Reliability Data Report Product Family R515 LT1999 / LT5400 / LT6000 / LT6001 / LT6002 / LT6003 / LT6004 / LT6005 / LT6015 / LT6016 / LT6017 / LT6020 / LT6023 / LT6108 / LT6109 / LT6118 / LT6119 / LT6375 / LT6558 Reliability Data Report Report Number: R515 Report generated on: Mon Apr 18 13:27:25 PDT 2016 OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE NEWEST DATE K DEVICE HRS CODE CODE (+125°C) 1 No. of FAILURES 2,3 QFN/DFN SOIC/MSOP SOT 706 1927 154 0630 0552 0630 1517 1518 0630 1027 2703 90 0 0 0 Totals 2,787 - - 3,820 0 HIGHLY ACCELERATED STRESS TEST AT +130 DEG C / 85% RH PACKAGE TYPE SAMPLE SIZE OLDEST DATE NEWEST DATE K DEVICE HRS CODE CODE (+85°C) No. of FAILURES 4 SOIC/MSOP SOT 314 154 1335 1150 1411 1336 1205 591 0 0 Totals 468 - - 1,796 0 K DEVICE HRS No. of FAILURES PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SSOP/TSSOP SOIC/MSOP 1418 74 6515 SOT Totals 2314 10,321 OLDEST DATE NEWEST DATE CODE CODE 0720 0530 0529 1508 0539 1516 82 10 608 0 0 0 0649 - 1516 - 125 825 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES TEMP CYCLE FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN 995 0720 1508 237 0 SSOP/TSSOP SOIC/MSOP SOT 228 6306 1671 0530 0529 0649 0539 1516 1516 86 2166 372 0 0 0 Totals 9,200 - - 2,861 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES THERMAL SHOCK FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE CODE CODE CYCLES QFN/DFN SSOP/TSSOP 1094 154 0720 0530 1508 0539 248 115 0 0 SOIC/MSOP SOT Totals 5372 1802 8,422 0529 0649 - 1516 1516 - 1983 248 2,594 0 0 0 (1) Assumes Activation Energy = 1.0 Electron Volts (2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =0.48 FITS (3) Mean Time Between Failure in Years = 237875.61 (4) Assumes 20X Acceleration from 85 °C to +130 °C Note 1: 1 FIT = 1 Failure in One Billion Hours. Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL Preconditioning Reliability Data Report Report Number: R515 Report generated on: Mon Apr 18 13:27:25 PDT 2016 HIGH TEMPERATURE BAKE AT 150 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SOIC/MSOP SOT 225 126 128 Totals 479 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES CODE CODE 1217 1028 0814 1424 1440 1513 225 118 128 0 0 0 - - 471 0 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES CODE CODE HIGH TEMPERATURE BAKE AT 175 DEG C PACKAGE TYPE SAMPLE SIZE QFN/DFN SOIC/MSOP 173 1218 1229 1215 1444 1444 173 1219 0 0 SOT Totals 331 1,722 1247 - 1330 - 331 1,723 0 0