0.6 ± 0.2] (2) DC10 current (A) that will cause an± approximate ΔT.. of 401.3 °C. Operating temperature range -55 °C to +125 °C < [0.3] 0.012 0.024 ± 0.2] 0.008 < [0.3] 0.012 [0.3] [0.6 ± 0.2] [0.6 ±approximate 0.2] [0.3] Notes (3)[0.3] [0.6 DC current (A) that will an ΔT of 40 °C. < 0.012 0.024 < [0.3] 0.012 (4) (1) GLOBAL PART NUMBER GLOBAL PART (3) [0.3] [0.6 ± ± 0.008 0.2] [0.3] DCtest current (A) that NUMBER will cause cause L0°C to drop approximately 30 %. All data is referenced to 25 ambient. 0.024 ± 0.008 DC current (A) that will cause an approximate ΔT of 40 °C. (1) Notes [0.3] [0.6 ± 0.2] [0.3] (4) All test data(A) is referenced to 25 ambient. that will(ambient cause L0+°C totemp. drop approximately %. (5) DC (2) [0.6 ± 0.2] (4) Thecurrent part temperature rise) should not30 exceed Operating temperature range -55 to +125 °C . DC current (A) that will cause L0°C to°C drop approximately 30 %. (1) (2) 0.031 test data is H referenced to 25 ambient. (5) All 0.039 Operating temperature range -55 °C to2 +125 °C . 0.039 < 0.012 0.0241 ±0 0.0082M < 0.012H 1 The part temperature (ambient + temp. rise) should not exceed I H P 1 21 Z H E R 1 (3) I H P 1 1 2 A Z E R R 0 125 °C under worst case operating conditions. Circuit design, (5) DC current (A) that will(ambient cause an+approximate ΔT of 40 °C. 0.031 [0.8][0.3] [1.0] The current part temperature temp. rise) should not°C. exceed (2) (3) [1.0] [0.3] [0.6 ± 0.2] Operating temperature range -55 °C size to +125 .Circuit DC (A) that will cause an approximate ΔT of 40 0.039 0.031 °CMax. under worst case operating conditions. design, [0.8] Max. (4) 125 component placement, PWB and°C thickness, airflow Max. DC current (A) that will cause Ltrace to drop approximately 30 %. 125 °C under worst case operating conditions. Circuit design, 0 (3) [1.0] (4) DC [0.8] an approximate ΔT of 40 °C. Max. current (A) thatprovisions will cause L to drop approximately 30airflow %. placement, PWBall trace size and thickness, 0affect and othertemperature cooling therise) partshould temperature. Part (5) component Max. FAMILY PRODUCT SIZE PACKAGE I PRODUCT FAMILY SIZEnot exceed PACKAGE INDUCTANCE TOL. SERIES 0.037 component placement, PWBalltrace size and thickness, airflow The part (ambient + temp. 0.037 0.037 (4) (5) DC and other cooling provisions affect therise) part temperature. Part 0.031 current (A) that will cause L in totemp. drop approximately %. The part temperature (ambient + should not30 exceed temperature should be verified the end application. 0.037 [0.95] VALUE [0.95] CODE [0.95] CODE and other cooling provisions all0in affect the part temperature. Part 125 °C under worst case operating conditions. Circuit design, [0.8] 0.037 (5) 125 temperature should be verified the end application. °C under worst case operating conditions. Circuit design, [0.95] The part temperature + temp. rise) should not exceed Max. temperature should be(ambient verified in thesize end application. component placement, PWB trace and thickness, airflow [0.95] component placement, PWB trace size and thickness, airflow 125 °C under worst case operating Circuit design, and other cooling provisions all affectconditions. the part temperature. Part 0.037 and other cooling provisions affect the and part thickness, temperature. Part component PWBalltrace airflow temperature placement, should be verified in thesize end application. 0.079 [0.95] 0.079 temperature should be verified the end application. 0.079 and other cooling provisions all in affect the part temperature. Part Revision: 10-Nov-15 Revision: 10-Nov-15 Document Number: 34404 1 1 0.079 [2.0] [2.0] [2.0] temperature should be verified in the end application. 0.079 [2.0] For technical questions, contact: [email protected] For technical questions, contact: [email protected] [2.0] THIS DOCUMENT SUBJECT TOTHIS CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIB THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBEDISHEREIN AND DOCUMENT 0.079 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay. ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 [2.0] 0.063 APPLICATIONS (1) PECIFICATIONS (4) • • • • • • 0.063 0.063 [1.6] [1.6] 0.063 [1.6] [1.6] 0.063 [1.6] 1.0 μH μH ± 20 20 % % e3 1.0 ± 1.0 μH ± 20 % 1.0 μH VALUE ± 20 TOLERANCE % ® LEAD INDUCTANCE INDUCTANCE (Pb)-FREE STANDARD JEDEC INDUCTANCE VALUE INDUCTANCE TOLERANCE INDUCTANCE VALUE INDUCTANCE TOLERANCE INDUCTANCE VALUE INDUCTANCE TOLERANCE 1.0 μH ± 20 % MODEL PART INDUCTANCE GLOBAL NUMBER VALUE GLOBAL PART PART NUMBER NUMBER GLOBAL II E HR H H1 H PR P 10 1 I H H P 1 GLOBAL I H PART H NUMBER P 1 PRODUCT FAMILY FAMILY PACKAGE INDUCTANCE PRODUCT PRODUCT FAMILY I PRODUCT H H P 1 CODE VALUE FAMILY PRODUCT FAMILY 2M 2 2 2 TOL. 2 INDUCTANCE TOLERANCE 10 21 1 2 1 2 1 2 SIZE SERIES SIZE SIZE 2 1 SIZE SIZE Z A Z A Z H Z H Z H Z H ER ER ER ER CODE PACKAGE PACKAGE CODE PACKAGE CODE PACKAGE CODE ER e3 e3 e3 e3 ® LEAD (Pb)-FREE STANDARD JEDEC® LEAD (Pb)-FREE STANDARD JEDEC ® JEDEC LEAD (Pb)-FREE STANDARD JEDEC® LEAD (Pb)-FREE STANDARD e3 PACKAGE CODE JEDEC® LEAD (Pb)-FREE STANDARD E R E R E R E R PACKAGE PACKAGE PACKAGE E CODE CODER PACKAGE CODE CODE PACKAGE CODE 1 1 1 1 R 0 R 0 R 0 R 0 INDUCTANCE INDUCTANCE INDUCTANCE 1 INDUCTANCE R 0 VALUE VALUE VALUE VALUE INDUCTANCE VALUE M M M M TOL. TOL. TOL. M TOL. 0 1 0 1 0 1 0 1 SERIES SERIES SERIES1 0SERIES TOL. SERIES Revision: 10-Nov-15 10-Nov-15 Document Number: Number: 34404 34405 1 Document Number: 34404 1 Revision: Document 1 Revision: 10-Nov-15 Document Number: 34405 1 For technical technical questions, questions, contact: contact: [email protected] Revision: 10-Nov-15 Document Number: 34404 For technical questions, contact: [email protected] 34405 1 For [email protected] For technical questions, contact: [email protected] THIS DOCUMENT DOCUMENT ISHEREIN SUBJECT TOTHIS CHANGE WITHOUT NOTICE. [email protected] PRODUCTS DESCRIBED DESCRIBED HEREIN HEREIN AND AND THIS THIS DOCUMENT DOCUMENT For DOCUMENT technical questions, contact: CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED AND THIS IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS Product Sheet 2/2 VMN-PT0486-1603 THIS DOCUMENT IS SUBJECT TOTO CHANGE WITHOUT NOTICE. THEFORTH PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT SPECIFIC DISCLAIMERS, SET AT www.vishay.com/doc?91000 www.vishay.com/doc?91000 Revision: Document Number: 34405 O SPECIFIC DISCLAIMERS, SET FORTH AT10-Nov-15 www.vishay.com/doc?91000 1SET ARE SUBJECT SPECIFIC DISCLAIMERS, AT THIS DOCUMENT IS SUBJECT TOTO CHANGE WITHOUT NOTICE. THEFORTH PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 ForSPECIFIC technicalDISCLAIMERS, questions, contact: ARE SUBJECT TO SET [email protected] FORTH AT www.vishay.com/doc?91000 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 www.vishay.com